二次离子质谱深度剖面分析氢化微晶硅薄膜中的氧污染

运用二次离子质谱研究了甚高频等离子体增强化学气相沉积制备的不同硅烷浓度和功率条件下薄膜中的氧污染情况.结果发现：薄膜中的氧含量随硅烷浓度和功率的变化而改变.制备的微晶硅薄膜，晶化程度越高薄膜中的氧含量相对越多.另外，不同本底真空中的氧污染实验结果表明：微晶硅材料中的氧含量与本底真空有很大的关系，因此要制备高质量的微晶硅材料，高的本底真空是必要条件. 关键词： 甚高频等离子体增强化学气相沉积 二次离子质谱 氧污染     

微晶硅n-i-p太阳电池中n型掺杂层对本征层结构特性的影响

采用高压射频等离子体增强化学气相沉积方法在非晶和微晶两种n型硅薄膜衬底上沉积了一系列不同厚度的本征微晶硅薄膜,研究了不同n型硅薄膜对本征微晶硅薄膜的表面形貌、晶化率和结晶取向等结构特性的影响.结果表明,本征微晶硅薄膜结构对n型掺杂层具有强烈的依赖作用,微晶n型掺杂层能够有效减少n/i界面非晶孵化层的厚度,改善本征微晶硅薄膜的纵向均匀性,进而提高微晶硅n-i-p太阳电池性能. 关键词： 孵化层 微晶硅薄膜 纵向均匀性 n-i-p太阳电池     

甚高频高速沉积微晶硅薄膜的研究

采用甚高频化学气相沉积(VHF-PECVD)技术制备了系列微晶硅(μc-Si:H)薄膜样品,重点研究了硅烷浓度、功率密度、沉积气压和气体总流量对薄膜沉积速率和结晶状态的影响,绘制了沉积气压和功率密度双因素相图. 以0.75nm/s的高速沉积了器件质量级的微晶硅薄膜,并以该沉积速率制备出了效率为5.5%的单结微晶硅薄膜电池. 关键词： 微晶硅薄膜 高速沉积 甚高频化学气相沉积     

微晶硅薄膜高速沉积及电学性质的研究

采用甚高频等离子体增强化学气相沉积（VHF-PECVD）技术在高功率密度和高压强条件下,通过改变硅烷浓度和气体总流量对薄膜沉积参数进行了两因素优化,最终在硅烷浓度为45%,气体总流量为100 sccm条件下,获得沉积速率142 nm/s,电导激活能047 eV的优质硅薄膜;同时,通过单因素优化制备出沉积速率为21 nm/s的微晶硅薄膜.利用晶粒间界势垒模型和费米能级统计偏移模型对薄膜的电学特性和传导行为分别进行了研究分析,同时初步分析了“后氧化”对薄膜电学性能的影响. 关键词： μc-Si:H 甚高频等离子体增强化学气相沉积 高速沉积 电学特性     

激发频率对VHF-PECVD制备微晶硅材料性能的影响

采用甚高频等离子增强化学气相沉积(VHF-PECVD)的方法制备了硅烷浓度分别为6％和7％， 随激发频率变化(40—70MHz)的氢化微晶硅(μc-Si∶H)薄膜材料.研究了材料的电学特性、 结构特性、沉积速率与激发频率之间的关系.结果发现材料的光敏性随频率的增加先降低后 提高，晶化率和沉积速率的变化趋势与之相反；在晶化率最高点，材料在(220)的晶向衍射 峰最高.并从光发射谱的角度研究了材料结构和沉积速率随频率变化的原因. 关键词： 甚高频等离子增强化学气相沉积 本征微晶硅 激发频率     

p种子层对单室制备微晶硅电池性能的影响

采用单室等离子体化学气相沉积技术沉积pin微晶硅电池时,硼污染降低了本征材料的晶化率并影响了p/i界面特性.针对该问题文中采用p种子层技术,即在沉积p层后采取高的H₂/SiH₄比率及适当的功率又沉积一个薄的p层,初步研究了p种子层对微晶硅i层纵向均匀性及电池性能的影响.实验结果表明：采用此方法能改善p/i界面特性,提高本征材料纵向结构的均匀性并降低硼对本征层的污染,有效地提高单结微晶硅电池的性能.最后,通过优化沉积条件,制备得到光电转换效率为881%（1 cm 关键词： 单室 甚高频等离子体增强化学气相沉积 微晶硅太阳电池 p种子层     

