HfO2基铁电薄膜的结构、性能调控及典型器件应用

大数据、物联网和人工智能的快速发展对存储芯片、逻辑芯片和其他电子元器件的性能提出了越来越高的要求.本文介绍了HfO₂基铁电薄膜的铁电性起源,通过掺杂元素改变晶体结构的对称性或引入适量的氧空位来降低相转变的能垒可以增强HfO₂基薄膜的铁电性,在衬底和电极之间引入应力、减小薄膜厚度、构建纳米层结构和降低退火温度等方法也可以稳定铁电相.与钙钛矿氧化物铁电薄膜相比, HfO₂基铁电薄膜具有与现有半导体工艺兼容性更强和在纳米级厚度下铁电性强等优点.铁电存储器件理论上可以达到闪存的存储密度,读写次数超过10¹⁰次,同时具有读写速度快、低操作电压和低功耗等优点.此外,还总结了HfO₂基薄膜在负电容晶体管、铁电隧道结、神经形态计算和反铁电储能等方面的主要研究成果.最后,讨论了HfO₂基铁电薄膜器件当前面临的挑战和未来的机遇.     

离子辅助沉积法制备SiO2介质薄膜的应力研究

在高功率垂直腔面发射激光器制作工艺中,生长出低应力、高质量、高稳定性的SiO₂介质层非常关键。我们使用高效率LaB₆离子源辅助,在低放电电流条件下,在GaAs衬底上沉积了SiO₂,并对退火的应力影响进行了测试。在有离子辅助沉积时,对不同生长速率、不同厚度的应力影响进行了研究,对沉积过程进行了分析。结果表明:离子辅助沉积的SiO₂薄膜的应力远小于常规工艺条件下沉积的薄膜的应力,且退火后应力变化小。     

ZrO2／SiO2多层膜中膜厚组合周期数及基底材料对残余应力的影响

ZrO₂／SiO₂多层膜由相同沉积条件下的电子束蒸发方法制备而成， 通过改变多层膜中高(ZrO₂)、低(SiO₂)折射率材料膜厚组合周期数的方法，研究了沉积 在熔石英和BK7玻璃 基底上多层膜中残余应力的变化. 用ZYGO光学干涉仪测量了基底镀膜前后曲率半径的变化， 并确定了薄膜中的残余应力. 结果发现，该多层膜中的残余应力为压应力，随着薄膜中膜厚 组合周期数的增加，压应力值逐渐减小. 而且在相同条件下，石英基底上所沉积多层膜中的 压应力值要小于BK7玻璃基底上所沉积多层膜中的压应力值. 用x射线衍射技术测量分析了膜 厚组合周期数不同的ZrO₂／SiO₂多层膜微结构，发现随着周期数增 加，多层膜的结晶程 度增强. 同时多层膜的微结构应变表现出了与所测应力不一致的变化趋势，这主要是由多层 膜中，膜层界面之间复杂的相互作用引起的. 关键词： 2／SiO₂多层膜')" href="#">ZrO₂／SiO₂多层膜 残余应力 膜厚组合周期数     

二氧化钒薄膜的低温制备及其性能研究

针对VO₂薄膜在微测辐射热计上的应用，采用射频反应溅射法，在室温下制备氧化钒薄膜；研究了氧分压对薄膜沉积速率、电学性质及成分的影响.通过调节氧分压，先获得成分接近VO₂的非晶化薄膜，再在400℃空气中氧化退火，便可制得高电阻温度系数，低电阻率的VO₂薄膜，电阻温度系数约为-4%/℃，薄膜方块电阻为R_□为100—300kΩ；薄膜在室温下沉积，400℃下退火的制备方法与微机电加工(micro electromechanic 关键词： 二氧化钒 电阻温度系数 氧分压 射频反应溅射法     

GaSb基PECVD法制备SiO2薄膜的应力研究

为了实现在GaSb衬底上获得低应力的SiO₂薄膜,研究了等离子体增强化学气相沉积法（PECVD）在晶格失配较大的GaSb衬底上沉积SiO₂薄膜的应力情况。通过改变薄膜沉积时的工艺条件,如反应温度、射频功率、反应压强、气体流量比,并基于曲率法模型,对镀膜前后的曲率半径进行了实验测量,利用Stoney公式计算相关应力值并绘制应力变化曲线。详细讨论了PECVD工艺条件的改变对SiO₂薄膜应力所产生的影响。同时通过在Si衬底上沉积SiO₂薄膜,对比分析了导致薄膜应力产生的因素及变化过程。实验结果表明,在沉积温度为300℃、射频功率为20 W、腔体压强为90 Pa、气体流量比SiH₄/N₂O为125/70 cm³·min^-1的工艺参数下,PECVD法在GaSb衬底上沉积的SiO₂薄膜应力相对较小。     

