一种改进的SRAM单粒子效应检测系统

中国科学院近代物理研究所材料研究中心开展了对静态随机存储器(Static Random Access Memory,SRAM)单粒子效应(Single Event Effects,SEEs)的深入研究。材料中心目前拥有的两套SRAM单粒子检测系统各自具有一定的局限性,所以又提出了一种改进的SRAM SEE检测方法,并研制了相关电路。该检测系统在兰州重离子研究装置(HIRFL)提供的束流辐射终端上进行了多次实验,获得了一批实验数据。其中包括129Xe束流辐照条件下,对65 nm SRAM单粒子翻转的研究;12C束流辐照条件下,对65,130和150 nm商用错误纠正编码加固SRAM SEE的研究;129Xe束流辐照条件下,对普通商用SRAM单粒子锁定的研究等。实验验证了该检测系统的有效性和可靠性,为开展SRAM SEE的研究提供了重要的检测平台,并为以后开展更复杂器件SEE的研究提供了实验经验和技术基础。     

各向异性静态随机存储器中的多位翻转分析研究

重离子实验结果表明,具有高线性能量转移(LET)或大角度入射的快重离子导致静态随机存储器(SRAM)中的多位翻转(MBU)比例增大,甚至超过单位翻转比例。单个离子径迹中的电荷可以沿着径向扩散数个微米,被临近的灵敏区收集后引起MBU。器件灵敏区的各向异性空间布局与离子入射方向共同影响测试器件的MBU图形特征。位线接触点的纵向隔离导致横向型成为主要的两位翻转图形;"L"型和"田"型分别是主要的三位翻转和四位翻转图形。最后,对SRAM抗MBU加固设计和实验验证方法进行了讨论。     

Angular dependence of multiple-bit upset response in static random access memories under heavy ion irradiation

Experimental evidence is presented relevant to the angular dependences of multiple-bit upset (MBU) rates and patterns in static random access memories (SRAMs) under heavy ion irradiation. The single event upset (SEU) cross sections under tilted ion strikes are overestimated by 23.9% 84.6%, compared with under normally incident ion with the equivalent linear energy transfer (LET) value of ～ 41 MeV/(mg/cm 2 ), which can be partially explained by the fact that the MBU rate for tilted ions of 30 is 8.5%-9.8% higher than for normally incident ions. While at a lower LET of ～ 9.5 MeV/(mg/cm 2 ), no clear discrepancy is observed. Moreover, since the ion trajectories at normal and tilted incidences are different, the predominant double-bit upset (DBU) patterns measured are different in both conditions. Those differences depend on the LET values of heavy ions and devices under test. Thus, effective LET method should be used carefully in ground-based testing of single event effects (SEE) sensitivity, especially in MBU-sensitive devices.     

Modeling and assessing the influence of linear energy transfer on multiple bit upset susceptibility

The influence of the metric of linear energy transfer （LET） on single event upset （SEU）, particularly multiple bit upset （MBU） in a hypothetical 90-nm static random access memory （SRAM） is explored. To explain the odd point of higher LET incident ion but induced lower cross section in the curve of SEU cross section, MBUs induced by incident ions 132Xe and 2~9Bi with the same LET but different energies at oblique incidence are investigated using multi-functional package for single event effect analysis （MUFPSA）. In addition, a comprehensive analytical model of the radial track structure is incorporated into MUFPSA, which is a complementation for assessing and interpreting MBU susceptibility of SRAM. The results show that （i） with the increase of incident angle, MBU multiplicity and probability each present an increasing trend; （ii） due to the higher ion relative velocity and longer range of ~ electrons, higher energy ions trigger the MBU with less probability than lower energy ions.     

Simulation of temporal characteristics of ion-velocity susceptibility to single event upset effect

Using a Monte Carlo simulation tool of the multi-functional package for SEEs Analysis(MUFPSA), we study the temporal characteristics of ion-velocity susceptibility to the single event upset(SEU) effect, including the deposited energy,traversed time within the device, and profile of the current pulse. The results show that the averaged dposited energy decreases with the increase of the ion-velocity, and incident ions of209 Bi have a wider distribution of energy deposition than132 Xe at the same ion-velocity. Additionally, the traversed time presents an obvious decreasing trend with the increase of ion-velocity. Concurrently, ion-velocity certainly has an influence on the current pulse and then it presents a particular regularity. The detailed discussion is conducted to estimate the relevant linear energy transfer(LET) of incident ions and the SEU cross section of the testing device from experiment and simulation and to critically consider the metric of LET.     