硼对沉积本征微晶硅薄膜特性的影响

采用甚高频等离子体增强化学气相沉积(VHF-PECVD)技术制备了不同腔室环境下的微晶硅薄膜.对单室沉积掺杂层p材料后遗留在腔室中的硼对本征微晶i材料电学特性和结构特性的影响进行了详细研究.测试结果表明：单室沉积p层后的硼降低了微晶i层材料的暗电导,增加了材料的光敏性;由于硼对i层污染程度的不同,使得材料的激活能发生了变化;腔室中残余的硼也导致微晶硅薄膜的结晶状况恶化,同时弱化了材料的(220)择优取向.而在较高功率和较强氢稀释下制备的晶化率较高,(220)晶向明显择优的材料受硼污染影响相对减小. 关键词： 单室 甚高频等离子体增强化学气相沉积 微晶硅 硼     

高速微晶硅薄膜沉积过程中的等离子体稳态研究

通过光发射光谱监测高速沉积微晶硅薄膜过程中I(H_α^*)/I(SiH^*) 随沉积时间的变化趋势, 分析高速率微晶硅薄膜纵向晶化率逐渐增大的原因. 通过氢稀释梯度法, 即硅烷浓度梯度和氢气流量梯度法来改善材料的纵向均匀性.结果表明: 硅烷浓度梯度法获得的材料晶化率从沉积300 s时的53%增加到沉积600 s时的62%, 相比于传统方式下纵向晶化率从55%到75%的变化有了明显的改善. 在硅烷耗尽的情况下, 增加氢气流量一方面增加了气体总流量, 使得电子碰撞概率增加, 电子温度降低, 从而降低氢气的分解, 抑制SiH_x基团的放氢反应, 同时背扩散现象也得到了一定的缓解, 使得I(H_α^*)/I(SiH^*) 在沉积过程中逐渐增加的趋势有所抑制, 所制备的材料的纵向晶化率在240 s 后维持在53%-60%范围内, 同样改善了薄膜的纵向结构. 关键词： 光发射光谱 高速沉积 微晶硅 纵向结构均匀性     

单室沉积高效非晶硅/微晶硅叠层太阳电池的研究

采用甚高频等离子体增强化学气相沉积技术,在前期单室沉积的微晶硅薄膜太阳电池和非晶硅/微晶硅叠层太阳电池研究的基础上,通过对微晶硅底电池本征层硅烷浓度的优化,获得了初始效率达到11.02%(电池面积1.0 cm²)的非晶硅/微晶硅叠层太阳电池.同时,100 cm²的非晶硅/微晶硅叠层太阳电池的组件效率也达到了9.04%. 关键词： 非晶硅/微晶硅叠层电池 单室 甚高频     

衬底温度和硼掺杂对p型氢化微晶硅薄膜结构和电学特性的影响

以B₂H₆为掺杂剂,采用射频等离子体增强化学气相沉积技术在玻璃衬底上制备p型氢化微晶硅薄膜.研究了衬底温度和硼烷掺杂比对薄膜的微结构和暗电导率的影响.结果表明：在较高的衬底温度下很低的硼烷掺杂比即可导致薄膜非晶化;在实验范围内,随着衬底温度升高薄膜的晶化率单调下降,暗电导率先缓慢增加然后迅速下降,变化趋势与硼烷掺杂比的影响极为相似.最后着重讨论了p型氢化微晶硅薄膜的生长机理. 关键词： p型氢化微晶硅薄膜 衬底温度 晶化率 电导率     