负离子元素杂质破坏模型

探讨了HfO₂薄膜中负离子元素杂质破坏模型，并得出薄膜中的杂质主要来源于 镀膜材料. 用电子束蒸发方法沉积两种不同Cl元素含量的HfO₂薄膜，测定薄膜 弱吸收和损伤阈值来验证负离子元素破坏模型. 结果表明，随着Cl元素含量的增加薄膜的弱 吸收增加损伤阈值减小. 这主要是因为负离子元素在蒸发过程中形成挥发性的气源中心而产 生缺陷，缺陷在激光辐照过程中又形成吸收中心. 因此负离子元素的存在将加速薄膜的破坏 . 关键词： 负离子元素杂质 缺陷 吸收     

ZrO2薄膜残余应力实验研究

采用ZYGO MarkⅢ-GPI数字波面干涉仪对电子束蒸发方法制备的ZrO2薄膜中的残余应力进行了研究,讨论了沉积温度、沉积速率等工艺参量对ZrO2薄膜残余应力的影响。实验结果表明：随着沉积温度及沉积速率的升高,ZrO2薄膜中残余应力状态由张应力变为压应力,且压应力值随着沉积温度升高而增大。同时用X射线衍射技术测量分析了不同沉积条件下ZrO2薄膜的微结构组织,探讨了ZrO2薄膜微结构与其应力的对应关系。     

氢稀释对多晶硅薄膜结构特性和光学特性的影响

以SiCl₄和H₂为气源，用等离子体增强化学气相沉积技术，在250℃的低温下，研究氢稀释度对多晶硅薄膜结构特性的影响.实验结果表明，对于以SiCl₄和H₂组成的反应源气体，氢对薄膜生长特性的影响有异于SiH₄/H₂，在一定功率下，薄膜的晶化率随氢稀释度的减小而增加，在一定的氢稀释度下薄膜晶化度达到最大值85％；随着氢稀释度的继续减小，薄膜晶化度迅速下降，并逐渐向非晶态结构转变.随氢稀释度的减小，薄膜的光学带隙由 1.5eV减小至约1.2eV，而后增大至1.8eV.沉积速率则随氢稀释度的减小先增加后减小，在无氢条件下，无薄膜形成.在最佳氢稀释度条件下，Cl基是促进晶化度提高，晶粒长大的一个主要因素. 关键词： 多晶硅薄膜 微结构 氢稀释 4')" href="#">SiCl₄     

激光诱导多层光学薄膜损伤分析与仿真

提出一种全面分析光学薄膜损伤特性的方法,根据热传导理论与电子增殖理论建立激光辐照下多层介质膜的损伤理论模型。以HfO₂/SiO₂多层高反膜为例,计算红外纳秒脉冲激光作用下膜系内部的温度场、应力场以及自由电子数密度分布,对其热学特性与电子增殖特性进行综合评估后,得到不同输入条件下膜系的损伤阈值。结果表明,薄膜材料的损伤特性会受到驻波场的影响,在1064 nm波长的激光辐照下HfO₂/SiO₂ 多层介质薄膜的热致应力损伤效应先于热熔融效应先于场效应发生,且薄膜中SiO₂层发生热损伤,而薄膜并未发生场损伤,此外薄膜的损伤阈值随着激光脉宽的增大而增大。     

O2流量对磁控溅射N掺杂TiO2薄膜成分及晶体结构的影响

利用直流脉冲磁控溅射方法在室温下通过改变O₂流量制备具有不同晶体结构的N掺杂TiO₂薄膜,利用台阶仪、X射线光电子能谱仪、X射线衍射仪、紫外-可见分光光度计等设备对薄膜沉积速率、化学成分、晶体结构、禁带宽度等进行分析.结果表明:所制备的薄膜元素配比约为TiO_1.68±0.06N_0.11±0.01,N为替位掺杂,所有样品退火前后均未形成Ti—N相结构,N掺杂TiO₂薄膜的沉积速率、晶体结构等主要依赖于O₂流量.在O₂流量为2 sccm时,N掺杂TiO₂薄膜沉积速率相对较高,薄膜为非晶态结构,但薄膜内含有锐钛矿(anatase)和金红石(rutile)相晶核,退火后薄膜呈anatase和rutile相混合结构,禁带宽度仅为2.86 eV.随着O₂流量的增加,薄膜沉积速率单调下降,退火后样品禁带宽度逐渐增加.当O₂流量为12 sccm时,薄膜为anatase相择优生长,退火后呈anatase相结构,禁带宽度为3.2 eV.综合本实验的分析结果,要在室温条件下制备晶态N掺杂TiO₂薄膜,需在高O₂流量(＞10 sccn)条件下制备. 关键词： 2薄膜')" href="#">N掺杂TiO₂薄膜 磁控溅射 化学配比 晶体结构     

