用N2-H2等离子体氮化GaAs衬底对ECR-PEMOCVD生长立方GaN的影响

我们研究了采用电子回旋共振等离子体增强金属有机化学气相沉积(ECR-PEMOCVE)技术在GaAs(001)衬底上外延生长立方GaN的过程中衬底氮化条件对外延膜生长的影响.发现氮化时在氮等离子体中加入氢等离子体对于立方GaN薄膜生长具有显著影响.和氮化过程中不加入氢等离子体相比,氮化过程中加入氢等离子体生长出的外延膜其X射线衍射(XRD)半高宽(FWHM)可以最高降低40%以上.原子力显微镜(AFM)观察表明:在N2-H2混合等离子中氮化过的衬底上外延的缓冲层表面变得更为平滑,晶粒也变得粗大.最后,我们提出了一个化学模型对上述结果进行了分析和解释..     

GaAs(001)衬底上分子束外延生长立方和六方GaN薄膜

采用分子束外延方法在GaAs(001)衬底上生长出了03微米厚的GaN薄膜,X射线双晶衍射和室温光荧光测试结果表明,采用GaAs氮化表面作为成核层可获得高纯度立方GaN薄膜而采用AlAs氮化表面作为成核层可获得高纯度六方GaN薄膜.这一研究结果表明在GaAs衬底上生长GaN薄膜的相结构可以通过选择不同的成核层来控制. 关键词：     

AlN插入层对硅衬底GaN薄膜生长的影响

利用金属有机化合物气相外延沉积技术在2inch(5.08cm)Si(111)图形衬底上生长了GaN外延薄膜,在Al组分渐变AlGaN缓冲层与GaN成核层之间引入了AlN插入层,研究了AlN插入层对GaN薄膜生长的影响。结果表明,随着AlN插入层厚度的增加,GaN外延膜(002)面与(102)面X射线衍射摇摆曲线半峰全宽明显变小,晶体质量变好,同时外延膜在放置过程中所产生的裂纹密度逐渐减小直至不产生裂纹。原因在于AlN插入层的厚度对GaN成核层的生长模式有明显影响,较厚的AlN插入层使GaN成核层倾向于岛状生长,造成后续生长的nGaN外延膜具有更多的侧向外延成分,从而降低了GaN外延膜中的位错密度,减少了GaN外延膜中的残余张应力。同时还提出了一种利用荧光显微镜观察黄带发光形貌来表征GaN成核层形貌和生长模式的新方法。     

国产SiC衬底上利用AIN缓冲层生长高质量GaN外延薄膜

采用高温AlN作为缓冲层在国产SiC衬底上利用金属有机物化学气相外延技术生长GaN外延薄膜.通过优化AlN缓冲层的生长参数得到了高质量的GaN外延薄膜,其对称(0002)面和非对称(1012)面X射线衍射摇摆曲线的半峰宽分别达到130 arcsec和252 arcsec,这是目前报道的在国产SiC衬底上生长GaN最好的...     

预通三甲基铝对AlN薄膜的结构与应变的影响

采用有机金属化学气相沉积设备用两步生长法在(0001)蓝宝石衬底上制备AlN薄膜。研究了预通三甲基铝(TMAl)使衬底铝化对外延AlN的影响。利用高分辨X射线衍射(XRD)技术和扫描电子显微镜(SEM) 分析了样品的结晶质量以及外延膜中的残余应力。通过SEM观察发现,短时间的预通TMAl处理对AlN薄膜表面的影响不大;但随着预通时间的增加,表面会出现六角形的岛。通过优化TMAl的预通时间可以保护衬底被氮化有利于Al极性面AlN的生长,从而得到的Al极性面AlN表面比较平整;但是预通TMAl时间过长会使衬底表面沉积金属态铝而不容易形成平整的表面。X射线双晶摇摆曲线结果表明:样品的(0002)和(101 2)面的X射线双晶摇摆曲线的半峰宽随着预通TMAl时间的不断增加,由此得出薄膜的晶体质量不断下降。这可以解释为:预通TMAl使形成的晶核不再规则,从而在成核层形成了很多亚颗粒降低了晶体质量。进一步对XRD结果分析,我们也发现了这样的应力变化。这种应力的变化起源可以归结于内应力(岛的合并在其晶界引入的应力)与外应力(晶格失配与热失配引起的应力)共同作用的结果。     

