高In组分InGaNAs/GaAs量子阱的生长及发光特性

采用分子束外延技术(MBE)在Ga As衬底上外延生长高In组分(40%)In Ga NAs/Ga As量子阱材料,工作波长覆盖1.3~1.55μm光纤通信波段。利用室温光致发光(PL)光谱研究了N原子并入的生长机制和In Ga NAs/Ga As量子阱的生长特性。结果表明:N组分增加会引入大量非辐射复合中心;随着生长温度从480℃升高到580℃,N摩尔分数从2%迅速下降到0.2%;N并入组分几乎不受In组分和As压的影响,黏附系数接近1;生长温度在410℃、Ⅴ/Ⅲ束流比在25左右时,In_(0.4)Ga_(0.6)N_(0.01)As_(0.99)/Ga As量子阱PL发光强度最大,缺陷和位错最少;高生长速率可以获得较短的表面迁移长度和较好的晶体质量。     

Si(001)衬底上分子束外延生长Ge0.975Sn0.025合金薄膜

使用低、高温两步法生长的高质量Ge薄膜作为缓冲层,在Si(001)衬底上采用分子束外延法生长出Ge_0.975Sn_0.025合金薄膜.X射线双晶衍射和卢瑟福背散射谱等测试结果表明,Ge_0.975Sn_0.025合金薄膜具有很好的晶体质量,并且没有发生Sn表面分凝.另外,Ge_0.975Sn_0.025合金薄膜在500 ℃下具有很好的热稳定性,有望在Si基光电器件中得到应用. 关键词： GeSn Ge 分子束外延 外延生长     

分子束外延Mn4N单晶薄膜的反常霍尔效应研究

Mn₄N是立方相的反钙钛矿型晶体,具有显著的亚铁磁性和反常霍尔效应.该文利用等离子辅助分子束外延在MgO(100)衬底上生长厚度为40 nm的Mn₄N(100)单晶薄膜,通过X射线衍射θ扫描和φ扫描,证实外延层的结构符合Mn₄N单晶的空间结构特征;化学态测试结果表明Mn₄N(100)薄膜内部存在Mn⁰、Mn²⁺和Mn⁴⁺等几种价态,其实际化学式为Mn_3.6N,薄膜中存在富余的N元素;电学测试数据表明Mn₄N(100)薄膜具有以电子为载流子的反常霍尔效应(在正磁场中得到负的霍尔电阻率),正常霍尔效应的贡献约占千分之六,其反常霍尔电阻率随着测试温度升高5 K～350 K单调增大,说明温度升高导致电子散射现象加剧.通过对测试数据分析可以推断,在5 K～50 K和50 K～75 K温度范围,反常霍尔效应的来源可分别归结为电子斜散射机制和电子边跳机制.在75 K～350 K这一温度范围内,反常霍尔效应...     

GaxN2:Zn3-x薄膜的分子束外延生长及其光学和电子输运性能表征

本文采用分子束外延技术,通过对金属分子束的精确控制,在MgO(002)基底上成功生长了Ga_xN₂∶Zn_3-x合金薄膜.高分辨率单晶X光衍射仪表征结果表明Ga_xN₂∶Zn_3-x合金薄膜仍是以(400)Zn₃N₂为主导的复合晶体结构,对衍射数据的分析得到该薄膜晶粒尺寸小.用扫描电子显微镜和能谱射线分析仪对其表面和成分做了深入的分析和讨论,在固定的金属流量比的生长环境下,不同厚度的样品在成膜后x均为0.65,化学通式Zn_2.35Ga_0.65N₂.该结果表明Ga元素属于重度掺杂,同时也体现了分子束外延技术在共掺杂技术中的优越性.本文也测量并讨论了Zn_2.35Ga_0.65N₂薄膜的光学性能,实验得到的1.85 eV的光学带隙与理论推算基本吻合,说明Ga的掺入有Ga-N结构...     