Investigation on properties of TiO2 thin films deposited at different oxygen pressures

TiO₂ thin films were prepared by electron beam evaporation at different oxygen partial pressures. The influences of oxygen partial pressure on optical, mechanical and structural properties of TiO₂ thin films were studied. The results showed that with the increase of oxygen partial pressure, the optical transmittance gradually increased, the transmittance edge gradually shifted to short wavelength, and the corresponding refractive index decreased. The residual stresses of all samples were tensile, and the value increased as oxygen partial pressure increasing, which corresponded to the evolutions of the packing densities. The structures of TiO₂ thin films all were amorphous because deposition particles did not possess enough energy to crystallize.     

Influences of oxygen partial pressure on structure and related properties of ZrO2 thin films prepared by electron beam evaporation deposition

ZrO₂ thin films were prepared by electron beam evaporation at different oxygen partial pressures. The influences of oxygen partial pressure on structure and related properties of ZrO₂ thin films were studied. Transmittance, thermal absorption, structure and residual stress of ZrO₂ thin films were measured by spectrophotometer, surface thermal lensing technique (STL), X-ray diffraction and optical interferometer, respectively. The results showed that the structure and related properties varied progressively with the increase of oxygen partial pressure. The refractive indices and the packing densities of the thin films decreased when the oxygen partial pressure increased. The tetragonal phase fraction in the thin films decreased gradually as oxygen partial pressure increased. The residual stress of film deposited at base pressure was high compressive stress, the value decreased with the increase of oxygen partial pressure, and the residual stress became tensile with the further increase of oxygen pressure, which was corresponding to the evolution of packing densities and variation of interplanar distances.     

Si基铁电Bi3.15Nd0.85Ti3O12多层薄膜的一致取向生长和性能的研究

采用脉冲激光沉积(PLD)技术，利用LSCO/CeO₂/YSZ多异质缓冲层，在Si(100)基 片上成功地制备了c轴一致取向的Bi_3.15Nd_0.85Ti₃O12(BNT)铁电薄膜.利用X射线衍射(XRD)和扫描电镜(SEM)分析测定了薄膜的相结构 、取向和形貌特征，考察了沉积温度和氧分压对BNT薄膜微结构、取向和形貌的影响，确定 了BNT薄膜的最佳沉积条件.对在优化的条件下制备得到的BNT薄膜的C-V曲线测试得到了典型 的蝴蝶形曲线，表明该薄膜具有较好的电极化反转存储特性.最后讨论了BNT薄膜铁电性能与 薄膜取向的相关性. 关键词： 3.15Nd_0.85Ti₃O₁₂')" href="#">Bi_3.15Nd_0.85Ti₃O₁₂ 铁电薄 膜 多层异质结 脉冲激光沉积     

Role of oxygen impurity in growth and magnetic properties of Ni83Fe17 permalloy thin films

To study the influence of oxygen impurities in the sputtering atmosphere on microstructure, and the magnetic and magnetotransport properties, thin films of Ni₈₃Fe₁₇ were deposited under dc magnetron sputtering technique into which regulated oxygen gas was introduced. The partial pressure of oxygen was varied from 2×10⁻⁷ to 3×10⁻⁶ mbar. X-ray diffraction patterns indicate the reduction of grain growth with increasing the oxygen partial pressure. The grain microstructure and the composition were confirmed through high resolution transmission electron microscopy attached with Scanning Transmission Electron Microscopy (STEM). Transition from canted to rectangular magnetic hysteresis loop was observed through magnetization measurements for samples prepared under higher oxygen partial pressure which implies the structural changes in the magnetic domain formation. These observations were further confirmed through the measurements of anisotropic magnetoresistance properties.     

