微波电子回旋共振等离子体增强化学气相沉积法沉积氟化非晶碳薄膜的研究

使用三氟甲烷和苯的混合气体,利用微波电子回旋共振等离子体增强化学气相沉积法制备了F/C比在0.11—0.62之间的α-C∶F薄膜.研究了微波功率对薄膜沉积和结构的影响,发现微波功率的升高提高了薄膜的沉积速率,降低了薄膜的F/C比,也降低了薄膜中CF和CF₃基团的密度,而使CF₂基团的密度保持不变.在高微波功率下可以获得主要由CF₂基团和C=C结构组成的α-C∶F薄膜.薄膜的介电频率关系(1×10³—1×10⁶Hz)和损耗频率关系(1×10²—1×10⁵Hz)均呈指数规律减小,是缺陷中心间简单隧穿引起的跳跃导电所致.α-C∶F薄膜的介电极化主要来源于电子极化 关键词： 氟化非晶碳薄膜 ECR等离子体沉积 键结构 介电性质     

新型透明导电薄膜ErF3掺杂In2 O3的研制

利用电子束沉积技术首次制备了氟化铒 (ErF₃) 掺杂的氧化铟(In₂O₃)透明导电薄膜(IEFO),研究了薄膜的晶体结构、光学特性和电学特性。利用原子力显微镜测试了不同厚度薄膜的形貌,初步研究了薄膜的生长过程。研究发现:IEFO薄膜为多晶结构,Er原子的掺入改变了薄膜的优势生长方向,使薄膜在(211)、(222)、(444)3个方向上的生长趋势基本相同。 薄膜电阻率为1.265×10^-3 Ω·cm,电子迁移率为45.76 cm²·V^-1·s^-1,电子浓度为1.197×10²⁰ cm^-3,在380~780 nm范围内的可见光平均透过率为81%。     

约化场强对氮-氧混合气放电等离子体演化特性的影响

采用零维等离子体动力学模型,计算了不同约化场强条件下N₂/O₂放电等离子体的演化特性.结果表明,平均电子能量与约化场强有着近似的线性关系,在约化场强为100 Td时,平均电子能量约为2.6 eV、最大电子能量达35 eV;约化场强是影响电子能量函数分布的主要因素.气体放电过程结束后,振动激发态氮分子的粒子数浓度不再变化,电子激发态的氮分子、原子和氧原子的粒子数浓度达到一峰值后开始降低;放电结束后的氧原子通过复合反应生成臭氧.约化场强升高,由于低能电子减少的影响,振动激发态氮分子的粒子数浓度降低,当约化场强由50 Td增加75 Td,100 Td时,粒子数浓度由3.83×10¹¹ cm^-3降至1.98×10¹¹ cm^-3和1.77×10¹¹ cm^-3,其他粒子浓度则相应增大. 关键词： 等离子体 约化场强 粒子演化 数值模拟     

MW-ECR PE-UMS等离子体特性及对Zr-N薄膜结构性能的影响

采用静电探针技术对微波电子回旋共振(MW-ECR) 等离子体进行了诊断,利用等离子体增强 非平衡磁控溅射(PE-UMS)法在常温下制备了Zr-N薄膜, 通过EPMA，XRD，显微硬度对膜的 结构和性能进行评价.实验结果表明，随氮气流量增加，总的等离子体密度从807×10⁹c m^-3增加到831×10⁹cm^-3然后逐渐减小为752×10 ⁹cm^-3；而N₂⁺密度则从312×10^{8< /sup>cm-3线性递增到335×109cm-3；电子温度变化 不大.对薄膜而言，随N₂+密度增大，样品中氮含量增加，而晶粒逐 渐变小，当样品中N/ Zr原子比达到14时，薄膜中出现亚稳态的Zr₃N₄相以及非晶相， 在更高氮流量下，整 个薄膜转变为非晶态.与此相应，薄膜硬度由最初的225GPa增大到2678GPa 然后逐渐减 小到1982GPa. 关键词： 氮化锆薄膜 ECR等离子体 磁控溅射 诊断}     