MOCVD生长Si衬底上HT-AlN缓冲层低生长压力对GaN薄膜的影响

采用金属有机化学气相沉积（MOCVD）技术在Si（111）衬底上外延GaN薄膜,对高温AlN（HT-AlN）缓冲层在小范围内低生长压力（6.7~16.6 kPa）条件下对GaN薄膜特性的影响进行了研究。研究结果表明GaN外延层的表面形貌、结构和光学性质对HT-AlN缓冲层的生长压力有很强的的依赖关系。增加HT-AlN缓冲层的生长压力,GaN薄膜的光学和形貌特性均有明显改善,当HT-AlN缓冲层的生长压力为13.3 kPa时,得到无裂纹的GaN薄膜,其（002）和（102）面的X射线衍射峰值半高宽分别为735 arcsec和778 arcsec,由拉曼光谱计算得到的张应力为0.437 GPa,原子力显微镜（AFM）观测到表面粗糙度为1.57 nm。     

AlN缓冲层对ZnO薄膜质量的影响

采用脉冲激光沉积法以AlN为缓冲层在Si(100)衬底上制备了ZnO薄膜,并测量了样品的XRD谱、SEM图和PL谱.结果表明,AlN缓冲层可以提高Si衬底上外延生长ZnO薄膜的晶体质量.改变缓冲层的生长温度(50～500 ℃)所制备样品的测量结果表明,较低温度下生长的AlN缓冲层有利于制备高质量的ZnO外延层薄膜,其中AlN缓冲层生长温度为100 ℃时外延生长ZnO薄膜晶体质量最好.     

衬底温度对Al/Zn_3N_2薄膜制备的影响

运用等离子体发射光谱,分析衬底温度对氮化锌薄膜制备过程中各等离子体活性基团的影响,随着温度升高,N*2第一正系B3Πg→A3Σ+u,N*2第二正系C3Πu→B3Πg,N+*2第一负系B2Σ+u→X2Σ+g,Zn*以及Zn+*活性基团等离子体发射光谱特征谱线强度逐渐增强;由于衬底温度升高,腔室中各离子动能增加,使得碰撞电离加剧,导致N*2,N+*2,Zn*以及Zn+*活性基团的等离子体离子密度增加;等离子体发射光谱分析结果表明衬底温度在一定范围内升高有利于氮化锌薄膜生长。采用离子源辅助磁控溅射技术在Al薄膜上制备Zn3N2薄膜;X射线衍射图谱(XRD)分析结果表明:室温下,反应生长出单一择优取向面(321)氮化锌薄膜;随着温度的升高,在Al膜上反应生长的氮化锌薄膜择优取向面逐渐丰富,出现(222),(400),(600),(411),(332),(431)以及(622)择优取向面,体现出随着衬底温度的升高,薄膜的结晶度逐渐增加。XP-1台阶仪分析的结果表明,随着衬底温度的升高,氮化锌薄膜的沉积率逐渐增大。场效应扫描电子显微镜(SEM)图表明氮化锌薄膜晶粒尺寸随着衬底温度的升高逐渐变小,表面结构更加致密,晶粒排列更加有序;SEM断面扫描显示Al膜和氮化锌薄膜结合非常紧密。衬底温度影响薄膜性能实验分析结果与等离子体发射光谱分析的结果基本一致,体现出等离子体发射光谱了解等离子体内在特性的有效、快捷性。     

AlN缓冲层对Si基GaN外延薄膜性质的影响

采用金属有机化合物化学气相沉积（MOCVD）方法制备了不同AlN缓冲层厚度的GaN样品,研究了AlN缓冲层厚度对GaN外延层的应力、表面形貌和晶体质量的影响。研究结果表明：厚度为15 nm的AlN缓冲层不仅可以有效抑制Si扩散,而且还给GaN外延层提供了一个较大的压应力,避免GaN薄膜出现裂纹。在该厚度AlN缓冲层上制备的GaN薄膜表面光亮、无裂纹,受到的张应力为0.3 GPa,（0002）和（1012）面的高分辨X射线衍射摇摆曲线峰值半高宽分别为536 arcsec和594 arcsec,原子力显微镜测试得到表面粗糙度为0.2 nm。     

