0.18 μm部分耗尽绝缘体上硅互补金属氧化物半导体电路单粒子瞬态特性研究

利用脉冲激光入射技术研究100级0.18 μm部分耗尽绝缘体上硅互补金属氧化物半导体反相器链的单粒子瞬态效应, 分析了激光入射器件类型及入射位置对单粒子瞬态脉冲传输特性的影响. 实验结果表明, 单粒子瞬态脉冲在反相器链中的传输与激光入射位置有关, 当激光入射第100级到第2级的n型金属-氧化物-半导体器件, 得到的脉冲宽度从287.4 ps增加到427.5 ps; 当激光入射第99级到第1级的p型金属-氧化物-半导体器件, 得到的脉冲宽度从150.5 ps增加到295.9 ps. 激光入射点靠近输出则得到的瞬态波形窄; 靠近输入则得到的瞬态波形较宽, 单粒子瞬态脉冲随着反相器链的传输而展宽. 入射器件的类型对单粒子瞬态脉冲展宽无影响. 通过理论分析得到, 部分耗尽绝缘体上硅器件浮体效应导致的阈值电压迟滞是反相器链单粒子瞬态脉冲展宽的主要原因. 而示波器观察到的与预期结果幅值相反的正输出脉冲, 是输出节点电容充放电的结果.     

Effect of cryogenic temperature characteristics on 0.18-μm silicon-on-insulator devices

The experimental results of the cryogenic temperature characteristics on 0.18-μm silicon-on-insulator(SOI) metaloxide-silicon(MOS) field-effect-transistors(FETs) were presented in detail. The current and capacitance characteristics for different operating conditions ranging from 300 K to 10 K were discussed. SOI MOSFETs at cryogenic temperature exhibit improved performance, as expected. Nevertheless, operation at cryogenic temperature also demonstrates abnormal behaviors, such as the impurity freeze-out and series resistance effects. In this paper, the critical parameters of the devices were extracted with a specific method from 300 K to 10 K. Accordingly, some temperature-dependent-parameter models were created to improve fitting precision at cryogenic temperature.     

22 nm工艺超薄体全耗尽绝缘体上硅晶体管单粒子瞬态效应研究

利用计算机辅助设计技术数值仿真工具, 研究22 nm工艺技术节点下超薄体全耗尽绝缘体上硅晶体管单粒子瞬态效应, 系统地分析了掺杂地平面技术、重离子入射位置、栅功函数和衬底偏置电压对于单粒子瞬态效应的影响. 模拟结果表明, 掺杂地平面和量子效应对于单粒子瞬态效应影响很小, 重离子入射产生大量电荷, 屏蔽了初始电荷分布的差异性. 单粒子瞬态效应以及收集电荷和重离子入射位置强相关, 超薄体全耗尽绝缘体上硅最敏感的区域靠近漏端. 当栅功函数从4.3 eV变化到4.65 eV时, 单粒子瞬态电流峰值从564 μA减小到509 μA, 收集电荷从4.57 fC减小到3.97 fC. 超薄体全耗尽绝缘体上硅器件单粒子瞬态电流峰值被衬底偏置电压强烈调制, 但是收集电荷却与衬底偏置电压弱相关. 关键词： 超薄体全耗尽绝缘体上硅 单粒子瞬态效应 电荷收集 数值仿真     

用于FED和PDP平板显示高压驱动电路的CMOS器件

在Synopsys TCAD软件环境下,结合中国科学院微电子研究所0.8μm标准CMOS工艺条件对于高压CMOS器件进行了工艺和器件模拟。由于考虑到与标准CMOS工艺的兼容性,高压CMOS器件均采用LDMOS结构;根据RESURF技术,对于器件的漂移区进行了优化。器件模拟结果表明,高压NMOS器件源漏击穿电压为220 V;阈值电压和驱动能力分别为0.8 V和1×10-4A/μm。高压PMOS器件源漏击穿电压为-135 V;阈值电压和驱动能力分别为-9.7 V和1.8×10-4A/μm。高压CMOS器件的研制可为进一步研制FED和PDP平板显示高压驱动电路奠定基础。     

Estimation of pulsed laser-induced single event transient in a partially depleted silicon-on-insulator 0.18-μm MOSFET

In this paper, we investigate the single event transient(SET) occurring in partially depleted silicon-on-insulator(PDSOI) metal–oxide–semiconductor(MOS) devices irradiated by pulsed laser beams. Transient signal characteristics of a 0.18-μm single MOS device, such as SET pulse width, pulse maximum, and collected charge, are measured and analyzed at wafer level. We analyze in detail the influences of supply voltage and pulse energy on the SET characteristics of the device under test(DUT). The dependences of SET characteristics on drain-induced barrier lowering(DIBL) and the parasitic bipolar junction transistor(PBJT) are also discussed. These results provide a guide for radiation-hardened deep sub-micrometer PDSOI technology for space electronics applications.     

