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Si(001)衬底上分子束外延生长Ge0.975Sn0.025合金薄膜   总被引:1,自引:0,他引:1       下载免费PDF全文
使用低、高温两步法生长的高质量Ge薄膜作为缓冲层,在Si(001)衬底上采用分子束外延法生长出Ge0.975Sn0.025合金薄膜.X射线双晶衍射和卢瑟福背散射谱等测试结果表明,Ge0.975Sn0.025合金薄膜具有很好的晶体质量,并且没有发生Sn表面分凝.另外,Ge0.975Sn0.025合金薄膜在500 ℃下具有很好的热稳定性,有望在Si基光电器件中得到应用. 关键词: GeSn Ge 分子束外延 外延生长  相似文献   
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Strain-compensated Ge/Si0.15Ge0.85 multiple quantum wells were grown on an Si0.1>Ge0.9 virtual substrate using ultrahigh vacuum chemical vapor deposition technology on an n+-Si(001) substrate. Photoluminescence measurements were performed at room temperature, and the quantum confinement effect of the direct-bandgap transitions of a Ge quantum well was observed, which is in good agreement with the calculated results. The luminescence mechanism was discussed by recombination rate analysis and the temperature dependence of the luminescence spectrum.  相似文献   
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Strain-compensated Ge/Si0.15Ge0.85 multiple quantum wells were grown on an Si0.1Ge0.9 virtual substrate using ultrahigh vacuum chemical vapor deposition technology on an n +-Si(001) substrate.Photoluminescence measurements were performed at room temperature,and the quantum confinement effect of the direct-bandgap transitions of a Ge quantum well was observed,which is in good agreement with the calculated results.The luminescence mechanism was discussed by recombination rate analysis and the temperature dependence of the luminescence spectrum.  相似文献   
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胡炜玄  成步文  薛春来  苏少坚  王启明 《中国物理 B》2011,20(12):126801-126801
The Si epitaxial films are grown on Si (100) substrates using pure Si2H6 as a gas source using ultrahigh vacuum chemical vapour deposition technology. The values of growth temperature Tg are 650 ℃, 700 ℃, 730 ℃, 750 ℃, and 800 ℃. Growth mode changes from island mode to step-flow mode with Tg increasing from 650 ℃ to 700 ℃. Rippled surface morphologies are observed at Tg = 700 ℃, 730 ℃, and 800 ℃, but disappear when Tg = 750 ℃. A model is presented to explain the formation and the disappearance of the ripples by considering the stability of the step-flow growth.  相似文献   
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用PAA模板法实现硅基纳米孔阵列结构   总被引:1,自引:0,他引:1       下载免费PDF全文
用二次阳极氧化方法制备出分立、双向贯通并且超薄(500—1000 nm)的多孔阳极氧化铝膜,贴合到硅片上进行干法刻蚀,实现图形转移,得到了硅基纳米孔阵列结构,并对工艺中影响图形转移质量的因素进行了探索.扫描电镜(SEM)测试结果表明该途径得到的纳米结构孔形态均匀且大面积有序,孔深度可达到125 nm.对该样品进行热氧化处理后进行光致发光(PL)测试,结果表明其光致发光机理是基于通常较微弱的TO声子辅助的硅带边发光,并实现了显著发光增强,对这种增强效果的物理机理进行了理论分析.该结构具有的独特光学特性为利用 关键词: 多孔阳极氧化铝模板 硅基纳米孔阵列结构 图形转移  相似文献   
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