Rectifying resistance switching behaviors of SnO2 microsphere films modulated by top electrodes

Based on the bipolar resistive switching (RS) characteristics of SnO₂ films, we have fabricated a new prototypical device with sandwiched structure of Metal/SnO₂/fluorine-doped tin oxide (FTO). The SnO₂ microspheres film was grown on FTO glass by template-free hydrothermal synthesis, which was evaporated with various commonly used electrodes such as aluminium (Al), silver (Ag), and gold (Au), respectively. Typical self-rectifying resistance switching behaviors were observed for the RS devices with Al and Au electrodes. However, no obvious rectifying resistance switching behavior was observed for the RS device with Ag electrode. Above results were interpreted by considering the different interface barriers between SnO₂ and top metal electrodes. Our current studies pave the ways for modulating the self-rectifying resistance switching properties of resistive memory devices by choosing suitable metal electrodes.     

Improved yield in molecular electronic devices using amino-style molecules

Molecular electronic devices were fabricated with amino-style derivatives as redox-active components. These molecules are amphiphilic to allow monolayer formation by the Langmuir–Blodgett (LB) method, and this LB monolayer is inserted between two metal electrodes. On measuring the current–voltage (I–V) characteristics, it was found that the Al/amino style LB monolayer/Al devices show remarkable hysteresis and switching behavior, so that they can be used as memory devices at ambient conditions, when an aluminum oxide layer exists on the bottom electrode. From the results of I–V measurements, we acquired values of the switching voltage and some large on/off ratios in the case of the ASBC-18 molecule. Also, we improved the yield of the molecular electronic device by reducing the area of the device and by inserting a Ti protecting layer between the top metal electrode and the amino style LB monolayer.     

基于二维材料MXene的仿神经突触忆阻器的制备和长/短时程突触可塑性的实现

兼具长时程可塑性与短时程可塑性的电子突触被认为是类脑计算系统的重要基础.将一种新型二维材料MXene应用到忆阻器中,制备了基于Cu/MXene/SiO_2/W的仿神经突触忆阻器.结果表明, Cu/MXene/SiO_2/W忆阻器成功实现了稳定的双极性模拟阻态切换,同时成功模拟了生物突触短时程可塑性的双脉冲易化功能和长时程可塑性的长期增强/抑制行为,其中双脉冲易化的易化指数与脉冲间隔时间相关. Cu/MXene/SiO_2/W忆阻器的突触仿生特性,归功于MXene辅助的Cu离子电导丝形成与破灭的类突触响应机理.由于Cu/MXene/SiO_2/W忆阻器兼具长时程可塑性与短时程可塑性,其在突触仿生电子学和类脑智能领域将会具有巨大的应用前景.     

Digital and analog memory devices based on 2D layered MPS_3 (M= Mn,Co, Ni) materials

We demonstrate digital and analog devices with an Ag/MPS_3/Au structure based on layered MPS_3(M=Mn,Co,Ni)2 D materials.All devices show the bipolar behavior of resistive switching.In addition,Ag/MnPS3/Au and Ag/NiPS_3/Au devices show synaptic characteristics of potentiation and depression.The digital and analog characteristics of resistance states enable Ag/MPS_3/Au devices to work as both binary memory and artificial synapse devices.The Ag/MPS_3/Au memory devices are promising for applications of flexible eye-like and brain-like systems on a chip when they are integrated with photodetectors and FETs composed of full MPS_3 materials.     

忆阻器单阻态下的记忆电容行为及多态特性

采用供体-受体类型的共聚物构建了Al/共聚物/ITO结构的有机记忆器件,并对其电流-电压(I-V)和电容-电压(C-V)特性进行了研究.结果表明:器件不仅表现出明显的记忆电阻特征,而且在单个电阻状态下还存在记忆电容行为,使器件呈现出两种电阻状态和与之对应的四种电容状态,具有电阻和电容的双参量记忆能力.在此基础上对器件的电容开关行为进行了电压幅值的调制,使器件出现了更多的电容状态,为多级存储的实现提供了一条有效途径.最后通过引入分子内部极化算符,建立了记忆电阻和记忆电容的关联性,给出了描述器件双参量多状态特征的矩阵模型.     

