AlGaN/GaN高电子迁移率晶体管器件电离辐照损伤机理及偏置相关性研究

本文利用~(60)Coγ射线,针对AlGaN/GaN高电子迁移率晶体管(high-electron mobility transistors,HEMT)器件,开展了在不同偏置下器件电离辐照总剂量效应实验研究.采用1/f噪声结合直流电学特性参数对实验结果进行测量分析,分析结果表明,受到辐照诱生氧化物缺陷电荷与界面态的影响,当辐照总剂量达到1 Mrad(Si)时,零偏条件下AlGaN/GaN HEMT器件的电学参数退化得最大,其中,饱和漏电流减小36.28%,最高跨导降低52.94%;基于McWhorter模型提取了AlGaN/GaN HEMT器件辐照前后的缺陷密度,零偏条件下辐照前后缺陷密度变化最大,分别为4.080×10~(17)和6.621×10~(17)cm~(-3)·eV~(-1).其损伤机理是在氧化物层内诱生缺陷电荷和界面态,使AlGaN/GaN HEMT器件的平带电压噪声功率谱密度增加.     

高能氩离子辐照硅产生的缺陷研究

在室温下750MeV氩离子对本征单晶硅进行辐照,通过用正电子湮没寿命测量技术、电子顺磁共振技术以及红外光吸收方法研究了辐照产生的缺陷.结果表明:电中性双空位是辐照产生的主要空位团;在4.3×10¹⁴ions/cm²的高剂量下未见样品发生非晶化转变;虽然在离子射程末端双空位的浓度随剂量的增加而显著增大,但在以电离激发过程为主要能损方式的区域里双空位的浓度基本不变.据此可以认为,电子能损过程对辐照产生的缺陷有退人作用.     

多量子阱激光二极管质子辐射效应及其退火特性

 研究5和2 MeV质子对法布里-珀罗（FP）腔结构及分布反馈（DFB）结构的多量子阱激光二极管的辐射效应,结果显示：在5×10¹²～5×10¹³ cm^-2质子注量范围内,随着注量的增大,激光二极管阈值电流逐渐增大,电流-电压特性的低压区电流渐渐增大。由60Coγ总剂量实验结果推断:质子对实验器件的损伤源于质子位移效应。采用Trim程序的模拟结果表明：在2 MeV质子射程以内,2 MeV质子要比5 MeV质子产生的空位数多。这使得相同辐照注量下,2 MeV质子要比5 MeV质子导致的阈值电流增大更多,损伤更为严重。激光二极管辐射损伤存在着正向偏置退火效应,FP和DFB结构的二极管具有相似的加电退火规律,均可拟合成指数衰减形式,退火曲线可以分成退火常数不同的几段进行拟合。正向偏置退火效应使得辐照期间,处于加电状态的激光二极管比处于短路状态的激光二极管退化程度有所减弱。     

用于质子和伽马射线探测的金刚石薄膜探测器的辐照性能

 研制出CVD金刚石薄膜探测器,在国家串列加速器和⁶⁰Co稳态辐射源上分别完成了该探测器对9 MeV质子束流和1.25 MeV γ射线的辐照性能研究。结果表明:该探测器在9 MeV质子照射累积强度达到10¹³ cm^-2时,探测器信号电荷收集效率减小量低于3.5%,辐照前后探测器暗电流没有明显变化。计算得到9 MeV质子对该探测器的损伤系数为1.3×10^-16 μm^-1·cm²。由于γ射线与金刚石作用产生的电子起到了填补缺陷的作用,探测器信号电荷收集效率随γ射线照射剂量的增加略有增加,在γ射线累积照射量达到10.32 C/kg时,其增幅小于0.7%。说明金刚石薄膜探测器具有较高耐辐照强度,适用于高强度辐射测量领域。     

质子辐照空间级硅橡胶的正电子淹没寿命谱研究

 用正电子淹没寿命谱方法（PALS）研究了质子辐照对空间级硅橡胶KH-L-Y微观结构的影响。试验结果表明，PALS谱所揭示的最长寿命成分的t₃, I₃及自由体积分数Vf随辐照剂量的增加开始明显下降；而当辐照剂量大于10¹⁵cm^-2后，随剂量的增加平缓上升。辐照剂量小于10¹⁵cm^-2时，质子辐照使硅橡胶自由体积减小，分子链间堆砌紧密；辐照剂量大于10¹⁵cm^-2时，质子辐照使硅橡胶自由体积增大。交联密度及DMA测试结果同样表明，质子辐照在剂量较小时硅橡胶的交联密度及玻璃化转变温度增加，辐照以交联效应为主；而剂量较大时辐照降解占优势。     