湿法刻蚀对Si基片孔点阵及ZnO外延薄膜周期形貌的影响

利用射频等离子体辅助分子束外延法,在刻有周期性孔点阵结构的Si衬底上生长了ZnO二维周期结构薄膜,系统研究了湿法化学刻蚀对孔形点阵Si(100),Si(111)基片表面形貌的影响,以及两种初底上ZnO外延薄膜的结晶质量与周期形貌的差异.X射线衍射及扫描电子显微测试结果表明：Si (111)衬底上生长出的ZnO二维周期结构薄膜具有较好的结晶质量与较好的周期性表面形貌.该研究结果为二维周期结构的制备提供了一种新颖的方法. 关键词： ZnO 分子束外延 Si 湿法刻蚀     

蓝宝石衬底上GaN/AlxGa1-xN超晶格插入层对AlxGa1-xN外延薄膜应变及缺陷密度的影响

室温300K下,由于Al_xGa_1-xN的带隙宽度可以从GaN的3.42eV到AlN的6.2eV之间变化,所以Al_xGa_1-xN是紫外光探测器和深紫外LED所必需的外延材料.高质量高铝组分Al_xGa_1-xN材料生长的一大困难就是Al_xGa_1-xN与常用的蓝宝石衬底之间大的晶格失配和热失配.因而采用MOCVD在GaN/蓝宝石上生长的Al_xGa_1-xN薄膜由于受张应力作用非常容易发生龟裂.GaN/Al_xGa_1-xN超晶格插入层技术是释放应力和减少Al_xGa_1-xN薄膜中缺陷的有效方法.研究了GaN/Al_xGa_1-xN超晶格插入层对GaN/蓝宝石上Al_xGa_1-xN外延薄膜应变状态和缺陷密度的影响.通过拉曼散射探测声子频率从而得到材料中的残余应力是一种简便常用的方法,Al_xGa_1-xN外延薄膜的应变状态可通过拉曼光谱测量得到.Al_xGa_1-xN外延薄膜的缺陷密度通过测量X射线衍射得到.对于具有相同阱垒厚度的超晶格,例如4nm/4nm,5nm/5nm,8nm/8nm的GaN/Al_0.3Ga_0.7N超晶格,研究发现随着超晶格周期厚度的增加Al_xGa_1-xN外延薄膜缺陷密度降低,Al_xGa_1-xN外延薄膜处于张应变状态,且5nm/5nmGaN/Al_0.3Ga_0.7N超晶格插入层Al_xGa_1-xN外延薄膜的张应变最小.在保持5nm阱宽不变的情况下,将垒宽增大到8nm,即十个周期的5nm/8nmGaN/Al_0.3Ga_0.7N超晶格插入层使Al_xGa_1-xN外延层应变状态由张应变变为压应变.由X射线衍射结果计算了Al_xGa_1-xN外延薄膜的刃型位错和螺型位错密度,结果表明超晶格插入层对螺型位错和刃型位错都有一定的抑制效果.透射电镜图像表明超晶格插入层使位错发生合并、转向或是使位错终止,且5nm/8nmGaN/Al_0.3Ga_0.7N超晶格插入层导致Al_xGa_1-xN外延薄膜中的刃型位错倾斜30°左右,释放一部分压应变.     

分子束外延法在Sapphire衬底上生长的Zn1－xMgxO薄膜折射率及厚度的测试

利用偏振光椭圆率测量仪对分子束外延(MBE)法在Sapphire衬底上生长的Zn_1-xMg_xO 薄膜的薄膜折射率和厚度进行了测试. 结合ICP法测得的薄膜中的Mg组成量，经数值拟合，导出表征薄膜厚度与薄膜生长条件、薄膜折射率与薄膜中的Mg组成量之间关系的曲线，为MBE法在Sapphire衬底上生长Zn_1-xMg_xO 薄膜时控制薄膜厚度以及在制作Zn_1-xMg_xO 薄膜的波导时控制薄膜的折射率提供了理论依据. 关键词： ZnMgO薄膜 偏振光椭圆率测量仪 折射率 分子束外延(MBE)     

