铝诱导层交换超薄多晶硅薄膜制备及压阻特性

超薄多晶硅薄膜具有优异的压敏特性。铝诱导层交换(ALILE)制备多晶硅薄膜具有成膜温度低薄膜性能优良等特点。利用ALILE方法在玻璃基底上低温条件下制备了50 nm超薄多晶硅(poly-Si)薄膜,并对薄膜微观结构及压阻特性进行了研究。Raman光谱在521 cm-1出现尖锐、对称的特征峰,表明超薄多晶硅薄膜晶化状态良好。此外,在拉曼光谱480 cm-1处没有明显出现a-Si的Raman特征峰也说明制备的poly-Si薄膜样品完全结晶;XRD光谱表明ALILE制备薄膜在(111)和(220)晶向择优生长,晶粒尺寸约5 μm;霍尔效应测试结果表明：ALILE制备薄膜为p型掺杂,空穴浓度为9×1018～6×1019 cm-3;压阻特性研究表明：ALILE超薄多晶硅薄膜应变系数(GF)达到了60以上,且与薄膜厚度相关;应变温度相关系数(TCGF)在-0.17～0%℃范围内;电阻温度相关系数(TCR)在-0.2～-0.1%℃范围内。ALILE超薄多晶硅薄膜具有GF大、TCGF小和TCR小等特点。因此,有望在压力传感器领域得到应用。     

退火对Ge诱导晶化多晶Si薄膜结晶特性的影响

本文采用磁控溅射法, 衬底温度500 ℃下在硅衬底上分别制备具有Ge填埋层的a-Si/Ge 薄膜和a-Si薄膜, 并进行后续退火, 采用Raman光谱、X射线衍射、原子力显微镜及场发射扫描电镜等对所制薄膜样品进行结构表征. 结果表明, Ge有诱导非晶硅晶化的作用, 并得出以下重要结论: 衬底温度为500 ℃时生长的a-Si/Ge薄膜, 经600 ℃退火5 h Ge诱导非晶硅薄膜的晶化率为44%, 在相同的退火时间下退火温度提高到700 ℃, 晶化率达54%. 相同条件下, 无Ge填埋层的a-Si薄膜经800 ℃退火5 h薄膜实现晶化, 晶化率为46%. 通过Ge填埋层诱导晶化可使在相同的条件下生长的非晶硅晶薄膜的晶化温度降低约200 ℃. Ge诱导晶化多晶Si薄膜在Si(200)方向具有高度择优取向, 且在此方向对应的晶粒尺寸约为76 nm. 通过Ge诱导晶化制备多晶Si薄膜有望成为制备高质量多晶Si薄膜的一条有效途径.     

低温制备微晶硅薄膜生长机制的研究

采用热丝化学气相沉积技术制备了一系列处于不同生长阶段的薄膜样品，用原子力显微镜系 统地研究生长在单晶硅衬底和玻璃衬底上薄膜表面形貌的演化.按照分形理论分析得到：在 玻璃衬底上的硅薄膜以零扩散随机生长模式生长；而在单晶硅衬底上，薄膜早期以有限扩散 生长模式生长，当膜厚超过某一临界厚度时转变为零扩散随机生长模式.岛面密度与膜厚的 依赖关系表明，在临界厚度时硅衬底和玻璃衬底上的岛面密度均出现了极大值.Raman谱的测 量证实，玻璃衬底上薄膜临界厚度与非晶/微晶相变之间存在密切的关系.不同的衬底材料直 接影响反应 关键词： 生长机制 微晶硅薄膜 表面形貌 热丝化学气相沉积     

磁控共溅射法沉积的硅量子点SiN_x薄膜的光谱特性

采用双极脉冲和射频磁控共溅射沉积法在不同温度的Si(100)衬底和石英衬底上制备了富硅SiNx薄膜。在氮气氛中,于1 050℃下采用快速光热退火热处理,获得了包含硅量子点的SiNx薄膜。采用Fourier变换红外光谱、Raman光谱、掠入射X射线衍射和光致发光光谱对退火后的薄膜样品进行了表征。结果显示:Fourier变换红外光谱中出现了富硅Si—N键,表明薄膜为富硅SiNx薄膜;当衬底温度不低于200℃时,薄膜样品的拉曼光谱中出现了硅纳米晶的Si—Si振动横光学模,掠入射X射线衍射中出现了明显的Si(111)和Si(311)的衍射峰,证实了硅量子点的形成;发现存在一最佳衬底温度(300℃),该条件下获得的硅量子点的数量和晶化率最高;衬底温度为300和400℃的样品的光致发光光谱中均有3个可见荧光峰,结合拉曼光谱结果,用纳米晶硅的量子限域效应和辐射复合缺陷态对荧光峰进行了合理解释;由光致发光光谱计算出的衬底温度为300和400℃的样品的硅量子点平均尺寸分别为3.5和3.4nm。这些结果有助于优化含硅量子点的SiNx薄膜的制备参数,在硅基光电子器件的应用方面有重要意义。     

