同质与异质外延掺杂CVD金刚石薄膜的结构与性能

采用化学气相沉积(CVD)技术,以高温高压(HTHP)合成的(100)金刚石和p型(100)Si为衬底制备了硫掺杂和硼-硫共掺杂金刚石薄膜,利用原子力显微镜(AFM)、扫描隧道显微镜(STM)及隧道电流谱(CITS)等手段分析同质和异质外延CVD掺杂金刚石薄膜的结构和性能.结果表明:异Si衬底上CVD金刚石的形核密度低,薄膜表面比较粗糙,粗糙度达到18.5nm;同质HTHP金刚石衬底上CVD金刚石薄膜晶粒尺寸约为10—50nm,表面平整,表面粗糙度为1.8nm.拉曼测试和电阻测量的结果显示,在HTHP金刚 关键词： 金刚石 掺杂 外延     

4H-SiC同质外延生长Grove模型研究

本文通过对4H-SiC同质外延化学反应和生长条件的分析,建立了4H-SiC同质外延生长的Grove模型,并结合实验结果进行了分析和验证.通过理论分析和实验验证,得到了外延中氢气载气流量和生长温度对4H-SiC同质外延生长速率的影响.研究表明:外延生长速率在衬底直径上为碗型分布,中心的生长速率略低于边缘的生长速率;随着载气流量的增大,生长速率由输运控制转变为反应速率控制,生长速率先增大而后逐渐降低;载气流量的增加,会使高温区会发生漂移,生长速率的理论值和实验出现一定的偏移;随着外延生长温度的升高,化学反应速率和气相转移系数都会增大,提高了外延速率;温度对外延反应速率的影响远大于对生长质量输运的影响,当温度过分升高后,外延生长会进入质量控制区;但过高的生长温度导致源气体在生长区边缘发生反应,生成固体粒子,使实际参与外延生长的粒子数减少,降低了生长速率,且固体粒子会有一定的概率落在外延层上,严重影响外延层的质量.通过调节氢气流量,衬底旋转速度和生长温度,可以有效的控制外延的生长速度和厚度的均匀性.     

4H-SiC同质外延的绿带发光与缺陷的关系

利用室温光致发光谱(PL)对CVD法生长的4H-SiC同质外延特性进行研究,发现有绿带发光(GL)特性.用扫描电子显微镜(SEM) 、二次离子质谱(SIMS)和X射线光电子谱(XPS)技术获得了4H-SiC样品纵截面形貌和元素相对含量分布.结果表明,GL与4H-SiC晶体中碳空位(V_C)及络合体缺陷相关,V_C和缓冲层的扩展缺陷(点缺陷和刃位错等)是GL微观来源.GL的半峰宽(FWHM) 反映了参与复合发光的V_C及其络合缺陷能级分散的程度.室温下获得的样品GL强度和光谱波长度可用于分析4H-SiC外延中缺陷分布和晶体质量. 关键词： 绿带发光 4H-SiC同质外延 晶体缺陷     

Si面4H-SiC衬底上外延石墨烯近平衡态制备

SiC热解法是制备大面积、高质量石墨烯的理想选择之一.外延石墨烯的晶体质量仍是制约其应用的关键因素之一.本文通过SiC热解法在4H-SiC(0001)衬底上制备单层外延石墨烯.通过引入氩气惰性气氛和硅蒸气,使SiC衬底表面的Si原子升华与返回概率接近平衡,外延石墨烯生长速率大大减慢,单层石墨烯的生长时间从15 min延长至75 min.测试分析表明,生长速率减慢,外延石墨烯中缺陷减少,晶体质量提高,使得外延石墨烯的电性能都得到改善,单层外延石墨烯的最高载流子迁移率达到1200 cm2/V·s,方阻604?/.以上结果表明,控制生长气氛,减慢生长速率是实现高质量外延石墨烯的可行途径之一.     

