2-氨基嘧啶对铜的缓蚀机理

利用动电位极化曲线、线性极化、X射线光电子能谱(XPS)、X射线俄歇能谱(X-AES)和表面增强拉曼散射(SERS)研究2-氨基嘧啶(2-AP)对金属铜的缓蚀作用。结果表明: 在含Cl~-离子的酸性介质中, 2-AP是铜的有效缓蚀剂; 随着介质pH值的增加, 2-AP的缓蚀能力降低。2-AP缓蚀能力随pH值明显变化的原因在于只有在酸性介质中, 质子化了的2-AP分子、Cl~-离子和铜表面原子(或离子)才可能形成保护作用强的多聚配合物膜。     

烯丙基硫脲和十二烷基硫醇对铜的缓蚀作用

用自组装技术在铜电极表面上制备了纯烯丙基硫服自组装膜，并以十二烷基硫 醇进一步修饰得到混合自组装膜。最后，将混合膜覆盖的铜电极浸入NaCl溶液中， 进行交流电处理，电化学交流阻抗谱和极化曲线测定表明，经过交流电处理后，在 0．5mol·dm^-3 NaCl溶液中，电荷传递电阻增大，腐蚀电流密度下降，膜的最大 覆盖度为98．6％，对金属铜腐蚀的续蚀效率为98．5％。而且，不论交流电处理与 否，混合自组装膜在较宽的电极电位范围内均表现出很强的稳定性。     

卤离子溶液中邻香兰素邻苯二胺对铜的缓蚀作用

应用恒电位稳态极化和交流阻抗技术研究了希夫碱—邻香兰素邻苯二胺 (V_oPh_V)在中性NaCl或NaBr溶液中对金属铜阳极溶解和腐蚀的缓蚀作用 .通过比较铜在空白溶液与含有V_o_Ph_V溶液中的电化学行为解释了V_o_Ph_V的缓蚀机制 .此外还研究了V_o_Ph_V自组装膜在Na Cl溶液中对铜腐蚀的缓蚀效应 .     

Studies of Self-assembled Monolayers Formed by Imidazoline on Iron Surface by SEM and SECM

Self-assembled monolayers (SAMs) formed from organic substances can improve the inhibition of metal corrosion, because uniform and closely packed films formed on the metal surface providing an insulating layer1, 2. SAMs on the iron surface are studied so far because iron is one active metal which is easily corroded in the air. In this paper, SECM and SEM have successfully been applied in the study of SAMs inhibition corrosion for iron. SECM has been used to study the electrochemically a…     

A Selective Film Based on Poly(3‐octylthiophene) Doped with Dihydroxyanthraquinone Sulfonate

A stable film of poly(3‐octylthiophene)–dihydroxyanthraquinone sulfonate has been synthesized electrochemically in non‐aqueous solution. The incorporation of dihydroxyanthraquinone sulfonate as an anionic complexing ligand into poly(3‐octylthiophene) film during electropolymerization was achieved and copper ions were accumulated by reduction on the electrode surface. The presence of dihydroxyanthraquinone sulfonate during the electrochemical polymerization of 3‐octylthiophene is shown to impact the sensitivity and the stability of the organic conducting film electrode response. The electroanalysis of copper(II) ions using conducting polymer electrode was achieved by differential pulse anodic stripping voltammetry with remarkable selectivity. The analytical performance was evaluated and linear calibration graphs were obtained in the concentration range of 50–400 ng mL^?1 copper(II) ion for 240 seconds accumulation time and the limit of detection was found to be 7.8 ng mL^?1. To check the selectivity of the proposed stripping voltammetric method for copper(II) ion, various metal ions as potential interferents were tested. The developed method was applied to copper(II) determination in certified reference material, NWRI‐TMDA‐61, trace elements in fortified water.     

铁表面组装磷酸三乙酯缓蚀功能分子膜的研究

研究一种新型的自组装成膜物质—磷酸三乙酯(TEP).实验发现,TEP自组装膜能有效抑制铁在0.5mol.L-1硫酸溶液中的腐蚀.电化学测试显示,组装时间对成膜效果产生影响.在最初较短的组装时间内,TEP自组装膜的缓蚀效率随组装时间延长而快速增加,之后增加速率减慢直至恒定.     

