CMOS器件60Coγ射线、电子和质子电离辐射损伤比较

利用TRIM95蒙特卡罗软件计算了质子在二氧化硅中的质量阻止本领和能量沉积,比较了质子在二氧化硅中的电离阻止本领与核阻止本领,分析了质子在材料的表面吸收剂量与灵敏区实际吸收剂量的关系.利用60Coγ射线、1MeV电子和2-9 MeV质子对CC4007RH和CC4011器件进行辐照实验,比较60Coγ射线和带电粒子的电离辐射损伤情况.实验结果表明,60Coγ射线、1MeV电子和2-7MeV质子辐照损伤效应中,在0V栅压下可以相互等效;在5V栅压下,以60Coγ射线损伤最为严重,1MeV电子的辐射损伤与60Coγ射线差别不大,9MeV以下质子辐射损伤总是小于60Coγ射线,能量越低,损伤越小.     

CMOS器件60Co γ射线、电子和质子电离辐射损伤比较

利用TRIM95蒙特卡罗软件计算了质子在二氧化硅中的质量阻止本领和能量沉积，比较了质子在二氧化硅中的电离阻止本领与核阻止本领，分析了质子在材料的表面吸收剂量与灵敏区实际吸收剂量的关系.利用⁶⁰Co γ射线、1MeV电子和2—9 MeV质子对CC4007RH和CC4011器件进行辐照实验，比较⁶⁰Co γ射线和带电粒子的电离辐射损伤情况.实验结果表明，⁶⁰Co γ射线、1MeV 电子和2—7MeV质子辐照损伤效应中，在0V栅压下可以相互等效； 关键词： γ射线 电子 质子 辐射损伤     

电子辐射环境中NPN输入双极运算放大器的辐射效应和退火特性

本文对不同偏置下的NPN输入双极运算放大器LM108分别在1.8 MeV和1 MeV两种电子能量下、不同束流电子辐照环境中的损伤特性及变化规律进行了研究, 分析了不同偏置状态下其辐照敏感参数在辐照后三种温度 (室温, 100 ℃, 125 ℃) 下随时间变化的关系, 讨论了引起电参数失效的机理, 并且分析了器件在室温和高温的退火效应以讨论引起器件电参数失效的机理. 结果表明, 1.8 MeV和1 MeV 电子对运算放大器LM108主要产生电离损伤, 相同束流下1.8 MeV电子造成的损伤比1 MeV 电子更大, 相同能量下0.32 Gy(Si)/s束流电子产生的损伤大于1.53 Gy(Si)/s束流电子. 对于相同能量和束流的电子辐照, 器件零偏时的损伤大于正偏时的损伤. 器件辐照后的退火行为都与温度有较大的依赖关系, 而这种关系与辐照感生的界面态密度增长直接相关.     

3 MeV质子辐照对AlGaN/GaN高电子迁移率晶体管的影响

研究了AlGaN/GaN 高电子迁移率晶体管(HEMT)的质子辐照效应. 在3 MeV质子辐照下, 当辐照剂量达到1× 10¹⁵ protons/cm²时, 漏极饱和电流下降了20%, 最大跨导降低了5%. 随着剂量增加, 阈值电压向正向漂移, 栅泄露电流增加. 在相同辐照剂量下, 1.8 MeV质子辐照要比3 MeV质子辐照退化严重. 从SRIM软件仿真中得到不同能量质子在AlGaN/GaN异质结中的辐射损伤区, 以及在一定深度形成的空位密度. 结合变频C-V测试结果进行分析, 表明了质子辐照引入空位缺陷可能是AlGaN/GaN HEMT器件电学特性退化的主要原因.     

