用SiCl4/H2气源沉积多晶硅薄膜光照稳定性的研究

对以SiH4/H2及SiCl4/H2为源气体、采用等离子体增强化学气相沉积技术制备的非晶硅薄膜和多晶硅薄膜进行了光照稳定性的研究.实验表明,制备的多晶硅薄膜并没有出现非晶硅中的光致衰减现象,其光电导、暗电导在光照过程中没有下降反而有所上升且电导率变化快慢受氢稀释度的制约.多晶硅薄膜的光照稳定性可能来源于高的晶化度及Cl元素的存在.     

La2/3Ca1/3MnO3薄膜的光致电阻率变化特性

射频磁控溅射法制备了La_2/3Ca_1/3MnO₃纳米薄膜(LCMO).该薄膜发生FM-PM相变的转变点温度为T_c≈308K（近似为电阻峰值温度T_p）；在不同温度下的光电导性质实验表明所制备的LCMO薄膜在连续激光作用时低温段（Tc）表现为光致电阻率增大效应，即ΔR/R＞0，并在R-T曲线拐点附近取得极大值，（ΔR/R）_max=43.5%；当T>T关键词： 钙钛矿薄膜 光响应 电子自旋 小极化子     

H2对Ar稀释SiH4等离子体CVD制备多晶硅薄膜的影响

以SiH₄，Ar和H₂为反应气体，采用射频等离子体化学气相沉积方法在300℃下制备了低温多晶Si薄膜.实验发现，反应气体中H₂的比例是影响薄膜结晶质量的重要因素，在适量的H₂比例下制备的多晶Si薄膜具有结晶相体积分数高，氢含量低，生长速率快、抗杂质污染等特性. 关键词： 低温多晶Si薄膜 等离子体CVD 4')" href="#">Ar稀释SiH₄ 2比例')" href="#">H₂比例     

Fe3O4薄膜的电输运及光诱导特性研究

用脉冲激光沉积法在(111)Si衬底上成功制备了高度择优取向的Fe₃O₄薄膜.电阻-温度关系表明Fe₃O₄薄膜的Verwey转变(T_V)约在122 K,低温段(T_V)输运特征满足Mott变程跳跃模型,高温段(T>T_V)为小极化子输运.激光作用下的光电导实验发现,在整个温区表现为光致电阻率减小,而且低温段的电阻变化率比高温段要大很多.分析认为Fe₃O₄薄膜的光致电阻率变化主要与激光激发t_2g电子的转移有关. 关键词： 3O₄薄膜')" href="#">Fe₃O₄薄膜 小极化子 光诱导特性     

稳定、优质nc-Si/a-Si:H薄膜的研制和特性分析

利用等离子体增强化学气相沉积技术研制出了优质稳定的氢化非晶-纳米晶两相结构硅薄膜.薄膜的光电导率相对于器件质量的非晶硅有两个数量级的提高；光敏性也较好，光、暗电导比可以达到１０⁴，此外薄膜的光电导谱具有更宽的长波光谱响应.更为重要 的是薄膜的光致退化效应远小于典型的非晶硅薄膜，在光强为５０ｍW／ｃｍ²的卤钨灯光 照２４h后，光电导的衰退小于１０％.这种薄膜优良的光电性能源于薄膜中的非晶母体的存在使其在 光学跃迁中的动量选择定则发生松弛，因而具有大的光学吸收系数和 关键词： 非晶硅 微结构 光致变化     

CeO2/Nb2O5界面效应对提高CeO2氧敏特性的XPS研究

用射频/直流磁控溅射法制备了CeO₂/Nb₂O₅双层氧敏薄膜，利用X射线光电子能谱(XPS)，描述并解释了单层CeO₂薄膜中氧随温度变化的动力学行为，以及CeO₂/Nb₂O₅薄膜界面对氧敏特性的影响.通过对Ce3d XPS谱的高斯拟合，计算了Ce³⁺浓度并给出了判定Ce⁴⁺还原的标志.结果表明，界面效应可以提高CeO₂/Nb₂O₅薄膜中Ce⁴⁺的还原能力，使之远远高于单层CeO₂薄膜，这对薄膜的氧敏特性是极为有利的. 关键词：     