聚邻氨基苯甲酸-铜复合薄膜修饰电极的制备及其电化学性能

利用聚合物官能团对金属离子的配位作用,在电极表面原位制备了金属粒子。 首先在玻碳电极（GCE）表面电沉积聚邻氨基苯甲酸(PoABA),再化学吸附铜离子(Cu2+),用水合肼还原得到单质铜(Cu0)。 采用扫描电子显微镜和能谱分析表征了聚邻氨基苯甲酸 铜(PoABA-Cu0)复合薄膜的表面形貌和元素构成,研究了PoABA-Cu0修饰电极的电化学性能,并以其检测了过氧化氢（H2O2）。 结果表明,电极表面被修饰上了一层PoABA-Cu0复合薄膜;制备的修饰电极对H2O2具有良好的电催化性能,在邻氨基苯甲酸的聚合圈数为10、Cu2+的吸附时间为10 min、工作电压为-0.3 V时,该修饰电极对H2O2表现出了最佳的检测性能,其线性浓度范围为5.0×10-5～1.0×10-2 mol/L,灵敏度为96.3 μA·L/(mmol·cm),检测限为5.0×10-5 mol/L,且具有较好的稳定性。     

AMT在青铜-柠檬酸体系中的缓蚀行为及其机理

用电化学方法、红外反射光谱法研究AMT(2-氨基-5-巯基-1,3,4-噻二唑)在青铜 -5％柠檬酸体系中的缓蚀行为和机理.结果表明,AMT能有效抑制青铜在柠檬酸中的腐蚀,属 混合型缓蚀剂.红外反射光谱表明,膜的最外层结构为Cu(Ⅰ)AMT,AMT中-NH2参与一价铜的络 合反应,环上离氨基最近的N参与配位. 缓蚀机理归因于成相膜的形成.     

Electroless Deposition of Copper on Poly(tetrafluoroethylene) Films Modified by Plasma-Induced Surface Grafting of Poly(4-vinylpyridine)

Argon plasma-pretreated poly(tetrafluoroethylene) (PTFE) films were solution coated with a thin layer of poly(4-vinyl pyridine) (P4VP). Subsequent exposure of the films to argon plasma resulted in the grafting of P4VP on the PTFE films. Electroless plating of copper could be carried out effectively on the P4VP-grafted PTFE (P4VP-g-PTFE) surface after PdCl₂ activation and in the absence of SnCl₂ sensitization (the Sn-free process). The catalytic processes of the electroless plating of copper in the presence and absence of sensitization by SnCl₂ were also compared. The effect of glow discharge conditions on the P4VP concentration and the adhesion strength of the electrolessly deposited copper was investigated. The T-peel adhesion strength of the electrolessly deposited copper with the graft-modified PTFE film was improved in the absence of SnCl₂ sensitization and could reach about 3 N/cm. PdCl₂ activation and electroless deposition of copper could not be carried out on the pristine or the Ar plasma-treated PTFE surface in the absence of prior sensitization by SnCl₂. X-ray photoelectron spectroscopic (XPS) analysis revealed that the electrolessly deposited copper delaminated from the P4VP-g-PTFE film by cohesive failure inside the PTFE film.     

Poly(vinylpyrrolidone)‐based films grown on copper surfaces

The influence of molecular weight and the amount of the poly(vinylpyrrolidone) (PVP) on the growth of poly(vinylpyrrolidone)–based films on copper surfaces was studied by electrochemical, infrared and electronic spectroscopy, and thermogravimetric methods. Complex polymer/metal ions were deposited onto a copper surface, as the result of the electrochemically generated reaction of copper cations with PVP and SCN^?, in sulfuric acid media. Spontaneous film growth on copper surfaces was generated and characterized as a Cu(II)/PVP/SCN^? complex. Infrared spectra and thermal gravimetric curves of the films generated at + 0.7 V were compared with the chemically synthesized complex, and show the same patterns. The oxidation process can be described as: Cu(0)→Cu(I) and Cu(I)→Cu(II), and the copper complex formed at more positive potentials was characterized as Cu(II)/PVP/SCN^?, with copper bonded to the oxygen atom of PVP and thiocyanate ligand N‐linked. This study focuses on the complex formation on a copper surface in acid media and its characterization through electrochemical and spontaneously generated reactions. © 2009 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 2206–2214, 2009     

借助聚丙烯酸制备铜粒子修饰电极并用于双氧水的电催化性能研究

利用羧基对金属离子的络合作用在电极表面原位制备金属粒子用于电催化过氧化氢(H2O2). 首先在电极表面电沉积聚丙烯酸, 然后化学吸附铜离子, 再用水合肼将其还原成零价铜. 铜粒子簇均匀分散在聚丙烯酸网络中, 其尺寸可通过吸附铜离子的数量和吸附-还原次数来控制. 由于铜微粒的电催化作用, 该修饰电极对H2O2表现出了良好的电流响应. 运用该方法可以在电极表面制备多种金属微粒, 并且聚丙烯酸的自由羧基可以与氨基反应, 从而可共价固定带氨基的酶和抗体, 有望构建多种新型的化学和生物传感器.     