氢化硅薄膜介观力学行为及其与微结构内禀关联特性

使用等离子体增强化学气相沉积系统，在射频和直流负偏压的双重激励下制备了本征和掺杂后的氢化硅薄膜.利用拉曼谱对薄膜进行了微结构分析，用纳米压痕系统研究了薄膜的介观力学行为.研究表明：制备于玻璃衬底上的氢化硅薄膜，由于存在非晶态的过渡缓冲层，弹性模量小于相应的制备于单晶硅衬底的薄膜.对于掺杂的氢化硅薄膜，由于磷的掺入使得薄膜晶粒细化、有序度提高，薄膜的晶态比一般在40％以上.而硼的掺入，薄膜晶态比减小，一般低于40％.同时发现，掺磷、本征和掺硼的氢化硅薄膜分别在晶态比为45％，30％和15％左右处，弹性模量较 关键词： 氢化硅薄膜 拉曼谱 弹性模量 晶态比     

Mechanical properties of thin films of hydrogenated silicon and their relationship with microstructure

Thin films of hydrogenated silicon were deposited on glass and single-crystalline silicon substrates using a capacitively coupled radio-frequency plasma-enhanced vapor-deposition system with the help of direct-current bias stimulation. Micro-Raman scattering was applied to investigate the microstructure of the thin films obtained. The crystalline volume fraction, X _c, was obtained from the Raman spectra. Microscopic mechanical characterization of the thin films was carried out by nanoindentation based on the conventional depth-sensing indentation method. An analytical relation between X _c and the elastic modulus was thereby established. The elastic modulus of the film on a glass substrate was found to be lower than that of the film on a monocrystalline silicon substrate with the same X _c. The grain size of a phosphorus-doped thin film was smaller than that of the intrinsic one, with greater ordering of the grains and X _c was found to be usually above 40%. A film with boron doping was on the opposite side, with X _c usually below 40%. In the phosphorus-doped, intrinsic, and boron-doped films, the elastic moduli were lower when the X _c values were 45%, 30%, and 15%, respectively.     

热丝化学气相沉积技术低温制备多晶硅薄膜的结构与光电特性

以金属W和Ta为热丝，采用热丝化学气相沉积 ，在250℃玻璃衬底上沉积多晶硅薄膜.研究了热丝温度、沉积气压、热丝与衬底间距等沉积参数对硅薄膜结构和光电特性的影响，在优化条件下获得晶态比X_c＞90%，暗电导率σ_d=10^-7—10-6Ω ^-1cm^-1，激活能E_a=0.5eV，光能隙E_opt≤1.3 eV的多晶硅薄膜. 关键词： 多晶硅薄膜 热丝化学气相沉积 光电特性     

n型掺杂层结构对n-i-p型微晶硅电池性能和光致衰退特性的影响

采用射频化学气相沉积法,制备了一系列具有不同晶化率n型掺杂层的n-i-p结构微晶硅薄膜太阳电池.发现本征层的结构很大程度上依赖于n型掺杂层的结构,特别是n/i界面处的孵化层厚度以及本征层的晶化率.该系列太阳电池在100 mW/cm²的白光下照射400 h,实验结果证实了本征层晶化率最大（X_c(i)=65%）的电池性能表现出最低的光致衰退率.拥有非晶/微晶过渡区n型掺杂层的电池（本征层晶化率X_c(i)=54%）分别 关键词： 微晶硅 n-i-p结构太阳电池 光致衰退 晶化率     

Evolution of infrared spectra and optical emission spectra in hydrogenated silicon thin films prepared by VHF-PECVD