Raman散射和AFM对多晶硅薄结晶状况的研究

采用等离子体增强化学气相沉积(PECVD)法在普通玻璃衬底上制备了多晶硅(p-si)薄膜。利用拉曼(Raman)散射谱、原子力显微镜(AFM)研究了衬底温度、射频功率和SiH4浓度对薄膜晶化的影响,并对其结果进行分析讨论。研究结果表明,当衬底温度从200℃逐渐提高到400℃、SiH4浓度从5%降到1%,硅膜的晶化率逐渐提高,结构逐渐由非晶向多晶转变,射频功率对薄膜的晶化状况也有很大影响。     

分步法高速沉积微晶硅薄膜

为提高微晶硅薄膜的纵向结晶性能, 在甚高频等离子体增强化学气相沉积技术的基础上, 采用过渡参数缓变和两步法相结合的方法在普通玻璃衬底上高速沉积薄膜. 当功率密度为2.1 W/cm², 硅烷浓度在6%和9.6%之间变化时, 从薄膜方向和玻璃方向测算的Raman晶化率的差异维持在2%以内. 硅烷浓度为9.6%时, 薄膜沉积速率可达3.43 nm/s, 从薄膜方向和玻璃方向测算的Raman晶化率分别为50%和48%, 差异的相对值仅为4.0%. 合理控制过渡阶段的参数变化, 可使两个方向的Raman晶化率差值下降到一个百分点. 表明采用新方法制备薄膜, 不仅可以抑制非晶孵化层的形成, 改善微晶硅薄膜的纵向结构, 还为制备优质薄膜提供了较宽的参数变化空间. 关键词： 微晶硅薄膜 非晶孵化层 高速沉积 甚高频等离子体增强化学气相沉积     

纳米晶硅薄膜中氢含量及键合模式的红外分析

采用传统射频等离子体化学气相沉积技术在100—350℃的衬底温度下高速沉积氢化硅薄膜. 傅里叶变换红外光谱和Raman谱的研究表明,纳米晶硅薄膜中的氢含量和硅氢键合模式与薄膜的晶化特性有密切关系,当薄膜从非晶相向晶相转变时,氢的含量减少了一半以上,硅氢键合模式以SiH₂为主. 随着衬底温度的升高和晶化率的增加,纳米晶硅薄膜中氢的含量以及其结构因子逐渐减少. 关键词： 氢化纳米晶硅薄膜 红外透射谱 氢含量 硅氢键合模式     

外延在蓝宝石衬底上的非掺杂GaN研究

采用改变生长条件的方法制备GaN薄膜,在(0001)面蓝宝石衬底上利用金属有机物化学气相沉积技术制备了不同样品,并借助X射线双晶衍射仪(XRD)、PL谱测试仪和光学显微镜对材料进行了分析。XRD(0002)面和(1012)面测试均表明TMGa流量为70 cm3/min时样品位错密度最低。利用该TMGa流量进一步制备了改变生长温度的样品。XRD和PL谱测试结果表明,提高生长温度有利于提高GaN样品的晶体质量和光学性能。最后,利用光学显微镜对样品的表面形貌进行了分析。     

原子力显微镜在PLD法制备ZnO薄膜表征中的应用

利用脉冲激光沉积(PLD)法在氧压为16 Pa、衬底温度为400~700 ℃时,在单晶Si(100) 衬底上制备ZnO薄膜,并通过原子力显微镜(AFM)、X射线衍射(XRD)谱和光致发光谱对制得的薄膜样品进行表面形貌、结构特性和发光性质研究。其中通过原子力显微镜对样品的二维、三维以及剖面线图进行了分析。结果表明衬底温度700 ℃时得到的薄膜样品表面较均匀致密,晶粒生长较充分,结晶质量较高,相对发光强度高。控制氧压为5.7 Pa,在衬底温度为600 ℃,沉积时间分别为10,20,45 min制备ZnO薄膜样品;利用原子力显微镜对样品进行表面形貌观察,得知只有沉积时间足够长才能使薄膜表面晶粒充分生长。     

