铜电极表面硅烷膜的自组装及其性能研究

应用自组装技术在铜电极表面上制备3巯基丙基三甲氧基硅烷自组装膜.红外光谱研究该自组装膜结构,电化学方法考察3-巯基丙基三甲氧基硅烷膜在5%NaCl溶液中对铜电极的缓蚀性能.结果表明,于不同浓度的3-巯基丙基三甲氧基硅烷乙醇溶液中自组装的硅烷膜表现出较好的抗腐蚀性.     

多巴胺在2-氨基-5-巯基-[1,3,4]三氮唑自组装膜电极上的准可逆行为研究及分析应用

利用新合成的巯基试剂2-氨基-5-巯基-[1，3，4]三氮唑在金电极表面进行了首次自组装，用电化学法和扫描电子显徽镜对自组装膜电极进行了表征。研究了多巴胺在该自组装膜电极上的电化学行为，发现该自组装膜能有效促进多巴胺在电极与溶液之间的电子传递．表现为二电子传递的准可逆行为，电极反应速率常数为0．105cm／s。该自组装膜电极用于多巴胺注射液含量的测定，结果满意。     

铜表面烯丙基硫脲自组装膜的电化学行为

为阐明金属Cu在含稀丙基硫脲NaCl溶液中的腐蚀行为和规律,利用自组装技术在铜表面制备了烯丙基硫脲自组装膜,并在中性氯化钠体系中测试了该自组装膜的电化学行为和缓蚀效率.电化学测定表明,烯丙基硫脲自组装膜对阴极过程有明显的抑制,并且发现自组装膜的保护性质与腐蚀电位、烯丙基硫脲的浓度和溶液中Cl-浓度密切相关.烯丙基硫脲的...     

铁表面银纳米粒子自组装膜及其缓蚀性能研究

应用化学还原法于水溶液中制备银纳米粒子.在十二烷基硫醇的保护下,将银纳米粒子从水相转移到甲苯相,并将处理好的铁电极浸泡在含有十二烷基硫醇保护的银纳米粒子/甲苯溶液中,制得十二烷基硫醇/银纳米粒子自组装混合膜.电化学方法如交流阻抗谱(EIS)、极化曲线等研究该自组装膜在0.5 mol.L-1H2SO4溶液中的缓蚀作用.XPS测试证实该自组装膜十二烷基硫醇和银纳米粒子之存在.     

中性介质中铜缓蚀剂的成膜过程

使用光电化学与电化学石英晶体微天平联用（PECQCM）技术对中性介质铜缓蚀剂成膜过程进行了现场研究．结果表明，在中性Na2SO4溶液中钝化型缓蚀剂Na2OrO4对Cu成膜生长有抛物线规律，而由于Cl-的影响，在中性NaCl溶液中，该缓蚀剂膜生长曲线为折线型．沉淀型缓蚀剂Na2SiO3在Na2SO4溶液中的铜晶振电极上不成膜，而在NaCl溶液中可成膜．     

正、叔十二烷基硫醇在铜表面上自组装膜测试

研究了正、叔十二烷基硫醇在铜表面上的自组装及混合自组装成膜情况,并利用交流阻抗和极化曲线电化学方法测试了正、叔十二烷基硫醇在铜表面上自组装膜及混合自组装膜对铜的耐腐蚀性,考察了正十二烷基硫醇自组装膜质量与正十二烷基硫醇溶液的浓度及组装时间的关系。研究结果显示,混合自组装膜的质量及其对铜的耐腐蚀性比仅组装正或叔十二烷基硫醇均有很大的提高。     

铜表面二硫代氨基甲酸改性葡萄糖自组装膜的缓蚀作用

合成了一种环境友好型的缓蚀剂--二硫代氨基甲酸改性葡萄糖（DTCG）。 采用该缓蚀剂在铜表面制备了自组装膜,并运用电化学阻抗谱、极化曲线方法研究了该膜在3%NaCl溶液中对铜的缓蚀性能。 研究结果表明,DTCG自组装膜对铜有良好的缓蚀效果,在自组装时间为4 h、自组装浓度为120 mg/L的缓蚀效率接近于97%。 量子化学计算结果也证明了DTCG具有优异的缓蚀性能。     