离子束溅射制备Nb2O5光学薄膜的特性研究

研究了离子束溅射(IBS)制备的Nb₂O₅薄膜的光学特性、应力、薄膜微结构等特性,系统地分析了辅助离子源的离子束能量和离子束流对薄膜特性的影响.结果显示,在辅助离子源不同参数情况下,折射率在波长550 nm处为2.310—2.276,应力值为-281—-152 MPa.在合适的工艺参数下,消光系数可小于10^-4,薄膜具有很好的表面平整度.与用离子辅助沉积(IAD)制备的薄膜相比,IBS制备的薄膜具有更好的光学特性和薄膜微结构. 关键词： 2O₅薄膜')" href="#">Nb₂O₅薄膜 离子束溅射 光学特性 应力     

Development of structural and optical properties of WOx films upon increasing oxygen partial pressure during reactive sputtering

WO_x films were prepared by reactive dc magnetron sputtering using tungsten target. Sputtering was carried out at a total pressure of 1.2 Pa using a mixture of argon plus oxygen in an effort to determine the influence of the oxygen partial pressure on structural and optical properties of the films. The deposition rate decreases significantly as the surface of the target is oxidized. X-Ray diffraction revealed the amorphous nature of all the films prepared at oxygen partial pressures higher than 1.71×10⁻³ Pa. For higher oxygen partial pressures, fully transparent films were deposited, which showed a slight increase in optical band gap with increasing oxygen partial pressure, while the refractive index was simultaneously decreased.     

沉积温度对HfO2薄膜残余应力的影响

 用电子束蒸发方法制备了HfO₂薄膜，根据镀膜前后基片曲率半径的变化，用Stoney公式计算了薄膜应力，讨论了沉积温度对薄膜残余应力的影响。结果发现，HfO₂薄膜的残余应力均为张应力，应力值随沉积温度的升高先增大后减小，在280 ℃左右出现极大值。对样品进行了XRD测试，从微观结构上对实验结果进行了分析，发现微结构演变引起的内应力变化是引起薄膜残余应力改变的主要因素，HfO2薄膜在所选沉积温度60~350 ℃内出现了晶态转变，堆积密度随温度升高而增大。     

The electrical and magnetic properties of epitaxial orthorhombic YMnO3 thin films grown under various oxygen pressures

Orthorhombic YMnO₃ thin films were epitaxially grown on bare and LaNiO₃ buffered (0 0 1)-SrTiO₃ substrates by pulsed laser deposition under various oxygen pressures from 5 to 30 Pa. The crystal structure and microstructure of these films have been characterized by both X-ray diffractions and transmission electron microscopy. The leakage current, modeled as the space charge limited current (SCLC) mechanism, decreased significantly with the increase of oxygen content. It is further found that the magnetic property of films is greatly enhanced in YMnO₃ films grown under high oxygen pressure, which can be explained decreased oxygen vacancies. In addition, bipolar switching behavior was obtained only in the films grown under 30 Pa oxygen pressure, which is attributed to the decrease of voltage-driven oxygen vacancy migration.     

沉积参量及时效时间对 SiO2薄膜残余应力的影响

SiO2 薄膜由电子束蒸发方法沉积而成。用GPI数字波面光学干涉仪测量了不同沉积条件下玻璃基底镀膜前后曲率半径的变化,并确定了 SiO2 薄膜中的残余应力。在其他条件相同的情况下,当沉积温度由 190 ℃升高到350 ℃时,SiO2 薄膜中的压应力由-156 MPa增大为-289 MPa。氧分压由3.0×10-3 Pa升高到13.0×10-3 Pa时,SiO2 薄膜中的应力由-223.5 MPa变为20.4 MPa。通过对薄膜折射率的测量,发现薄膜的堆积密度随沉积条件的改变也发生了规律性的变化。应力的变化主要是由于沉积时蒸发粒子的动能不同,导致薄膜结构不同引起的。同时,在样品的存放过程中,发现随着存放时间的延长,薄膜中的应力表现出了由压应力状态向张应力状态演变的趋势。     

Effect of O2 gas partial pressure on structures and dielectric characteristics of rf sputtered ZrO2 thin films

Amorphous and polycrystalline zirconium oxide thin films have been deposited by reactive rf magnetron sputtering in a mixed argon/oxygen or pure oxygen atmosphere with no intentional heating of the substrate. The films were characterized by high-resolution transmission electron microscopy (HR-TEM), atomic force microscopy (AFM), spectroscopic ellipsometry (SE), and capacitance versus voltage (C-V) measurements to investigate the variation of structure, surface morphology, thickness of SiO₂-like interfacial layer as well as dielectric characteristics with different oxygen partial pressures. The films deposited at low oxygen partial pressures (less than 15%) are amorphous and dense with a smooth surface. In contrast, the films prepared at an oxygen partial pressure higher than 73% are crystallized with the microstructure changing from the mixture of monoclinic and tetragonal phases to a single monoclinic structure. The film structural transition is believed to be consequences of decrease in the oxygen vacancy concentration in the film and of increase of the energetically neutral particles in the plasma due to an increased oxygen partial pressure. SE measurements showed that significant interfacial SiO₂ growth has taken place above approximately 51%. The best C-V results in terms of relative dielectric constant values are obtained for thin films prepared at an oxygen partial pressure of 15%.