侧向外延法生长的高质量GaN及其外延缺陷的观察

在有条状SiO2图形的GaN“模板”上,侧向外延方法生长了高质量的GaN。荧光显微镜的结果表明在SiO2掩膜区有成核过程发生。原因可能是SiO2的质量不高,为GaN的生长提供了一些成核中心。在GaN层的厚度达到4．5μm后,侧向的融合开始发生。侧向生长的速度与垂直生长速度几乎相同。在所有的SiO：掩膜上方都形成了空洞。样品在240℃熔融的KOH中腐蚀13min。在SiO2掩膜区生长的GaN,其腐蚀坑密度(相当于穿透位错密度)减少到几乎为零。而在窗口区生长的GaN,腐蚀坑密度仍然很高,达到10^8cm^-2量级。同时,我们发现具有不同窗口尺寸的样品在SiO2掩膜区上侧向生长的CaN的晶体质量基本相同,与窗口区的宽度几乎无关。室温光荧光结果表明侧向外延法生长的CaN中的晶格失配应力已被部分释放。     

改进的DLA方法模拟薄膜二维生长

对经典的DLA模型进行改进，研究了薄膜的二维生长过程.通过改变表征吸附原子在基底扩散 能力的参量D_T，D_C以及表征沉积速率的参量D_V，得到 了与实验一致的薄 膜分形生长模式和团状生长模式.分析了薄膜的形核阶段原子团的大小分布，以及不同条件 下原子团的数目和大小随覆盖度的变化. 关键词： DLA 薄膜生长 分形生长 团状生长     

4H-SiC同质外延生长Grove模型研究

本文通过对4H-SiC同质外延化学反应和生长条件的分析,建立了4H-SiC同质外延生长的Grove模型,并结合实验结果进行了分析和验证.通过理论分析和实验验证,得到了外延中氢气载气流量和生长温度对4H-SiC同质外延生长速率的影响.研究表明:外延生长速率在衬底直径上为碗型分布,中心的生长速率略低于边缘的生长速率;随着载气流量的增大,生长速率由输运控制转变为反应速率控制,生长速率先增大而后逐渐降低;载气流量的增加,会使高温区会发生漂移,生长速率的理论值和实验出现一定的偏移;随着外延生长温度的升高,化学反应速率和气相转移系数都会增大,提高了外延速率;温度对外延反应速率的影响远大于对生长质量输运的影响,当温度过分升高后,外延生长会进入质量控制区;但过高的生长温度导致源气体在生长区边缘发生反应,生成固体粒子,使实际参与外延生长的粒子数减少,降低了生长速率,且固体粒子会有一定的概率落在外延层上,严重影响外延层的质量.通过调节氢气流量,衬底旋转速度和生长温度,可以有效的控制外延的生长速度和厚度的均匀性.     

微晶硅薄膜的表面粗糙度及其生长机制的X射线掠角反射研究

采用等离子体增强化学气相沉积技术沉积一系列处于不同生长阶段的微晶硅薄膜.通过同步辐射X射线掠角反射技术研究微晶硅薄膜的表面粗糙度随时间等的演化，探讨微晶硅薄膜的生长动力学过程及其生长机制.研究结果表明，在衬底温度为200 ℃，电极间距为2 cm，沉积气压为6.66×1０² Pa，射频功率密度为0.22 W/cm²，氢稀释度分别为99%和98%的沉积条件下，在玻璃衬底上生长的微晶硅薄膜生长指数β分别为0.21±0.01和0.24±0.01.根据KPZ模型，微晶硅薄膜的生长机制为有限扩散生长. 关键词： X射线掠角反射 微晶硅薄膜 表面粗糙度 生长机制     

