Effect of magnetic field on the terahertz radiationdetection in high electron mobility transistors

In this paper, we make a theoretical investigation of the plasma-wave instability mechanism in a two-dimensional electron fluid in a high electron mobility transistor (HEMT) driven by the terahertz radiation in the presence of a perpendicular magnetic field. It is found that the resonant peaks of the gate-to-source/drain admittances and detection responsivity depend on the strength of the external magnetic field. Such phenomena can be used to produce a desired effect by adjusting the intensity of the magnetic field.     

Ultraviolet Phototransistors on AlGaN/GaN Heterostructures

We report on the fabrication and characterization of phototransistors based on AIGaN/GaN heterostructure grown over 6H-SiC substrates. The device has two functions： as a high electron mobility transistor （HEMT） and an ultraviolet photodetector at the same time. As an HEMT, its maximum transconductance is 170mS/ram, while the minimum cutoff frequency fT and the maximum oscillation frequency fm are 19 and 35 GHz, respectively. As a photodetector, the device is visible blind, with an ultraviolet/green contrast of three orders of magnitude, and a responsivity as high as 1700 A/W at the wavelength of 362nm.     

具有p-GaN岛状埋层耐压结构的横向AlGaN/GaN高电子迁移率晶体管

GaN基高电子迁移率晶体管(HEMT)相对较低的击穿电压严重限制了其大功率应用.为了进一步改善器件的击穿特性,通过在n-GaN外延缓冲层中引入六个等间距p-GaN岛掩埋缓冲层(PIBL)构成p-n结,提出一种基于p-GaN埋层结构的新型高耐压AlGaN/GaN HEMT器件结构.Sentaurus TCAD仿真结果表明,在关态高漏极电压状态下,p-GaN埋层引入的多个反向p-n结不仅能够有效调制PIBL AlGaN/GaN HEMT的表面电场和体电场分布,而且对于缓冲层泄漏电流有一定的抑制作用,这保证了栅漏间距为10μm的PIBL HEMT能够达到超过1700 V的高击穿电压(BV),是常规结构AlGaN/GaN HEMT击穿电压(580 V)的3倍.同时,PIBL结构AlGaN/GaN HEMT的特征导通电阻仅为1.47 m?·cm~2,因此获得了高达1966 MW·cm~(-2)的品质因数(FOM=BV~2/R_(on,sp)).相比于常规的AlGaN/GaN HEMT,基于新型p-GaN埋岛结构的HEMT器件在保持较低特征导通电阻的同时具有更高的击穿电压,这使得该结构在高功率电力电子器件领域具有很好的应用前景.     

地物光谱仪测量中的温湿度影响

地物光谱仪在遥感领域的应用日益重要,可用于研究不同地物条件下可见和红外的光谱辐射特性,从而获得地表的光谱辐射亮度、光谱辐射照度或方向反射因子等信息。地物光谱特性的准确测量是光学遥感定量分析的基础,对于航天传感器定标、遥感数据反演等具有极其重要的意义。地物光谱仪在测量前必须进行光谱辐射定标,一方面定标过程中地物光谱仪的光谱响应特性可能发生漂移,另一方面测量时的环境与定标环境可能差异较大,都会影响测量的准确性。在恒温恒湿条件下,实验采用谱线灯光源和积分球光源考察了地物光谱仪波长和光谱响应度随探测器温度的变化。数据显示当光谱仪内部硅阵列探测器温度上升时,波长位置并未发生改变;而光谱仪的光谱响应度随着温度上升明显增大。当硅探测器温度从28.3 ℃升至35.2 ℃时,光谱仪在380～990 nm的光谱响应度变化达到1.8%～7.3%;同时近红外1 000～1 800 nm的平均变化约3.0%,2 000～2 500 nm的变化约1.9%。当改变环境温度和湿度时,测量数据表明湿度影响主要在大气中水分子的吸收峰附近波长,对其他波长影响很小;光谱仪光谱响应度与内部探测器的温度近似存在一一对应关系,环境温度的影响可以近似根据内部探测器温度变化予以表征。理论上当环境条件改变时,根据光谱响应度随温度的变化和探测器的监测温度,可以进行光谱数据修正。最后,实验测量了一组探测器温度下对应的光谱响应度,采用多项式拟合和最小二乘法建立了地物光谱仪光谱响应度与温度的函数关系。根据函数关系插值得到的光谱响应度修正因子和直接测量得到的数据基本一致,全谱段的差异几乎都小于0.2%,表明光谱响应度与温度的对应关系可用于解决不同环境条件下的测量准确性。     