分子束外延生长的(GaAs1－xSbx/InyGa1－yAs)/GaAs量子阱光致发光谱研究

报道了(GaAs_1-xSb_x/In_yGa_1-yAs)/Ga As量子阱结构的分子束外延生长与光致发光谱研究结果.变温与变激发功率光致发光谱的研究表明了此结构 为二型量子阱发光性质.讨论了光谱双峰结构的跃迁机制.通过优化生长条件，获得了室温1 31μm发光. 关键词： 分子束外延 量子阱 二型发光     

用激光分子束外延在Si衬底上外延生长高质量的TiN薄膜

采用激光分子束外延技术,利用两步法,在Si单晶衬底上成功地外延生长出TiN薄膜材料.原子力显微镜分析结果显示, TiN薄膜材料表面光滑,在10 μm×10 μm范围内,均方根粗糙度为0842nm.霍耳效应测量结果显示,TiN薄膜在室温条件下的电阻率为36×10^-5Ω·cm,迁移率达到5830 cm²/V·S,表明TiN薄膜材料是一种优良的电极材料.X射线θ—2θ扫描结果和很高的迁移率均表明,高质量的TiN薄膜材料被外延在Si衬底 关键词： 激光分子束外延 TiN单晶薄膜 外延生长     

辐射感生应力弛豫对AlmGa1－mN/GaN HEMT电学特性的影响

基于电荷控制原理建立了辐射感生Al_mGa_1-mN势垒层应力弛豫对Al_mGa_1-mN/GaN HEMTs器件电学特性影响的解析模型，并进行了仿真分析.结果表明，对于高Al组分HEMTs器件，Al_mGa_1-mN势垒层中辐射感生的应力弛豫影响更为显著.辐射感生应力弛豫不但导致2DEG下降和阈值电压正向漂移，而且能够引起漏极输出电流的明显下降.辐射感生应力弛豫是赝配Al_mGa_1-mN/GaN HEMTs辐射损伤的重要机理之一. 关键词： mGa_1-mN/GaN')" href="#">Al_mGa_1-mN/GaN HEMT 辐射损伤 应力弛豫     

内嵌InAs量子点的δ掺杂GaAs/AlxGa1-xAs二维电子气特性分析

采用分子束外延技术对δ掺杂GaAs/Al_xGa_1-xAs二维电子气(2DEG)样品进行了生长. 在样品生长过程中, 分别改变掺杂浓度(N_d)、空间隔离层厚度(W_d) 和Al_xGa_1-xAs中Al组分(x_Al)的大小, 并在双温(300 K, 78 K)条件下对生长的样品进行了霍尔测量; 结合测试结果, 分别对N_d, W_d及x_Al与GaAs/Al_xGa_1-xAs 2DEG的载流子浓度和迁移率之间的关系规律进行了细致的分析讨论. 生长了包含有低密度InAs量子点层的δ掺杂GaAs/Al_xGa_1-xAs 2DEG 样品, 采用梯度生长法得到了不同密度的InAs量子点. 霍尔测量结果表明, 随着InAs量子点密度的增加, GaAs/Al_xGa_1-xAs 2DEG的迁移率大幅度减小, 实验中获得了密度最低为16×10⁸/cm²的InAs量子点样品. 实验结果为内嵌InAs量子点的δ掺杂GaAs/Al_xGa_1-xAs 2DEG的研究和应用提供了依据和参考. 关键词： 二维电子气 InAs量子点 载流子浓度 迁移率     

Correlation between pit formation and phase separation in thick InGaN film on a Si substrate

We demonstrate improved surface pit and phase separation in thick InGaN grown on a GaN/Si (111) substrate, using plasma-assisted molecular beam epitaxy with an indium modulation technique. The formation of surface pit and compositional inhomogeneity in the InGaN epilayer are investigated using atomic force microscopy, scanning electron microscopy and temperature-dependent photoluminescence. Indium elemental mapping directly reveals that poor compositional homogeneity occurs near the pits. The indium-modulation epitaxy of InGaN minimizes the surface indium segregation, leading to the reduction in pit density and size. The phase separation in InGaN with a higher pit density is significantly suppressed, suggesting that the pit formation and the phase separation are correlated. We propose an indium migration model for the correlation between surface pit and phase separation in InGaN.     