BaTiO3/p-Si异质结的整流特性和光诱导特性的研究

利用脉冲激光沉积法成功制备了BaTiO₃/p-Si异质结, 该异质结在80–300 K 显示出了良好的整流特性和光诱导特性. 开启电压随着温度的升高而逐渐降低. 利用不同频率的光子辐照样品, 观察到明显的光电导效应. 且随着照射光子能量的增大, 结电流也相应变大, 光诱导效应越明显. BaTiO₃薄膜电阻-温度(R-T) 曲线显示氧缺陷条件下BaTiO₃薄膜具有良好的半导体特性. 关键词： 异质结 光诱导效应 3薄膜')" href="#">BaTiO₃薄膜     

非晶/微晶相变域硅薄膜及其太阳能电池

采用甚高频等离子体增强化学气相沉积（VHF-PECVD）法，成功制备出从非晶到微晶过渡区 域的硅薄膜. 样品的微结构、光电特性及光致变化的测量结果表明这些处于相变域的硅薄膜 兼具非晶硅优良的光电性质和微晶硅的稳定性. 用这种两相结构的材料作为本征层制备了p- i-n太阳能电池，并测量了其稳定性. 结果在AM15(100mW/cm²) 的光强下曝光 800—5000min后，开路电压略有升高，转换效率仅衰退了29%. 关键词： 相变域硅薄膜 光电特性 太阳能电池     

氢稀释对多晶硅薄膜结构特性和光学特性的影响

以SiCl₄和H₂为气源，用等离子体增强化学气相沉积技术，在250℃的低温下，研究氢稀释度对多晶硅薄膜结构特性的影响.实验结果表明，对于以SiCl₄和H₂组成的反应源气体，氢对薄膜生长特性的影响有异于SiH₄/H₂，在一定功率下，薄膜的晶化率随氢稀释度的减小而增加，在一定的氢稀释度下薄膜晶化度达到最大值85％；随着氢稀释度的继续减小，薄膜晶化度迅速下降，并逐渐向非晶态结构转变.随氢稀释度的减小，薄膜的光学带隙由 1.5eV减小至约1.2eV，而后增大至1.8eV.沉积速率则随氢稀释度的减小先增加后减小，在无氢条件下，无薄膜形成.在最佳氢稀释度条件下，Cl基是促进晶化度提高，晶粒长大的一个主要因素. 关键词： 多晶硅薄膜 微结构 氢稀释 4')" href="#">SiCl₄     

(La0.7Sr0.3MnO3)m(BiFeO3)n超晶格间隔的La0.7Sr0.3MnO3三明治结构制备及表征

采用射频磁控溅射的方法在SrTiO₃（001） 基片上制备了（La_0.7Sr_0.3MnO₃）_m（BiFeO₃）_n超晶格间隔的La_0.7Sr_0.3MnO₃三明治结构.X射线衍射分析证明（La_0.7Sr_0.3MnO_{关键词： 超晶格薄膜 电诱导效应 隧道效应}     

Roles of SiH4 and SiF4 in growth and structural changes of poly-Si films

The structural properties of polycrystalline silicon films, prepared by plasma enhanced chemical vapor deposition system, with different flow rates of SiH₄/SiF₄ mixtures at 300 °C were investigated. This study indicates that the low hydrogen coverage on the growing surface, under optimum fluorine radicals, will be leaded to an improvement of crystallized area as compared with case of high hydrogen coverage surface. Moreover, the studies of the role of SiH₄ and SiF₄ radicals show that the SiH₄ radicals are important in the nucleation and growth of grains. However, SiF₄ radicals are effective in the structural change of grain boundaries regions and by this way, in the present system, establish the growth of grains under the dominant 〈1 1 0〉 direction. The stress investigation indicates that addition of high flow rate of SiF₄ in amorphous film, results in the nearly stress free films. Finally, we found that the changes in g-value reflect the changes in the intrinsic compressive and tensile stress in the both polycrystalline and amorphous silicon films.     

