10—20MeV中子引起单粒子翻转能量沉积统计分析

基于Monte Carlo计算模拟, 对10—20MeV中子引起存储器单粒子翻转能量沉积进行了统计分析, 为了解单粒子翻转随机过程提供能量沉积统计信息.     

中子引起单粒子翻转过程中能量沉积统计分析

利用Monte Carlo方法,对14MeV中子引起存储器单粒子翻转过程进行了计算模拟,从而对引起单粒子翻转的关键因素——存储器灵敏区中的能量沉积进行了统计分析,为了解单粒子翻转随机过程提供了详细的能量沉积统计信息。The process of the single event upset induced by 14 MeV neutrons in SRAM silicon chip is simulated by using a Monte Carlo method. The deposited energies in sensitive volumes in the chip, which is an important factor in the single event upset, are statistically analysed. The statistic information about the deposited energies is provided for understanding the detailed random process of the single event upset.     

Monte Carlo方法在单粒子翻转数值模拟中的应用

描述了在单粒子翻转数值模拟中的一种有效方法-Monte Carlo方法,并对该方法中的粒子输运过程和相关的随机抽样进行了描述.对14MeV的中子从存储器硅片表面随机入射引起的单粒子翻转进行了计算和分析,同时计算了Monte Carlo方法引起的误差.     

中子引起单粒子翻转过程的Monte Carlo计算模拟

从中子与硅原子相互作用的物理机理出发,利用Monte Carlo方法编制了中子引起单粒子翻转的计算模拟程序,并对14 MeV中子环境下的16K位静态存储器硅片翻转过程中的物理量进行了计算,同时可为中子引起的单粒子翻转的研究提供截面和描述内部物理过程的参考数据。     

粒子(E≥45 MeV)核内级联Monte Carlo模拟程序研究

本文基于核内级联物理过程,采用Monte Carlo方法发展了一款质子、中子以及π介子的粒子输运程序.基本物理模型基于适当简化和核内级联Bertini模型,同时借鉴了INCL模型质心系下的角微分分布以克服Bertini模型之不足,即采用Monte Carlo方法模拟核子与核子、核子与π介子间的弹性散射、非弹性散射等过程,粒子相互作用时,核子密度随半径变化且作用截面参考Bertini模型22类实验截面数据,出射粒子散射角在质心系下的抽样遵从INCL模型所确定的微分分布.可模拟45—3500 MeV的中子、质子或2500 MeV以下π介子引起的核内级联过程.入射粒子能量在60—378 MeV范围内反应截面理论计算值与已有实验数据、以及在65—3000 MeV较宽能区范围内反应截面、出射粒子增殖比、微分截面和剩余核等计算结果与MCNPX,GEANT 4和PHITS模拟结果符合较好.     

14MeV中子照相中散射中子对成像影响的Monte Carlo模拟

依据实验参数，建立了14MeV快中子照相的物理模型，并利用Monte Carlo方法对照相过程进行了模拟. 分析了经聚乙烯样品散射的中子对快中子图像的影响随样品与探测器间距及样品参数的变化. 计算结果表明，样品与探测器的距离d<5cm时，样品中的散射中子对图像的影响强烈依赖于d，而当d>20cm时，样品散射中子对图像的影响可忽略；当样品密度为3—5g/cm³时散射中子对图像的影响相对最大；样品宽度越大，图像中的散射成分越多，当宽度在3cm以上时散射成分的强度趋于饱和. 关键词： 14MeV中子 快中子照相 散射中子 Monte Carlo模拟     

静态随机存储器单粒子翻转效应三维数值模拟

针对特征尺寸为1.5 μm的国产静态随机存储器（SRAM）,构建了三维SRAM存储单元模型,并对重离子引起的SRAM单粒子翻转效应进行了数值模拟.计算并分析了单粒子引起的单粒子翻转和电荷收集的物理图像,得到了SRAM器件的单粒子翻转截面曲线.单粒子翻转的数值模拟结果与重离子微束、重离子宽束实验结果比较一致,表明所建立的三维器件模型可以用来研究SRAM器件的单粒子翻转效应. 关键词： 三维数值模拟 单粒子翻转 微束 宽束     