增强型Cascode结构氮化镓功率器件的高能质子辐射效应研究

针对增强型共栅共源(Cascode)级联结构和耗尽型AlGaN/GaN功率器件,利用60 MeV能量质子开展辐射效应研究.获得了经质子辐照后器件电学性能的退化规律,并与常规耗尽型HEMTs器件辐照后的电学性能进行了比较,发现增强型Cascode结构器件对质子辐照更加敏感,分析认为级联硅基MOS管的存在是其对质子辐照敏感的主要原因.质子辐照使硅基MOS管栅氧化层产生大量净的正电荷,诱导发生电离损伤效应,使其出现阈值电压负向漂移及栅泄漏电流增大等现象.利用等效(60 MeV能量质子,累积注量1×10¹² p/cm²)剂量的⁶⁰Co γ射线辐射器件得到电离损伤效应结果,发现器件的电学性能退化规律与60 MeV能量质子辐照后的退化规律一致.通过蒙特卡罗模拟得到质子入射在Cascode型器件内诱导产生的电离能损和非电离能损,模拟结果表明电离能损是导致器件性能退化的主要原因.     

keV 质子辐照对Kapton/Al光学性能的影响

 采用空间综合辐照设备对Kapton/Al薄膜进行了质子辐照地面模拟试验，选取质子能量90 keV,辐照通量5.0×10¹¹ cm¹²·s^-1。通过辐照前后光谱反射系数的变化考察了实验样品的光学性能退化特征。借助于反射光谱和紫外-可见吸收光谱和傅里叶转换红外光谱分析技术分析了辐照后Kapton/Al光学性能的退化机理。研究结果表明：辐照过程中样品表面发生了复杂的化学反应，随着辐照剂量的增加光能隙逐渐减小，Kapton吸收曲线的末端边缘发生红移并且在可见光区吸收强度增加。     

中子辐照对AlGaN/GaN高电子迁移率晶体管器件电特性的影响

本文采用能量为1 MeV的中子对SiN钝化的AlGaN/GaN HEMT(高电子迁移率晶体管)器件进行了最高注量为1015cm-2的辐照.实验发现:当注量小于1014cm-2时,器件特性退化很小,其中栅电流有轻微变化(正向栅电流IF增加,反向栅电流IR减小),随着中子注量上升,IR迅速降低.而当注量达到1015cm-2时,在膝点电压附近,器件跨导有所下降.此外,中子辐照后,器件欧姆接触的方块电阻退化很小,而肖特基特性退化却相对明显.通过分析发现辐照在SiN钝化层中引入的感生缺陷引起了膝点电压附近漏电流和反向栅泄漏电流的减小.以上结果也表明,SiN钝化可以有效地抑制中子辐照感生表面态电荷,从而屏蔽了绝大部分的中子辐照影响.这也证明SiN钝化的AlGaN/GaN HEMT器件很适合在太空等需要抗位移损伤的环境中应用.     

增强型AlGaN/GaN高电子迁移率晶体管高温退火研究

深入研究了两种增强型AlGaN/GaN高电子迁移率晶体管(HEMT)高温退火前后的直流特性变化.槽栅增强型AlGaN/GaN HEMT在500 ℃ N₂中退火5 min后,阈值电压由0.12 V正向移动到0.57 V,器件Schottky反向栅漏电流减小一个数量级.F注入增强型AlGaN/GaN HEMT在 400 ℃ N₂中退火2 min后,器件阈值电压由0.23 V负向移动到-0.69 V,栅泄漏电流明显增大.槽栅增强型器件退火过程中Schottky有效势垒     

AlGaN/GaN异质结载流子面密度测量的比较与分析

对MOCVD技术在蓝宝石衬底上生长的不同Al组分AlGaN/GaN异质结进行了范德堡法Hall测量和电容-电压(C-V)测量，发现Hall测量载流子面密度值大于C-V测量值，并且随着AlGaN层Al组分的增加，两种测量值都在增加，同时它们的差值也在增加.认为产生这一结果的原因有两方面.一方面，Ni/Au肖特基金属淀积在AlGaN/GaN异质结上，改变了AlGaN势垒层的表面状态，使得一部分二维电子气(2DEG)电子被抽取到空的施主表面态中，从而减小了AlGaN/GaN异质结界面势阱中的2DEG浓度.随着势垒层Al组分的增加，AlGaN层产生了更多的表面态，从而使得更多的电子被抽取到了空的表面态中.另一方面，由于C-V测量本身精确度受到串联电阻的影响，使得测量电容小于实际电容，从而低估了载流子浓度.     