Lattice damage in InGaN induced by swift heavy ion irradiation

The microstructural responses of In_0.32Ga_0.68N and In_0.9Ga_0.1N films to 2.25 GeV Xe ion irradiation have been investigated using x-ray diffraction, Raman scattering, ion channeling and transmission electron microscopy. It was found that the In-rich In_0.9Ga_0.1N is more susceptible to irradiation than the Ga-rich In_0.32Ga_0.68N. Xe ion irradiation with a fluence of 7× 10¹¹ ions·cm^-2 leads to little damage in In_0.32Ga_0.68N but an obvious lattice expansion in In_0.9Ga_0.1N. The level of lattice disorder in In_0.9Ga_0.1N increases after irradiation, due to the huge electronic energy deposition of the incident Xe ions. However, no Xe ion tracks were observed to be formed, which is attributed to the very high velocity of 2.25 GeV Xe ions. Point defects and/or small defect clusters are probably the dominant defect type in Xe-irradiated In_0.9Ga_0.1N.     

利用In0.82Ga0.18As与InP衬底之间的应力制作结构材料的缓冲层

采用低压金属有机化学气相淀积(LP-MOCVD)技术,在InP(100)衬底上生长In0.82Ga0.18As,研究生长温度对In0.82Ga0.18As材料表面形貌、结晶质量和电学性能的影响.利用InP(100)衬底与In0.82Ga0.18As材料晶格失配所产生的应变,在不同的生长温度下应变释放程度不同,进而在In...     

Temperature and excitation dependence of stimulated emission and spontaneous emission in InGaN epilayer

Temperature and excitation dependent photoluminescence(PL) of InGaN epilayer grown on c-plane Ga N/sapphire template by molecular beam epitaxy(MBE) has been systematically investigated. The emission spectra of the sample consisted of strong multiple peaks associated with one stimulated emission(SE) located at 430 nm and two spontaneous emissions(SPE) centered at about 450 nm and 480 nm, indicating the co-existence of shallow and deep localized states.The peak energy of SE exhibiting weak s-shaped variation with increasing temperature revealed the localization effect of excitons. Moreover, an abnormal increase of the SPE intensity with increasing temperature was also observed, which indicated that the carrier transfer between the shallow and deeper localized states exists. Temperature dependent time-resolved PL(TRPL) demonstrated the carrier transfer processes among the localized states. In addition, a slow thermalization of hot carriers was observed in InGaN film by using TRPL and transient differential reflectivity, which is attributed to the phonon bottleneck effect induced by indium aggregation.     

Effect of In_x Ga_(1-x )N “continuously graded” buffer layer on InGaN epilayer grown by metalorganic chemical vapor deposition

In this paper we report on the effect of an In x Ga1-x N continuously graded buffer layer on an InGaN epilayer grown on a GaN template.In our experiment,three types of buffer layers including constant composition,continuously graded composition,and the combination of constant and continuously graded composition are used.Surface morphologies,crystalline quality,indium incorporations,and relaxation degrees of InGaN epilayers with different buffer layers are investigated.It is found that the In x Ga1-x N continuously graded buffer layer is effective to improve the surface morphology,crystalline quality,and the indium incorporation of the InGaN epilayer.These superior characteristics of the continuously graded buffer layer can be attributed to the sufficient strain release and the reduction of dislocations.     