空间高能离子在纳米级SOI SRAM中引起的单粒子翻转特性及物理机理研究

基于蒙特卡罗方法研究空间高能离子在65—32 nm绝缘体上硅静态随机存取存储器(SOI SRAM)中产生的灵敏区沉积能量谱、单粒子翻转截面和空间错误率特性及内在的物理机理.结果表明:单核能为200 MeV/n的空间离子在60—40 nm厚的灵敏区中产生的能损歧离导致纳米级SOI SRAM在亚线性能量转移阈值区域出现单粒子翻转;宽的二次电子分布导致灵敏区仅能部分收集单个高能离子径迹中的电子-空穴对,致使灵敏区最大和平均沉积能量各下降25%和33.3%,进而引起单粒子翻转概率降低,以及在轨错误率下降约80%.发现俘获带质子直接电离作用导致65 nm SOI SRAM的在轨错误率增大一到两个数量级.     

随机静态存储器低能中子单粒子翻转效应

 建立了中子单粒子翻转可视化分析方法,对不同特征尺寸（0.13~1.50 μm）CMOS工艺商用随机静态存储器(SRAM)器件开展了反应堆中子单粒子翻转效应的实验研究,获得了SRAM器件的裂变谱中子单粒子翻转截面随特征尺寸变化的变化趋势。研究结果表明:SRAM器件的特征尺寸越小,其对低能中子导致的单粒子翻转的敏感性越高。     

厚闪烁体内次级中子对快中子图像质量的影响研究

利用编制的快中子照相数值模拟程序(FNRSC)模拟计算了入射中子能量为14 MeV时,厚度5—300 mm闪烁体内次级中子对快中子图像质量的影响,结果表明闪烁体厚度d<50mm时,次级中子对图像的影响强烈依赖于闪烁体厚度,而当d>50 mm时,次级中子对图像的影响趋于饱和.将文献中利用蒙特卡罗中子-光子输运程序(MCNP)计算的次级中子对图像影响和文中计算结果进行了对比,给出了二者存在差异的主要原因：次级中子分布对入射中子空间分布的强烈依赖性;能量沉积和荧光输出这两种计算方法对 关键词： 14 MeV中子 快中子照相 次级中子 Monte Carlo模拟     

14 nm FinFET和65 nm平面工艺静态随机存取存储器中子单粒子翻转对比

使用中国散裂中子源提供的宽能谱中子束流,开展14 nm FinFET工艺和65 nm平面工艺静态随机存取存储器中子单粒子翻转对比研究,发现相比于65 nm器件,14 nm FinFET器件的大气中子单粒子翻转截面下降至约1/40,而多位翻转比例从2.2%增大至7.6%,源于14 nm FinFET器件灵敏区尺寸(80 nm×30 nm×45 nm)、间距和临界电荷(0.05 fC)的减小.不同于65 nm器件对热中子免疫的现象,14 nm FinFET器件中M0附近10B元素的使用导致其表现出一定的热中子敏感性.进一步的中子输运仿真结果表明,高能中子在器件灵敏区中产生的大量的射程长、LET值大的高Z二次粒子是多位翻转的产生诱因,而单粒子翻转主要来自于p,He,Si等轻离子的贡献.     

深亚微米SRAM质子单粒子翻转实验研究

宇航半导体器件运行在一个复杂的空间辐射环境中,质子是空间辐射环境中粒子的重要组成部分,因而质子在半导体器件中导致的辐射效应一直受到国内外的关注。利用兰州重离子加速器(Heavy Ion Research Facility In Lanzhou) 加速出的H2 分子打靶产生能量为10 MeV 的质子,研究了特征尺寸为0.5/0.35/0.15 μm体硅和绝缘体上硅(SOI) 工艺静态随机存储器(SRAM) 的质子单粒子翻转敏感性,这也是首次在该装置上开展的质子单粒子翻转实验研究。实验结果表明特征尺寸为亚微米的SOI 工艺SRAM器件对质子单粒子翻转不敏感,但随着器件特征尺寸的减小和工作电压的降低,SOI 工艺SRAM器件对质子单粒子翻转越来越敏感;特征尺寸为深亚微米的体硅工艺SRAM器件单粒子翻转截面随入射质子能量变化明显,存在发生翻转的质子能量阈值,CREME-MC模拟结果表明质子在深亚微米的体硅工艺SRAM器件中通过质子核反应导致单粒子翻转。Microelectronic devices are used in a harsh radiation environment for space missions. Among all the reliability issues concerned, proton induced single event upset (SEU) is becoming more and more noticeable for semiconductor components exposed on space. In this work, an experimental research of SEU induced by 10 MeV proton for static random access memory (SRAM) of 0.5, 0.35 and 0.15 m feature size is carried out on HeavyIon Research Facility in Lanzhou for the rst time. The experimental results show that proton induced SEUs in submicron and deep-submicron (SRAMs) are dominated by secondary ions generated by proton nuclear reaction events. The silicon-on-insulator SRAMs characters natural radiation-hardened SEU by proton. For the deep-submicron bulk-silicon technology SRAM, the proton SEU cross section is closely related to the proton energy and there is a threshold energy for the SEU occurrence by proton indirect ionization. CREME-MC simulation indicates that the SEU events in deep-submicron SRAM are induced by the proton nuclear reaction.     