Simulation study of InAlN/GaN high-electron mobility transistor with AlInN back barrier

In this work, we use a 3-nm-thick Al_(0.64)In_(0.36)N back-barrier layer in In_(0.17)Al_(0.83) N/Ga N high-electron mobility transistor(HEMT) to enhance electron confinement. Based on two-dimensional device simulations, the influences of Al_(0.64)In_(0.36) N back-barrier on the direct-current(DC) and radio-frequency(RF) characteristics of In AlN/GaN HEMT are investigated, theoretically. It is shown that an effective conduction band discontinuity of approximately 0.5 eV is created by the 3-nm-thick Al_(0.64)In_(0.36) N back-barrier and no parasitic electron channel is formed. Comparing with the conventional In AlN/GaN HEMT, the electron confinement of the back-barrier HEMT is significantly improved, which allows a good immunity to short-channel effect(SCE) for gate length decreasing down to 60 nm(9-nm top barrier). For a 70-nm gate length, the peak current gain cut-off frequency( f_T) and power gain cut-off frequency( f_(max)) of the back-barrier HEMT are172 GHz and 217 GHz, respectively, which are higher than those of the conventional HEMT with the same gate length.     

High-performance modulation-doped AlGaAs/InGaAs thermopiles for uncooled infrared FPA application

Novel thermopile based on modulation doped AlGaAs/InGaAs heterostructures is proposed and developed for the first time, for uncooled infrared FPA (Focal Plane Array) image sensor application. The high responsivity with the high speed response time are designed to be 4900 V/W with 110 μs under the 2 μm design rule. Based on integrated HEMT–MEMS technology, the 32 × 32 matrix FPA is fabricated to demonstrate its enhanced performances by black body measurement. The technology presented here demonstrates the potential of this approach for low-cost uncooled infrared FPA image sensor application.     

Damage effect and mechanism of the GaAs high electron mobility transistor induced by high power microwave

In this paper, we present the damage effect and mechanism of high power microwave(HPM) on Al GaAs/GaAs pseudomorphic high-electron-mobility transistor(p HEMT) of low-noise amplifier(LNA). A detailed investigation is carried out by simulation and experiment study. A two-dimensional electro-thermal model of the typical GaAs p HEMT induced by HPM is established in this paper. The simulation result reveals that avalanche breakdown, intrinsic excitation, and thermal breakdown all contribute to damage process. Heat accumulation occurs during the positive half cycle and the cylinder under the gate near the source side is most susceptible to burn-out. Experiment is carried out by injecting high power microwave into GaAs p HEMT LNA samples. It is found that the damage to LNA is because of the burn-out at first stage p HEMT. The interiors of the damaged samples are observed by scanning electron microscopy(SEM) and energy dispersive spectrometer(EDS). Experimental results accord well with the simulation of our model.     

Novel model of a AlGaN/GaN high electron mobility transistor based on an artificial neural network

In this paper we present a novel approach to modeling AlGaN/GaN high electron mobility transistor(HEMT) with an artificial neural network(ANN).The AlGaN/GaN HEMT device structure and its fabrication process are described.The circuit-based Neuro-space mapping(neuro-SM) technique is studied in detail.The EEHEMT model is implemented according to the measurement results of the designed device,which serves as a coarse model.An ANN is proposed to model AlGaN/GaN HEMT based on the coarse model.Its optimization is performed.The simulation results from the model are compared with the measurement results.It is shown that the simulation results obtained from the ANN model of AlGaN/GaN HEMT are more accurate than those obtained from the EEHEMT model.     

Evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistors by structure function method

The evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistor (HEMT) by structure function method is proposed in this paper.The evaluation is based on the transient heating measurement of the AlGaN/GaN HEMT by pulsed electrical temperature sensitive parameter method.The extracted chip-level and package-level thermal resistances of the packaged multi-finger AlGaN/GaN HEMT with 400-μm SiC substrate are 22.5 K/W and 7.2 K/W respectively,which provides a non-invasive method to evaluate the chip-level thermal resistance of packaged AlGaN/GaN HEMTs.It is also experimentally proved that the extraction of the chiplevel thermal resistance by this proposed method is not influenced by package form of the tested device and temperature boundary condition of measurement stage.     

Reverse blocking characteristics and mechanisms in Schottky-drain AlGaN/GaN HEMT with a drain field plate and floating field plates

In this paper, a novel Al Ga N/Ga N HEMT with a Schottky drain and a compound field plate(SD-CFP HEMT) is presented for the purpose of better reverse blocking capability. The compound field plate(CFP) consists of a drain field plate(DFP) and several floating field plates(FFPs). The physical mechanisms of the CFP to improve the reverse breakdown voltage and to modulate the distributions of channel electric field and potential are investigated by two-dimensional numerical simulations with Silvaco-ATLAS. Compared with the HEMT with a Schottky drain(SD HEMT) and the HEMT with a Schottky drain and a DFP(SD-FP HEMT), the superiorities of SD-CFP HEMT lie in the continuous improvement of the reverse breakdown voltage by increasing the number of FFPs and in the same fabrication procedure as the SD-FP HEMT.Two useful optimization laws for the SD-CFP HEMTs are found and extracted from simulation results. The relationship between the number of the FFPs and the reverse breakdown voltage as well as the FP efficiency in SD-CFP HEMTs are discussed. The results in this paper demonstrate a great potential of CFP for enhancing the reverse blocking ability in Al Ga N/Ga N HEMT and may be of great value and significance in the design and actual manufacture of SD-CFP HEMTs.     

半导体光电探测器响应度测试装置的研制

分析了半导体光电探测器光谱响应度的测试原理;研制了一套波长为０．４～１．１μｍ的光谱响度测试装置。该装置采用双光路替代法,可以测试绝对光谱响应度、相对光谱响应度和量子效率,并可减小光源不稳定性对测试结果的影响,最终给出了测试结果比对。     

Analysis of the modulation mechanisms of the electric field and breakdown performance in AlGaN/GaN HEMT with a T-shaped field-plate

A novel Al Ga N/Ga N high electron mobility transistor(HEMT) with a source-connected T-shaped field-plate(ST-FP HEMT) is proposed for the first time in this paper. The source-connected T-shaped field-plate(ST-FP) is composed of a source-connected field-plate(S-FP) and a trench metal. The physical intrinsic mechanisms of the ST-FP to improve the breakdown voltage and the FP efficiency and to modulate the distributions of channel electric field and potential are studied in detail by means of two-dimensional numerical simulations with Silvaco-ATLAS. A comparison to the HEMT and the HEMT with an S-FP(S-FP HEMT) shows that the ST-FP HEMT could achieve a broader and more uniform channel electric field distribution with the help of a trench metal, which could increase the breakdown voltage and the FP efficiency remarkably. In addition, the relationship between the structure of the ST-FP, the channel electric field, the breakdown voltage as well as the FP efficiency in ST-FP HEMT is analyzed. These results could open up a new effective method to fabricate high voltage power devices for the power electronic applications.     

