离子束增强沉积制备p型氧化锌薄膜及其机理研究

采用离子束增强沉积方法在Si和SiO₂/Si衬底上制备In-N共掺杂ZnO薄膜(INZO)，溅射靶是用ZnO和2 atm% In₂O₃粉体均匀混合并压制而成，在氩离子溅射ZnO靶的同时，氮、氩混合离子束垂直注入沉积的薄膜.实验结果显示INZO薄膜具有(002)的择优取向，并且为p型导电，电阻率最低为0.9Ωcm.薄膜在氮气、氧气气氛下退火，对薄膜的结构和电学特性与成膜和退火条件的关系进行了分析. 关键词： 氧化锌薄膜 p型掺杂 离子束增强沉积     

阴极电沉积ZnO薄膜的取向控制生长

采用阴极电沉积法,在Zn(NO3)2水溶液中,以304不锈钢为衬底制备了ZnO薄膜,研究了Zn2+浓度和电流密度对ZnO薄膜择优取向的影响规律。XRD结果表明:随着Zn2+浓度和电流密度增大,ZnO薄膜逐渐由(002)面择优取向生长转变为(101)面择优取向生长;当Zn2+浓度为0.005mol.L-1、电流密度为2.0mA.cm-2或Zn2+浓度为0.05mol.L-1、电流密度为0.5mA.cm-2时,可以得到(002)面择优取向生长的ZnO薄膜;当Zn2+浓度为0.05mol.L-1、电流密度为2.0mA.cm-2时,可以得到(101)面择优取向生长的ZnO薄膜。根据二维晶核理论,通过分析不同生长条件下的过饱和度及其对ZnO的(002)型和(101)型二维晶核形核活化能的影响,对这一规律进行了解释。可见,通过改变Zn2+浓度和电流密度能够实现阴极电沉积ZnO薄膜的取向可控生长。     

ZnO薄膜的制备和结构特性及应变

在SiO₂/Si衬底上面,利用射频磁控溅射方法,在不同的工艺条件下生长ZnO薄膜,然后进行热处理(600～1000℃退火).研究了氩氧比和退火温度对薄膜结晶性能的影响.薄膜的表面结构和晶体特性通过扫描电子显微镜(SEM)、X射线衍射(XRD)来进行表征.结果表明:所制备的薄膜为多晶纤锌矿结构,具有垂直于衬底的c轴(002)方向的择优取向性.热处理可使ZnO(002)衍射峰相对强度增强,半峰全宽(FWHM)变小,即退火使c轴生长的薄膜取向性增强.未经退火的ZnO薄膜存在张应力,经过热处理后应力发生改变,最后变成压应力,并且随着退火温度的升高,压应力逐渐增大.     

退火对ZnO薄膜光学特性的影响

用射频磁控溅射法在蓝宝石衬底上制备出ZnO薄膜,通过X射线衍射(XRD)、扫描电镜(SEM)和光致发光(PL)谱等研究了退火温度对ZnO薄膜结构和光学性质的影响。测量结果显示,所制备的ZnO薄膜为六角纤锌矿结构,具有沿c轴的择优取向;随着退火温度的升高,(002)XRD峰强度和平均晶粒尺寸增大,(002)XRD峰半高宽(FWHM)减小,光致发光紫外峰强度增强。结果证明,用射频磁控溅射法通过适当控制退火温度可得到高质量ZnO薄膜。     

Co,Sn共掺ZnO薄膜结构与光致发光的研究

采用溶胶-凝胶旋涂法在玻璃衬底上制备了Co,Sn掺杂ZnO系列薄膜.通过金相显微镜和X射线衍射(XRD)研究了Co与Sn掺杂对薄膜的表面形貌和微结构的影响.XRD结果表明,所有ZnO薄膜样品都存在(002)择优取向,特别Sn单掺ZnO薄膜的c轴择优取向最为显著,而且晶粒尺寸最大.XPS测试表明样品中Co和Sn的价态分别为2+和4+,证实Co²⁺,Sn⁴⁺进入了ZnO的晶格.室温光致发光谱(PL)显示在所有的样品中都有较强的蓝光双峰发射和较弱的绿光发 关键词： ZnO薄膜 溶胶-凝胶 掺杂 光致发光     