Electronic synapses based on ultrathin quasi-two-dimensional gallium oxide memristor

Synapse emulation is very important for realizing neuromorphic computing, which could overcome the energy and throughput limitations of today's computing architectures. Memristors have been extensively studied for using in nonvolatile memory storage and neuromorphic computing. In this paper, we report the fabrication of vertical sandwiched memristor device using ultrathin quasi-two-dimensional gallium oxide produced by squeegee method. The as-fabricated two-terminal memristor device exhibited the essential functions of biological synapses, such as depression and potentiation of synaptic weight, transition from short time memory to long time memory, spike-timing-dependent plasticity, and spike-rate-dependent plasticity. The synaptic weight of the memristor could be tuned by the applied voltage pulse, number,width, and frequency. We believe that the injection of the top Ag cations should play a significant role for the memristor phenomenon. The ultrathin of medium layer represents an advance to integration in vertical direction for future applications and our results provide an alternative way to fabricate synaptic devices.     

Effects of different dopants on switching behavior of HfO_2-based resistive random access memory

In this study the effects of doping atoms(Al, Cu, and N) with different electro-negativities and ionic radii on resistive switching of HfO2-based resistive random access memory(RRAM) are systematically investigated. The results show that forming voltages and set voltages of Al/Cu-doped devices are reduced. Among all devices, Cu-doped device shows the narrowest device-to-device distributions of set voltage and low resistance. The effects of different dopants on switching behavior are explained with deferent types of CFs formed in HfO2 depending on dopants: oxygen vacancy(Vo) filaments for Al-doped HfO2 devices, hybrid filaments composed of oxygen vacancies and Cu atoms for Cu-doped HfO2 devices,and nitrogen/oxygen vacancy filaments for N-doped HfO2 devices. The results suggest that a metal dopant with a larger electro-negativity than host metal atom offers the best comprehensive performance.     

Effects of moisture barriers on resistive switching in Pt-dispersed SiO2 nanometallic thin films

Moisture invasion into memory devices can result in data loss and malfunctions in write/erase switching. Deteriorated uniformity and retention characteristics, and distorted switching hysteresis loops, are observed in moisture-attacked Pt-dispersed SiO₂ nanometallic thin-film devices, and can be effectively prevented by coating the device with a nanoscale Al₂O₃ barrier layer grown by an atomic layer deposition method. The moisture-attacked devices exhibit evidence of cumulating ion current and ion potential with repeated switching. In contrast, a capped device with an extremely uniform and reproducible resistive switching behavior features a completely symmetric current–voltage curve expected for a purely electronic device.     

基于磁电耦合效应的基本电路元件和非易失性存储器

磁电耦合效应是指磁场控制电极化或者电场控制磁性的物理现象,它们为开发新型电子器件提供了额外的物理状态自由度,具有巨大的应用潜力.磁电耦合系数作为磁电耦合材料的重要参量,体现了材料磁化和电极化的耦合性能,其随外加物理场的变化可以表现出非线性回滞行为,具备作为非易失存储的物理状态特征.本文讨论了基于磁电耦合效应如何建立起电荷-磁通之间的直接关联,继而实现了第四种基本电路元件并构建了完整的电路元件关系图.在此基础上,研究了多铁性异质结中的非线性磁电耦合效应,并利用其独特的电荷-磁通关联特性,开发了基于磁电耦合系数的电写-磁读型非易失性信息存储、逻辑计算与类神经突触记忆等一系列新型信息功能器件.     

Fabrication and investigation of ferroelectric memristors with various synaptic plasticities

In the post-Moore era, neuromorphic computing has been mainly focused on breaking the von Neumann bottlenecks. Memristors have been proposed as a key part of neuromorphic computing architectures, and can be used to emulate the synaptic plasticities of the human brain. Ferroelectric memristors represent a breakthrough for memristive devices on account of their reliable nonvolatile storage, low write/read latency and tunable conductive states. However, among the reported ferroelectric memristors, the mechanisms of resistive switching are still under debate. In addition, there needs to be more research on emulation of the brain synapses using ferroelectric memristors. Herein, Cu/PbZr_0.52Ti_0.48O₃ (PZT)/Pt ferroelectric memristors have been fabricated. The devices are able to realize the transformation from threshold switching behavior to resistive switching behavior. The synaptic plasticities, including excitatory post-synaptic current, paired-pulse facilitation, paired-pulse depression and spike time-dependent plasticity, have been mimicked by the PZT devices. Furthermore, the mechanisms of PZT devices have been investigated by first-principles calculations based on the interface barrier and conductive filament models. This work may contribute to the application of ferroelectric memristors in neuromorphic computing systems.     