氮化物抛物量子阱中类氢杂质态能量

采用变分方法研究氮化物抛物量子阱(GaN/Al_xGa_1-xN)材料中类氢杂质态的能级,给出基态能量、第一激发态能量、结合能和跃迁能量等物理量随抛物量子阱宽度变化的函数关系.研究结果表明,基态能量、第一激发态能量、基态结合能和1s→2p±跃迁能量随着阱宽L的增大而减小,最后接近于GaN中3D值.GaN/Al_0.3Ga_0.7N抛物量子阱对杂质态的束缚程度比GaAs/Al_0.3Ga_0.7As抛物量子阱强,因此,在GaN/Al_0.3-Ga_0.7N抛物量子阱中束缚于杂质中心处的电子比在GaAs/Al_0.3Ga_0.7As抛物量子阱中束缚于杂质中心处的电子稳定.     

Ab-initio calculations of bandgap tuning of In1-xGaxY (Y = N,P) alloys for optoelectronic applications

The Ⅲ-V alloys and doping to tune the bandgap for solar cells and other optoelectronic devices has remained a hot topic of research for the last few decades. In the present article, the bandgap tuning and its influence on optical properties of In_1-xGa_xN/P, where (x = 0.0, 0.25, 0.50, 0.75, and 1.0) alloys are comprehensively analyzed by density functional theory based on full-potential linearized augmented plane wave method (FP-LAPW) and modified Becke and Johnson potentials (TB-mBJ). The direct bandgaps turn from 0.7 eV to 3.44 eV, and 1.41 eV to 2.32 eV for In_1-xGa_xN/P alloys, which increases their potentials for optoelectronic devices. The optical properties are discussed such as dielectric constants, refraction, absorption, optical conductivity, and reflection. The light is polarized in the low energy region with minimum reflection. The absorption and optical conduction are maxima in the visible region, and they are shifted into the ultraviolet region by Ga doping. Moreover, static dielectric constant ε₁(0) is in line with the bandgap from Penn's model.     

Effects of InGaN barriers with low indium content on internal quantum efficiency of blue InGaN multiple quantum wells

Blue In_0.2Ga_0.8N multiple quantum wells (MQWs) with In_xGa_{1 - x}N (x=0.01-0.04) barriers are grown by metal organic vapour phase epitaxy. The internal quantum efficiencies (IQEs) of these MQWs are studied in a way of temperature-dependent photoluminescence spectra. Furthermore, a 2-channel Arrhenius model is used to analyse the nonradiative recombination centres (NRCs). It is found that by adopting the InGaN barrier beneath the lowest well, it is possible to reduce the strain hence the NRCs in InGaN MQWs. By optimizing the thickness and the indium content of the InGaN barriers, the IQEs of InGaN/InGaN MQWs can be increased by about 2.5 times compared with conventional InGaN/GaN MQWs. On the other hand, the incorporation of indium atoms into the intermediate barriers between adjacent wells does not improve IQE obviously. In addition, the indium content of the intermediate barriers should match with that of the lowest barrier to avoid relaxation.     

Localized exciton dynamics in InGaN quantum well structures

InGaN multiple quantum well laser diode (LD) wafer that lased at 400 nm was shown to have the InN mole fraction, x, of only 6% in the wells. Nanometer-probe compositional analysis showed that the fluctuation of x was as small as 1% or less, which is the resolution limit. However, the wells exhibited a Stokes-like shift (SS) of 49 meV and an effective localization depth E₀ was estimated by time-resolved photoluminescence (TRPL) measurement to be 35 meV at 300 K. Since the effective electric field due to polarization in the wells is estimated to be as small as 286 kV/cm, SS is considered to originate from an effective bandgap inhomogeneity. Because the well thickness fluctuation was insufficient to produce SS or E₀, the exciton localization is considered to be an intrinsic phenomenon in InGaN material. Indeed, bulk cubic In_0.1Ga_0.9N, which does not suffer any polarization field or thickness fluctuation effect, exhibited an SS of 140 meV at 77 K and similar TRPL results. The origin of the localization is considered to be due to the large bandgap bowing and In clustering in InGaN material. Such shallow and low density localized states are leveled by injecting high density carriers under the lasing conditions for the 400 nm LDs.