Roles of SiH4 and SiF4 in growth and structural changes of poly-Si films

The structural properties of polycrystalline silicon films, prepared by plasma enhanced chemical vapor deposition system, with different flow rates of SiH₄/SiF₄ mixtures at 300 °C were investigated. This study indicates that the low hydrogen coverage on the growing surface, under optimum fluorine radicals, will be leaded to an improvement of crystallized area as compared with case of high hydrogen coverage surface. Moreover, the studies of the role of SiH₄ and SiF₄ radicals show that the SiH₄ radicals are important in the nucleation and growth of grains. However, SiF₄ radicals are effective in the structural change of grain boundaries regions and by this way, in the present system, establish the growth of grains under the dominant 〈1 1 0〉 direction. The stress investigation indicates that addition of high flow rate of SiF₄ in amorphous film, results in the nearly stress free films. Finally, we found that the changes in g-value reflect the changes in the intrinsic compressive and tensile stress in the both polycrystalline and amorphous silicon films.     

氮化硅薄膜中纳米非晶硅颗粒的键合结构及光致发光

采用螺旋波等离子体化学气相沉积技术以N₂/SiH₄/H₂为反应气体制备了镶嵌有纳米非晶硅颗粒的氢化氮化硅薄膜,通过改变N₂流量实现了薄膜从红到蓝绿的可调谐光致发光.傅里叶红外透射和紫外-可见光吸收特性分析表明,所生长薄膜具有较高的氢含量,N₂流量增加使氢的键合结构发生变化,非晶硅颗粒尺寸减小,所对应的薄膜的光学带隙逐渐增加和微观结构有序度减小.可调光致发光(PL)主要来源于纳米硅颗粒的量子限制效应发光,随N₂流量增加,PL的谱线展宽并逐渐增强. 关键词： 傅里叶红外透射谱 光吸收谱 纳米硅粒子镶嵌薄膜 光致发光     

Spin polarized La0.7Sr0.3MnO3 thin films on silicon

La_0.7Sr_0.3MnO₃ polycrystalline manganite thin films were grown on silicon (Si) substrates covered by SiO_x amorphous native oxide. Curie temperatures of about 325 K were achieved for 70-nm-thick films. Strong room temperature XMCD signal was detected indicating high spin polarization at the surface. Cross-sectional TEM images show sharp interface between SiO_x and manganite without signature of chemical reaction at the interface. Unusual sharp splitting of the manganite film was observed: on the top of a transition layer characterized by low crystalline order, a magnetically robust layer is formed.     

Interfaces analysis of the HfO2/SiO2/Si structure

The physical and chemical properties of the HfO₂/SiO₂/Si stack have been analyzed using cross-section HR TEM, XPS, IR-spectroscopy and ellipsometry. HfO₂ films were deposited by the MO CVD method using as precursors the tetrakis 2,2,6,6 tetramethyl-3,5 heptanedionate hafnium—Hf(dpm)₄ and dicyclopentadienil-hafnium-bis-diethylamide—Сp₂Hf(N(C₂H₅)₂)₂.The amorphous interface layer (IL) between HfO₂ and silicon native oxide has been observed by the HRTEM method. The interface layer comprises hafnium silicate with a smooth varying of chemical composition through the IL thickness. The interface layer formation occurs both during HfO₂ synthesis, and at the annealing of the HfO₂/SiO₂/Si stack. It was concluded from the XPS, and the IR-spectroscopy that the hafnium silicate formation occurs via a solid-state reaction at the HfO₂/SiO₂ interface, and its chemical structure depends on the thickness of the SiO₂ underlayer.     