不同参数溅射的ZnO薄膜硫化后的特性

采用直流反应磁控溅射法在玻璃和石英衬底上沉积了ZnO薄膜, 然后将它们在H^２S气流中 硫化得到ZnS薄膜．用x射线粉末衍射仪(XRD)、扫描电子显微镜(SEM)和UV-VIS透过光谱对Zn S薄膜样品进行了分析．结果表明, 该ZnS薄膜为六角晶体结构, 沿(002)晶面择优取向生长, 其结晶状态和透过光谱与工作气压、Ar/O^２流量比密切相关. 当气压高于1Pa 时, 得 到厚度很小的ZnS薄膜; 而气压低于1Pa时, 沉积的ZnO薄膜则不能全部反应生成ZnS. 另外, 当Ar/O^２流量比低于4∶1或高于4∶1时, 结晶状态都会变差. 此外, 由于ZnS薄 膜具有高 的沿(002)晶面择优取向的生长特性, 使得退火或未退火ZnO薄膜硫化后的晶粒尺寸变化很小 . 关键词： ZnS薄膜 磁控溅射 ZnO硫化 太阳电池     

MSM结构ZnO/Cu薄膜的接触特性

利用脉冲激光沉积(PLD)法在Si(111)衬底上分别生长了ZnO薄膜和Cu薄膜, 用Cu薄膜作电极,研究了ZnO薄膜与Cu薄膜的接触特性。分别用X射线衍射仪、扫描电子显微镜和I-V测试的方法对样品的晶体质量、结构和电学性质进行了测试。结果表明:样品中ZnO薄膜和Cu薄膜均具有高度的择优取向;当Cu和 ZnO直接接触时,样品的I-V特性是非线性的;当Cu和 ZnO之间通过ZnO:Cu层间接接触时形成良好的欧姆接触,而且退火后欧姆接触性能明显提高,电阻率降低约2/3。本研究为价格低廉的Cu电极成为ZnO基器件的欧姆电极提供了一定的依据。     

脉冲激光沉积(PLD)法生长高质量ZnO薄膜及其发光性能

采用脉冲激光沉积(PLD)法在单晶Si(100)衬底上生长ZnO薄膜,以X射线衍射(XRD)、原子力显微镜(AFM)和透射电镜(TEM)等手段分析了所得ZnO薄膜的晶体结构和微观形貌。优化工艺(700℃,20Pa)下生长的ZnO薄膜呈c轴高度择优取向,柱状晶垂直衬底表面生长,结构致密均匀。室温光致发光(PL)谱分析结果表明,随着薄膜生长时O₂分压的增大,近带边紫外发光峰与深能级发光峰之比显著增强,表明薄膜的结晶性能和化学计量比都有了很大的改善。O₂分压为20Pa时所生长的ZnO薄膜具有较理想的化学计量比和较高的光学质量。     

籽晶层对喷雾热分解法生长ZnO薄膜结晶质量和光电性能的影响

通过脉冲激光沉积(PLD)方法在Si(100)衬底上沉积一层高质量的ZnO籽晶层,在籽晶层上进一步采用超声喷雾热分解(USP)法生长ZnO薄膜,研究了籽晶层对ZnO薄膜结晶质量和ZnO/Si异质结光电特性的影响。研究结果表明,在籽晶层的诱导作用下,USP法生长ZnO薄膜由多取向结构变为(002)单一取向,结晶性能得到了显著改善;籽晶层上生长的薄膜呈现出垂直于衬底生长的柱状晶结构,微观结构更加致密。通过研究紫外光照前后ZnO/Si异质结的整流特性,发现引入籽晶层后,反向偏压下异质结的光电响应显著增加,并且在开路状态下出现明显的光伏效应。     

退火对ZnO薄膜晶体结构和ZnO/p-Si异质结光电性质的影响

采用脉冲激光沉积方法在p-Si(100)衬底卜牛长ZnO薄膜,分别在500℃、600℃和700℃下真空退火,采用X射线衍射仪研究了退火对ZnO薄膜品体结构的影响,并测量了ZnO的面电阻和ZnO/p-Si异质结的、I-V特性曲线.研究表明,随着退火温度的升高,ZnO的(002)衍射峰强度逐渐增大,半峰全宽不断减小,同时薄膜内应力减小,ZnO晶粒尺寸变大.表明高温退火有助于ZnO薄膜结晶质量的提高.在没有光照的条件下,异质结的漏电流随退火温度的增加而增大;用650 nm光照射样品时,600℃退火的样品表现出最明显的光电效应,而过高的退火温度会破坏ZnO/p-Si异质结的界面结构,使其光电流变小.所以,要得到性能良好的光电器件,应选取适当的退火温度.     