Cd0.96Zn0.04Te光致载流子动力学特性的太赫兹光谱研究

采用光抽运-太赫兹探测技术研究Cd_0.96Zn_0.04Te的载流子弛豫和瞬:态电导率特性.在中心波长800 nm的飞秒抽运光激发下,Cd_0.96Zn_0.04Te的载流子弛豫过程用单指数函数进行了拟合,其载流子弛豫时间长达几个纳秒,且在一定光激发载流子浓度范围内随光激发载流子浓度的增大而减小,这与电子-空穴对的辐射复合有关.在低.光激发载流子浓度(4.51×10¹⁶—1.81×10¹⁷ cm^-3)下,Cd_0.96Zn_0.04Te的太赫兹(terahertz,THz)瞬态透射变化率不随光激发载流子浓度增大而变化,主要是由于陷阱填充效应造成的载流子损失与光激发新增的载流子数量近似.随着光激发载流子浓度继续增大(1.81×10¹⁷—1.44×10¹⁸ cm^-3),THz瞬态透射变化率随光激发载流子浓度的增大而线性增大,是由于缺陷逐渐被...     

不同CHF3/CH4流量比下沉积a-C∶F∶H薄膜键结构的红外分析

通过微波电子回旋共振等离子体化学气相沉积方法使用CH₄/CHF₃源气体制备a-C∶F∶H薄膜.红外结果表明,a-C∶F∶H薄膜随着流量比R=[CHF₃]/[CHF₃]+[CH₄])的变化存在结构上的演变,R<64%时,薄膜主要是以类金刚石(DLC)特征的结构为主;当R>64%时,薄膜表现为一个类聚四氟乙烯(PTFE)的结构,结构单体主要为CF₂.同时这种结构上的变化影响着薄膜 关键词： a-C∶F∶H薄膜 傅里叶变换红外光谱 紫外可见光谱     

基于Al2O3/Pt纳米晶/HfO2叠层的MOS电容存储效应研究

采用电子束蒸发Pt和后快速热退火的方法,研究了退火条件对Pt纳米晶的生长特性的影响,结果显示Pt纳米晶的密度随退火温度的升高和退火时间的延长均表现出先增大后减小的趋势.在800℃下退火20 s能得到分布均匀的、密度为30×10¹¹ cm^-2的Pt纳米晶.进一步研究了基于Al₂O₃/Pt纳米晶/HfO₂叠层的MOS电容结构的存储效应,表明其在-3—+8 V扫描电压范围下C-V< 关键词： Pt纳米晶 快速热退火 原子层淀积 存储效应     

立方体AgCl微晶中［Fe(CN)6］4-引入的浅电子陷阱阱深与俘获截面的动力学模拟

为了描述在晶体生长阶段掺入［Fe(CN)₆］^4-的立方体AgCl微晶中 光电子的产生与 衰减过程，建立了一种由三个固有中心和一个浅电子陷阱(SETs)组成的动力学模型，并引出一组微分方程.通过求解微分方程得到与实验结果相符合的光电子衰减曲线及其寿命.调整相 关模拟参数，于常温下得到由［Fe(CN)₆］^4-引入的SETs阱深为0.1 15eV，电子俘获截面为2.136×10^-17cm². 关键词： 光电子 浅电子陷阱 俘获截面 AgCl微晶     

注氮GaAs中的深能级及其对自由载流子的补偿

详细研究了注氮n型GaAs中深的和浅的杂质缺陷的电学性质。深能级瞬态谱(DLTS)技术测量表明,能量为140keV和剂量为1×10¹³cm^-2的氮离子注入并经800℃退火30min的GaAs中存在四个电子陷阱,E₁(0.111),E₂(0.234),E₃(0.415),E₄(0.669)和一个空穴陷阱H(0.545),而在能量为20keV和剂量为5×10^{14关键词：}     

氧气空心阴极放电模拟

本文利用流体模型对气压为266 Pa的氧气环境下空心阴极放电的放电特性及不同粒子的生成损耗机制进行了模拟研究.模型中包含11种粒子和48个反应.在该模拟条件下,周围阴极所对应的负辉区产生重叠,表明放电中存在较强的空心阴极效应.计算得到了不同带电粒子与活性粒子的密度分布.带电粒子密度主要位于放电单元中心区域,电子和负氧离子O~-是放电体系中主要的负电荷,其密度峰值分别达到5.0×10¹¹ cm^-3和1.6×10¹¹ cm^-3;O₂~+是放电体系中主要的正电荷,其密度峰值为6.5×10¹¹ cm^-3.放电体系中同时存在丰富的活性氧粒子,并且其密度远高于带电粒子,按其密度高低依次为基态氧原子O、单重激发态氧分子O₂(a~1Δ_g)、激发态氧原子O(~1D)、臭氧分子O₃.对电子、O~-和O₂~+的生成和损耗的反应动力学过程进行了深入分析,同时给出了不同活性...     