电子诱发波导微放电实验研究

针对宇航微波器件功率密度越来越大,空间电子可能诱发微波器件发生微放电的潜在威胁,通过设计特殊波导结构,利用电子枪提供的种子电子入射到特殊波导内,在波导内通入大功率微波信号,利用检波器和示波器分别检测透射波形和反射波形,观察微放电现象的持续过程;改变电子入射能量,观测到不同程度的微放电现象,该电子枪提供种子电子诱发波导微放电效应的实验方法为微波器件微放电效应研究提供了重要手段。     

深亚微米SRAM质子单粒子翻转实验研究

宇航半导体器件运行在一个复杂的空间辐射环境中,质子是空间辐射环境中粒子的重要组成部分,因而质子在半导体器件中导致的辐射效应一直受到国内外的关注。利用兰州重离子加速器(Heavy Ion Research Facility In Lanzhou) 加速出的H2 分子打靶产生能量为10 MeV 的质子,研究了特征尺寸为0.5/0.35/0.15 μm体硅和绝缘体上硅(SOI) 工艺静态随机存储器(SRAM) 的质子单粒子翻转敏感性,这也是首次在该装置上开展的质子单粒子翻转实验研究。实验结果表明特征尺寸为亚微米的SOI 工艺SRAM器件对质子单粒子翻转不敏感,但随着器件特征尺寸的减小和工作电压的降低,SOI 工艺SRAM器件对质子单粒子翻转越来越敏感;特征尺寸为深亚微米的体硅工艺SRAM器件单粒子翻转截面随入射质子能量变化明显,存在发生翻转的质子能量阈值,CREME-MC模拟结果表明质子在深亚微米的体硅工艺SRAM器件中通过质子核反应导致单粒子翻转。Microelectronic devices are used in a harsh radiation environment for space missions. Among all the reliability issues concerned, proton induced single event upset (SEU) is becoming more and more noticeable for semiconductor components exposed on space. In this work, an experimental research of SEU induced by 10 MeV proton for static random access memory (SRAM) of 0.5, 0.35 and 0.15 m feature size is carried out on HeavyIon Research Facility in Lanzhou for the rst time. The experimental results show that proton induced SEUs in submicron and deep-submicron (SRAMs) are dominated by secondary ions generated by proton nuclear reaction events. The silicon-on-insulator SRAMs characters natural radiation-hardened SEU by proton. For the deep-submicron bulk-silicon technology SRAM, the proton SEU cross section is closely related to the proton energy and there is a threshold energy for the SEU occurrence by proton indirect ionization. CREME-MC simulation indicates that the SEU events in deep-submicron SRAM are induced by the proton nuclear reaction.     

重离子核反应对单粒子翻转的影响（英文）

LET作为一个传统的工程参量,并不能完全满足单粒子翻转数据表征的需要,而且也不能直接地反映核反应的一些特性(包括核反应概率与次级粒子),因此研究了重离子与器件作用过程中核反应对单粒子翻转的影响。基于蒙特卡罗模拟与深入的分析,本研究对比了在直接电离与考虑核反应两种模式下的模拟结果。在模拟中,利用不同的重离子表征了核反应在单粒子翻转发生中所起的作用。结果显示,核反应对单粒子翻转截面的贡献依赖于离子的能量,并呈现非单调的变化关系。基于模拟的结果,建议用重离子核反应引起单粒子翻转的最恶劣情况来预估空间单粒子翻转率。     

Monte Carlo evaluation of spatial multiple-bit upset sensitivity to oblique incidence

We investigate the impact of heavy ion irradiation on a hypothetical static random access memory (SRAM) device. Influences of the irradiation angle, critical charge, drain-drain spacing, and dimension of device structure on the device sensitivity have been studied. These prediction and simulated results are interpreted with MUFPSA, a Monte Carlo code based on Geant4. The results show that the orientation of ion beams and device with different critical charge exert indispensable effects on multiple-bit upsets (MBUs), and that with the decrease in spacing distance between adjacent cells or the dimension of the cells, the device is more susceptible to single event effect, especially to MBUs at oblique incidence.     

Large energy-loss straggling of swift heavy ions in ultra-thin active silicon layers

Monte Carlo simulations reveal considerable straggling of energy loss by the same ions with the same energy in fully-depleted silicon-on-insulator (FDSOI) devices with ultra-thin sensitive silicon layers down to 2.5 nm. The absolute straggling of deposited energy decreases with decreasing thickness of the active silicon layer. While the relative straggling increases gradually with decreasing thickness of silicon films and exhibits a sharp rise as the thickness of the silicon film descends below a threshold value of 50 nm, with the dispersion of deposited energy ascending above ±10%. Ion species and energy dependence of the energy-loss straggling are also investigated. For a given beam, the dispersion of deposited energy results in large uncertainty on the actual linear energy transfer (LET) of incident ions, and thus single event effect (SEE) responses, which pose great challenges for traditional error rate prediction methods.