蓝宝石表面处理对氮化镓薄膜的影响

采用化学方法腐蚀c-面蓝宝石衬底，以形成一定的图案；利用LP-MOCVD在经过不同腐蚀时间的蓝宝石衬底上外延生长GaN薄膜。采用高分辨率双晶X射线衍射（DCXRD）、三维视频光学显微镜（OM）、扫描电子显微镜（SEM）和原子力显微镜（AFM）进行分析。结果表明，对蓝宝石衬底腐蚀50min情况下，外延生长的GaN薄膜晶体质量最优，其（0002）面上的XRD 半峰全宽为202.68arcsec，（10-12）面上的XRD 半峰全宽为300.24arcsec；其均方根粗糙度（RMS）为0.184nm。     

Influence of AlN buffer layer thickness on structural properties of GaN epilayer grown on Si (111) substrate with AlGaN interlayer

We present the growth of GaN epilayer on Si (111) substrate with a single AlGaN interlayer sandwiched between the GaN epilayer and AlN buffer layer by using the metalorganic chemical vapour deposition. The influence of the AlN buffer layer thickness on structural properties of the GaN epilayer has been investigated by scanning electron microscopy, atomic force microscopy, optical microscopy and high-resolution x-ray diffraction. It is found that an AlN buffer layer with the appropriate thickness plays an important role in increasing compressive strain and improving crystal quality during the growth of AlGaN interlayer, which can introduce a more compressive strain into the subsequent grown GaN layer, and reduce the crack density and threading dislocation density in GaN film.     

Effect of double AlN buffer layer on the qualities of GaN films grown by radio-frequency molecular beam epitaxy

This paper reports that the GaN thin films with Ga-polarity and high quality were grown by radio-frequency molecular beam epitaxy on sapphire （0001） substrate with a double A1N buffer layer. The buffer layer consists of a high-temperature （HT） A1N layer and a low-temperature （LT） A1N layer grown at 800℃ and 600℃, respectively. It is demonstrated that the HT-A1N layer can result in the growth of GaN epilayer in Ga-polarity and the LT-A1N layer is helpful for the improvement of the epilayer quality. It is observed that the carrier mobility of the GaN epilayer increases from 458 to 858cm^2/V.s at room temperature when the thickness of LT-A1N layer varies from 0 to 20nm. The full width at half maximum of x-ray rocking curves also demonstrates a substantial improvement in the quality of GaN epilavers by the utilization of LT-A1N layer.     

The effect of low temperature AlN interlayers on the growth of GaN epilayer on Si (111) by MOCVD

Low temperature (LT) AlN interlayers were used to effectively reduce the tension stress and micro-cracks on the surface of the GaN epilayer grown on Si (111) substrate. Optical Microscopy (OM), Atomic Force Microscopy (AFM), Surface Electron Microscopy (SEM) and X-Ray Diffraction (XRD) were employed to characterize these samples grown by metal-organic chemical vapor deposition (MOCVD). In addition, wet etching method was used to evaluate the defect of the GaN epilayer. The results demonstrate that the morphology and crystalline properties of the GaN epilayer strongly depend on the thickness, interlayer number and growth temperature of the LT AlN interlayer. With the optimized LT AlN interlayer structures, high quality GaN epilayers with a low crack density can be obtained.     

SiC/AlN上外延GaN薄膜的黄带发光与晶体缺陷的关系

利用室温光致发光(PL)技术研究了在6HSiC(0001)上用金属有机物化学汽相沉积(MOCVD)外延生长的GaN薄膜“黄带”发光(YL)特点,与扫描电子显微镜(SEM)、X射线衍射(XRD)技术得到的GaN薄膜的表面形貌质量和内部结晶质量的结果相对照,表明“YL”发光强度与GaN薄膜的扩展缺陷多少直接相对应通过二次离子质谱(SIMS)技术获取的GaN薄膜中Ga元素深度分布揭示出镓空位(V_Ga)最可能是“YL”发光的微观来源分析认为,虽然宏观扩展缺陷(丝状缺陷、螺形位错等)和微观点缺陷V_Ga及其与杂质的络合物(complexes)都表现出与“YL”发射密切相关,但V_Ga及其与杂质的络合物更可能是“YL”发射的根本微观来源室温下获得的样品“YL”发射强度和光谱精细结构可用于分析GaN薄膜缺陷和晶体质量.     