增强型Cascode结构氮化镓功率器件的高能质子辐射效应研究

针对增强型共栅共源(Cascode)级联结构和耗尽型AlGaN/GaN功率器件,利用60 MeV能量质子开展辐射效应研究.获得了经质子辐照后器件电学性能的退化规律,并与常规耗尽型HEMTs器件辐照后的电学性能进行了比较,发现增强型Cascode结构器件对质子辐照更加敏感,分析认为级联硅基MOS管的存在是其对质子辐照敏感的主要原因.质子辐照使硅基MOS管栅氧化层产生大量净的正电荷,诱导发生电离损伤效应,使其出现阈值电压负向漂移及栅泄漏电流增大等现象.利用等效(60 MeV能量质子,累积注量1×10¹² p/cm²)剂量的⁶⁰Co γ射线辐射器件得到电离损伤效应结果,发现器件的电学性能退化规律与60 MeV能量质子辐照后的退化规律一致.通过蒙特卡罗模拟得到质子入射在Cascode型器件内诱导产生的电离能损和非电离能损,模拟结果表明电离能损是导致器件性能退化的主要原因.     

质子在碳化硅中不同深度的非电离能量损失

利用蒙特卡罗方法,应用Geant4程序,模拟计算了1—500 MeV质子在碳化硅材料中的非电离能量损失,并研究了不同种类的初级反冲原子对非电离能量损失的贡献.模拟结果表明:在相同质子辐照下,碳化硅材料中的非电离能量损失要比硅、镓等半导体材料更小,说明碳化硅器件的稳定性更好,抗位移损伤能力更强;当靶材料足够厚时,在不同能量质子辐照下,材料损伤最严重的区域会随着质子入射能量的增加从质子射程末端逐渐前移到材料表面;不同种类的初级反冲原子对非电离能量损失的贡献表明,在低能质子辐照下,28Si和~(12)C是位移损伤的主要原因,而随着质子能量的增加,通过核反应等过程产生的次级离子迅速增多,并对材料浅层造成严重的位移损伤.     

多量子阱激光二极管质子辐射效应及其退火特性

 研究5和2 MeV质子对法布里-珀罗（FP）腔结构及分布反馈（DFB）结构的多量子阱激光二极管的辐射效应,结果显示：在5×10¹²～5×10¹³ cm^-2质子注量范围内,随着注量的增大,激光二极管阈值电流逐渐增大,电流-电压特性的低压区电流渐渐增大。由60Coγ总剂量实验结果推断:质子对实验器件的损伤源于质子位移效应。采用Trim程序的模拟结果表明：在2 MeV质子射程以内,2 MeV质子要比5 MeV质子产生的空位数多。这使得相同辐照注量下,2 MeV质子要比5 MeV质子导致的阈值电流增大更多,损伤更为严重。激光二极管辐射损伤存在着正向偏置退火效应,FP和DFB结构的二极管具有相似的加电退火规律,均可拟合成指数衰减形式,退火曲线可以分成退火常数不同的几段进行拟合。正向偏置退火效应使得辐照期间,处于加电状态的激光二极管比处于短路状态的激光二极管退化程度有所减弱。     

氦原子与氯离子碰撞过程中电子损失的研究

反冲离子飞行时间-散射离子位置灵敏符合技术及多参数获取系统测量了2 MeV～8 MeV的氯离子撞击氦原子,伴随氯离子电子损失过程氦的双、单重电离相对截面比;及氦原子被电离伴随的氯离子的双、单电子损失相对截面比.对测量结果进行了分析讨论.     

NMOS器件不同剂量率γ射线辐射响应的理论预估

介绍了利用线性响应理论预估CC4007-NMOS器件在剂量率01，23，44和91rad(Si)/s下的辐射损伤情况，理论预估值和试验结果符合得比较好.利用线性响应理论预估了CC4007-NMOS器件从低剂量率到高剂量率环境下的辐射损伤及25℃长时间退火情况，结果表明，在相同偏压下，高剂量率辐照加室温退火所引起的阈值电压漂移量在误差容许的范围内等于低剂量率辐照的漂移量，两者总的时间相同.利用线性响应理论预估CC4007-NMOS器件在不同剂量率辐照下的失效剂量.     