A series of hydrogenated silicon thin films with varying silane concentrations have been deposited by using very high frequency plasma enhanced chemical vapor deposition (VHF-PECVD) method. The deposition process and the silicon thin films are studied by using optical emission spectroscopy (OES) and Fourier transfer infrared (FTIR) spectroscopy, respectively. The results show that when the silane concentration changes from 10% to 1%, the peak frequency of the Si—H stretching mode shifts from 2000 cm ^{- 1} to 2100 cm ^{- 1}, while the peak frequency of the Si—H wagging—rocking mode shifts from 650 cm ^{- 1} to 620 cm ^{- 1}. At the same time the SiH^*/H_α intensity ratio in the plasma decreases gradually. The evolution of the infrared spectra and the optical emission spectra demonstrates a morphological phase transition from amorphous silicon (a-Si:H) to microcrystalline silicon (μc-Si:H). The structural evolution and the μc-Si:H formation have been analyzed based on the variation of H_α and SiH^* intensities in the plasma. The role of oxygen impurity during the plasma process and in the silicon films is also discussed in this study.     

Influence of the deposition parameters on the transition region of hydrogenated silicon films growth

Hydrogenated microcrystalline and amorphous silicon thin films were prepared by very high frequency plasmaenhanced chemical vapour deposition （VHF PECVD） by using a mixture of silane and hydrogen as source gas. The influence of deposition parameters on the transition region of hydrogenated silicon films growth was investigated by varying the silane concentration （SC）, plasma power （Pw）, working pressure （P）, and substrate temperature （Ts）. Results suggest that SC and Ts are the most critical factors that affect the film structure transition from microcrystalline to amorphous phase. A narrow region in the range of SC and Ts, in which the rapid phase transition takes place, was identified. It was found that at lower P or higher Pw, the transition region is shifted to larger SC. In addition, the dark conductivity and photoconductivity decrease with SC and show sharp changes in the transition region. It proposed that the transition process and the transition region are determined by the competition between the etching effect of atomic hydrogen and the growth of amorphous phase.     

Electrochemically deposited bismuth telluride thin films

Thin films of bismuth telluride grown by electrochemical deposition technique on conducting glass and Mo sheet substrates, were characterized for their structural, morphological, optical and compositional analysis. These studies revealed polycrystalline anisotropic and layered structure of these films with different compositional stoichiometry. In the present work electrochemical deposition of bismuth telluride thin films is studied as a dopant material in II–VI group absorber materials for photovoltaic application since it has a narrow optical energy band gap of 0.13 eV. In this deposition process different film growth parameters were optimized to get good quality of compositionally uniform bismuth telluride thin film. XRD analysis revealed a hexagonal symmetry with large c-axis lattice constants (Bi₂Te₃, Bi_2+XTe_3−X).     

Influence of total gas flow rate on microcrystalline silicon films prepared by VHF-PECVD

Hydrogenated microcrystalline silicon (\mu c-Si:H) films are fabricated by very high frequency plasma enhanced chemical vapour deposition (VHF-PECVD) at a silane concentration of 7% and a varying total gas flow rate (Hk₂+SiHk₄). Relations between the total gas flow rate and the electrical and structural properties as well as deposition rate of the films are studied. The results indicate that with the total gas flow rate increasing the photosensitivity and deposition rate increase, but the crystalline volume fraction (Xk_c) and dark conductivity decrease. And the intensity of (220) peak first increases then decreases with the increase of the total gas flow rate. The cause for the changes in the structure and deposition rate of the films with the total gas flow rate is investigated using optical emission spectroscopy (OES).     

相变域硅薄膜材料的光稳定性

采用RF-PECVD技术，通过改变反应气体的硅烷浓度制备了一系列不同晶化率不掺杂的硅薄膜材料，研究了工艺变化对材料结构的影响及材料光电特性同微结构的关系.随后进行了光衰退试验，在分析光照前后光电特性变化规律的基础上，认为材料中的非晶成分是导致材料光电特性衰退的主要原因.在靠近过渡区非晶一侧的硅材料比普通非晶硅稳定，衰退率较少；高晶化率微晶硅材料性能稳定，基本不存在光衰退；在靠近过渡区微晶一侧的硅材料虽然不是完全不衰退，但相比高晶化率硅材料来说更适合制备高效微晶硅电池. 关键词： 射频等离子体增强化学气相沉积 硅薄膜 Staebler-Wronski(SW)效应 稳定性