In0.5(Ga1-xAlx)0.5P合金的掺杂生长特性

利用LP-MOCVD分别生长Zn和S掺杂的In0.5(Ga1-xAlx)0 5P外延层,研究生长温度、掺杂源流量、V/Ⅲ比、Al组分以及衬底晶向偏离等生长条件对外延层掺杂浓度的影响.实验结果表明:降低生长温度和Al含量、增加DEZn流量、选择由(100)向(111)A偏6～15的衬底都有利于增加IRGaAlP合金中Zn的掺杂浓度;提高生长温度和增加SIH4流量、减小Al含量和V/Ⅲ比,都有助于增加Si掺杂浓度,而衬底晶向对Si掺杂浓度无影响.     

非故意掺杂GaN层厚度对蓝光LED波长均匀性的影响

通过调整非故意掺杂氮化镓层的厚度,分析氮化镓基LED外延生长过程中应力的演变行为,以控制外延片表面的翘曲程度,从而获得高均匀性与一致性的外延片。由于衬底与外延层之间的热膨胀系数差别较大,在生长温度不断变化的过程中,外延片的翘曲状态也随之改变。在n型氮化镓生长结束时,外延片处于凹面变形状态。在随后的过程中,外延薄膜"凹面"变形程度不断减小,甚至转变为"凸面"变形,所以n型氮化镓生长结束时外延片的变形程度会直接影响多量子阱沉积时外延片的翘曲状态。当非掺杂氮化镓沉积厚度为3.63μm时,外延片在n型氮化镓层生长结束时变形程度最大,在沉积多量子阱时表面最为平整,这与PLmapping测试所得波长分布以及标准差值最小相一致。通过合理控制非故意掺杂氮化镓层的厚度以调节外延层中的应力状态,可获得均匀性与一致性良好的LED外延片。     

在6H-SiC衬底上用低压MOVPE法生长AlN和GaN的过程中用(AlN/GaN)多层缓冲层来控制残余应力

人们已提出用BAlGaN四元系材料制备紫外光谱区的光发射器件.GaN和AlN二元系是这种四元材料在器件应用中的基础材料.6H-SiC衬底在氮化物生长中因其晶格失配小是一大优势,而且SiC衬底的热膨胀系数也和AlN的很接近.然而,对于AlN外延层来说,需要控制其中的残余应力,因为在SiC衬底上直接生长的AlN外延层中存在着因晶格失配所产生的压缩应力.另一方面,在SiC衬底上直接生长的GaN外延层中存在着拉伸应力.这种拉伸应力起源于GaN比衬底有着更大的热膨胀系数.本文讨论了在6H-SiC衬底上生长的氮化物外延层中残余应力的类型、数量及控制.为此目的,提出了在6H-SiC衬底上,无论是生长AlN,还是生长GaN,都可以采用(GaN/AlN)多层缓冲层的办法,作为控制残余应力的有效方法.我们还讨论了AlN和GaN外延层的结晶质量和残余应力间的关系.     

梯度掺杂与均匀掺杂GaN光电阴极的对比研究

为了提高负电子亲和势(NEA)GaN光电阴极的量子效率,利用金属有机化合物化学气相淀积(MOCVD)外延生长了梯度掺杂反射式GaN光电阴极,其掺杂浓度由体内到表面依次为1×10¹⁸ cm^-3,4×10¹⁷ cm^-3,2×10¹⁷ cm^-3和6×10¹⁶ cm^-3,每个掺杂浓度区域的厚度约为45 nm,总的厚度为180 nm.在超高真 关键词： NEA GaN光电阴极 梯度掺杂 量子效率 能带结构     

6H碳化硅衬底上硅碳锗薄膜的生长特性研究

采用低压热壁化学气相沉积法,在6H-SiC衬底(0001)面上生长了不同温度(1100—1250℃),不同GeH₄流量比(6.3%—25%)的SiCGe薄膜样品,研究了SiCGe薄膜的表面形貌、生长特性以及样品中Ge组分含量的变化. 扫描电镜测试结果表明,SiCGe薄膜在低温下倾向于岛状生长模式,随着生长温度提高,岛状生长逐渐过渡到层状生长模式,同时伴有岛形状和密度的变化. X射线光电子能谱测试得出SiCGe样品中的Ge含量约为0.15％—0.62％,在其他参数不变的情况下,样品的G 关键词： 碳化硅 化学气相沉积 反相边界 岛状生长     

