EDA对铜在稀盐酸中的缓蚀效果及硫离子的影响

应用极化曲线塔菲尔区外推法考察了以乙二胺(EDA)作酸性溶液铜缓蚀剂的缓蚀行为以及硫离子对其缓蚀效果的影响.结果表明,在含有EDA的酸性溶液中加入Na2S使铜的腐蚀电位正移,腐蚀速率降低,缓蚀效率提高.溶液中HS-的存在能对EDA的缓蚀作用产生协同效应,这主要是由于HS-在铜表面的强化学吸附,从而更有利于EDA在铜表面形成CuHSEDA吸附保护层,抑制铜的腐蚀.     

头孢哌酮-镧配合物对碳钢的缓蚀性能

头孢哌酮钠(CFPS)和稀土离子La~(3+)在水溶液中能够形成配合物,采用电导法和高效液相色谱法研究了配合物的形成。采用失重法、电化学法、扫描电子显微镜法(SEM)和X射线光电子能谱法(XPS)研究了La~(3+)和CFPS以及CFPS-La~(3+)在HCl介质中对碳钢表面的缓蚀性能。单一CFPS在最佳浓度5×10~(-4) mol·L~(-1)时,其缓蚀效率为62%,而La~(3+)对碳钢的缓蚀作用不明显。当两者配合时,CFPS浓度仍为5×10~(-4) mol·L~(-1),保持CFPS和La~(3+)的摩尔比为2∶1,缓蚀效率可达90%以上,表明CFPS-La~(3+)对碳钢的缓蚀效果比单一药物或稀土好。     

非均相芬顿体系协同去除复合双污染物:化学转化,pH影响和机理分析

系统研究了ZVI(零价铁粉)-Fenton体系协同去除铜离子和亚甲基蓝(MB)污染物过程中, ZVI微表面发生的化学转化以及目标污染物降解机理. 分别利用扫描电子显微镜(SEM), X射线能谱(EDS), X射线衍射(XRD), X射线光电子能谱(XPS)和傅里叶变换红外光谱(FTIR)等技术, 对比分析了反应前后以及不同体系之间ZVI表面结构, Fe和Cu化学转移的变化. 结果表明, 在ZVI/H₂O₂体系中反应后ZVI表面腐蚀产物较多, 主要为Fe₃O₄和Fe₂O₃. 在ZVI/H₂O₂-Cu体系中, 虽ZVI腐蚀作用更加剧烈, 但ZVI表面残留的腐蚀产物较少, 且腐蚀产物中Fe₃O₄含量的占比增加. Cu ²⁺主要还原产物为Cu ⁰, 同时还伴随着CuO的生成. pH影响实验表明, ZVI/H₂O₂-Cu体系不仅强化了MB的降解, 有效地去除了总溶解铜离子(TCu), 同时还扩大ZVI-Fenton体系的有效pH范围(pH=2.5~5.5). 叔丁醇捕获自由基实验表明, 羟基自由基是氧化降解MB的主要活性物质. 最后针对ZVI-Fenton体系协同去除复合双目标污染物的机理进行研究分析.     

聚乙烯吡咯烷酮对模拟混凝土孔隙液中钢筋的缓蚀效应

应用电化学阻抗谱和极化曲线测试技术,结合扫描电子显微镜(SEM)、X射线光电子能谱(XPS)和拉曼(Raman)光谱分析,研究了表面活性剂聚乙烯吡咯烷酮(PVP)作为缓蚀剂对钢筋的缓蚀效应和机理.结果表明,PVP对pH值为11.0,含0.5 mol/L NaCl的模拟混凝土孔隙液中的钢筋具有良好的缓蚀作用,可有效抑制钢筋的腐蚀;PVP浓度变化对钢筋腐蚀行为有显著的影响,当浓度为25 mg/L时,PVP对钢筋的缓蚀效率达到89.1%;PVP通过在钢筋表面形成吸附膜来抑制钢筋的腐蚀.     

4-氨基吡啶分子印迹聚合物毛细管整体柱的制备及电色谱性能研究

以4-氨基吡啶(4-AP)为印迹分子,热引发原位合成了分子印迹聚合物毛细管整体柱,聚合物通过共价键和石英毛细管内壁相连,制备方法简单、快捷.在最佳电色谱条件下,4-AP和2-AP之间的分离度在印迹聚合物柱上高达2.5,而在不含印迹的对照柱上仅为0.35.通过研究流动相条件对4-AP,2-AP和硫脲迁移的影响,对4-AP印迹聚合物的电色谱识别机理进行了探讨.印迹识别能力随缓冲溶液离子强度的减小或流动相中乙腈比例的增大而增大.上述两种情形下,流动相中阳离子浓度均减少,使得聚合物孔穴中可与4-AP发生静电作用的有效羧基作用位点增加,从而显现出孔穴对印迹分子的专一亲和作用(形状、大小和作用力).缓冲溶液的种类和pH值对该印迹聚合物识别能力的影响较为复杂,在磷酸盐缓冲溶液体系中,pH值对识别能力的影响呈抛物线形,pH=5时识别能力最强;在醋酸盐缓冲溶液体系中,高pH值有利于分离.     