国产星用VDMOS器件总剂量辐射损伤效应研究

研究了两种国产星用VDMOS器件在不同偏置条件下的总剂量辐射损伤效应, 探讨了器件的阈值电压、击穿电压、导通电阻、漏电流等电参数随累积剂量、退火时间的变化关系. 实验结果表明这两种国产星用VDMOS器件辐照后电参数符合技术指标, 满足在复杂空间电离辐射环境下工作的要求.此外, 通过对器件在不同偏置条件下的总剂量辐射损伤效应进行研究, 对其他型号星用VDMOS器件工艺和设计的进一步改进, 具有参考作用.     

A comparison of ionizing radiation damage in CMOS devices from 60Co gamma rays, electrons and protons

Radiation hardened CC4007RH and non-radiation hardened CC4011 devices were irradiated using 80Co gamma rays, 1 MeV electrons and 1--9 MeV protons to compare the ionizing radiation damage of the gamma rays with the charged particles. For all devices examined, with experimental uncertainty, the radiation induced threshold voltage shifts (△Vth) generated by 60Co gamma rays are equal to that of 1 MeV electron and 1-7 MeV proton radiation under 0 gate bias condition. Under 5 V gate bias condition, the distinction of threshold voltage shifts (△Vth) generated by 60Co gamma rays and 1 MeV electrons irradiation are not large, and the radiation damage for protons below 9 MeV is always less than that of 60Co gamma rays. The lower energy the proton has, the less serious the radiation damage becomes.     

Degradation mechanisms of current gain in NPN transistors

An investigation of ionization and displacement damage in silicon NPN bipolar junction transistors (BJTs) is presented. The transistors were irradiated separately with 90-keV electrons, 3-MeV protons and 40-MeV Br ions. Key parameters were measured {\em in-situ} and the change in current gain of the NPN BJTS was obtained at a fixed collector current (I_{\rm c}=1~mA). To characterise the radiation damage of NPN BJTs, the ionizing dose D_{\i} and displacement dose D_{\d} as functions of chip depth in the NPN BJTs were calculated using the SRIM and Geant4 code for protons, electrons and Br ions, respectively. Based on the discussion of the radiation damage equation for current gain, it is clear that the current gain degradation of the NPN BJTs is sensitive to both ionization and displacement damage. The degradation mechanism of the current gain is related to the ratio of D_{\rm d}/(D_{\rm d}+D_{\rm i}) in the sensitive region given by charged particles. The irradiation particles leading to lower D_{\rm d}/(D_{\rm d}+D_{\rm i}) within the same chip depth at a given total dose would mainly produce ionization damage to the NPN BJTs. On the other hand, the charged particles causing larger D_{\rm d}/(D_{\rm d}+D_{\rm i}) at a given total dose would tend to generate displacement damage to the NPN BJTs. The Messenger--Spratt equation could be used to describe the experimental data for the latter case.     

超深亚微米互补金属氧化物半导体器件的剂量率效应

对0.18 μm互补金属氧化物半导体(CMOS)工艺的N型金属氧化物半导体场效应晶体管(NMOSFET)及静态随机存储器(SRAM)开展了不同剂量率下的电离总剂量辐照试验研究. 结果表明: 在相同累积剂量, SRAM的低剂量率辐照损伤要略大于高剂量率辐照的损伤, 并且低剂量率辐照损伤要远大于高剂量率辐照加与低剂量率辐照时间相同的室温退火后的损伤. 虽然NMOSFET 低剂量率辐照损伤略小于高剂量率辐照损伤, 但室温退火后, 高剂量率辐照损伤同样要远小于低剂量率辐照损伤. 研究结果表明0.18 μm CMOS工艺器件的辐射损伤不是时间相关效应. 利用数值模拟的方法提出了解释CMOS器件剂量率效应的理论模型.     

