Si(001)衬底上分子束外延生长Ge0.975Sn0.025合金薄膜

使用低、高温两步法生长的高质量Ge薄膜作为缓冲层,在Si(001)衬底上采用分子束外延法生长出Ge_0.975Sn_0.025合金薄膜.X射线双晶衍射和卢瑟福背散射谱等测试结果表明,Ge_0.975Sn_0.025合金薄膜具有很好的晶体质量,并且没有发生Sn表面分凝.另外,Ge_0.975Sn_0.025合金薄膜在500 ℃下具有很好的热稳定性,有望在Si基光电器件中得到应用. 关键词： GeSn Ge 分子束外延 外延生长     

Room-temperature direct-bandgap photoluminescence from strain-compensated Ge/SiGe multiple quantum wells on silicon

Strain-compensated Ge/Si_0.15Ge_0.85 multiple quantum wells were grown on an Si_0.1>Ge_0.9 virtual substrate using ultrahigh vacuum chemical vapor deposition technology on an n⁺-Si(001) substrate. Photoluminescence measurements were performed at room temperature, and the quantum confinement effect of the direct-bandgap transitions of a Ge quantum well was observed, which is in good agreement with the calculated results. The luminescence mechanism was discussed by recombination rate analysis and the temperature dependence of the luminescence spectrum.     

被动调Q双波长Yb:YAG板条激光的偏振控制

采用激光二极管(LD)来泵浦Yb:YAG板条晶体被动调Q双波长激光器，开展可控激光输出偏振态的实验研究。实验搭建紧凑的V型谐振腔，通过调节输出镜(OC)的倾角可以实现激光输出从0°水平线偏振到90°垂直线偏振的切换。通过实验设计可以得出最终的输出偏振态取决于腔内的附加相位差，当腔内附加相位差为π时，输出偏振由水平偏振向垂直偏振切换。实验结果表明：当OC倾角的变化量约为3.6 mrad时，线偏振态从水平偏振切换至垂直偏振，水平线偏振的消光比最优为28.98 dB,垂直线偏振的消光比最优为25.96 dB;在泵浦功率为18.42 W时，获得了1.66 W的平衡双波长激光输出，对应的脉冲宽度为42.6 ns。     

Ge(001)衬底上分子束外延生长高质量的Ge1-xSnx合金

Ge_1-xSn_x是一种新型IV族合金材料, 在光子学和微电子学器件研制中具有重要应用前景. 本文使用低温分子束外延(MBE)法, 在Ge(001)衬底上生长高质量的Ge_1-xSn_x合金, 组分x分别为1.5%, 2.4%, 2.8%, 5.3%和14%, 采用高分辨X射线衍射(HR-XRD)、卢瑟福背散射谱(RBS) 和透射电子显微镜(TEM)等方法表征Ge_1-xSn_x合金的材料质量. 对于低Sn组分(x≤ 5.3%)的样品, Ge_1-xSn_x合金的晶体质量非常好, RBS的沟道/随机产额比(χ_min)只有5.0%, HR-XRD曲线中Ge_1-xSn_x衍射峰的半高全宽(FWHM)仅100' 左右. 对于x=14%的样品, Ge_1-xSn_x合金的晶体质量相对差一些, FWHM=264.6'. 关键词： 锗锡合金 锗 分子束外延     

Room-temperature direct-bandgap photoluminescence from strain-compensated Ge/SiGe multiple quantum wells on silicon

Strain-compensated Ge/Si_0.15Ge_0.85 multiple quantum wells were grown on an Si_0.1Ge_0.9 virtual substrate using ultrahigh vacuum chemical vapor deposition technology on an n +-Si（001） substrate.Photoluminescence measurements were performed at room temperature,and the quantum confinement effect of the direct-bandgap transitions of a Ge quantum well was observed,which is in good agreement with the calculated results.The luminescence mechanism was discussed by recombination rate analysis and the temperature dependence of the luminescence spectrum.     

GeSn合金的晶格常数对Vegard定律的偏离

在Si (001)衬底上, 以高质量的弛豫Ge薄膜作为缓冲层, 先后生长Sn组分x分别为2.5%, 5.2%和7.8%的完全应变的三层Ge_1-xSn_x合金薄膜. 在Si (001)衬底上直接生长了x分别为0.005, 0.016, 0.044, 0.070和0.155的五个弛豫Ge_1-xSn_x样品. 通过卢瑟福背散射谱、高分辨X射线衍射和X射线倒易空间图等方法测量了Ge_1-xSn_x合金的组分 与晶格常数. 实验得到的晶格常数相对Vegard定律具有较大的正偏离, 弯曲系数b=0.211 Å.     

Formation of rippled surface morphology during Si/Si （100） epitaxy by ultrahigh vacuum chemical vapour deposition

The Si epitaxial films are grown on Si (100) substrates using pure Si2H6 as a gas source using ultrahigh vacuum chemical vapour deposition technology. The values of growth temperature T_g are 650 ℃, 700 ℃, 730 ℃, 750 ℃, and 800 ℃. Growth mode changes from island mode to step-flow mode with T_g increasing from 650 ℃ to 700 ℃. Rippled surface morphologies are observed at T_g = 700 ℃, 730 ℃, and 800 ℃, but disappear when T_g = 750 ℃. A model is presented to explain the formation and the disappearance of the ripples by considering the stability of the step-flow growth.     

用PAA模板法实现硅基纳米孔阵列结构

用二次阳极氧化方法制备出分立、双向贯通并且超薄（500—1000 nm）的多孔阳极氧化铝膜,贴合到硅片上进行干法刻蚀,实现图形转移,得到了硅基纳米孔阵列结构,并对工艺中影响图形转移质量的因素进行了探索.扫描电镜（SEM）测试结果表明该途径得到的纳米结构孔形态均匀且大面积有序,孔深度可达到125 nm.对该样品进行热氧化处理后进行光致发光（PL）测试,结果表明其光致发光机理是基于通常较微弱的TO声子辅助的硅带边发光,并实现了显著发光增强,对这种增强效果的物理机理进行了理论分析.该结构具有的独特光学特性为利用 关键词： 多孔阳极氧化铝模板 硅基纳米孔阵列结构 图形转移     

Strained and strain-relaxed epitaxial Ge1-xSnx alloys on Si（100） substrates

Epitaxial Ge1-xSnx alloys are grown separately on a Ge-buffer/Si(100) substrate and directly on a Si(100) substrate by molecular beam epitaxy (MBE) at low temperature. In the case of the Ge buffer/Si(100) substrate, a high crystalline quality strained Ge0.97Sn0.03 alloy is grown, with a χmin value of 6.7% measured by channeling and random Rutherford backscattering spectrometry (RBS), and a surface root-mean-square (RMS) roughness of 1.568 nm obtained by atomic force microscopy (AFM). In the case of the Si(100) substrate, strain-relaxed Ge0.97Sn0.03 alloys are epitaxially grown at 150°C-300°C, with the degree of strain relaxation being more than 96%. The X-ray diffraction (XRD) and AFM measurements demonstrate that the alloys each have a good crystalline quality and a relatively flat surface. The predominant defects accommodating the large misfit are Lomer edge dislocations at the interface, which are parallel to the interface plane and should not degrade electrical properties and device performance.