Neutron irradiation effects on AlGaN/GaN high electron mobility transistors

AlGaN/GaN high electron mobility transistors (HEMTs) were exposed to 1 MeV neutron irradiation at a neutron fluence of 1 × 10¹⁵ cm^-2. The dc characteristics of the devices, such as the drain saturation current and the maximum transconductance, decreased after neutron irradiation. The gate leakage currents increased obviously after neutron irradiation. However, the rf characteristics, such as the cut-off frequency and the maximum frequency, were hardly affected by neutron irradiation. The AlGaN/GaN heterojunctions have been employed for the better understanding of the degradation mechanism. It is shown in the Hall measurements and capacitance-voltage tests that the mobility and concentration of two-dimensional electron gas (2DEG) decreased after neutron irradiation. There was no evidence of the full-width at half-maximum of X-ray diffraction (XRD) rocking curve changing after irradiation, so the dislocation was not influenced by neutron irradiation. It is concluded that the point defects induced in AlGaN and GaN by neutron irradiation are the dominant mechanisms responsible for performance degradations of AlGaN/GaN HEMT devices.     

Neutron irradiation effects on A1GaN//GaN high electron mobility transistors

AlGaN/GaN high electron mobility transistors(HEMTs) were exposed to 1 MeV neutron irradiation at a neutron fluence of 1 × 10 15 cm 2.The dc characteristics of the devices,such as the drain saturation current and the maximum transconductance,decreased after neutron irradiation.The gate leakage currents increased obviously after neutron irradiation.However,the rf characteristics,such as the cut-off frequency and the maximum frequency,were hardly affected by neutron irradiation.The AlGaN/GaN heterojunctions have been employed for the better understanding of the degradation mechanism.It is shown in the Hall measurements and capacitance-voltage tests that the mobility and concentration of two-dimensional electron gas(2DEG) decreased after neutron irradiation.There was no evidence of the full-width at half-maximum of X-ray diffraction(XRD) rocking curve changing after irradiation,so the dislocation was not influenced by neutron irradiation.It is concluded that the point defects induced in AlGaN and GaN by neutron irradiation are the dominant mechanisms responsible for performance degradations of AlGaN/GaN HEMT devices.     

The effects of 60Co γ-ray irradiation on the DC characteristics of enhancement-mode AlGaN/GaN high-electron-mobility transistors

The effects of 60Co γ-ray irradiation on the DC characteristics of AlGaN/GaN enhancement-mode high-electron-mobility transistors (E-mode HEMTs) are investigated. The results show that having been irradiated by 60Co γ-rays at a dose of 3 Mrad (Si), the E-mode HEMT reduces its saturation drain current and maximal transconductance by 6% and 5%, respectively, and significantly increases both forward and reverse gate currents, while its threshold voltage is affected only slightly. The obvious performance degradation of E-mode AlGaN/GaN HEMTs is consistent with the creation of electronegative surface state charges in the source-gate spacer and gate-drain spacer after being irradiated.     

Strain modification of AlGaN layers using swift heavy ions

Epitaxial AlGaN/GaN layers grown by molecular beam epitaxy (MBE) on SiC substrates were irradiated with 150 MeV Ag ions at a fluence of 5×10¹² ions/cm². The samples used in this study are 50 nm Al_0.2Ga_0.8N/1 nm AlN/1 μ m GaN/0.1 μ m AlN grown on SI 4H-SiC. Rutherford backscattering spectrometry/channeling strain measurements were carried out on off-normal axis of irradiated and unirradiated samples. In an as-grown sample, AlGaN layer is partially relaxed with a small tensile strain. After irradiation, this strain increases by 0.22% in AlGaN layer. Incident ion energy dependence of dechanneling parameter shows E ^1/2 dependence, which corresponds to the dislocations. Defect densities were calculated from the E ^1/2 graph. As a result of irradiation, the defect density increased on both GaN and AlGaN layers. The effect of irradiation induced-damages are analyzed as a function of material properties. Observed results from different characterization techniques such as RBS/channeling, high-resolution XRD and AFM are compared and complemented with each other to deduce the information. Possible mechanisms responsible for the observations have been discussed in detail.     