Radiation effects on MOS and bipolar devices by 8 MeV protons, 60 MeV Br ions and 1 MeV electrons

The radiation effects of the metal-oxide-semiconductor (MOS) and the bipolar devices are characterised using 8~MeV protons, 60~MeV Br ions and 1~MeV electrons. Key parameters are measured {\it in-situ} and compared for the devices. The ionising and nonionising energy losses of incident particles are calculated using the Geant4 and the stopping and range of ions in matter code. The results of the experiment and energy loss calculation for different particles show that different incident particles may give different contribution to MOS and bipolar devices. The irradiation particles, which cause larger displacement dose within the same chip depth of bipolar devices at a given total dose, would generate more severe damage to the voltage parameters of the bipolar devices. On the contrary, the irradiation particles, which cause larger ionising damage in the gate oxide, would generate more severe damage to MOS devices. In this investigation, we attempt to analyse the sensitivity to radiation damage of the different parameter of the MOS and bipolar devices by comparing the irradiation experimental data and the calculated results using Geant4 and SRIM code.     

基于4晶体管像素结构的互补金属氧化物半导体图像传感器总剂量辐射效应研究

对基于4晶体管像素结构互补金属氧化物半导体图像传感器的电离总剂量效应进行了研究,着重分析了器件的满阱容量和暗电流随总剂量退化的物理机理.实验的总剂量为200 krad(Si),测试点分别为30 krad(Si),100 krad(Si),150 krad(Si)和200 krad(Si),剂量率为50 rad(Si)/s.实验结果发现随着辐照总剂量的增加,器件的满阱容量下降并且暗电流显著增加.其中辐照使得传输门沟道掺杂分布发生改变是满阱容量下降的主要原因,而暗电流退化则主要来自于浅槽隔离界面缺陷产生电流和传输门-光电二极管交叠区产生电流.实验还表明样品器件的转换增益在辐照前后未发生明显变化,并且与3晶体管像素结构不同,4晶体管像素结构的互补金属氧化物半导体图像传感器没有显著的总剂量辐照偏置效应.     

Analysis of proton and γ-ray radiation effects on CMOS active pixel sensors

Radiation effects on complementary metal-oxide-semiconductor(CMOS) active pixel sensors(APS) induced by proton and γ-ray are presented. The samples are manufactured with the standards of 0.35 μm CMOS technology. Two samples have been irradiated un-biased by 23 MeV protons with fluences of 1.43 × 10~(11) protons/cm~2 and 2.14 × 10~(11) protons/cm~2,respectively, while another sample has been exposed un-biased to 65 krad(Si) ~(60)Co γ-ray. The influences of radiation on the dark current, fixed-pattern noise under illumination, quantum efficiency, and conversion gain of the samples are investigated. The dark current, which increases drastically, is obtained by the theory based on thermal generation and the trap induced upon the irradiation. Both γ-ray and proton irradiation increase the non-uniformity of the signal, but the nonuniformity induced by protons is even worse. The degradation mechanisms of CMOS APS image sensors are analyzed,especially for the interaction induced by proton displacement damage and total ion dose(TID) damage.     

质子辐射下互补金属氧化物半导体有源像素传感器暗信号退化机理研究

对某国产0.5 μm工艺制造的互补金属氧化物半导体有源像素传感器进行了10 MeV质子辐射试验, 当辐射注量达到预定注量点时, 采用离线的测试方法, 定量测试了器件暗信号的变化情况. 试验结果表明, 随着辐射注量的增加暗信号迅速增大. 采用MULASSIS (multi-layered shielding simulation software)软件计算了电离损伤剂量和位移损伤剂量, 在与γ辐射试验数据对比的基础上, 结合器件结构和工艺参数, 建立了分离质子辐射引起的电离效应和位移效应理论模型, 深入分析了器件暗信号的退化机理. 研究结果表明, 对该国产器件而言, 电离效应导致的表面暗信号和位移效应导致的体暗信号对整个器件暗信号退化的贡献大致相当.     

Comparison of radiation degradation induced by x-ray and 3-MeV protons in 65-nm CMOS transistors

The total ionizing dose(TID) response of 65-nm CMOS transistors is studied by 10-ke V x-ray and 3-Me V protons up to 1 Grad(SiO_2) total dose.The degradation levels induced by the two radiation sources are different to some extent.The main reason is the interface dose enhancement due to the thin gate oxide and the low energy photons.The holes' recombination also contributes to the difference.Compared to these two mechanisms,the influence of the dose rate is negligible.