阻变式存储器存储机理

阻变式存储器(resistive random access memory,RRAM)是以材料的电阻在外加电场作用下可在高阻态和低阻态之间实现可逆转换为基础的一类前瞻性下一代非挥发存储器.它具有在32nm节点及以下取代现有主流Flash存储器的潜力,成为目前新型存储器的一个重要研究方向.但阻变式存储器的电阴转变机理不明确,制约它的进一步研发与应用.文章对阻变式存储器的体材料中几种基本电荷输运机制进行了归纳,总结了目前对阻变式存储器存储机理的理论模型.     

Flexible NiO nanocrystal-based resistive memory device fabricated by low-temperature solution-process

In this study, a nickel oxide (NiO) nanocrystal (NC) based flexible resistive memory device is demonstrated at temperature as low as 180 °C by ligand exchange process. The fabricated device for flexible application with structure Ni/NiO/Ni on PI substrate exhibits excellent switching characteristics with low set/reset voltages and stable resistance values in both ON and OFF states for over 100 switching cycles of memory operation. Also, this flexible memory device shows stable resistive switching properties under compressive stress with bending radius to 10 mm and consecutive bending cycles. The ReRAM fabricated by a low-temperature solution-process shows potential for next generation flexible electronics.     

氧分压对Ni/HfO_x/TiN阻变存储单元阻变特性的影响

采用射频磁控溅射的方法,基于不同氧分压制备的氧化铪构建了Ni/HfO_x/TiN结构阻变存储单元.研究发现,随着氧分压的增加,薄膜表面粗糙度略有降低;另一方面,阻变单元功耗降低,循环耐受性能可达10~3次,且转变电压分布的一致性得到改善.结合电流-电压曲线线性拟合结果及外加温度测试探究了器件的转变机理,得出在低阻态的传导机理为欧姆传导机理,在高阻态的传导机理为肖特基发射机理,并根据氧空位导电细丝理论,对高低阻态的阻变机理进行了详细的理论分析.     

Synaptic plasticity and classical conditioning mimicked in single indium-tungsten-oxide based neuromorphic transistor

Emulation of synaptic function by ionic/electronic hybrid device is crucial for brain-like computing and neuromorphic systems. Electric-double-layer(EDL) transistors with proton conducting electrolytes as the gate dielectrics provide a prospective approach for such application. Here, artificial synapses based on indium-tungsten-oxide(IWO)-based EDL transistors are proposed, and some important synaptic functions(excitatory post-synaptic current, paired-pulse facilitation,filtering) are emulated. Two types of spike-timing-dependent plasticity(Hebbian STDP and anti-Hebbian STDP) learning rules and multistore memory(sensory memory, short-term memory, and long-term memory) are also mimicked. At last, classical conditioning is successfully demonstrated. Our results indicate that IWO-based neuromorphic transistors are interesting for neuromorphic applications.     

Effect of cation and anion defects on the resistive switching polarity of ZnO x thin films

In this paper, we achieve the resistive switching (RS) polarity from unipolar to bipolar in a simple Al/ZnO _x /Al structure by moderating the oxygen content in the ZnO sputtering process. In a pure Ar sputtering, Al/ZnO _x /Al shows unipolar behavior, as oxygen partial pressure increases, the RS polarity changes to bipolar, and the switch current decreases by about five orders of magnitude. The current transport properties of unipolar device show ohmic behavior under both high resistance (HRS) and low resistance states (LRS), but the bipolar device shows Schottky barrier modulated current transport properties. We study the defect types in the unipolar and bipolar devices through photoluminescence (PL) spectra. The PL results show that the interstitial zinc (Zn_i) and interstitial oxygen (O_i) are dominant in unipolar and bipolar devices, respectively. We attribute this phenomenon to Zn_i and O_i playing important role in unipolar (URS) and bipolar resistive switching (BRS), respectively.     

