Raman spectrum study of graphite irradiated by swift heavy ions

Highly oriented pyrolytic graphites are irradiated with 40.5-Me V and 67.7-Me V ^112Sn-ions in a wide range of fluences： 1×10^11 ions/cm^2–1×10^14ions/cm^2. Raman spectra in the region between 1200 cm^-1 and 3500cm^-1 show that the disorder induced by Sn-ions increases with ion fluence increasing. However, for the same fluence, the amount of disorder is greater for 40.5-Me V Sn-ions than that observed for 67.7-Me V Sn-ions, even though the latter has a slightly higher value for electronic energy loss. This is explained by the ion velocity effect. Importantly, ～ 3-cm^-1frequency shift toward lower wavenumber for the D band and ～ 6-cm^-1 shift toward lower wavenumber for the 2D band are observed at a fluence of 1×10^14 ions/cm^2, which is consistent with the scenario of radiation-induced strain. The strain formation is interpreted in the context of inelastic thermal spike model, and the change of the 2D band shape at high ion fluence is explained by the accumulation of stacking faults of the graphene layers activated by radiation-induced strain around ion tracks. Moreover,the hexagonal structure around the ion tracks is observed by scanning tunneling microscopy, which confirms that the strains near the ion tracks locally cause electronic decoupling of neighboring graphene layers.     

各向异性静态随机存储器中的多位翻转分析研究

重离子实验结果表明,具有高线性能量转移(LET)或大角度入射的快重离子导致静态随机存储器(SRAM)中的多位翻转(MBU)比例增大,甚至超过单位翻转比例。单个离子径迹中的电荷可以沿着径向扩散数个微米,被临近的灵敏区收集后引起MBU。器件灵敏区的各向异性空间布局与离子入射方向共同影响测试器件的MBU图形特征。位线接触点的纵向隔离导致横向型成为主要的两位翻转图形;"L"型和"田"型分别是主要的三位翻转和四位翻转图形。最后,对SRAM抗MBU加固设计和实验验证方法进行了讨论。     

快重离子辐照C60薄膜的强电子激发效应研究

利用能量为2.0GeV的¹³⁶Xe和2.7GeV的²³⁸U离子对C₆₀薄膜进行了辐照,并用傅立叶变换红外光谱、X射线衍射谱和拉曼散射技术分析了辐照过的C₆₀样品,在傅立叶变换红外光谱上,首次观察到一个位于670cm^－1处的,表征未知结构的新峰,研究了其强度随电子能损和辐照剂量的变化规律.分析结果表明,电子能量转移主导了C₆₀薄膜的损伤过程;而损伤的部分恢复是由强电子激发的退火效应引起的;另外,离子的速度在损伤的建立过程中也起了一定的作用     

GeV能量的Fe离子在C60薄膜中的辐照效应研究

利用傅立叶转换红外光谱和Raman谱仪分析了0.98 GeV的Fe离子在电子能损Se为3.5 keV/nm时， 不同辐照剂量（5×1010 —8×1013 ions/cm2)下， 在C60薄膜中引起的辐照损伤效应。 分析表明， Fe离子辐照引起了C60分子的聚合与损伤。 在辐照剂量达到一中间值1×1012 ions/cm2， C60分子的损伤得到部分恢复， 归因于电子激发引起的退火效应。 通过对Raman数据的拟合分析， 演绎出Fe离子辐照在C60材料中形成的潜径迹截面或引起损伤的截面约为1.32×10-14 cm2。     

高能氩离子辐照硅产生的缺陷研究

在室温下750MeV氩离子对本征单晶硅进行辐照,通过用正电子湮没寿命测量技术、电子顺磁共振技术以及红外光吸收方法研究了辐照产生的缺陷.结果表明:电中性双空位是辐照产生的主要空位团;在4.3×10¹⁴ions/cm²的高剂量下未见样品发生非晶化转变;虽然在离子射程末端双空位的浓度随剂量的增加而显著增大,但在以电离激发过程为主要能损方式的区域里双空位的浓度基本不变.据此可以认为,电子能损过程对辐照产生的缺陷有退人作用.     

