溅射功率对直流磁控溅射Ti膜结构的影响

 采用直流磁控溅射方法制备了纯Ti膜，研究了不同功率下Ti膜的沉积速率、表面形貌及晶型结构，并对其应力进行了研究。研究表明：薄膜的沉积速率随溅射功率的增加而增加，当溅射功率为20 W时，原子力显微镜(AFM)图像显示Ti膜光洁、致密，均方根粗糙度最小可达0.9 nm。X射线衍射(XRD)分析表明薄膜的晶体结构为六方晶型，Ti膜应力先随溅射功率增大而增大，在60 W时达到最大值（为945.1 MPa），之后随溅射功率的增大有所减小。     

膜厚对直流磁控溅射Nb薄膜微结构的影响

 采用直流磁控溅射方法制备膜厚为50, 100, 200, 400, 600 nm的Nb薄膜,对薄膜的沉积速率、表面形貌、晶体结构进行了研究,并对其应力和择优取向进行了详细的分析。原子力显微镜图像显示Nb膜表面光滑、致密,均方根粗糙度达到0.1 nm量级。X射线小角衍射给出了薄膜的晶格结构、晶粒尺寸和应力情况。分析表明薄膜为多晶体心立方结构(bcc),在(110)晶面方向存在明显的择优取向,且随着薄膜厚度增大而增强。Nb膜应力先随薄膜厚度增大而增大,在200 nm时达到最大值(为1.015 1 GPa),后随薄膜厚度的增大有所减小。     

场发射显示Ag膜电极的制备及其电性能

场发射显示(FED)被认为是CRT的平板化,受到人们关注。作者采用直流磁控溅射法,在Al₂O₃过渡层上制备面心立方结构的Ag多晶薄膜。通过XRD、SEM、AFM测试分析发现,溅射功率分为两个区域,在溅射功率不高于2.8 kW时,沉积速率随着功率线性增大,得到Ag膜晶粒尺寸均一,薄膜电阻率逐步降低;溅射功率高于2.8 kW后,沉积速率没有显著增大,出现较多的大晶粒,电阻率升高,并且从理论上给出了解释。综合来看,溅射功率在2.8 kW所制备的Ag膜微观结构质量达到最佳,电阻率也达到最小值。     

高择优取向Mo薄膜的直流磁控溅射制备及其电学性能

使用直流磁控溅射法在玻璃基底上沉积Mo薄膜,采用X射线衍射仪、原子力显微镜和四探针测试系统研究了溅射工艺对Mo薄膜的结构、形貌和电学性能的影响.结果表明:当基片温度为150 ℃时,薄膜获得(211)晶面择优取向生长,而在低于250 ℃的其它温度条件下,样品则表现为(110)晶面择优取向生长.进一步的表面形貌分析显示:薄膜的粗糙度随基片温度变化不明显,其值大约为0.35 nm,随溅射功率密度的增大而变大|电学性能方面:随着溅射功率密度的升高,薄膜导电性能迅速增强,电阻率呈现近似指数函数衰减|随着基底温度的升高,薄膜的电阻率先减小后增大,当基底温度为150 ℃时,薄膜电阻率降低至最小值2.02×10-5 Ω·cm.     

射频磁控溅射法制备的Eu掺杂ZnO薄膜的结构及其发光性质

用射频磁控溅射法在石英衬底上制备了ZnO:Eu3+薄膜,通过X射线衍射仪、扫描电子显微镜和荧光光谱仪测试了薄膜结构、形貌以及发光性能,重点考察了溅射功率和退火工艺对其组织结构和发光性能的影响.结果表明:样品均呈现ZnO的六角纤锌矿结构,增大溅射功率有利于形成ZnO的c轴择优取向;增大溅射功率以及高温退火会使晶粒尺寸增大...     