Significant performance enhancement in AlGaN/GaN high electron mobility transistor by high-κ organic dielectric

The electrical properties of AlGaN/GaN high electron mobility transistor (HEMT) with and without high-κ organic dielectrics are investigated. The maximum drain current I_{D max} and the maximum transconductance g_{m max} of the organic dielectric/AlGaN/GaN structure can be enhanced by 74.5%, and 73.7% compared with those of the bare AlGaN/GaN HEMT, respectively. Both the threshold voltage V_T and g_{m max} of the dielectric/AlGaN/GaN HEMT are strongly dielectric-constant-dependent. Our results suggest that it is promising to significantly improve the performance of the AlGaN/GaN HEMT by introducing the high-κ organic dielectric.     

GaInP/GaAs/Ge三结太阳电池不同能量质子辐照损伤模拟

以GaInP/GaAs/Ge三结太阳电池为研究对象,开展了能量为0.7, 1, 3, 5, 10 MeV的质子辐照损伤模拟研究,建立了三结太阳电池结构模型和不同能量质子辐照模型,获得了不同质子辐照条件下的I-V曲线,光谱响应曲线,结合已有实验结果验证了本文模拟结果,分析了三结太阳电池短路电流、开路电压、最大功率、光谱响应随质子能量的变化规律,利用不同辐照条件下三结太阳电池最大输出功率退化结果,拟合得到了三结太阳电池最大输出功率随位移损伤剂量的退化曲线.研究结果表明,质子辐照会在三结太阳电池中引入位移损伤缺陷,使得少数载流子扩散长度退化幅度随质子能量的减小而增大,从而导致三结太阳电池相关电学参数的退化随质子能量的减小而增大.相同辐照条件下,中电池光谱响应退化幅度远大于顶电池光谱响应退化幅度,中电池抗辐照性能较差,同时中电池长波范围内光谱响应的退化幅度比短波范围更大,表明中电池相关电学参数的退化主要来源于基区损伤.     

The effects of ⁶⁰Co γ-ray irradiation on the DC characteristics of enhancement-mode AlGaN/GaN high-electron-mobility transistors

The effects of 60Co γ-ray irradiation on the DC characteristics of AlGaN/GaN enhancement-mode high-electron-mobility transistors (E-mode HEMTs) are investigated. The results show that having been irradiated by 60Co γ-rays at a dose of 3 Mrad (Si), the E-mode HEMT reduces its saturation drain current and maximal transconductance by 6% and 5%, respectively, and significantly increases both forward and reverse gate currents, while its threshold voltage is affected only slightly. The obvious performance degradation of E-mode AlGaN/GaN HEMTs is consistent with the creation of electronegative surface state charges in the source-gate spacer and gate-drain spacer after being irradiated.     

CMOS图像传感器在质子辐照下热像素的产生和变化规律

应用于空间的图像传感器在辐射影响下产生的热像素严重影响空间光电探测性能,本文通过质子辐照试验研究了热像素的产生和变化规律。首先,使用3 MeV和10 MeV两种能量的质子对图像传感器进行辐照,分析不同能量、不同注量的质子辐照产生热像素的性质;其次,再对辐照后的器件进行退火试验,分析热像素的退火规律。对于相同注量辐照,3 MeV质子辐照下热像素产生率大约是10 MeV质子辐照下的2.3倍,但是10 MeV质子辐照产生热像素的灰度值高于3 MeV质子;辐照过程中热像素的数量都是随着注量的增加线性增加。退火过程中,热像素数量都不断减少,而3 MeV质子辐照产生的热像素相比于10 MeV质子,退火更为显著。结果表明,质子辐照下每个质子与器件之间的作用过程及产生缺陷的机制是相对独立的,不同质子的作用过程之间没有相关性。不同能量的质子辐照产生缺陷的类型不同,导致热像素具有不同特性。