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Improvement of total-dose irradiation hardness of silicon-on-insulator materials by modifying the buried oxide layer with ion implantation 下载免费PDF全文
The hardening of the buried oxide (BOX) layer of separation by implanted
oxygen (SIMOX) silicon-on-insulator (SOI) wafers against total-dose irradiation
was investigated by implanting ions into the BOX layers. The tolerance to
total-dose irradiation of the BOX layers was characterized by the
comparison of the transfer
characteristics of SOI NMOS transistors before and after irradiation to
a total dose of 2.7
Mrad(SiO2. The experimental results show that the implantation of
silicon ions into the BOX layer can improve the tolerance of the BOX layers
to total-dose irradiation. The investigation of the mechanism of the
improvement suggests that the deep electron traps introduced by silicon
implantation play an important role in the remarkable improvement in
radiation hardness of SIMOX SOI wafers. 相似文献
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基于蒙特卡罗方法研究空间高能离子在65—32 nm绝缘体上硅静态随机存取存储器(SOI SRAM)中产生的灵敏区沉积能量谱、单粒子翻转截面和空间错误率特性及内在的物理机理.结果表明:单核能为200 MeV/n的空间离子在60—40 nm厚的灵敏区中产生的能损歧离导致纳米级SOI SRAM在亚线性能量转移阈值区域出现单粒子翻转;宽的二次电子分布导致灵敏区仅能部分收集单个高能离子径迹中的电子-空穴对,致使灵敏区最大和平均沉积能量各下降25%和33.3%,进而引起单粒子翻转概率降低,以及在轨错误率下降约80%.发现俘获带质子直接电离作用导致65 nm SOI SRAM的在轨错误率增大一到两个数量级. 相似文献
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