半导体家族(二)

<正>4.半导体器件家族半导体器件同样是种类繁多、神通广大、各显其能,其族谱如图15所示。在半导体器件中贡献最突出的当属双极晶体管(BJT)和金属-氧化物-半导体场效应晶体管(MOSFET)。他们既可以以分立器件的形式单独成为产品实用,也可以作为构成集成电路的基本器件。4.1分立器件半导体分立器件包括具有整流作用的二级管(Diode),可作为开关或线性放大应用的BJT、MOSFET、结型场效应晶体管(JFET)、垂直双扩散场     

A snapback-free TOL-RC-LIGBT with vertical P-collector and N-buffer design

A reverse-conducting lateral insulated-gate bipolar transistor(RC-LIGBT) with a trench oxide layer(TOL), featuring a vertical N-buffer and P-collector is proposed. Firstly, the TOL enhances both of the surface and bulk electric fields of the N-drift region, thus the breakdown voltage(BV) is improved. Secondly, the vertical N-buffer layer increases the voltage drop VPNof the P-collector/N-buffer junction, thus the snapback is suppressed. Thirdly, the P-body and the vertical N-buffer act as the anode and the cathode, respectively, to conduct the reverse current, thus the inner diode is integrated. As shown by the simulation results, the proposed RC-LIGBT exhibits trapezoidal electric field distribution with BV of 342.4 V, which is increased by nearly 340% compared to the conventional RC-LIGBT with triangular electric fields of 100.2 V. Moreover,the snapback is eliminated by the vertical N-buffer layer design, thus the reliability of the device is improved.     

高温对MOSFET ESD防护器件维持特性的影响

静电放电(electro-static discharge, ESD)防护结构的维持电压是决定器件抗闩锁性能的关键参数,但ESD器件参数的热致变化使得防护器件在高温环境中有闩锁风险.本文研究了ESD防护结构N沟道金属-氧化物-半导体(N-channel metal oxide semiconductor, NMOS)在30—195℃的工作温度下的维持特性.研究基于0.18μm部分耗尽绝缘体上硅工艺下制备的NMOS器件展开.在不同的工作温度下,使用传输线脉冲测试系统测试器件的ESD特性.实验结果表明,随着温度的升高,器件的维持电压降低.通过半导体工艺及器件模拟工具进行二维建模及仿真,提取并分析不同温度下器件的电势、电流密度、静电场、载流子注入浓度等物理参数的分布差异.通过研究以上影响维持电压的关键参数随温度的变化规律,对维持电压温度特性的内在作用机制进行了详细讨论,并提出了改善维持电压温度特性的方法.     

Evolution of optical properties and molecular structure of PCBM films under proton irradiation

Low-energy proton irradiation effects on the optical properties and the molecular structure of phenyl-C₆₁-butyric acid methyl ester (PCBM) are studied in this work. The PCBM films are irradiated by 100-keV proton beams with fluences of 5×10¹² p/cm², 5×10¹³ p/cm², and 5×10¹⁴ p/cm², respectively. The photoluminescence (PL) peaks of the post-irradiated PCBM films show a progressive decrease in the peak intensity as the proton fluences increase, which can be attributed to the deep defect levels induced by proton irradiation. Additionally, a slight blue-shift in the PL spectrum is also observed at a proton fluence of 5×10¹⁴ p/cm². The underlying mechanism can be traced back to the lift of the lowest unoccupied molecular orbital (LUMO) level, which is caused by the attachment of methoxy radicals on ortho position of the phenyl ring in the post-irradiated PCBM structure. This work is of significance in understanding the radiation hardness and the damage mechanism of the PCBM film in radiation environments, which is essential before it is put into practical application in space.     

A 4H-SiC merged P-I-N Schottky with floating back-to-back diode

A novel 4H-SiC merged P-I-N Schottky (MPS) with floating back-to-back diode (FBD), named FBD-MPS, is proposed and investigated by the Sentaurus technology computer-aided design (TCAD) and analytical model. The FBD features a trench oxide and floating P-shield, which is inserted between the P+/N-(PN) junction and Schottky junction to eliminate the shorted anode effect. The FBD is formed by the N-drift/P-shield/N-drift and it separates the PN and Schottky active region independently. The FBD reduces not only the V_turn to suppress the snapback effect but also the V_on at bipolar operation. The results show that the snapback can be completely eliminated, and the maximum electric field (E_max) is shifted from the Schottky junction to the FBD in the breakdown state.