电流滴定法对两种短链分子自组装膜的研究

把带有—NH2的半胱胺和4-氨基硫酚两种短链分子组装到金电极上,形成自组装单分子膜;两种自组装膜在[Fe(CN)6]3-/4-溶液中进行循环伏安扫描时,出现了不同于长链分子自组装膜的行为:峰间距变窄、峰电流变大的现象,这是由于两者在金上组装不够致密,以及末端的—NH2存在对[Fe(CN)6]3-/4-的影响造成的。通过改变溶液的pH,研究溶液中H 浓度对半胱胺自组装膜和4-氨基硫酚自组装膜在[Fe(CN)6]3-/4-溶液中电化学行为的影响;通过电流滴定的方法求算出半胱胺自组装膜和4-氨基硫酚自组装膜的表面pKb分别为2.4±0.2和4.7±0.2;通过在碱性条件下的循环伏安图,对两者的组装效果进行了比较。     

邻氨基硫酚自组装膜修饰电极测定多巴胺

邻氨基硫酚自组装膜修饰电极测定多巴胺;多巴胺;邻氨基硫酚;自组装膜;金电极;方波伏安法     

卤离子溶液中邻香兰素邻苯二胺对铜的缓蚀作用

应用恒电位稳态极化和交流阻抗技术研究了希夫碱—邻香兰素邻苯二胺 (V_oPh_V)在中性NaCl或NaBr溶液中对金属铜阳极溶解和腐蚀的缓蚀作用 .通过比较铜在空白溶液与含有V_o_Ph_V溶液中的电化学行为解释了V_o_Ph_V的缓蚀机制 .此外还研究了V_o_Ph_V自组装膜在Na Cl溶液中对铜腐蚀的缓蚀效应 .     

A New Approach for Preparing Effective Inhibition Film on Copper Based on Self-assembled Process

A new method for preparing effective inhibition film on copper has been developed.Pheylthiourea(PT) was firest absorbed to copper surface to form a monolayer.1-Dodecanethiol(DT) was then assembled on the surface for modification.Finally,Ac voltage was loded on copper covered the mixed film to improve it further.After these processes,an effective inhibition film was gained because of its high charge transfer resistance and low corrosion current density shown in electrochemical impedance spectra and polarization.The inhibition efficiency was more than 97%.     

2-氨基嘧啶对铜的缓蚀机理

利用动电位极化曲线、线性极化、X射线光电子能谱(XPS)、X射线俄歇能谱(X-AES)和表面增强拉曼散射(SERS)研究2-氨基嘧啶(2-AP)对金属铜的缓蚀作用。结果表明: 在含Cl~-离子的酸性介质中, 2-AP是铜的有效缓蚀剂; 随着介质pH值的增加, 2-AP的缓蚀能力降低。2-AP缓蚀能力随pH值明显变化的原因在于只有在酸性介质中, 质子化了的2-AP分子、Cl~-离子和铜表面原子(或离子)才可能形成保护作用强的多聚配合物膜。     

Employing electrochemical frequency modulation for studying corrosion and corrosion inhibition of copper in sodium chloride solutions

The inhibition effect of 2-carboxymethylthio-4-(p-methoxyphenyl)-6-oxo-1,6-dihy-dropyrimidine-5-carbonitrile (CPD) towards the corrosion of copper was studied in aerated stagnant 3.5% NaCl at 25 °C using ac techniques include electrochemical frequency modulation and electrochemical impedance spectroscopy as well as potentiodynamic polarization measurements. Corrosion rates determined using electrochemical frequency modulation (EFM) which measures the non-linear behaviour of a corroding system are compared with corrosion rates obtained from traditional electrochemical techniques and show good agreement. Data obtained from EIS were analyzed to model the corrosion inhibition process through equivalent circuit. Polarization measurements showed that CPD acts as mixed-type inhibitor. The inhibition efficiency increases with an increase in the concentration of CPD. The adsorption of the inhibitor on the copper surface in the sodium chloride solution was found to obey Langmuir’s adsorption isotherm. A mixed inhibition mechanism is proposed for the inhibitive effects of CPD as revealed by potentiodynamic polarization technique.     

3-氨基-1,2,4-三氮唑对铜的缓蚀性能和吸附行为

采用电化学和表面增强拉曼光谱(SERS)方法研究了新型环境友好型金属水处理剂3-氨基-1,2,4-三氮唑(ATA)对铜在3% NaCl溶液中的缓蚀性能和吸附行为. 结果表明, ATA对铜有较好的缓蚀作用, 其中ATA浓度为0.24 mmol·L-1时对铜的缓蚀效率最高, 为97.65%, 其吸附行为符合Langmuir吸附等温式, 吸附机理是典型的化学吸附援SERS表明, ATA分子通过很强的吸附于铜表面达到抑制其腐蚀的作用, 是ATA-与Cu+形成配合物来阻止氯离子化合物(CuCl-2)的生成.     

