质子辐照下正照式和背照式图像传感器的单粒子瞬态效应

CMOS图像传感器应用于空间任务时容易受到质子单粒子效应影响.本文采用商用正照式(FSI)和背照式(BSI)CMOS图像传感器开展了不同能量的质子辐照实验,实验中通过在线测试方法分析质子单粒子效应.其中,质子能量最高为200 Me V,总注量为10¹⁰ particle/cm~2,结果未发现外围电路的单粒子效应,但观察到像素阵列出现不同形状的单粒子瞬态亮斑.通过提取瞬态亮斑沉积能量和尺寸大小两个特征参数,比较了不同能量质子对瞬态亮斑特征的影响,以及FSI和BSI中瞬态亮斑特征的差异.最后,结合仿真方法,与实验结果进行比较,预测了质子在CMOS图像传感器像素单元产生瞬态亮斑的能量沉积分布.仿真结果验证了光电二极管耗尽区厚度减小和外延层减薄是导致BSI图像传感器中质子能量沉积分布左移的主要因素.     

CMOS图像传感器在质子辐照下热像素的产生和变化规律

应用于空间的图像传感器在辐射影响下产生的热像素严重影响空间光电探测性能,本文通过质子辐照试验研究了热像素的产生和变化规律。首先,使用3 MeV和10 MeV两种能量的质子对图像传感器进行辐照,分析不同能量、不同注量的质子辐照产生热像素的性质;其次,再对辐照后的器件进行退火试验,分析热像素的退火规律。对于相同注量辐照,3 MeV质子辐照下热像素产生率大约是10 MeV质子辐照下的2.3倍,但是10 MeV质子辐照产生热像素的灰度值高于3 MeV质子;辐照过程中热像素的数量都是随着注量的增加线性增加。退火过程中,热像素数量都不断减少,而3 MeV质子辐照产生的热像素相比于10 MeV质子,退火更为显著。结果表明,质子辐照下每个质子与器件之间的作用过程及产生缺陷的机制是相对独立的,不同质子的作用过程之间没有相关性。不同能量的质子辐照产生缺陷的类型不同,导致热像素具有不同特性。     

Radiation Effects Due to 3 MeV Proton Irradiations on Back-Side Illuminated CMOS Image Sensors

Benefitting from the higher quantum efficiency and sensitivity compared with the front-side illumination(FSI)CMOS image sensors(CISs), backside illumination(BSI) CMOS image sensors tend to replace CCDs and FSI CISs for space applications. However, the radiation damage effects and mechanisms of BSI CISs in the radiation environment are not well understood. We provide radiation effects due to 3MeV proton irradiations of BSI CISs dedicated to imaging by the analyses of mean dark current increase, dark current nonuniformity and full well capacity in pixel arrays and isolated photodiodes. Additionally, the present annealing certifies the radiationinduced defects, which are responsible for the parameter degradations in BSI CISs.     

Total ionizing dose effects in pinned photodiode complementary metal-oxide-semiconductor transistor active pixel sensor

A pinned photodiode complementary metal–oxide–semiconductor transistor(CMOS) active pixel sensor is exposed to ~(60)Co to evaluate the performance for space applications. The sample is irradiated with a dose rate of 50 rad(SiO_2)/s and a total dose of 100 krad(SiO_2), and the photodiode is kept unbiased. The degradation of dark current, full well capacity,and quantum efficiency induced by the total ionizing dose damage effect are investigated. It is found that the dark current increases mainly from the shallow trench isolation(STI) surrounding the pinned photodiode. Further results suggests that the decreasing of full well capacity due to the increase in the density, is induced by the total ionizing dose(TID) effect, of the trap interface, which also leads to the degradation of quantum efficiency at shorter wavelengths.