氢化物气相外延生长高质量GaN膜生长参数优化研究

系统研究了低温成核层生长时间、高温生长时的V/Ⅲ 比以及生长温度对氢化物气相外延生长GaN膜晶体质量的影响. 研究发现合适的低温成核层为后续高温生长提供成核中心, 并能有效降低外延膜与衬底间的界面自由能, 促进成核岛的横向生长; 优化的V/Ⅲ比和最佳生长温度有利于降低晶体缺陷密度, 促进横向生长, 增强外延膜的二维生长. 利用扫描电子显微镜、原子力显微镜、高分辨X射线衍射、 低温光致发光谱和室温拉曼光谱对优化条件下生长的GaN外延膜进行了结构和光电特性表征. 测试结果表明, 膜表面平整光滑, 呈现二维生长模式表面形貌; (002)和(102)面摇摆曲线半高宽分别为317和343 arcsec; 低温光致发光谱中近带边发射峰为3.478 eV附近的中性施主束缚激子发射峰, 存在11 meV的蓝移, 半高宽为10 meV, 并且黄带发光强度很弱;常温拉曼光谱中E₂ (high) 峰发生1.1 cm^-1蓝移.结果表明, 优化条件下生长的GaN外延膜具有良好的晶体质量和光电特性, 但GaN 膜中存在压应力. 关键词： 氮化镓 氢化物气相外延 低温成核层     

分子束外延生长SiGe合金中位错密度的研究

Schimmel腐蚀液腐蚀结合高倍光学显微镜观察发现，不同尺寸的掩膜窗内生长的SiGe外延层中的位错密度在整个外延层中从SiGe/Si界面到SiGe外延层表面由少到多，再由多到少明显地分成3个区，无掩膜窗限制的大面积区内的SiGe层则只呈现2个区，掩膜材料与掩膜窗尺寸不同，这3个区的位错密度也不同，掩膜形成过程中产生的应力对衬底晶格的影响，以及掩膜边界对衬底与外延层的影响是造成这种不同的根本原因。     

N型4H-SiC同质外延生长

利用水平式低压热壁CVD (LP-HW-CVD) 生长系统,台阶控制生长和衬底旋转等优化技术,在偏晶向的4H-SiC Si(0001) 晶面衬底上进行4H-SiC同质外延生长,生长温度和压力分别为1550℃和10⁴ Pa,用高纯N₂作为n型掺杂剂的4H-SiC原位掺杂技术,生长速率控制在5μm/h左右.采用扫描电镜(SEM)、原子力显微镜(AFM),傅里叶变换红外光谱(FTIR)和Hg/4H-SiC肖特基结构对同质外延表面形貌、厚度、掺杂浓度以及均匀性进行了测试.实验结果表明,4H-SiC同质外延在表面无明显缺陷,厚度均匀性1.74%, 1.99% 和1.32%(σ/mean),掺杂浓度均匀性为3.37%,2.39%和2.01%.同种工艺条件下,样品间的厚度和掺杂浓度误差为1.54%和3.63%,有很好的工艺可靠性. 关键词： 4H-SiC 同质外延生长 水平热壁CVD 均匀性     

用激光分子束外延在Si衬底上外延生长高质量的TiN薄膜

采用激光分子束外延技术,利用两步法,在Si单晶衬底上成功地外延生长出TiN薄膜材料.原子力显微镜分析结果显示, TiN薄膜材料表面光滑,在10 μm×10 μm范围内,均方根粗糙度为0842nm.霍耳效应测量结果显示,TiN薄膜在室温条件下的电阻率为36×10^-5Ω·cm,迁移率达到5830 cm²/V·S,表明TiN薄膜材料是一种优良的电极材料.X射线θ—2θ扫描结果和很高的迁移率均表明,高质量的TiN薄膜材料被外延在Si衬底 关键词： 激光分子束外延 TiN单晶薄膜 外延生长     

高质量GaN外延薄膜的生长

综述了高质量ＧａＮ外延薄膜的生长研究工作的最新重要进展．主要采用的新工艺为：在较低温度下生长ＧａＮ缓冲层后再高温生长ＧａＮ外延薄膜,双气流金属有机化合物气相沉积（ＭＯＣＶＤ）,以及用开有窗口的ＳｉＯ２膜截断穿过位错后横向覆盖外延生长（ｅｐｉｔａｘｉａｌｙｌａｔｅｒａｌｏｖｅｒｇｒｏｗｔｈ）．Ｘ射线衍射和高分辨电镜研究证实,上述工艺使ＧａＮ外延薄膜质量得到显著提高．利用这种薄膜研制成的蓝色激光管即将投放市场．     