应力和掺杂对Mg:GaN薄膜光致发光光谱影响的研究

对化学气相沉积(MOCVD)法在宝石衬底上生长的Mg掺杂GaN薄膜的表面及其GaN缓冲层的光致发光(PL)光谱进行了测量，用Raman光谱和x射线衍射(XRD)对GaN薄膜中的应力进行确定，通过PL光谱中的中性束缚激子跃迁能量的变化确定薄膜中应力的影响，从而研究Mg掺杂对p型GaN的DAP跃迁影响规律. 关键词： 光致发光 应力 Raman光谱     

Low-Temperature (<100°C) Poly-Si Thin Film Fabrication on Glass

Polycrystalline silicon (poly-Si) thin-film is fabricated on Al-coated planar glass substrates at the temperature below 100°C, using aluminium-induced crystallized (AIC) amorphous silicon (a-Si) deposited by dc-magnetron sputtering under an electric field. The properties of NA poly-Si films (AIC of dc-magnetron sputtered silicon non-annealing) are characterized by Raman spectroscopy and x-ray diffraction (XRD) spectroscopy. A narrow and symmetrical Raman peak at a wave number of about 521cm^-1 is observed for samples, showing that the films are fully crystallized. XRD spectra reveal that the films are preferentially (111) oriented. Furthermore, the XRD spectrum of the sample prepared without electric field does not show any XRD peaks for poly-Si, which only appears at about 38°for Al (111) orientation. It is indicated that the electric field plays an important role in crystallization of poly-Si during the dc-magnetron sputtering. Thus, high quality poly-Si film can be obtained at low temperature and separate post-deposition step of AIC of a-silicon can be avoided.     

AlCl3-induced crystallization of amorphous silicon thin films

It is reported that the direct contact between Al and amorphous silicon (a-Si) enhances the crystallization of a-Si films. But the polycrystalline silicon (poly-Si) films crystallized by the direct contact of Al metal film suffer the problems of rough surface. In our study, we utilized the AlCl₃ vapor during the a-Si films deposition instead of Al metal film to enhance crystallization. X-ray diffraction (XRD) shows that the AlCl₃ vapor so successfully enhanced the crystallization of a-Si films that the crystallization was completed in 5 h at 540 °C. And the orientation of the poly-Si film deposited with AlCl₃ vapor is much more random than that of annealed with Al metal under layer. But the average grain size is much larger than that. Moreover, the surface of the AlCl₃-induced crystallized poly-Si film was much smoother than that of the Al-induced poly-Si film. The Al and Cl incorporation into the poly-Si film was confirmed using X-ray photoelectron spectroscopy (XPS) and found that the quantity of Al and Cl incorporated into the Si film was below the detection limit of XPS.     

Rapid determination of surface roughness of polycrystalline silicon following frontside and backside excimer laser irradiation

Excimer-laser crystallization (ELC) is the most commonly employed technology for fabricating low-temperature polycrystalline silicon (LTPS). Investigations on the surface roughness of polycrystalline silicon (poly-Si) thin films have become an important issue because the surface roughness of poly-Si thin films is widely believed to be related to its electrical characteristics. In this study, we develop a simple optical measurement system for rapid surface roughness measurements of poly-Si thin films fabricated by frontside ELC and backside ELC. We find that the incident angle of 20° is a good candidate for measuring the surface roughness of poly-Si thin films. The surface roughness of polycrystalline silicon thin films can be determined rapidly from the reflected peak power density measured by the optical system developed using the prediction equation. The maximum measurement error rate of the optical measurement system developed is less than 9.71%. The savings in measurement time of the surface roughness of poly-Si thin films is up to 83%. The method of backside ELC is suggested for batch production of low-temperature polycrystalline silicon thin-film transistors due to the lower surface roughness of poly-Si films and higher laser-beam utilization efficiency.     

Evolution of microstructure in polycrystalline silicon thin films upon excimer laser crystallization

Polycrystalline silicon (poly-Si) films fabricated by pulsed excimer laser crystallization (ELC) have been investigated using time-resolved optical measurements, scanning-electron microscopy, and cross-sectional transmission-electron microscopy. Detailed crystallization mechanisms are proposed to interpret the microstructure evolution of poly-Si films for both frontside and backside ELC. It is found that the backside ELC is a good candidate for the manufacturing of low-temperature polycrystalline silicon because of the high laser efficiency and low surface roughness of the poly-Si films.     