缓蚀剂对铜作用的激光扫描微区光电化学研究

采用激光扫描微区光电化学显微技术(PEM)对不同浓度下的苯并三氮唑(BTA)及其衍生物4-羧基苯并三唑甲酯与5-羧基苯并三唑甲酯的混合物(CBTME)在硼砂缓冲溶液(pH9.2)中对铜电极的缓蚀作用作了比较研究。研究发现当电位正向扫描至某一电位时,一定浓度的BTA或CBTME作用下,铜电极光响应由p-型转化为n-型,并可依此判断缓蚀剂的缓蚀性能,n-型光响应越大,缓蚀剂的缓蚀性能越好,与循环伏安光电流及交流阻抗测试的结果相一致;实验还发现,影响缓蚀剂对铜作用的过程不仅与缓蚀剂本身有关,还与电极电位有关。在一定的电位与一定的缓蚀剂浓度下可观察到铜电极表面共存着p-型和n-型区域及p转n的过程,因此可从微观上观察到缓蚀剂与铜表面作用的过程,为缓蚀剂的应用建立了良好的理论基础。     

Nanotechnological evaluation of protein adsorption on dialysis membrane surface hydrophilized with polyvinylpyrrolidone

Hydrophilizing synthetic polymer dialysis membranes with polyvinylpyrrolidone (PVP) play an important role for inhibition of protein adsorption on membrane surface. In the present study, the effect of PVP on protein adsorption was evaluated from a nano-scale perspective. Swelling behavior of PVP present on wet polysulfone (PS)/PVP film surfaces was observed by atomic force microscopy (AFM). Fibrinogen and human serum albumin (HSA) were immobilized on the tip of AFM probes, with which a force-curve between protein and wet PS/PVP film surface was measured by AFM while scanning in order to visualize two-dimensional protein adsorbability on film surfaces. Furthermore, HSA adsorbability on non-PVP containing PEPA dialysis membrane (FLX-15GW) and PVP containing PEPA dialysis membrane (FDX-150GW) was evaluated by the AFM force-curve method. As a result, PS/PVP film surface was completely covered with hydrated and swollen PVP at 5 wt% or more PVP content. Protein adsorbability on PS/PVP film surfaces decreased greatly with increasing content of PVP. The adsorption of HSA was inhibited by the presence of PVP on film surfaces more significantly than that of more hydrophobic fibrinogen. HSA adsorbability on wet FLX-15GW dialysis membrane surface was 428 ± 174 pN whereas that on wet FDX-150GW dialysis membrane surface was 42 ± 29 pN.     

MMI作为铜的盐酸酸洗缓蚀剂作用机理的研究

用失重法研究了N-甲基-2-巯基咪唑（MMI）在5％盐酸中对铜的酸洗缓蚀性能.探讨了温度和MMI浓度对缓蚀效果的影响，从中得出了MMI在铜表面的吸附等温式，计算了吸附热及MMI的加入对铜在盐酸中腐蚀反应活化能的影响，进而探讨了MMI对铜缓蚀作用的机理.结果表明， 30 ℃下，在5％盐酸中，当MMI的浓度在3 mmol•L－1和8 mmol•L－1之间时,缓蚀率随MMI浓度的增加而迅速增加，当浓度达到8 mmol•L－1时，缓蚀率趋于定值，而当浓度小于3 mmol•L－1时， MMI的加入会加速铜的腐蚀；吸附在铜表面的MMI分子间的作用力整体表现为引力； MMI在铜表面的吸附是吸热反应； MMI的加入降低了铜的腐蚀反应活化能.     

Investigation of molybdate–benzotriazole surface treatment against copper tarnishing

The synergistic effect of benzotriazole (BTAH) and molybdate on the inhibition of copper tarnish was studied in this paper. The antitarnish treatment of copper was conducted with BTAH solution containing molybdate. The surface morphology observation and composition analysis were investigated by SEM with energy dispersive X‐ray (EDX) spectroscopy. The addition of molybdate improved the protection of BTAH significantly. The BTAH + molybdate treated copper specimen has higher N concentration in its surface. The structure of the protective film was studied by XPS and AES measurements. It was characterized to be a complex of Cu(I)BTA. The antitarnish effect is certified by the formation of the protective Cu(I)BTA film. Molybdate does not participate in the formation of the protective film. The presence of molybdate promotes the passivation of copper. This facilitates the stabilization of the cuprous oxide film, and strengthens the adsorption of BTAH. Copyright © 2008 John Wiley & Sons, Ltd.     