2-氨基嘧啶在盐酸介质中对钢的缓蚀性能

用失重法、动电位极化曲线和电化学阻抗谱（EIS）研究了2-氨基嘧啶(2-AP)在1.0~5.0 mol/L HCl溶液中（20~50 ℃）对冷轧钢的缓蚀作用。 结果表明,2-AP对冷轧钢在1.0 mol/L HCl中具有良好的缓蚀作用,且在钢表面的吸附符合校正的Langmuir吸附模型;缓蚀率随缓蚀剂浓度的增加而增大,但随温度的升高和HCl浓度的增加而降低。 2-AP为混合抑制型缓蚀剂;EIS谱呈半圆容抗弧,电荷转移电阻随缓蚀剂浓度的增加而增大。     

水热法合成AgGd0.9Eu0.1(WO4)2及其发光性能

利用水热法制备了不同形貌的AgGd_0.9Eu_0.1(WO₄)₂ 红色发光材料, 通过X射线衍射(XRD)、扫描电镜(SEM)、X射线能谱分析(EDS)、透射电镜(TEM)及荧光光谱(PL)对不同条件下制备样品的物相、形貌和荧光性质进行了表征, 探讨了初始溶液的pH值和表面活性剂的种类对产物形貌和颗粒尺寸的影响. 结果表明: 本文所述条件下所得样品均属于单斜晶系|初始溶液的pH值和表面活性剂的种类对产物的形貌起关键作用. 通过调整初始溶液的pH值和表面活性剂的种类, 可以得到不同粒径的球形、棒状和空心球形颗粒|AgGd_0.9Eu_0.1(WO₄)₂的发射光谱表现为Eu^3＋离子的特征发射, 样品颗粒的形貌以及颗粒尺寸对发射光谱的强度有一定影响.     

钛酸盐纳米管与二硫化碳修饰钛酸盐纳米管的合成、表征及其去除重金属离子性能

在水热法制备钛酸盐纳米管的基础上, 通过形成黄原酸基反应合成了CS2修饰的钛氧纳米管. 采用粉末X射线衍射(XRD)、透射电镜(TEM)、红外光谱(FTIR)和拉曼光谱(Raman)等技术对产物进行了表征. 以水溶液中铅离子、铜离子和银离子作为目标重金属离子, 分别用纯钛酸盐纳米管和CS2修饰后的钛氧纳米管对其进行反应和吸附, 通过一系列对比性实验, 评价了不同形式纳米管去除重金属的能力. 实验结果表明, 与文献报道的吸附剂对重金属离子的吸附量相比, 纯钛酸盐纳米管和CS2修饰的钛氧纳米管吸附重金属离子的容量非常大, 尤其是经CS2修饰后的钛氧纳米管去除铅离子的能力明显增强, 它们去除重金属离子的能力还与重金属盐的阴离子、溶液的pH值相关. 在相同的pH条件下, 钛酸盐纳米管去除铅离子、铜离子和银离子的能力分别为599.37, 163.22和474.73 mg/g; CS2修饰的钛氧纳米管去除铅离子、铜离子和银离子的能力分别为663.37, 160.21和423.05 mg/g.     

接枝改性羧甲基纤维素对铜离子的吸附研究

将离子型单体丙烯酸(AA)及非离子型单体丙烯酰胺(AM)接枝在羧甲基纤维素(CMC)上,通过协同作用提高材料的吸水性及吸水速率,并研究了其对铜离子的吸附性能.通过傅里叶红外(FTIR)对材料分析表明,从及AM成功接枝在CMC上;对吸附物进行了表面分析,扫描电镜图(SEM)显示吸附物表面有大量颗粒状物质,X射线能谱(XPS)证实材料表面吸附了铜离子;在浓度为10mmol/L的铜离子溶液中,CMC-g-P(AA-co-AM)材料的吸附容量为20.30mmol/g.     

pH值对电沉积CuInSe2薄膜的组份、结构及光电性能的影响

本文采用一步恒电位沉积法在铟锡氧化物(ITO)基底上制备CuInSe2薄膜,研究了沉积过程中不同的离子浓度配比及pH值对CuInSe2膜结构性能的影响。利用扫描电子显微镜(SEM)、X射线能谱仪(EDS)及X射线衍射仪(XRD)研究了薄膜材料的结构性能,结果发现pH值对薄膜的化学成份、表面形貌、晶格结构都有显著影响,通过控制合适的浓度及酸度分别制备了高质量富铟与富铜薄膜。利用表面光电压(SPS)技术分别对富铟与富铜薄膜的光电分离特性进行了研究,结果发现富铟薄膜具有很强的光电响应;而富铜薄膜由于Cu-Se相的存在,在薄膜中形成了新的界面,电子-空穴对在其界面处因捕获而发生复合,从而导致其光电响应的强烈降低。所得到的结果为提高铜铟硒薄膜的光电效率提供了有价值的新思路。     