多晶Si0.9654Mn0.0346:B薄膜的磁性研究

利用磁控溅射和快速热处理的方法制备了Mn,B共掺的多晶硅薄膜(Si_0.9654Mn_0.0346:B).磁性和结构研究发现薄膜有两个铁磁相.低温铁磁相来源于杂相Mn₄Si₇,高温铁磁相(居里温度T_C～250K)是由Mn原子掺杂进入Si晶格导致.晶化后的薄膜利用射频等离子体增强化学气相沉积系统(PECVD)进行短暂(4min)的氢化处理后发现,薄膜的微结构没有发生变化而饱和磁化强度却随着 关键词： 磁性半导体 硅 氢化     

Microstructure and dielectric properties of La2O3 doped amorphous SiO2 films as gate dielectric material

As a potential gate dielectric material, the La₂O₃ doped SiO₂ (LSO, the mole ratio is about 1:5) films were fabricated on n-Si (0 0 1) substrates by using pulsed laser deposition technique. By virtue of several measurements, the microstructure and electrical properties of the LSO films were characterized. The LSO films keep the amorphous state up to a high annealing temperature of 800 °C. From HRTEM and XPS results, these La atoms of the LSO films do not react with silicon substrate to form any La-compound at interfacial layer. However, these O atoms of the LSO films diffuse from the film toward the silicon substrate so as to form a SiO₂ interfacial layer. The thickness of SiO₂ layer is only about two atomic layers. A possible explanation for interfacial reaction has been proposed. The scanning electron microscope image shows the surface of the amorphous LSO film very flat. The LSO film shows a dielectric constant of 12.8 at 1 MHz. For the LSO film with thickness of 3 nm, a small equivalent oxide thickness of 1.2 nm is obtained. The leakage current density of the LSO film is 1.54 × 10⁻⁴ A/cm² at a gate bias voltage of 1 V.     

Formations and morphological stabilities of ultrathin CoSi2 films

In this paper we investigate the formations and morphological stabilities of Co-silicide fihns using 1-8-nm thick Co layers sputter-deposited on silicon （100） substrates. These ultrathin Co-silicide films are formed via solid-state reaction of the deposited Co films with Si substrate at annealing temperatures from 450 ℃ to 850 ℃. For a Co layer with a thickness no larger than i nm, epitaxially aligned CoSi2 films readily grow on silicon （100） substrate and exhibit good morphological stabilities up to 600 ℃. For a Co layer thicker than 1 nm, polycrystalline CoSi and CoSi2 films are observed. The critical thickness below which epitaxially aligned CoSi2 film prevails is smaller than the reported critical thickness of the Ni layer for epitaxial alignment of NiSi2 on silicon （100） substrate. The larger lattice mismatch between the CoSi2 film and the silicon substrate is the root cause for the smaller critical thickness of the Co layer.     

Enhancement of ferromagnetism in polycrystalline Si0.965Mn0.035:B films by boron plasma treatment

This paper reports that the polycrystalline Si0.965Mn0.035:B films have been prepared by cosputtering deposition followed by rapid thermal annealing for crystallization. The polycrystalline thin films consist of two ferromagnetic phases. The low temperature ferromagnetic phase with Curie temperature (Tc) of about 50 K is due to the Mn4Si7 phase in the films, while the high temperature one (Tc～250 K) is resulted from the incorporation of Mn into silicon. The films are treated by boron plasma excited with the approach of microwave plasma enhanced chemical vapor deposition for 40 minutes. After plasma treatment, it is observed that no extra magnetic phases or magnetic complexes exist in the films, while both the high temperature saturation magnetization and the hole concentration in the films increase. The obvious correlation between the magnetic properties and the electrical properties of the polycrystalline Si0.965Mn0.035:B films suggests that the hole carriers play an important role in Si:Mn diluted magnetic semiconductors.