Low power consumption bipolar resistive switching characteristics of ZnO-based memory devices

Ag/ZnO/Pt structure resistive switching devices are fabricated by radio frequency (RF) magnetron sputtering at room temperature. The memory devices exhibit stable and reversible resistive switching behavior. The ratio of high resistance state to low resistance state can reach as high as 10 2 . The retention measurement indicates that the memory property of these devices can be maintained for a long time (over 10 4 s under 0.1-V durable stress). Moreover, the operation voltages are very low, -0.4 V (OFF state) and 0.8 V (ON state). A high-voltage forming process is not required in the initial state, and multi-step reset process is demonstrated. Resistive switching device with the Ag/ZnO/ITO structure is constructed for comparison with the Ag/ZnO/Pt device.     

铜掺杂氧化锌薄膜阻变特性的研究

以 ZnO：Al为底电极,Cu为顶电极,在同种工艺条件下分别制备了类电容结构的纯ZnO 阻变器件和ZnO：2%Cu阻变器件,分析比较了两种器件的典型I-V特性曲线、置位电压（V_Set）和复位电压（V_Reset）的分布范围、器件的耐久性。结果显示,ZnO：Cu阻变器件较纯ZnO阻变器件有更大的开关比和更稳定的循环性能。另外,研究了 ZnO：Cu阻变器件的阻变机理,通过对其I-V特性曲线分析得出以下结论：ZnO：Cu阻变器件在高阻态遵循空间电荷限制电流效应,低阻态符合欧姆定律。     

La施主掺杂SrTiO_3单晶的阻变性能研究

以La施主掺杂SrTiO_3(La STO)单晶为样品,制备了Pt/LaSTO/In结构存储器件.通过一系列电学测试,发现该器件具有稳定的多级阻变现象,最大开关比为10~4;高低阻电流-电压关系曲线的拟合分析表明,高阻时存在界面势垒,而低阻时满足电子隧穿模型特性.电子顺磁共振研究表明LaSTO单晶内存在带正电的空穴缺陷中心.综合分析证明器件的高低阻之间的转变由界面空位缺陷导致的电子俘获与去俘获引起.此外发现光照会对LaSTO单晶的阻值产生影响.该实验结果为LaSTO单晶在阻变存储器件中的应用提供了理论和技术指导.     

基于Cu/SiO_x/Al结构的阻变存储器多值特性及机理的研究

采用氧化硅材料构建了Cu/SiOx/Al的三明治结构阻变存储器件.用半导体参数分析仪对其阻变特性进行测量,结果表明其具有明显的阻变特性,并且通过调节限制电流,得到了四个稳定的阻态,各相邻阻态的电阻比大于10,并且具有良好的数据保持能力.在不同温度条件下对各个阻态进行电学测试及拟合,明确了不同阻态的电子传输机理不尽相同:阻态1和阻态2为欧姆传导机制,阻态3为P-F(Pool-Frenkel)发射机制,阻态4为肖特基发射机制.根据电子传输机制,建立了铜细丝导电模型并对Cu/SiOx/Al阻变存储器件各个阻态的电致阻变机制进行解释.     

玉米淀粉固态电解质质子\电子杂化突触晶体管

随绿色可持续发展观念的深入人心,研究人员致力于寻找天然有机材料应用于功能性电子器件.淀粉以其低廉的价格、丰富的来源和优异的机械性能进入了科研人员的视野.淀粉可由玉米、马铃薯、甘薯和葛根等含淀粉的物质中提取而得,一般不溶于水,在和水加热至一定温度时,则糊化成胶状溶液.本文通过旋涂法将玉米淀粉的胶状溶液旋涂至氧化铟锡玻璃表面,然后在30?C恒温环境中晾干制备成固态胶合状薄膜.以此薄膜作为固态电解质制备了氧化铟锌突触晶体管,并实现了生物神经突触的双脉冲易化、学习记忆能力、高通滤波等可塑性行为的仿真.本研究以玉米淀粉固态胶合薄膜作为电解质大大降低了氧化物薄膜晶体管固态电解质的成本,且该电解质无毒性、来源丰富,将为人工神经网络的开发提供一种可选择的元件.