Corrosion of copper in aerated acidic pickling solutions and its inhibition by 3-amino-1,2,4-triazole-5-thiol

Corrosion of copper in aerated acidic chloride pickling (0.5 M HCl) solutions and its inhibition by 3-amino-1,2,4-triazole-5-thiol (ATT) have been investigated using electrochemical techniques and weight-loss measurements, along with Raman spectroscopy. Electrochemical measurements for copper after varied immersion periods of 0, 24, and 48 h showed that the presence of ATT and the increase of its concentration significantly decrease cathodic, anodic, corrosion (j(Corr)) currents and corrosion rates (K(Corr)), as well as the dissolution currents at 300 mV vs Ag/AgCl, while increasing polarization resistance (Rp), degree of surface coverage (theta) and inhibition efficiency (IE%) to a great extent. Weight-loss measurements after different immersion periods of 6 to 48 h revealed that the dissolution of copper decreased to a minimum and the corresponding IE% increased with increasing ATT concentration. The detection of ATT molecules on the copper surface by Raman spectroscopy indicated that inhibition of copper corrosion is achieved by strong adsorption of ATT molecules onto the copper surface.     

PCB酸性蚀刻液中缓蚀剂对厚铜线路制作的影响

以2-巯基苯并噻唑(2-MBT)、 苯并三氮唑(BTA)和苯氧基乙醇(MSDS)作为缓蚀剂, 研究了其加入在酸性蚀刻液后对PCB厚铜线路的缓蚀效果。通过接触角测试、电化学测试和蚀刻因子得出缓蚀状态,并结合扫描电子显微镜观察铜表面形貌。通过分子动力学计算和量子化学模拟分析缓蚀剂在铜表面的吸附机理。结果表明,2-MBT + MSDS与BTA + MSDS的分子结构可有效地平行吸附在铜表面,且吸附能高于单一缓蚀剂。加入了2-MBT + MSDS的蚀刻液,对厚度约为33 μm铜线路进行刻蚀,铜线路的蚀刻因子提高到6.59,可有效应用于PCB厚铜线路制作。     

Adsorption of 4-aminopyridine on Co and Ag electrodes probed by SERS

The adsorption of 4-aminopyridine (4-AP) on Co and Ag electrodes in acid or alkaline solutions of KCl and KI electrolyte salts were monitored by the Surface-enhanced Raman Spectroscopy (SERS) technique. The SERS intensity for the Ag electrode was in 2 orders of magnitude higher than for the Co electrode, due to the enhancement of the Raman cross-section on Ag by the surface-plasmon excitation. In acidic chloride medium (pH 4), the SERS results for Ag electrodes indicate that the protonated form of 4-AP (4-APH⁺) adsorbs in the potential range of −0.1 to −0.6 V (Ag|AgCl|KCl sat) through hydrogen-bonding between 4-APH⁺ and Cl⁻ adsorbed on the electrode surface; at more negative potentials the neutral form 4-AP is the predominant adsorbed species. For Co electrode in the same medium, only bands due to neutral 4-AP were observed in the spectra at −0.8 and −0.9 V. For more negative potentials bands assigned to both 4-AP and 4-AP surface complex are observed, with the lasts being enhanced, as the potentials are turned more negative. In alkaline chloride medium (pH 13), for less negative potentials the bands assigned to free 4-AP were observed in the spectra of both Ag and Co surfaces. For more negative potentials, only bands assigned to the 4-AP surface complex were observed. For 0.1 mol L⁻¹ KI acidic or alkaline solutions, bands assigned to 4-AP and 4-APH⁺ were observed in a wider potential range than in chloride solutions. An adsorption scheme of 4-AP on Ag and Co is proposed for acidic and alkaline solutions.     

卤离子溶液中邻香兰素邻苯二胺对铜的缓蚀作用

应用恒电位稳态极化和交流阻抗技术研究了希夫碱—邻香兰素邻苯二胺 (V_oPh_V)在中性NaCl或NaBr溶液中对金属铜阳极溶解和腐蚀的缓蚀作用 .通过比较铜在空白溶液与含有V_o_Ph_V溶液中的电化学行为解释了V_o_Ph_V的缓蚀机制 .此外还研究了V_o_Ph_V自组装膜在Na Cl溶液中对铜腐蚀的缓蚀效应 .     