采用元胞自动机法模拟二元规则共晶生长

基于元胞自动机方法,建立了二元规则共晶生长的数值模拟模型.该模型耦合宏观温度场,考虑了溶质扩散、成分过冷以及曲率过冷等重要因素,实现了二元规则共晶的稳态层片生长.以共晶模型合金为对象,研究了定向凝固条件下不同过冷度、初始层片间距、温度梯度及凝固速率对共晶两相生长形貌及层片间距的影响,再现了两相在溶质扩散及界面能的相互作用下通过形核、分岔、湮没及合并等机理实现共晶层片间距的调整.模拟得到的结果与Jackson-Hunt模型及前人实验结果规律一致.将模型扩展到三维系统,验证了二元规则共晶生长三维模拟的可行性. 关键词： 规则共晶 生长形貌 层片间距 CA方法     

SiH4/H2等离子体气相生长硅薄膜的动力学模型

在化学气相沉积微晶硅薄膜过程中,为了降低成本,必须提高生长速率,但薄膜的微观结构和光电性能则随之降低,原因是成膜先驱物在薄膜表面上的扩散长度降低了. 本文利用量子化学的反应动力学理论建立有关成膜先驱物SiH₃和H的反应平衡方程,求解薄膜生长速率和成膜先驱物的扩散长度,并找出影响生长速率与扩散长度的微观参数,发现生长速率不仅与流向衬底的SiH₃的通量密度有关,而且与H的通量密度有关;SiH₃的扩散长度与衬底温度和薄膜表面的硅氢键的形态有关,当     

渐变掩蔽图形超低压选择区域生长法制备高质量InGaAsP多量子阱材料

采用超低压(22 mbar)选择区域生长(Selective Area Growth, SAG)金属有机化学汽相沉积(Metal-organic Chemical Vapor Deposition, MOCVD)技术成功制备了高质量InGaAsP/InGaAsP多量子阱(Multiple Quantum Well, MQW)材料. 在较小的掩蔽宽度变化范围内(15—30μm)，得到了46nm的光荧光(Photoluminescence, PL)波长偏移量，PL半高宽(Full-Width-at-Half- 关键词： 超低压 选择区域生长 渐变掩蔽图形     

Low temperature selective epitaxial growth of SiGe layers using various dielectric mask patterns and process conditions

The SiGe film was deposited at a low temperature of 675-725 °C with various dielectric mask patterns and process conditions using reduced pressure chemical vapor deposition. Pattern shape and process conditions associated with the growth rate and the Ge composition of the selective epitaxial growth (SEG) have been examined for the SiH₄-GeH₄-H₂ system. The objective was to understand the effect of pattern size at low temperature for the feasible device applications. The growth rates showed large non-uniformity of 1.4 depending upon the window width, 2-100 μm, of dielectric mask patterns. From the influence of the pattern shape/size and process parameters, the evolution of growth rates could be explained by the surface migration and the surface topology as well. After the surface migration control appearing dominantly at the initial stage, the surface topology became significant at the last part of the SEG process. The Ge composition is important to form the high quality SEG of SiGe films, so that it is important to optimize the flow rate of SiH₄, GeH₄, and total source gas.     

Migration characterization of Ga and In adatoms on dielectric surface in selective MOVPE

Migration characterizations of Ga and In adatoms on the dielectric surface in selective metal organic vapor phase epitaxy(MOVPE) were investigated. In the typical MOVPE environment, the selectivity of growth is preserved for Ga N,and the growth rate of Ga N micro-pyramids is sensitive to the period of the patterned SiO2 mask. A surface migration induced model was adopted to figure out the effective migration length of Ga adatoms on the dielectric surface. Different from the growth of Ga N, the selective area growth of In Ga N on the patterned template would induce the deposition of In Ga N polycrystalline particles on the patterned SiO2 mask with a long period. It was demonstrated with a scanning electron microscope and energy dispersive spectroscopy that the In adatoms exhibit a shorter migration length on the dielectric surface.     

Kinetic roughening in polymer film growth by vapor deposition

The growth front roughness of linear poly( p-xylylene) films grown by vapor deposition polymerization has been investigated using atomic force microscopy. The interface width w increases as a power law of film thickness d, w approximately d(beta), with beta = 0. 25+/-0.03, and the lateral correlation length xi grows as xi approximately d(1/z), with 1/z = 0.31+/-0.02. This novel scaling behavior is interpreted as the result of monomer bulk diffusion, and belongs to a new universality class that has not been discussed previously.     