金属有机物化学气相沉积同质外延GaN薄膜表面形貌的改善

为了获得高质量的GaN薄膜材料,研究了金属有机物气相沉积系统中GaN插入层对GaN衬底同质外延层表面宏观缺陷和晶体质量的影响.研究发现,插入层生长温度是影响GaN同质外延膜表面形貌和晶体质量的关键因素.由于生长模式与插入层生长温度相关,随着插入层生长温度的降低,外延膜生长模式由准台阶流模式转变为层状模式,GaN同质外延膜表面丘壑状宏观缺陷逐渐减少,但微观位错密度逐渐增大.通过对插入层温度和厚度的优化,进一步调控外延层的生长模式,最终有效降低了外延层表面的宏观缺陷,获得了表面原子级光滑平整、位错密度极低的GaN同质外延膜,其X射线衍射摇摆曲线(002),(102)晶面半峰宽分别为125arcsec和85arcsec,表面粗糙度均方根大小为0.23nm.     

SiC epitaxial layers grown by chemical vapour deposition and the fabrication of Schottky barrier diodes

This paper presents the results of unintentionally doped 4H-SiC epilayers grown on n-type Si-faced 4H-SiC substrates with 8° off-axis toward the [11\overline 2 0] direction by low pressure horizontal hot-wall chemical vapour deposition. Growth temperature and pressure are 1580~°C and 10⁴~Pa, respectively. Good surface morphology of the sample is observed using atomic force microscopy (AFM) and scanning electron microscopy (SEM). Fourier transform infrared spectroscopy (FTIR) and x-ray diffraction (XRD) are used to characterize epitaxial layer thickness and the structural quality of the films respectively. The carrier concentration in the unintentional 4H-SiC homoepitaxial layer is about 6.4×10¹⁴~cm^-3 obtained by c--V measurements. Schottky barrier diodes (SBDs) are fabricated on the epitaxial wafer in order to verify the quality of the wafer and to obtain information about the correlation between background impurity and electrical properties of the devices. Ni and Ti/4H-SiC Schottky barrier diodes with very good performances were obtained and their ideality factors are 1.10 and 1.05 respectively.     

Influence of silicon cluster on epitaxial growth of silicon carbide

Precursor concentration dependences of growth rate, doping concentration and surface morphology have been investigated in the epitaxial growth of 4H-SiC(0001) epilayers with horizontal hot-wall CVD system using various precursor concentrations under constant C/Si ratio. Form the experimental data it is found that silicon cluster which is formed through gas phase nucleation plays an important role in controlling the doping concentration and epitaxial growth rate of the silicon carbide. It was observed that t...     

Simulation of near-infrared photodiode detectors based on β-FeSi2/4H-SiC heterojunction

In this paper, we propose the near-infrared p-type β-FeSi₂/n-type 4H-SiC heterojunction photodetector with semiconducting silicide (β-FeSi₂) as the active region for the first time. Optoelectronic characteristics of the photodetector are simulated using a commercial simulator at room temperature. The results show that the photodetector has a good rectifying character and a good response to the near-infrared light. Interface states should be minimized to obtain a lower reverse leakage current. The response spectrum of the β-FeSi₂/4H-SiC detector, which consists of a p-type β-FeSi₂ absorption layer with a doping concentration of 1×10¹⁵ cm^-3 and a thickness of 2.5 μm, has a peak of 755 mA/W at 1.42 μm. The illumination of the SiC side obtains a higher responsivity than that of the β-FeSi₂ side. The results illustrate that the β-FeSi₂/4H-SiC heterojunction can be used as a near-infrared photodetector compatible with near-infrared optically-activated SiC-based power switching devices.     