Behaviors and mechanisms of copper adsorption on hydrolyzed polyacrylonitrile fibers

Polyacrylonitrile fiber (PANF) was hydrolyzed in a solution of sodium hydroxide and the hydrolyzed polyacrylonitrile fiber (HPANF) was used as an adsorbent to remove copper ions from aqueous solution. Scanning electron microscopy (SEM) showed that the hydrolysis process made the surface of HPANF rougher than that of PANF. Fourier transform infrared (FTIR) spectroscopy revealed that the HPANF contained conjugated imine (-Cz=Nz-) sequences. Batch adsorption results indicated that the HPANF was very effective in adsorbing copper, and the adsorption equilibrium could be reached within 10-20 min. Atomic force microscopy (AFM) showed that some aggregates formed on the surface of the HPANF after copper ion adsorption and the average surface roughness (R(a)) value of the HPANF changed from 0.363 to 3.763 nm due to copper adsorption. FTIR analysis indicated that copper adsorption caused a decrease of the light adsorption intensity of the imine (-Cz=Nz-) groups at 1573 and 1406 cm(-1) wavenumbers, and X-ray photoelectron spectroscopy (XPS) showed that the binding energy (BE) of some of the nitrogen atoms in the HPANF increased to a greater value due to copper adsorption. The FTIR and XPS results suggest that the adsorption of copper ions to the HPANF is attributed to the imine groups on the surface of the HPANF.     

Effect of methanolic plant extract on copper electro-polishing in ortho-phosphoric acid

The behavior of copper electro-polishing in ortho-phosphoric acid using the galvanostatic polarization method was ascertained. This was examined via measuring and comparing anode potential –limiting current relationship in solution of regularly mounting concentrations (from 50 to 1800 ppm of methanolic Allium sativum (garlic extract), Tilia cordata (Tilia leafs), Foeniculum vulgare (fennel seeds), and Lablab purpureus (Dolichos lablab extract) and weight loss method. Influence of temperature on the dissolution kinetics were investigated. First order kinetic is applicable to the copper dissolution in solution containing plant extracts. Surface morphologies, brightness and roughness of polished specimens were examined with a scanning electron microscope (SEM), reflectance and atomic force microscope (AFM). Addition of methanolic plant extract to electro-polishing solution produce a lesser limiting current. According to SEM, UV–VIS-NIR spectra and surface roughness measurements, addition of high concentration (1800 ppm) of methanolic plant extract to the electrolytic solution is highly effective to enhance surface quality. High reflection property is obtained when the different type of methanolic plant extract is added to the electro-polishing electrolyte. The minimum Ra and PV values are achieved by garlic extract, which records the highest reflectance value and inhibition efficiency. Weight loss data obtained is excellent conformity with the result obtained by electrochemical measurements.     

金属铜表面的三维齿状图形的化学微加工

金属铜表面的三维齿状图形的化学微加工;约束刻蚀剂层技术(CELT);化学刻蚀     

铜电极表面硅烷膜的自组装及其性能研究

应用自组装技术在铜电极表面上制备3巯基丙基三甲氧基硅烷自组装膜.红外光谱研究该自组装膜结构,电化学方法考察3-巯基丙基三甲氧基硅烷膜在5%NaCl溶液中对铜电极的缓蚀性能.结果表明,于不同浓度的3-巯基丙基三甲氧基硅烷乙醇溶液中自组装的硅烷膜表现出较好的抗腐蚀性.     

酞菁铜阴阳离子分子沉积(MD)膜润湿性研究

酞菁及其衍生物等大环平面分子具有良好的化学稳定性和优异的光电性能 [1,2 ] ,利用酞菁进行模拟生物光合作用的研究 ,以期实现新的光电转换技术 ,近年来已引起人们的广泛重视[3～ 5] .分子沉积(MD)超薄膜[6～ 8] 是以阴阳离子间静电相互作用为成膜驱动力 ,通过相反离子体系的单层交替沉积制备的层状有序超薄膜 .分子沉积技术广泛应用在固体表面改性和生物传感技术等领域 ,沉积分子的物理化学性质是影响其应用的主要因素 .本文通过紫外 -可见光谱跟踪了酞菁铜阴阳离子 MD膜的均匀沉积 ,并根据酞菁 MD膜表面接触角的变化 ,探讨分子端基的…