Synthesize,Characterization, and Corrosion Inhibition of Polypyrrole Thin Films on Copper

Polypyrrole (PPy) coatings were synthesized on copper by electrochemical polymerization of pyrrole monomer in aqueous acidic and basic solutions by cyclic voltammetry. The coatings were characterized with CV, UV-visible absorption spectroscopy, Fourier transform infrared (FT-IR) spectroscopy, and scanning electron microscopy (SEM) techniques. The corrosion protection aspects of PPy coatings have been investigated using the potentiodynamic polarization technique and electrochemical impedance spectroscopy (EIS). The potentiodynamic polarization measurements show that the PPy coating has ability to protect the copper against corrosion. It was concluded that a complete corrosion protective PPy film could not be obtained through direct electro-oxidation procedure. This may be due to copper dissolution in the monomer oxidation potential range.     

Corrosion of copper in aerated synthetic sea water solutions and its inhibition by 3-amino-1,2,4-triazole

Corrosion of copper in aerated synthetic sea water (3.5% NaCl) solutions and its inhibition by 3-amino-1,2,4-triazole (ATA) have been studied using electrochemical, gravimetric, and pH measurements, along with Raman spectroscopy. Electrochemical measurements indicated that the presence of ATA and the increase of its concentration suppress the corrosion process on the copper surface. This effect decreases cathodic, anodic, and corrosion (jcorr) currents and corrosion rates (Kcorr), while increasing polarization resistance (Rp), surface coverage (theta), and inhibition efficiency (IE%). Weight loss measurements indicated that the dissolution of copper and the accompanying change of pH decreased to a minimum even after 24 days immersion due to the presence of ATA and the increase of its concentration. Raman investigations revealed that the inhibition of copper corrosion is achieved by strong adsorption of ATA molecules onto the copper surface, preventing it from being corroded easily.     

Inhibition of copper corrosion in 3.5% NaCl solutions by a new pyrimidine derivative: electrochemical and computer simulation techniques

A new pyrimidine heterocyclic derivative, namely 2-ethylthio-4-(p-methoxyphenyl)-6-oxo-1,6-dihydropyrimidine-5-carbonitrile (EPD) was prepared and its inhibition performance towards copper corrosion in 3.5% NaCl solutions was studied by potentiodynamic polarization, electrochemical impedance spectroscopy (EIS) and electrochemical frequency modulation (EFM) measurements. Experimental investigations showed that EPD reduces markedly the copper corrosion in 3.5% NaCl solutions. EFM can be used as a rapid and non destructive technique for corrosion rate measurements without prior knowledge of Tafel constants. Monte Carlo simulation technique incorporating molecular mechanics and molecular dynamics can be used to simulate the adsorption of pyrimidine derivative (EPD) on the Cu (111) surface in 3.5% NaCl.     

Effects of 3-amino-1,2,4-triazole on the inhibition of copper corrosion in acidic chloride solutions

Effects of 3-amino-1,2,4-triazole (ATA) on the inhibition of copper corrosion in 0.5 M HCl solutions have been studied using gravimetric, electrochemical, and Raman spectroscopy investigations. Weight-loss measurements after varied immersion periods revealed that the dissolution rate of copper decreased to a minimum, while the inhibition efficiency (zeta%) and consequently the degree of surface coverage (theta) increased with the presence of ATA and the increase of its concentration. Potentiodynamic polarization, chronoamperometric, and electrochemical impedance spectroscopy (EIS) measurements after 0, 24, and 48 h immersion of the copper electrode in the test solutions showed that the presence of ATA molecules significantly decreased cathodic, anodic, and corrosion (jcorr) currents and corrosion rates (Rcorr) and greatly increased polarization resistance (Rp), zeta%, and theta; this effect was increased on increasing the ATA content in the solution. Raman spectroscopy confirmed that ATA molecules strongly adsorbed onto the copper surface, blocking its active sites and preventing it from being corroded easily.     

MMI作为铜的盐酸酸洗缓蚀剂作用机理的研究

用失重法研究了N-甲基-2-巯基咪唑（MMI）在5％盐酸中对铜的酸洗缓蚀性能.探讨了温度和MMI浓度对缓蚀效果的影响，从中得出了MMI在铜表面的吸附等温式，计算了吸附热及MMI的加入对铜在盐酸中腐蚀反应活化能的影响，进而探讨了MMI对铜缓蚀作用的机理.结果表明， 30 ℃下，在5％盐酸中，当MMI的浓度在3 mmol•L－1和8 mmol•L－1之间时,缓蚀率随MMI浓度的增加而迅速增加，当浓度达到8 mmol•L－1时，缓蚀率趋于定值，而当浓度小于3 mmol•L－1时， MMI的加入会加速铜的腐蚀；吸附在铜表面的MMI分子间的作用力整体表现为引力； MMI在铜表面的吸附是吸热反应； MMI的加入降低了铜的腐蚀反应活化能.