Characterization of 4Hben SiC substrates and epilayers by Fourier transform infrared reflectance spectroscopy

The infrared reflectance spectra of both 4H-SiC substrates and epilayers are measured in a wave number range from 400 cm^-1 to 4000 cm^-1 using a Fourier-transform spectrometer. The thicknesses of the 4H-SiC epilayers and the electrical properties, including the free-carrier concentrations and the mobilities of both the 4H-SiC substrates and the epilayers, are characterized through full line-shape fitting analyses. The correlations of the theoretical spectral profiles with the 4H-SiC electrical properties in the 30 cm^-1-4000 cm^-1 and 400 cm^-1-4000 cm^-1 spectral regions are established by introducing a parameter defined as error quadratic sum. It is indicated that their correlations become stronger at a higher carrier concentration and in a wider spectral region (30 cm^-1-4000 cm^-1). These results suggest that the infrared reflectance technique can be used to accurately determine the thicknesses of the epilayers and the carrier concentrations, and the mobilities of both lightly and heavily doped 4H-SiC wafers.     

Determination of the transport properties in 4H-SiC wafers by Raman scattering measurement

The free carrier density and mobility in n-type 4H-SiC substrates and epilayers were determined by accurately analysing the frequency shift and the full-shape of the longitudinal optic phonon--plasmon coupled (LOPC) modes, and compared with those determined by Hall-effect measurement and that provided by the vendors. The transport properties of thick and thin 4H-SiC epilayers grown in both vertical and horizontal reactors were also studied. The free carrier density ranges between 2×10¹⁸ cm^-3 and 8×10¹⁸ cm^-3 with a carrier mobility of 30--55 cm²/(V·s) for n-type 4H-SiC substrates and 1×10¹⁶--3×10¹⁶ cm^-3 with mobility of 290--490 cm²/(V·s) for both thick and thin 4H-SiC epilayers grown in a horizontal reactor, while thick 4H-SiC epilayers grown in vertical reactor have a slightly higher carrier concentration of around 8.1×10¹⁶ cm^-3 with mobility of 380 cm²/(V·s). It was shown that Raman spectroscopy is a potential technique for determining the transport properties of 4H-SiC wafers with the advantage of being able to probe very small volumes and also being non-destructive. This is especially useful for future mass production of 4H-SiC epi-wafers.     

Laser annealing of Al implanted silicon carbide: Structural and optical characterization

Pulsed-laser-based methods have been applied for post-implant annealing of p-type Al-doped 4H-SiC wafers in order to restore the crystal structure and to electrically activate the doping species. The annealing was performed with the third harmonic (355 nm) of a Nd:YAG laser at 4 ns pulse duration. The epilayers were characterized by micro-Raman spectroscopy under surface and cross-sectional backscattering. Changes in the phonon mode-intensity were related to the laser annealing induced recrystallization of the implanted material. The results were compared with changes in the infrared reflectivity across the Reststrahlen band. Transmission electron microscopy analysis showed the formation of columnar polycrystalline structure after the laser annealing process.     

Single crystal growth of SiC and electronic devices

Single crystal growth of silicon carbide (Sic) and application to electronic devices are reviewed. In the crystal growth, bulk and homoepitaxial growth are picked up, and crystal quality and electrical properties are described. For electronic devices, various device processes are argued. Power devices based on Sic are stressed in this review.

Bulk single crystals of SiC can be grown by a sublimation method, and large-area 6H-SiC and 4H-SiC single crystals are obtained. The occurrence of SiC polytypes is affected by the growth condition, and can be controlled successfully by optimizing these conditions. 6H-SiC is grown on 6H-SiC (0001) Si-faces, and 4H-SiC on 6H-SiC (0001) C-faces. The crystallinity of bulk crystals is investigated by reflection high-energy electron diffraction (RHEED) and X-ray analysis, and characterization is carried out in detail by optical and electrical measurement.

Successful homoepitaxial vapor phase growth of SiC can be realized using off-axis (0001) substrates prepared by a sublimation method called “step-controlled epitaxy”. Since the crystallinity of epilayers is improved during the step-controlled epitaxy, this growth technique is a key for getting high-quality crystal surfaces. Impurity doping is controlled during homoepitaxial growth by employing impurity gases, such as N₂, trimethylaluminum (TMA), and B₂H₆. A wide-range of carrier concentrations of 5 × 10¹³～3 × 10¹⁸ cm^?3 for n-type and 5 × 10¹⁶～3 × 10²⁰ cm^?3 for p-type are realized. The impurity-incorporation mechanism in the step-controlled epitaxy is discussed based on the C/Si ratio dependence of impurity doping.

