Optical Defect in GaN-Based Laser Diodes Detected by Cathodoluminescence

GaN-based laser diodes （LDs） with 399 nm wavelength are grown on sapphire substrates by metal organic chemical vapour deposition （MOCVD）. Electroluminescence spectra of the fabricated LDs show that the LDs from some grown wafers failed to emit laser. The SEM and XRD results show the similar surface morphology and interface qualities of multi quantum wells （MQWs） and super-lattices between LDs that succeed and fail to emit laser. However, the cathodoluminescence （CL） measurements reveal a kind of optical defect rather than structural defect in un-emitted LDs. Further depth-dependent CL imaging observation indicates that such optical defects originate from the MQWs to the surface of LDs as a non-irradiative recombination centre that should cause the failure of laser emitting of LDs.     

Improvement of Properties of p-GaN by Mg Delta Doping

The Mg-delta-doped GaN structure has been grown by low-pressure metalorganic chemical vapour deposition.The Hall-effect measurements reveal that the electrical properties are enhanced. The hole concentration is enhanced twice and hole mobility is enhanced three times by Mg-delta doping. Both the etch pit density data and the x-ray diffraction data demonstrate that Mg-delta doping can reduce the threading dislocation density of p-type GaN epilayer.     

Effect of Interface Nanotexture on Light Extraction of InGaN-Based Green Light Emitting Diodes

We report the enhancement of the light extraction of InGaN-based green light emitting diodes （LEDs） via the interface nanotexturing. The texture consists of high-density nanocraters on the surface of a sapphire substrate with an in situ etching. The width of nanocraters is about 0.5 μm and the depth is around 0.1 μm. It is demonstrated that the LEDs with interface texture exhibit about a 27% improvement in luminance intensity, compared with standard LEDs. High power InGaN-based green LEDs are obtained by using the interface nanotexture. An optical ray-tracing simulation is performed to investigate the effect of interface nanotexture on light extraction.     

Microstructure Study on Heterostructures of AIInGaN/GaN/Al2O3 by Using Rutherford Backscattering/Channelling and XRD

A quaternary AlInGaN layer is grown by metal-organic chemical vapour deposition on a sapphire （0001） substrate with a thick （〉 1μm） GaN intermediate layer. The compositions of In and A1 are determined by Rutherford backscattering （RBS）. The low ratio between the channelling yield and random yield according to the spectra of RBS/C （χmin = 1.44%） means that the crystal quality of the AllnGaN film is perfect. The perpendicular and the parallel elastic strain of the AIlnGaN layer, e^⊥=-0.15% and e^//= 0.16%, respectively, are derived using a combination of XRD and RBS/channelling.     

Effect of Al Doping in the InGaN/GaN Multiple Quantum Well Light Emitting Diodes Grown by Metalorganic Chemical Vapour Deposition

The effect of Al doping in the GaN layer of InGaN/GaN multiple quantum-well light emitting diodes （LEDs） grown by metalorganic chemical vapour deposition is investigated by using photoluminescence （PL） and highresolution x-ray diffraction. The full width at half maximum of PL of A1 doped LEDs is measured to be about 12nm. The band edge photoluminescence emission intensity is enhanced significantly. In addition, the in-plane compressive strain in the Al-doped LEDs is improved significantly and measured by reciprocal space map. The output power of Al-doped LEDs is 130mW in the case of the induced current of 200mA.     