Optical and structural investigation of a-plane GaN layers on r-plane sapphire with nucleation layer optimization

Nonpolar a-plane GaN epilayers are grown on several r-plane sapphire substrates by metal organic chemical vapour deposition using different nucleation layers:(A) a GaN nucleation layer deposited at low temperature(LT);(B) an AlN nucleation layer deposited at high temperature;or(C) an LT thin AlN nucleation layer with an AlN layer and an AlN/AlGaN superlattice both subsequently deposited at high temperature.The samples have been characterized by Xray diffraction(XRD),atomic force microscopy and photoluminescence.The GaN layers grown using nucleation layers B and C show narrower XRD rocking curves than that using nucleation layer A,indicating a reduction in crystal defect density.Furthermore,the GaN layer grown using nucleation layer C exhibits a surface morphology with triangular defect pits eliminated completely.The improved optical property,corresponding to the enhanced crystal quality,is also confirmed by temperature-dependent and excitation power-dependent photoluminescence measurements.     

Effect of high-temperature buffer thickness on quality of AlN epilayer grown on sapphire substrate by metalorganic chemical vapor deposition

The effect of an initially grown high-temperature AlN buffer (HT-AlN) layer's thickness on the quality of an AlN epilayer grown on sapphire substrate by metalorganic chemical vapor deposition (MOCVD) in a two-step growth process is investigated. The characteristics of AlN epilayers are analyzed by using triple-axis crystal X-ray diffraction (XRD) and atomic force microscopy (AFM). It is shown that the crystal quality of the AlN epilayer is closely related to its correlation length. The correlation length is determined by the thickness of the initially grown HT-AlN buffer layer. We find that the optimal HT-AlN buffer thickness for obtaining a high-quality AlN epilayer grown on sapphire substrate is about 20 nm.     

High resolution X-ray diffraction of GaN grown on Si (1 1 1) by MOVPE

High temperature GaN layers have been grown on Si (1 1 1) substrate by metalorganic vapor phase epitaxy (MOVPE). AlN was used as a buffer layer and studied as a function of thickness and growth temperature. The growth was monitored by in situ laser reflectometry. High resolution X-ray diffraction (HRXRD) revealed that optimized monocrystalline GaN was obtained for a 40 nm AlN grown at 1080 °C. This is in good agreement with the results of morphological study by scanning electron microscopy (SEM) and also confirmed by atomic force microscopy (AFM) observations. The best morphology of AlN with columnar structure and lower rms surface roughness is greatly advantageous to the coalescence of the GaN epilayer. Symmetric and asymmetric GaN reflections were combined for twist and stress measurements in monocrystalline GaN. It was found that mosaicity and biaxial tensile stress are still high in 1.7 μm GaN. Curvature radius measurement was also done and correlated to the cracks observations over the GaN surface.     

Effect of Ⅲ/Ⅴ Ratio of HT-AIN Buffer Layer on Polarity Selection and Electrical Quality of GaN Films Grown by Radio Frequency Molecular Beam Epitaxy

We investigate the effect of A/N ratio of the high temperature （HT） AIN buffer layer on polarity selection and electrical quality of GaN films grown by radio frequency molecular beam epitaxy. The results show that low Al/N ratio results in N-polarity GaN films and intermediate Al/N ratio leads to mixed-polarity GaN films with poor electrical quality. GaN films tend to grow with Ga polarity on Al-rich AIN buffer layers. GaN films with different polarities are confirmed by in-situ reflection high-energy electron diffraction during the growth process. Wet chemical etching, together with atomic force microscopy, also proves the polarity assignments. The optimum value for room-temperature Hall mobility of the Ga-polarity GaN film is 703cm^2/V.s, which is superior to the N-polarity and mixed-polarity GaN films.     

The influence of SixNy interlayer on GaN film grown on Si(111) substrate

A method to drastically reduce dislocation density in a GaN film grown on an Si(111) substrate is newly developed. In this method, the Si_xN_y interlayer which is deposited on an AlN buffer layer in situ is introduced to grow the GaN film laterally. The crack-free GaN film with thickness over 1.7 micron is grown on an Si(111) substrate successfully. Synthesized GaN epilayer is characterized by X-ray diffraction (XRD), atomic force microscope (AFM), and Raman spectrum. The test results show that the GaN crystal reveals a wurtzite structure with the <0001> crystal orientation and the full width at half maximum of the X-ray diffraction curve in the (0002) plane is as low as 403 arcsec for the GaN film grown on the Si substrate with an Si_xN_y interlayer. In addition, Raman scattering is used to study the stress in the sample. The results indicate that the Si_xN_y interlayer can more effectively accommodate the strain energy. So the dislocation density can be reduced drastically, and the crystal quality of GaN film can be greatly improved by introducing Si_xN_y interlayer.