Investigation of the energy resolution with a RETGEM detector

A novel Micro-pattern gaseous detector （MPGD）, thick GEM with electrodes made of a resistive material （RETGEM） is presented. In this paper we mainly investigate the energy resolution of a RETGEM in Ar＋CO2 with different gas mixtures. The results indicate that an energy resolution 30% in single and double mode can be obtained. The existence of an optimum energy resolution is discussed.     

利用重离子辐照技术制备锂离子电池隔膜

用能量11.4MeV/u和注量1×108ions/cm2的197Au离子垂直辐照聚丙烯薄膜,通过电导测量法监测温度、硫酸浓度和重铬酸钾浓度对径迹蚀刻速率的影响,得到合适的蚀刻条件;成功制备出孔径范围在600—1000nm的重离子径迹聚丙烯孔膜,并用场发射扫描电镜对孔的形状及孔径大小进行了表征,对孔洞锥角的形成进行了分析,为重离子辐照技术制备锂离子电池隔膜提供了实验数据。     

Surface Disorder of GaN Irradiated by Highly Charged Arq+-Ions

The surface damage to gallium nitride films irradiated by Ar^q＋ （6≤q≤16） ions at room temperature is studied by the atomic force microscopy. It is found that when charge state exceeds a threshold value, significant swelling was turned into obvious erosion in the irradiated region. The surface change of the irradiated region strongly depends on the charge state and ion fluence. On the other hand, surface change is less dependent on the kinetic energy nearly in the present experimental range （120 keV≤Ek≤220 keV）. For q≤14, surface of the irradiated region is covered with an amorphous layer, rough and bulgy. A step-up appears between the irradiated and un-irradiated region. Moreover, the step height and the surface roughness are functions of the ion dose and charge state, and increase with the increase of dose and charge state. Especially at and near boundary, a sharp bump like ridges in irradiated areas is observed, and there appear characteristic grooves in un-irradiated areas. For q=16, surface of the irradiated region was etched and erased.     

高电荷态离子$lt;sup$gt;126$lt;/sup$gt;Xe$lt;sup$gt;$lt;i$gt;q$lt;/i$gt;+$lt;/sup$gt;引起GaN表面形貌变化研究

用不同电荷态的¹²⁶Xe^q+离子（9≤q≤30）在室温下轰击GaN晶体表面,经原子力显微镜分析表明,当q>18,辐照区域由隆起转为显著的刻蚀.被轰击后的GaN晶体表面形貌主要取决于入射离子的电荷态.同时,样品表面形貌还与入射离子的剂量和入射角有关;在实验参数范围,与入射离子的初动能没有明显关系（180 keV≤E_k≤600 keV）.当入射离子的电荷态q=18,与样品表面法线成60°角倾斜入射和垂直表面入射时,样品的表面几乎没有变化,只是倾斜入射后有很微小的隆起;当q＜18时,样品表面膨胀隆起,粗糙度增强,倾斜入射时表面隆起比垂直入射时更明显,而且都有清晰的峰状分界区;当q＞18时,样品表面被蚀刻呈凹陷状,有明显的齿状刻痕,且侵蚀深度与离子剂量近似呈线性关系,倾斜入射时的刻蚀深度大于垂直入射时的刻蚀深度. 关键词： 高电荷态离子 GaN晶体 原子力显微镜 表面形貌     

电化学方法制备Si阵列微孔的工艺研究

对用电化学方法制备Si大孔阵列管坑工艺进行了初步探索。 通过对Si在KOH溶液中各向异性湿法蚀刻和在HF酸溶液中的电化学蚀刻过程中各种参数的摸索, 确定在室温下制备大孔阵列的最佳配比浓度, 蚀刻出符合要求的管坑阵列, 为进一步制备结构化闪烁屏奠定了实验基础。 The 3 D structures in silicon are increasingly coming to use in many fields. For example, the high resolution X ray digital imaging detector can be made by coupling CCD and the scintillating screen which is made by the array trenches filled with CsI(Tl). In the present work, we explored the technology of etching micro array on the n type silicon with high resistance. By studying the relative parameters of anisotropic etching of KOH and electro chemical etching of HF, the optimized concentration of HF was determined and the micro pore array trenches with 200 μm in depth were realized. The results establish an experimental base for further fabrication of the scintillating screen.