用X射线衍射法测定氮化镓马赛克结构中的面内扭转角

Ⅲ-Ⅴ族氮化物半导体材料在发光二极管、激光器和探测器方面有着广泛的应用,采用高分辨X射线衍射来测定用金属有机化学气相沉淀法在蓝宝石衬底上生长的氮化镓外延层马赛克结构的扭转角,分别研究了(0002)、(1013)、(1012)、(1011)、(2021)五个面的X射线摇摆曲线,并且用Pseudo-Voigt方程拟合每一个面的摇摆曲线,我们利用外推法很方便地测得氮化镓外延薄膜的面内扭转角。另外我们采用同步辐射X射线掠入射衍射对样品进行(1100)面反射φ扫描直接测得面内扭转角,对第一种方法进行验证,两种方法测量结果相同。从而提供一种简单、方便的GaN外延层的面内扭转角的测试方法,为深入研究GaN材料奠定良好基础。     

Electrical Characteristics of InGaN/AlGaN and InGaN/GaN MQW Near UV-LEDs

Electrical characteristics of In0.05 Ga0.95N/Al0.07Ga0.9aN and In0.05 Ga0.95N/GaN multiple quantum well （MQW） ultraviolet light-emltting diodes （UV-LEDs） at 400hm wavelength are measured. It is found that for InGaN/AlGaN MQW LEDs, both ideality factor and parallel resistance are similar to those of InGaN/GaN MQW LEDs, while series resistance is two times larger. It is suggested that the Al0.07Ga0.93N barrier layer did not change crystal quality and electrical characteristic of p-n junction either, but brought larger series resistance. As a result, InGaN/AlGaN MQW LEDs suffer more serious thermal dissipation problem although they show higher light output efficiency.     

Mosaic Structure Evolution in GaN Films with Annealing Time Grown by Metalorganic Chemical Vapour Deposition

We investigate mosaic structure evolution of GaN films annealed for a long time at 800℃ grown on sapphire substrates by metalorganic chemical vapour deposition by high-resolution x-ray diffraction. The result show that residual stress in GaN films is relaxed by generating edge-type threading dislocations （TDs） instead of screw-type TDs. Compared to as-grown GaN films, the annealed ones have larger mean twist angles corresponding to higher density of edge-type TDs but smaller mean tilt angles corresponding to lower density of screw-type TDs films. Due to the increased edge-type TD density, the lateral coherence lengths of the annealed GaN films also decrease. The results obtained from chemical etching experiment and grazing-incidence x-ray diffraction （GIXRD） also support the proposed structure evolution.     

用卢瑟福背散射/沟道技术及高分辨X射线衍射技术分析不同Al和In含量的AlInGaN薄膜的应变

利用卢瑟福背散射/沟道技术对在蓝宝石衬底上用金属有机化学气相沉积方法生长的有GaN缓冲层(>2μm)的一系列不同Al和In含量的AlInGaN薄膜进行组分及结晶品质的测量；并结合高分辨X射线衍射技术，通过对AlInGaN的对称(0002)面，及非对称(1015)面的θ—2θ扫描及倒空间扫描，可以精确测定AlInGaN外延层的晶格常数及水平和垂直方向的应变.实验结果表明AlInGaN 薄膜中不同含量Al和In对其应变有较大的影响，结合Vegard定理，对这一现象给出了理论的解释. 关键词： AlInGaN 高分辨X射线衍射 卢瑟福背散射/沟道 弹性应变     

侧向外延法生长的高质量GaN及其外延缺陷的观察

在有条状SiO2图形的GaN“模板”上,侧向外延方法生长了高质量的GaN。荧光显微镜的结果表明在SiO2掩膜区有成核过程发生。原因可能是SiO2的质量不高,为GaN的生长提供了一些成核中心。在GaN层的厚度达到4．5μm后,侧向的融合开始发生。侧向生长的速度与垂直生长速度几乎相同。在所有的SiO：掩膜上方都形成了空洞。样品在240℃熔融的KOH中腐蚀13min。在SiO2掩膜区生长的GaN,其腐蚀坑密度(相当于穿透位错密度)减少到几乎为零。而在窗口区生长的GaN,腐蚀坑密度仍然很高,达到10^8cm^-2量级。同时,我们发现具有不同窗口尺寸的样品在SiO2掩膜区上侧向生长的CaN的晶体质量基本相同,与窗口区的宽度几乎无关。室温光荧光结果表明侧向外延法生长的CaN中的晶格失配应力已被部分释放。