用不同的Mo靶溅射功率制备Mo/Si多层膜

 用磁控溅射法制备了周期厚度和周期数均相同的Mo/Si多层膜，用原子力显微镜和小角X射线衍射分别研究了Mo靶溅射功率不相同时，Mo/Si多层膜表面形貌和晶相的变化。随后在国家同步辐射实验室测量了Mo/Si多层膜的软X射线反射率。研究发现，随着Mo靶溅射功率的增大，Mo/Si多层膜的表面粗糙度增加，Mo的特征X射线衍射峰也增强，Mo/Si多层膜的软X射线峰值反射率先增大后减小。     

Si基Sc膜的制备及结构分析

采用电子束镀膜方法在Si基底上制备了Sc膜,利用XRD,SEM分析了不同镀膜工艺条件下制备的Sc膜的形貌和结构。结果表明:基底温度在350～550 ℃时,薄膜主要由单质Sc组成,而且随着基底温度的升高,膜的颗粒尺寸增大,膜也变得更加致密;基底温度提高至650 ℃时,膜全部由ScSi化合物组成,膜变成颗粒状结构。沉积速率对低温时Sc膜的形貌与结构的影响不明显,颗粒尺寸随沉积速率的增大而增大,但物相结构基本没有发生变化;而在高温650 ℃时,沉积速率对膜的形貌与结构产生了很大的影响,随着沉积速率的增大,膜表面出现了大量微裂纹,而且较低的沉积速率有利于获得衍射峰单一的膜,增大沉积速率将会导致衍射峰数量明显增加。     

磁控溅射制备微球表面金属Mo涂层的研究

利用磁控溅射制备了各种工艺参数不同的微球表面金属Mo涂层样品,并通过白光干涉仪和扫描电子显微镜对样品的表面及剖面进行了系统的测试分析。分别探究了溅射工作气压和沉积制备时间对微球表面Mo涂层表面形貌以及结晶质量的影响规律。结果表明通过优化工艺参数可制备微球直径约为800μm、涂层厚度为3.5μm到14.1μm、厚度均匀性良好的微球表面Mo涂层。Mo涂层中的晶粒呈现出柱状结构致密堆积在一起,且随涂层的厚度增加晶粒间空隙增大。     

不同氧分压下直流反应溅射ZnO薄膜的结构和光学特性

在室温,不同氧分压条件下,采用Zn靶直流反应溅射在石英衬底上制备了具有纤锌矿结构(002)择优取向的ZnO薄膜。薄膜的生长速率随氧分压的增大而减小,在20%-30%之间存在一个拐点,在此点之前,溅射产额减小的速率很快,而在此点之后,溅射产额减小的速率减慢了很多,当氧分压在30%以上时,溅射过程中Zn的氧化在靶表面就已经完成。通过单振子模型分析了薄膜的光学特性,采用X射线衍射的方法对薄膜的晶粒尺寸和应力进行分析。研究结果表明在氧分压20%以上时,薄膜在可见光波段具有较好的光学透明性和很高的电阻率。薄膜的光学折射率、晶面间距和内部应力均随着氧分压的增大而增大。并从薄膜生长机理上给出了理论解释。     

热退火对ZnO薄膜表面形貌与椭偏特性的影响

利用原子力显微镜(AFM)和椭偏仪对溅射制备的硅基ZnO薄膜的热退火表面形貌与椭偏特性进行了研究。结果发现：未退火或低温退火(≤850℃)薄膜的形貌呈现较弱的各向异性,晶粒尺寸大小较为均匀,尺寸约为50nm。当经高温退火后,ZnO薄膜的晶粒尺寸明显增大,同时伴随晶粒尺寸分布非均匀化,较大的尺寸可达400nm,而较小的尺寸仅为50nm。此外,椭偏测量表明：椭偏参数在不同的退火温区的变化呈现明显差别;当退火温度高于850℃时,薄膜的结构有明显的变化。     

脉冲溅射功率对含硅量子点SiC_x薄膜的结构和光学特性的影响

采用射频和脉冲磁控共溅射法并结合快速光热退火法制备了含硅量子点的SiC_x薄膜.采用掠入射X射线衍射、喇曼光谱、紫外-可见-近红外分光光度计和透射电子显微镜对薄膜进行表征.研究了脉冲溅射功率对薄膜中硅量子点数量、尺寸、晶化率和薄膜光学带隙的影响.结果表明:当溅射功率从70 W增至100 W时,硅量子点数量增多,尺寸增至5.33nm,晶化率增至68.67%,而光学带隙则减至1.62eV;随着溅射功率进一步增至110 W时,硅量子点数量减少,尺寸减至5.12nm,晶化率降至55.13%,而光学带隙却增至2.23eV.在本实验条件下,最佳溅射功率为100 W.     