沉积速率对甚高频等离子体增强化学气相沉积制备微晶硅薄膜生长标度行为的影响

本文采用甚高频等离子体增强化学气相沉积技术制备了沉积速率系列不同生长阶段的微晶硅薄膜,通过椭圆偏振技术研究了生长过程中微晶硅薄膜表面粗糙度的演化.实验结果表明:沉积速率为0.08和0.24nm/s的低速沉积时,硅薄膜表面粗糙度接近,生长指数分别为β=0.21和β=0.20,对应有限扩散生长模式,此时沉积速率对硅薄膜生长影响不大,原因是低速沉积时成膜先驱物有足够时间迁移到能量低的位置;当沉积速率增加到0.66nm/s时,硅薄膜表面粗糙度明显增加,生长指数β=0.81,大于0.5,出现了异常标度行为,与低速沉积的生长模式明显不同,原因是高速沉积时成膜前驱物来不及扩散就被下一层前驱物覆盖,降低了成膜前驱物在薄膜表面的扩散,使表面粗糙度增加和生长指数β增大.β大于0.5的异常标度行为与阴影效应有关.     

椭圆偏振技术研究VHF-PECVD高速沉积微晶硅薄膜的异常标度行为

采用VHF-PECVD技术高速沉积了不同生长阶段的微晶硅薄膜,通过椭圆偏振技术研究了生长过程中微晶硅薄膜表面粗糙度的演化.实验结果表明,沉积气压P_g=300 Pa时,β=0.81,其超出标度理论中β最大值为0.5范围,出现异常标度行为.这表明微晶硅薄膜高速生长中还存在其他粗糙化增加的因素,此粗糙化增加的因素与阴影作用有关. 关键词： 微晶硅薄膜 椭偏光谱法 生长机制 表面粗糙度     

Crystal Growth of Isotactic Polystyrene in Ultrathin Films: Thickness and Temperature Dependence

The growth rate and morphology of isotactic polystyrene crystals grown in ultrathin films have been examined experimentally in terms of the dependences both on the film thickness and on the crystallization temperature. We have found that the thickness dependence of growth rate, G, shows a crossover change when the film thickness becomes comparable with the lamellar thickness of the polymer crystals, irrespective of the temperatures. The morphology of crystals grown in ultrathin films shows a branching typical of dendrites, the growth of which is supposed to be controlled by a diffusion field. The change in the tip width of the dendrites with crystallization temperature follows the expected dependence of the Mullins–Sekerka stability length, ?_MS ∝ (D/G)^1/2, determined by the diffusion coefficient, D, and the growth rate. The results confirm that a diffusion field plays an essential role in the evolution of the structure.     

A growth kinetics model of rate decomposition for Si1-xGex alloy based on dimer theory

According to the dimer theory on semiconductor surface and chemical vapor deposition(CVD) growth characteristics of Si1-xGex, two mechanisms of rate decomposition and discrete flow density are proposed. Based on these two mechanisms, the Grove theory and Fick’s first law, a CVD growth kinetics model of Si1-xGex alloy is established. In order to make the model more accurate, two growth control mechanisms of vapor transport and surface reaction are taken into account. The paper also considers the influence of the dimer structure on the growth rate. The results show that the model calculated value is consistent with the experimental values at different temperatures.     

Nucleation of epitaxial graphene on SiC substrate by thermal annealing and chemical vapor deposition

Growth of epitaxial graphene (EG) on silicon carbide (SiC) is regarded as one of the most effective routes to high-quality graphene towards practical applicability. We try to build up a model to illuminate the nucleation process of EG on SiC by thermal decomposition. The model is derived from some experimental results and discloses that surface diffusion plays an important role in the nucleation. For the chemical vapor deposition process used, the organic gas as carbon precursor enables carbon deposition quickly for supporting the growth of high-quality graphene via vapor transformation, so that the nucleated and final graphene becomes almost stress-free and mimics the free-standing graphene. Our findings have a potential in preparing high-quality graphene by controlling the nucleation conditions.