Gap states in hydrogenated amorphous silicon: A comparison of photoemission and photoconductivity results

We report photoemission results from which we directly determined the density of states g(E) in the gap of a-Si:H between the top of the valence band E_v and the Fermi level. At 0.4 eV above E_v, g(E) was found to be ≈1×10²⁰ cm^-3 eV^-1 in the undoped film; P-doping increased g(E) in this region whereas annealing reduced it. The photoconductivity-derived optical absorption spectrum matched the shape of the photoemission spectrum, and thus supports the explanation that the photoconductivity shoulder at photon energies in the region of 1.3 eV is due to transitions from localized states above the valence band to the conduction band.     

Influence of 60Co gamma radiation on fluorine plasma treated enhancement-mode high- electron-mobility transistor

AlGaN/GaN depletion-mode high-electron-mobility transistor(D-HEMT) and fluorine(F) plasma treated enhancement-mode high-electron-mobility transistor(E-HEMT) are exposed to 60Co gamma radiation with a dose of 1.6 Mrad(Si).No degradation is observed in the performance of D-HEMT.However,the maximum transconductance of E-HEMT is increased after radiation.The 2DEG density and the mobility are calculated from the results of capacitance-voltage measurement.The electron mobility decreases after fluorine plasma treatment and recovers after radiation.Conductance measurements in a frequency range from 10 kHz to 1 MHz are used to characterize the trapping effects in the devices.A new type of trap is observed in the F plasma treated E-HEMT compared with the D-HEMT,but the density of the trap decreases by radiation.Fitting of G p /ω data yields the trap densities D T =(1-3) × 10 12 cm-2 · eV-1 and D T =(0.2 0.8) × 10 12 cm-2 ·eV-1 before and after radiation,respectively.The time constant is 0.5 ms-6 ms.With F plasma treatment,the trap is introduced by etch damage and degrades the electronic mobility.After 60Co gamma radiation,the etch damage decreases and the electron mobility is improved.The gamma radiation can recover the etch damage caused by F plasma treatment.     

用SCLC法研究低k多孔SiO2:F薄膜的隙态密度

用溶胶-凝胶法制备了低k多孔SiO₂:F薄膜，用空间电荷限制电流法(SCLC)研究了多孔SiO₂:F薄膜中的隙态密度以及掺F量对隙态密度的影响，得到了平衡费米能级附近的隙态密度约为7×10¹⁵cm^-3·eV^-1，以及带隙中隙态随能量的分布. 并对造成隙态的主要原因也进行了讨论.     

ZrO2 films deposited by photo-CVD at low temperatures

Zirconium oxide layers have been successfully deposited by photo-CVD at low temperatures. ZrO₂ growth was observed at temperatures as low as 100 °C. When deposited at 250 °C and above, these films exhibited a polycrystalline structure with a mixture of different crystal phases. Deposition at 300 °C was found to form moisture-free ZrO₂ films with a high refractive index of 2.1, a very low effective density of trapped electrons of ∼8.8×10⁸ cm^-2 and an interface trap density of 6.6×10⁹ cm^-2 eV^-1 being readily obtained. Received: 17 December 2001 / Accepted: 6 January 2002 / Published online: 3 June 2002     

Identification and elimination of inductively coupled plasma-induced defects in AlxGa1 - xN/GaN heterostructures

By using temperature-dependent Hall,variable-frequency capacitance-voltage and cathodoluminescence (CL) measurements,the identification of inductively coupled plasma (ICP)-induced defect states around the Al x Ga 1-x N/GaN heterointerface and their elimination by subsequent annealing in Al x Ga 1-x N/GaN heterostructures are systematically investigated.The energy levels of interface states with activation energies in a range from 0.211 to 0.253 eV below the conduction band of GaN are observed.The interface state density after the ICP-etching process is as high as 2.75×10 12 cm 2 ·eV 1.The ICP-induced interface states could be reduced by two orders of magnitude by subsequent annealing in N 2 ambient.The CL studies indicate that the ICP-induced defects should be Ga-vacancy related.     