Effects of deposition parameters on tantalum films deposited by direct current magnetron sputtering in Ar–O2 mixture

The structure, composition, and temperature coefficient of resistance of tantalum films sputtered in Ar–O₂ mixture were studied as a function of deposition parameters and substrates temperature. As the sputtering power increased from 25 to 100 W, the samples deposited at 300 °C only consisted of the β phase, the preferred-growth orientation of films changed from (2 0 0) to (2 0 2) and the temperature coefficient of resistance reduced from −289.8 to −116.7 ppm/°C. The decrease of the oxygen and other impurity in the films was observed as the increase of the sputtering power. In addition, the O/Ta ratio decrease and grain size reduction in the films related to a change of electrical resistivity were observed at substrate temperatures in the range of 300–500 °C. These results suggested that the electrical properties were due to the oxygen and other impurity content and grain size in the films rather than to growth orientation. At 650 °C, the deposited films contained both partial stable body-centered-cubic α phase with low resistivity and tetragonal β phase of Ta. The presence of α phase of Ta causes a sharp decrease of the electrical resistivity and a significant change in the microstructure of the samples.     

Preparation of boron carbon nitride thin films by radio frequency magnetron sputtering

Boron carbon nitride films were deposited by radio frequency magnetron sputtering using a composite target consisting of h-BN and graphite in an Ar-N₂ gas mixture. The samples were characterized by X-ray diffraction, Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy. The results suggest that the films are atomic-level hybrids composed of B, C and N atoms. The boron carbon nitride films prepared in the present experiment have a disordered structure. The sputtering power varied from 80 W to 130 W. This sputtering power was shown to have regular effect on the composition of boron carbon nitride films. The samples deposited at 80 W and 130 W are close to the stoichiometry of BC₃N. The sample deposited at 110 W is close to the stoichiometry of BCN. The samples deposited at 100 W and 120 W approach to BC₂N. It is very significant for us to synthesize boron carbon nitride compound with controllable composition by changing the sputtering power.     

Optical and mechanical properties of AlF3 films produced by pulse magnetron sputtering of Al targets with CF4/O2 gas

In this study, AlF₃ thin films were deposited by pulse magnetron sputtering of Al targets with different ratios of CF₄/O₂ gas and at different sputtering powers. The optical and mechanical properties of the AlF₃ thin films were analyzed. The transmittance spectra showed no obvious negative inhomogeneous refractive indices. Denser films with a low optical absorption were obtained when high sputtering powers were used (larger than 30 W). The lowest extinction coefficient (7.3 × 10⁻⁴ at 193 nm) of the films can be reached with 12 sccm O₂ flow rate and at 160W sputtering power. All of the residual stresses were compressive and their trends were consistent with the refractive indices. The lowest compressive stress (0.068 GPa) was obtained when the AlF₃ films were prepared at 160W sputtering power.     

Effect of sputtering power on surface topography of dc magnetron sputtered Ti thin films observed by AFM

Titanium films were deposited on glass substrates at room temperature by direct current (dc) magnetron sputtering at fixed Ar pressure of 1.7 Pa and sputtering time of 4 min with different sputtering power ranging from 100 to 300 W. Atomic force microscopy (AFM) was used to study topographic characteristics of the films, including crystalline feature, grain size, clustering and roughening. The amorphous-like microstructure feature has been observed at 100-150 W and the transition of crystal microstructure from amorphous-like to crystalline state occurs at 200 W. The increase in grain size of Ti films with the sputtering power (from 200 to 300 W) has been confirmed by AFM characterization. In addition, higher sputtering power (300 W) leads to the transformation of crystal texture from globular-like to hexagonal type. The study has shown that higher sputtering power results in the non-linear increase in deposition rate of Ti films. Good correlativity between the surface roughness parameters including root mean square (RMS) roughness, surface mean height (Ra) and maximum peak to valley height (P-V) for evaluating the lateral feature of the films has been manifested. Surface roughness has an increasing trend at 100-250 W, and then drops up to 300 W.     