Surface monitoring of HEMT structures

The data of Atomic Force Microscopy (AFM) surface monitoring and of mobility investigations in the HEMT structures based on the AlGaAs/InGaAs/GaAs heterostructures with pseudomorphic InGaAs channel are presented. The level of HEMT nanomaterial self-organization (LNSO) were obtained using the treatment the AFM data by the method of multifractal analysis. Direct correlation between the mobility values and LNSO was found for the most of studied HEMT structures that reflect the close relation between the LNSO values and the HEMT bulk properties. In the structures with LNSO changing from 1.13 to 1.45 the 1.5 time mobility decrease at 300 K and 4 times at 77 K was observed. The results obtained allow to suppose that the LNSO calculation based on surface monitoring of HEMT structures can be used for the optimization of their parameters and of their formation process.     

An improved EEHEMT model for kink effect on AlGaN/GaN HEMT

In this paper, a new current expression based on both the direct currect(DC) characteristics of the AlGaN/GaN high election mobility transistor(HEMT) and the hyperbolic tangent function tanh is proposed, by which we can describe the kink effect of the AlGaN/GaN HEMT well. Then, an improved EEHEMT model including the proposed current expression is presented. The simulated and measured results of I–V, S-parameter, and radio frequency(RF) large-signal characteristics are compared for a self-developed on-wafer AlGaN/GaN HEMT with ten gate fingers each being 0.4-μm long and 125-μm wide(Such an AlGaN/GaN HEMT is denoted as AlGaN/GaN HEMT(10 × 125 μm)). The improved large signal model simulates the I–V characteristic much more accurately than the original one, and its transconductance and RF characteristics are also in excellent agreement with the measured data.     

基于超连续光源的InGaAs探测器相对光谱响应度定标技术

InGaAs光电探测器是近红外波段重要的光探测器件之一,具有高量子效率、低暗电流、宽带宽等特性,被广泛应用于光电测量、光通信及遥感等领域中。基于超连续白光激光器与双单色仪的光谱比较装置,利用标准InGaAs陷阱探测器对平面InGaAs探测器在900 nm～1600 nm波段进行了相对光谱响应度的定标,并与利用钨灯作为光源的响应度定标结果进行了比较。两种光源条件下,光谱响应度在900 nm～1600 nm波段最大相对差值小于0.2%,取得了较好的一致性。超连续光源的测量重复性最大值小于0.06%,远小于使用卤钨灯的测量重复性1%,降低了因测量重复性贡献的不确定度分量,验证了超连续激光器在探测器相对光谱响应度定标中的可行性。此外,还对被定标的平面探测器光谱响应度结果进行了测量不确定度分析。     

Metal-semiconductor-metal ultraviolet photodetector based on GaN

A metal-semiconductor-metal (MSM) ultraviolet photodetector has been fabricated using unintentionally doped n-GaN films grown on sapphire substrates. Its dark current, photocurrent under the illumination with λ = 360 nm light, responsivity, and the dependence of responsivity on bias voltage were measured at room temperature. The dark current of the photodetector is 1.03 Na under 5 V bias, and is 15.3 Na under 10 V bias. A maximum responsivity of 0.166 A/W has been achieved under the illumination with λ= 366 nm light and 15 V bias. It exhibits a typical sharp band-edge cutoff at the wavelength of 366 nm, and a high responsivity at the wavelength from 320 nm to 366 nm. Its responsivity under the illumination with λ= 360 nm light increases when the bias voltage increases.     

Self-consistent analysis of double-δ-doped InAlAs/InGaAs/InP HEMTs

We have carried out a theoretical study of double-5-doped InAlAs/InGaAs/InP high electron mobility transistor （HEMT） by means of the finite differential method. The electronic states in the quantum well of the HEMT are calculated self-consistently. Instead of boundary conditions, initial conditions are used to solve the Poisson equation. The concentration of two-dimensional electron gas （2DEG） and its distribution in the HEMT have been obtained. By changing the doping density of upper and lower impurity layers we find that the 2DEG concentration confined in the channel is greatly affected by these two doping layers. But the electrons depleted by the Schottky contact are hardly affected by the lower impurity layer. It is only related to the doping density of upper impurity layer. This means that we can deal with the doping concentrations of the two impurity layers and optimize them separately. Considering the sheet concentration and the mobility of the electrons in the channel, the optimized doping densities are found to be 5 × 10^12 and 3× 10^12 cm^-2 for the upper and lower impurity layers, respectively, in the double-5-doped InAlAs/InGaAs/InP HEMTs.     