Investigation of AlGaN/GaN fluorine plasma treatment enhancement-mode high electronic mobility transistors by frequency-dependent capacitance and conductance analysis

This paper reports fluorine plasma treatment enhancement-mode HEMTs (high electronic mobility transistors) EHEMTs and conventional depletion-mode HEMTs DHEMTs fabricated on one wafer using separate litho-photography technology. It finds that fluorine plasma etches the AlGaN at a slow rate by capacitance--voltage measurement. Using capacitance--frequency measurement, it finds one type of trap in conventional DHEMTs with τ_T=(0.5-6) ms and D_T= (1 - 5) × 10¹³ cm^-2·eV^-1. Two types of trap are found in fluorine plasma treatment EHEMTs, fast with τ_T(f)=(0.2-2) μs and slow with τ_T(s)=(0.5-6) ms. The density of trap states evaluated on the EHEMTs is D_T(f)=(1 - 3) × 10¹² cm^-2·eV^-1 and D_T(s)=(2 - 6) × 10¹² cm^-2·eV^-1 for the fast and slow traps, respectively. The result shows that the fluorine plasma treatment reduces the slow trap density by about one order, but introduces a new type of fast trap. The slow trap is suggested to be a surface trap, related to the gate leakage current.     

Improvement of transport properties for polycrystalline silicon prepared by plasma-enhanced chemical vapor deposition

The carrier transport property of polycrystalline silicon (poly-Si:H:F) thin films was studied in relation to film microstructure, impurity, in situ or post-annealing treatments to obtain better carrier transport properties. Poly-Si:H:F films were prepared from SiF₄ and H₂ gas mixtures at temperatures <300 °C. Dark conductivity of the films prepared at high SiF₄/H₂ gas flow ratio (e.g., 60/3 sccm) exhibits a high value for intrinsic silicon and its Fermi level is located near the conduction band edge. The carrier incorporation is suppressed well, either by in situ hydrogen plasma treatment or by post-annealing with high-pressure hot-H₂O vapor. It is confirmed that weak-bonded hydrogen atoms are removed by the hot-H₂O vapor annealing. In addition, evident correlation between impurity concentrations and dark conductivity is not found for these films. It is thought that the carrier incorporation in the films prepared at high SiF₄/H₂ gas flow ratios is related to grain-boundary defects such as weak-bonded hydrogen. By applying hot-H₂O vapor annealing at 310 °C to a 1-μm-thick p-doped (400)-oriented poly-Si:H:F film, Hall mobility was improved from 10 cm²/Vs to 17 cm²/Vs. Received: 7 August 2000 / Accepted: 2 March 2001 / Published online: 20 June 2001     

Characterization of vacuum evaporated In - Se thin films

The InSe films of different thicknesses (290–730 mm) were deposited onto glass substrates under a pressure of 3×10^?5 Torr by vacuum evaporation method. The composition (In=53.50%, Se=46.50%) of this film was confirmed using Auger Electron Spectroscopy (AES). Thicknesses of the deposited films have been measured using a Multiple Beam Interferometry. The amorphous nature of the film is confirmed with X-ray diffractogram. From the transmittance spectra in the range of 500 nm-1200 nm, it is observed that the film showed direct allowed transition. Effect of thickness on the optical parameters such as the fundamental band gap, absorption constant, refractive index of InSe thin films are reported. Under low electric field (～ 1.5×10⁵ Vcm^?1), the results of DC conductivity measurements revealed that the variable range hopping is the dominant conduction mechanism. The values of localized states density, localization radius and hopping energy of this film are estimated as 5.57×10²⁰ cm^?3eV^?1, 0.84 Å and 0.247 eV, respectively.     

The thermal stability of atomic layer deposited HfLaOx: Material and electrical characterization

HfLaO_x based Metal–oxide–semiconductor capacitors were fabricated by atomic layer deposition in this work. The material and electrical properties of the films along with the high temperature thermal treatment were investigated. It was found that samples undergoing annealing at 900 °C exhibited the best performance. The film was found to be crystallized to a cubic structure at 900 °C, and the roughness of the films was estimated to be 0.332 nm. For electrical characterization, the C–V curve of the film is in good agreement with the corresponding simulated curve, and the capacitor does not show any hysteresis. Moreover, the D_it near the center of silicon band gap exhibits lowest value, and it was calculated to be 2.28 × 10¹¹ eV^?1 cm^?2.