铝诱导非晶硅薄膜的场致低温快速晶化及其结构表征

铝诱导非晶硅薄膜晶化可以降低退火温度、缩短退火时间，是制备多晶硅薄膜的一种重要方法.在此基础上，通过在退火过程中加入电场加速了界面处硅、铝原子间的互扩散，实现了非晶硅薄膜的快速低温晶化.实验结果表明，外加电场，退火温度为400℃，退火时间为60min时，薄膜的晶化率大于60％；退火温度为450℃退火时间为30min时，薄膜已经呈现明显的晶化现象；退火温度为500℃退火时间为15min时，薄膜的x射线多晶峰强度与非晶峰强度之比为未加电场的3—4倍. 关键词： 非晶硅薄膜 多晶硅薄膜 外加电场     

Micro-Raman spectroscopy characterization of polycrystalline silicon films fabricated by excimer laser crystallization

The rapid recrystallization of amorphous silicon films utilizing excimer laser crystallization (ELC) is presented. The resulting poly-Si films are characterized by Raman spectroscopy. Polycrystalline silicon (poly-Si) films with higher crystallinity can be realized by a dehydrogenation process before ELC. Raman spectra as a function of various excimer laser energy densities are demonstrated. The crystallinity and residual stress of the poly-Si films are determined and discussed.     

The influence of boron concentrations on structural properties in disorder silicon films

In this work we present a detailed structural of a series of B-doped hydrogenated microcrystalline silicon (μc-Si:H) films deposited by plasma-enhanced chemical vapor deposition (PECVD) and B-doped polycrystalline silicon (poly-Si) films produced by step-by-step laser crystallization process from amorphous silicon. The influence of doping on the structural properties and structural changes during the sequential crystallization processes were monitored by Raman spectroscopy. Unlike μc-Si:H films, that consist of a two-phase mixture of amorphous and ordered Si, partially crystallized sample shows a stratified structure with polycrystalline silicon layer at the top of an amorphous layer. With increasing doping concentration the LO-TO phonon line in poly-Si shift to smaller wave numbers and broadens asymmetrically. The results are discussed in terms of resonant interaction between optical phonons and direct intraband transitions known as a Fano resonance. In μc-Si:H films, on the other hand, the Fano effect is not observed. The increase of doping in μc-Si:H films suppressed the crystalline volume fraction, which leads to an amorphization in the film structure. The structural variation in both μc-Si:H and poly-Si films leads to a change in hydrogen bonding configuration.     

On the Discontinuity of Polycrystalline Silicon Thin Films Realized by Aluminum-Induced Crystallization of PECVD-Deposited Amorphous Si

Crystallization of glass/Aluminum (50, 100, 200 nm) /hydrogenated amorphous silicon (a-Si:H) (50, 100, 200 nm) samples by Aluminum-induced crystallization (AIC) is investigated in this article. After annealing and wet etching, we found that the continuity of the polycrystalline silicon (poly-Si) thin films was strongly dependent on the double layer thicknesses. Increasing the a-Si:H/Al layer thickness ratio would improve the film microcosmic continuity. However, too thick Si layer might cause convex or peeling off during annealing. Scanning electron microscopy (SEM) and Energy Dispersive X-ray spectroscopy (EDX) are introduced to analyze the process of the peeling off. When the thickness ratio of a-Si:H/Al layer is around 1 to 1.5 and a-Si:H layer is less than 200 nm, the poly-Si film has a good continuity. Hall measurements are introduced to determine the electrical properties. Raman spectroscopy and X-ray diffraction (XRD) results show that the poly-Si film is completely crystallized and has a preferential (111) orientation.     

A novel optical diagnostic technique for analyzing the recrystallization characteristics of polycrystalline silicon thin films following frontside and backside excimer laser irradiation

Excimer laser annealing (ELA) is a widely used technique for producing polycrystalline silicon (poly-Si) thin films. An optical inspection system with simple optical arrangements for rapid measurement of recrystallization results of poly-Si thin films is developed in this study. The recrystallization results after both frontside ELA and backside ELA can be easily visible from the profile of peak power density distribution using the optical inspection system developed with an optimized moving velocity of 0.312 mm/s of the specimen. The method of backside ELA is suggested for batch production of low-temperature polycrystalline silicon thin-film transistors due to higher laser beam utilization efficiency and lower surface roughness of poly-Si films.     

Rapid surface roughness measurements of silicone thin films with different thicknesses

A rapid optical measurement system for rapid surface roughness measurement of polycrystalline silicon (poly-Si) thin films was developed in this study. Two kinds of thickness of poly-Si thin films were used to study rapid surface roughness measurements. Six different incident angles were employed for measuring the surface roughness of poly-Si thin films. The results reveal that the incident angle of 20° was found to be a good candidate for measuring the surface roughness of poly-Si thin films. Surface roughness (y) of poly-Si thin films can be determined rapidly from the average value of reflected peak power density (x) measured by the optical system developed using the trend equation of y = ?0.1876x + 1.4067. The maximum measurement error rate of the optical measurement system developed was less than 8.61%. The savings in measurement time of the surface roughness of poly-Si thin films was up to 83%.