磁控溅射制备极紫外高反射率多层膜应力研究

为制备硼边附近6.7 nm波长的极紫外高反射率多层膜反射镜,研究了Mo_2C/B_4C,Mo/B_4C周期多层膜,重点解决薄膜应力难题。采用直流磁控溅射技术制备了膜层厚度为30 nm的Mo,Mo_2C,B_4C,单层膜,周期厚度为3.5 nm,30对的Mo_2C/B_4C,Mo/B_4C周期多层膜。利用台阶仪测试了镀膜前后基底面形,计算并比较了不同薄膜样品的应力值。结果表明Mo_2C/B_4C多层膜压应力要远小于Mo/B_4C多层膜,且成膜质量与Mo/B_4C相当。因此Mo_2C/B_4C是应用于6.7 nm反射镜较好的多层膜材料组合。     

Effect of amorphous C films deposited by RF magnetron sputtering on smoothing K9 glass substrate

Soft X-ray multilayer reflectors must be deposited on super-smooth surface such as super-polished silicon wafers or glasses, which are complicate, time-consuming and expensive to produce. To overcome this shortage, C films deposited by RF magnetron sputtering were considered to smooth the K9 glass substrates’ surface in the present paper. The structure of C films was systematically studied by XRD and Raman spectrum. The surface morphology and rms-roughness were obtained by AFM. Then, we calculated the impact of the C layers on the reflectivity curve of Mo/Si soft X-ray multilayer reflector around 13.5 nm. The C films exhibit typical amorphous state. With the increasing of power and thickness, the content of sp3 hybrid bonding decreases while the amount or size of well-organized graphite clusters increases. The surface rms-roughness decreases from 2.4 nm to 0.62 nm after smoothed by an 80 nm thick C layer deposited in 500 W, which is the smoothest C layer surface we have obtained. The calculation results show that the theoretical normal incidence reflectivity of Mo/Si multilayer at 13.5 nm increases from 7% to 63%.     

Plasma-based sputtering of indium tin oxide for the application of photovoltaic cells

Transparent and conducting indium tin oxide (ITO) thin films were deposited on soda lime glass substrates by RF plasma magnetron sputtering at room temperature. The effect of thickness (100, 200 and 300?nm) on the physical (structural, optical, electrical) properties of ITO thin films was investigated systematically. It is observed that with an increase in thickness, the X-ray diffraction data indicate polycrystalline films with grain orientations predominantly along (222) and (400) directions; the average grain size increases from 10 to 30?nm; the optical band gap increases from 3.68 to 3.73?eV and the transmission decrease from 80% to 70% . Four-point probes show a low resistivity (2.4×10^?5?Ω?cm) values for film with a thickness 300?nm. Present work shows that the ITO is a promising transparent conductive oxide material for the solar cell application.     

Influence of deposition pressure and power on characteristics of RF-Sputtered Mo films and investigation of sodium diffusion in the films

Mo films deposited by DC sputtering are widely used as back contact in CIGS and CZTS based thin film solar cells. However, there have been only a few studies on the deposition of Mo films by RF sputtering method. In this context, Mo films on SLG substrates were prepared as a function of deposition pressure and power by using RF magnetron sputtering method to contribute to this shortcoming. Mo films were deposited at 250 °C substrate temperature by using 20, 15, 10 mTorr Ar pressures at 120 W RF power and 10 mTorr Ar pressure at 100 W RF power. Structural, morphological and reflectivity properties of RF-sputtered Mo films were clarified by XRD, AFM, FE-SEM and UV–Vis measurements. In addition, due to sodium incorporation from SLG substrate to the absorber layer through Mo back contact layer is so essential in terms of improving the conversion efficiency values of CIGS and CZTS thin film solar cell devices, the effects of Na diffusion in the films were analyzed with SIMS depth profile. The electrical properties of the films such as mobility, carrier density and resistivity were determined by Hall Effect measurements. It was found that Mo films prepared at 120 W, 10 mtorr and 250 °C substrate temperature and then annealed at 500 °C for 30 min, had resistivity as low as 10⁻⁵ Ω cm, as well as higher amount of Na incorporation than other films.