Corrosion inhibition performance of 2-ethyl phenyl-2, 5-dithiohydrazodicarbonamide on Fe (110)/Cu (111) in acidic/alkaline solutions: Synthesis,experimental, theoretical,and molecular dynamic studies

Herein, 2-ethyl phenyl-2,5-dithiohydrazodicarbonamide (2EPDCA) was synthesised and tested as a corrosion inhibitor for mild steel (MS) and copper (Cu) in 1 M HCl and 3.5% NaCl, respectively. Fourier transform infrared spectroscopy (FT-IR) and (NMR) nuclear magnetic resonance (¹H, ¹³C) were used to identify the chemical structure. Both experimental and computational approaches have been conducted to evaluate inhibitor efficiency on both metal systems. The electrochemical results showed that the 2EPDCA inhibition efficiency for MS systems was 95% at 1 × 10^?2 M, while in copper systems it was 97.5% at 1 × 10^?2 M. The Langmuir adsorption isotherm was fitted using adsorption surface coverage data, and for inhibitor in both systems, the kind of adsorption was mixed (physisorption and chemisorption). Through scanning electron microscopy (SEM), EDX, and atomic force microscopy (AFM) tests, we have confirmed the presence of the inhibitor molecules on the metal surface in both systems. Quantum chemistry simulations indicate that the superior corrosion inhibition efficacy of 2EPDCA on copper compared to mild steel surfaces is attributable to the former's greater electron donating propensity on copper. The adsorption of 2EPDCA molecules on Fe (110) and Cu (111) surfaces was further verified by molecular dynamic simulations, with the former having a greater adsorption energy. The results indicate that the corrosion inhibitor was effective even in harsh conditions, and it can be thought of as a novel corrosion inhibitor for mild steel and copper that provides good protection.     

铅铈和铅钙锡合金阳极腐蚀膜的性能研究

利用叠加交流伏安法、线性电位扫描法、交流阻抗技术和XPS研究了铅铈合金和铅钙锡合金在阳极1.28 V, 4.5 mol/L的硫酸溶液中所形成的阳极腐蚀膜. 结果表明: 稀土铈能抑制阳极膜中高阻抗的Pb(II)化合物的生长, 降低腐蚀膜的阻抗, 并增加膜的孔隙率. 同时可以提高合金的析氢过电位, 有利于电池免维护性能的提高.     

MMI作为铜的盐酸酸洗缓蚀剂作用机理的研究

用失重法研究了N-甲基-2-巯基咪唑（MMI）在5％盐酸中对铜的酸洗缓蚀性能.探讨了温度和MMI浓度对缓蚀效果的影响，从中得出了MMI在铜表面的吸附等温式，计算了吸附热及MMI的加入对铜在盐酸中腐蚀反应活化能的影响，进而探讨了MMI对铜缓蚀作用的机理.结果表明， 30 ℃下，在5％盐酸中，当MMI的浓度在3 mmol•L－1和8 mmol•L－1之间时,缓蚀率随MMI浓度的增加而迅速增加，当浓度达到8 mmol•L－1时，缓蚀率趋于定值，而当浓度小于3 mmol•L－1时， MMI的加入会加速铜的腐蚀；吸附在铜表面的MMI分子间的作用力整体表现为引力； MMI在铜表面的吸附是吸热反应； MMI的加入降低了铜的腐蚀反应活化能.     

Inhibition of copper corrosion by bipyrazole compound in aerated 3% NaCl

The corrosion behaviour of copper in aerated 3% NaCl solution was investigated by rotating electrode at various rates. The reduction of O₂ obeys the Levich equation. The inhibition of the copper corrosion in aerated 3% NaCl solution was studied by using potentiodynamic polarisation and linear polarisation resistance (LRP) in the presence of different concentrations of a bipyrazolic compound named N,N-bis (3-carbomethoxy-5-methylpyrazol-1-ylmethyl) cyclohexylamine (BiPyA). The presence of this compound in the solution decreases the corrosion current density and increases the linear resistance polarisation. The inhibition efficiencies obtained from cathodic Tafel plots and LRP methods are in good agreement. BiPyA compound presents an efficient inhibitor of copper corrosion, acts as a mixed-type inhibitor and adsorbs on the copper surface according to the Langmuir isotherm model.