Neutron-induced single event upset simulation in Geant4 for three-dimensional die-stacked SRAM

Three-dimensional integrated circuits(3D ICs)have entered into the mainstream due to their high performance,high integration,and low power consumption.When used in atmospheric environments,3D ICs are irradiated inevitably by neutrons.In this paper,a 3D die-stacked SRAM device is constructed based on a real planar SRAM device.Then,the single event upsets(SEUs)caused by neutrons with different energies are studied by the Monte Carlo method.The SEU cross-sections for each die and for the whole three-layer die-stacked SRAM device is obtained for neutrons with energy ranging from 1 MeV to 1000 MeV.The results indicate that the variation trend of the SEU cross-section for every single die and for the entire die-stacked device is consistent,but the specific values are different.The SEU cross-section is shown to be dependent on the threshold of linear energy transfer(LETth)and thickness of the sensitive volume(Tsv).The secondary particle distribution and energy deposition are analyzed,and the internal mechanism that is responsible for this difference is illustrated.Besides,the ratio and patterns of multiple bit upset(MBU)caused by neutrons with different energies are also presented.This work is helpful for the aerospace IC designers to understand the SEU mechanism of 3D ICs caused by neutrons irradiation.     

Pattern dependence in synergistic effects of total dose on single-event upset hardness

The pattern dependence in synergistic effects was studied in a 0.18 μm static random access memory(SRAM) circuit.Experiments were performed under two SEU test environments:3 Me V protons and heavy ions.Measured results show different trends.In heavy ion SEU test,the degradation in the peripheral circuitry also existed because the measured SEU cross section decreased regardless of the patterns written to the SRAM array.TCAD simulation was performed.TIDinduced degradation in n MOSFETs mainly induced the imprint effect in the SRAM cell,which is consistent with the measured results under the proton environment,but cannot explain the phenomena observed under heavy ion environment.A possible explanation could be the contribution from the radiation-induced GIDL in pMOSFETs.     

重离子在14-nm FinFET SRAM器件引起的单粒子翻转

通过重离子实验研究了14-nm FinFET工艺静态随机存取存储器(SRAM)的单粒子翻转(SEU)特性。通过使用Weibull函数拟合SEU截面获得该器件的线性能量转移(LET)阈值:0.1 MeV/(mg/cm2)。对多位翻转(MBU)贡献的统计结果表明,当LET等于40.3 MeV/(mg/cm2)时,MBU的占比超过95%。此外,FinFET SRAM的SEU截面呈现出与Fin相关的入射角度的各向异性。该研究对基于FinFET工艺的抗辐射CMOS集成电路(IC)的设计具有一定的指导作用。     

Impact of incident direction on neutron-induced single-bit and multiple-cell upsets in 14 nm FinFET and 65 nm planar SRAMs

Based on the BL09 terminal of China Spallation Neutron Source (CSNS), single event upset (SEU) cross sections of 14 nm fin field-effect transistor (FinFET) and 65 nm quad data rate (QDR) static random-access memories (SRAMs) are obtained under different incident directions of neutrons: front, back and side. It is found that, for both technology nodes, the "worst direction" corresponds to the case that neutrons traverse package and metallization before reaching the sensitive volume. The SEU cross section under the worst direction is 1.7-4.7 times higher than those under other incident directions. While for multiple-cell upset (MCU) sensitivity, side incidence is the worst direction, with the highest MCU ratio. The largest MCU for the 14 nm FinFET SRAM involves 8 bits. Monte-Carlo simulations are further performed to reveal the characteristics of neutron induced secondary ions and understand the inner mechanisms.