Low power fluorine plasma effects on electrical reliability of AlGaN/GaN high electron mobility transistor

The new electrical degradation phenomenon of the AlGaN/GaN high electron mobility transistor(HEMT) treated by low power fluorine plasma is discovered. The saturated current, on-resistance, threshold voltage, gate leakage and breakdown voltage show that each experiences a significant change in a short time stress, and then keeps unchangeable. The migration phenomenon of fluorine ions is further validated by the electron redistribution and breakdown voltage enhancement after off-state stress. These results suggest that the low power fluorine implant ion stays in an unstable state. It causes the electrical properties of AlGaN/GaN HEMT to present early degradation. A new migration and degradation mechanism of the low power fluorine implant ion under the off-stress electrical stress is proposed. The low power fluorine ions would drift at the beginning of the off-state stress, and then accumulate between gate and drain nearby the gate side. Due to the strong electronegativity of fluorine, the accumulation of the front fluorine ions would prevent the subsequent fluorine ions from drifting, thereby alleviating further the degradation of AlGaN/GaN HEMT electrical properties.     

具有部分本征GaN帽层新型AlGaN/GaN高电子迁移率晶体管特性分析

为了优化传统Al GaN/GaN高电子迁移率晶体管(high electron mobility transistors,HEMTs)器件的表面电场,提高击穿电压,本文提出了一种具有部分本征GaN帽层的新型Al GaN/GaN HEMTs器件结构.新型结构通过在Al GaN势垒层顶部、栅电极到漏电极的漂移区之间引入部分本征GaN帽层,由于本征GaN帽层和Al GaN势垒层界面处的极化效应,降低了沟道二维电子气(two dimensional electron gas,2DEG)的浓度,形成了栅边缘低浓度2DEG区域,使得沟道2DEG浓度分区,由均匀分布变为阶梯分布.通过调制沟道2DEG的浓度分布,从而调制了Al GaN/GaN HEMTs器件的表面电场.利用电场调制效应,产生了新的电场峰,且有效降低了栅边缘的高峰电场,Al GaN/GaN HEMTs器件的表面电场分布更加均匀.利用ISE-TCAD软件仿真分析得出:通过设计一定厚度和长度的本征GaN帽层,Al GaN/GaN HEMTs器件的击穿电压从传统结构的427 V提高到新型结构的960 V.由于沟道2DEG浓度减小,沟道电阻增加,使得新型Al GaN/GaN HEMTs器件的最大输出电流减小了9.2%,截止频率几乎保持不变,而最大振荡频率提高了12%.     

X~Ku波段宽带驱动放大器设计

基于SiC衬底的0.25 μm GaN HEMT工艺,设计了一款X~Ku波段宽带1 W驱动放大器单片微波集成电路。设计使用了一种有源器件的大信号输出阻抗的等效RC模型验证了GaN HEMT工艺模型的准确性,并获得了不同尺寸的GaN HEMT的大信号输出阻抗。第一级管芯采用负反馈结构,降低匹配网络的Q值,通过带通匹配网络拓扑,实现了宽带匹配。测试结果表明,在28 V的工作电压下,8~18 GHz的频率内驱动放大器实现了输出功率大于30 dBm,功率附加效率大于21%,功率增益大于15 dB。芯片尺寸为:2.20 mm×1.45 mm。该芯片电路具有频带宽、效率高、尺寸小的特点,主要用于毫米波收发组件、无线通讯等领域,具有广泛的应用前景。