Electrical properties of SiC grown by step-controlled epitaxy are determined precisely. A high electron mobility of 720 cm²/Vs is obtained in an undoped 4H-SiC epilayer with an electron concentration of 2.5 × 10^l6 cm^?3 at 300 K. This electron mobility is about two times higher than that of 6H-Sic (～380 cm²/Vs). High breakdown fields of 1～5 × 10⁶ V/cm are obtained for both 6H- and 4H-SiC, one order of magnitude higher than those for Si. A high saturation electron drift velocity of 1.6 × 10⁷ cm/s is obtained in 4H-Sic, which may make possible high performance of high-frequency 4H-SiC power devices. Impurity levels and deep levels are investigated by Hall effect, admittance spectroscopy, and DLTS measurement. Metal/4H-SiC Schottky barrier heights are characterized and a strong dependence on metal work function without strong “pinning” is elucidated.

Device processes are described for ion implantation. Interface properties of SiO₂/SiC are characterized in detail using metal-oxide-semicond.     

Experimental analysis of current conduction through thermally grown SiO<Subscript>2</Subscript> on thick epitaxial 4H-SiC employing Poole-Frenkel mechanism

Electrical properties of SiO₂ grown on the Si-face of the epitaxial 4H-SiC substrate by wet thermal oxidation technique have been experimentally investigated in metal oxide-silicon carbide (MOSiC) structure with varying oxide thicknesses employing Poole-Frenkel (P-F) conduction mechanism. The quality of SiO₂ with increasing thickness in MOSiC structure has been analysed on the basis of variation in multiple oxide traps due to effective P-F conduction range. Validity of Poole-Frenkel conduction is established quantitatively employing electric field and the oxide thickness using forward I–V characteristics across MOSiC structures. From P-F conduction plot (ln(J/E) vs. E ^1/2), it is revealed that Poole-Frenkel conduction retains its validation after a fixed electric field range. The experimental methodology adopted is useful for the characterization of oxide films grown on 4H-SiC substrate.     

New 4H silicon carbide metal semiconductor field-effect transistor with a buffer layer between the gate and the channel layer

A new 4H silicon carbide metal semiconductor field-effect transistor (4H-SiC MESFET) structure with a buffer layer between the gate and the channel layer is proposed in this paper for high power microwave applications. The physics-based analytical models for calculating the performance of the proposed device are obtained by solving one- and two-dimensional Poisson's equations. In the models, we take into account not only two regions under the gate but also a third high field region between the gate and the drain which is usually omitted. The direct-current and the alternating-current performances for the proposed 4H-SiC MESFET with a buffer layer of 0.2 μ m are calculated. The calculated results are in good agreement with the experimental data. The current is larger than that of the conventional structure. The cutoff frequency (f_T) and the maximum oscillation frequency (f_max) are 20.4 GHz and 101.6 GHz, respectively, which are higher than 7.8 GHz and 45.3 GHz of the conventional structure. Therefore, the proposed 4H-SiC MESFET structure has better power and microwave performances than the conventional structure.     

n-SiC的电子拉曼散射及二级拉曼谱研究

研究了利用离子注入法得到的掺氮n-SiC拉曼光谱. 理论线形分析表明,与4H-SiC相比,6H-SiC中LO声子等离子体激元耦合模(LOPC模)拉曼位移随自由载流子浓度变化较小. 5145nm激发光下得到的电子拉曼散射光谱表明,k位处由1s(A₁)到1s(E)的能谷轨道跃迁带来的拉曼谱6H-SiC中有四条,4H-SiC中有二条;高频6303及635cm^-1处观察到的谱线被认为与深能级缺陷有关. 最后,利用纤锌矿型结构二级拉曼散射选择定则指认了6 关键词： 碳化硅 电子拉曼散射 轨道能谷分裂 倍频谱