离子注入ZnO薄膜的拉曼光谱研究

室温下,用80 keV N⁺和400 keV Xe⁺离子注入ZnO薄膜,注入剂量分别为5.0×10¹⁴—1.0×10¹⁷/cm²和2.0×10¹⁴—5.0×10¹⁵/cm².利用拉曼散射技术对注入前后的ZnO薄膜进行光谱测量和分析,研究了样品的拉曼光谱随离子注入剂量的变化规律.实验结果发现,未进行离子注入的样品在99,435 cm<     

快重离子辐照引起Ni/SiO2界面原子混合及相变研究

在室温下用308 MeV的Xe离子和853 MeV的Pb离子辐照Ni/SiO2样品, 用卢瑟福背散射和X射线衍射技术对样品进行了分析。 通过分析Ni/SiO2样品中元素成分分布和结构随离子辐照剂量和电子能损的变化, 探索了离子辐照在Ni/SiO2样品中引起的界面原子混合与结构相变现象。 实验结果显示, Xe和Pb离子辐照均能引起明显的Ni原子向SiO2基体的扩散并导致界面附近Ni, Si和O原子的混合。 实验观测到低剂量Xe离子辐照可产生NiSi2相, 而高剂量Xe离子辐照则导致了Ni3Si和NiO相的形成。 根据热峰模型, Ni原子的扩散和新相的形成可能由沿离子入射路径强电子激发引起的瞬间热峰过程驱动。Ni/SiO2 interface were irradiated at room temperature with 308 MeV Xe ions to 1×1012, 5×1012 Xe/cm2 and 853 MeV Pb ions to 5×1011 Pb/cm2, respectively. These samples were analyzed using Rutherford Backscattering Spectrometry (RBS) and X ray diffraction spectroscopy (XRD), from which the intermixing and phase change were investigated. The obtained results show that both Xe and Pb ions could induce diffusion of Ni atoms to SiO2 substrates and result in intermixing of Ni with SiO2. Furthermore, 1.0×1012 Xe/cm2 irradiation induced the formation of NiSi2 and 5.0×1012 Xe/cm2 irradiation created Ni3Si and NiO phases. The diffusion of Ni atoms and the formation of new phase may be driven by a transient thermal spike process induced by the intense electronic energy loss along the incident ion path.     

单晶YSZ的Xe+辐照损伤的电子显微分析

 不同注量200keV Xe⁺ 注入YSZ单晶样品的电子显微分析结果表明，随着辐照注量的增加，缺陷簇的密度增大，在1×10¹⁵~1×10¹⁶cm^-2Xe⁺注量，缺陷簇密度迅速增大，形成间隙型位错环；当Xe⁺注量增大到1×10¹⁷cm^-2，缺陷簇密度的增加变得缓慢，并且有直径为2～4nm的Xe气泡析出。选区电子衍射花样表明YSZ样品没有产生非晶化转变。在Xe⁺辐照的离位率高达约350dpa的情况下，YSZ晶体没有非晶化，其原因主要是由于注入的Xe⁺以气泡形式析出。     

VIOLET LIGHT-EMISSION FROM Ge+-IMPLANTED SiO2 FILMS ON Si SUBSTRATE

Germanium ions were implanted into SiO₂ films which were thermally grown on crystalline Si at an energy of 60 keV and with doses of 1×10¹⁵ and 1×10¹⁶ cm^-2.Under an ultraviolet excitation of ～5.0 eV,the implanted f ilms annealed at various temperatures exhibit intense violet luminescence with a peak at 396 nm.It is ascribed to the T₁→S₀ transition in GeO,which was formed during implantation and annealing process.     

Implanted ZnO thin films: Microstructure, electrical and electronic properties

Magnetron sputtered polycrystalline ZnO thin films were implanted using Al, Ag, Sn, Sb and codoped with TiN in order to improve the conductivity and to attempt to achieve p-type behaviour. Structural and electrical properties of the implanted ZnO thin films were examined with X-ray diffractometry (XRD), scanning electron microscopy (SEM), secondary ion mass spectrometry (SIMS), atomic force microscopy (AFM) and conductivity measurements. Depth profiles of the implanted elements varied with the implant species. Implantation causes a partial amorphisation of the crystalline structure and decreases the effective grain size of the films. One of the findings is the improvement, as a consequence of implantation, in the conductivity of initially poorly conductive samples. Heavy doping may help for the conversion of conduction type of ZnO thin films. Annealing in vacuum mitigated structural damage and stress caused by implantation, and improved the conductivity of the implanted ZnO thin films.     

Room temperature magnetic properties of Fe and C implanted ZnO films

ZnO films prepared by radio frequency magnetron sputtering were singly or sequentially implanted with 120 keV Fe ions at a fluence of 5 × 10¹⁶ ions/cm² and 20 keV C ions at a fluence of 3 × 10¹⁵ ions/cm². Magnetic and optical properties as well as structures of the films have been investigated using various techniques. Magnetic measurements show that the as-deposited ZnO film presents room temperature ferromagnetism. Single Fe or C ion implantation has no contribution to enhancement in the film magnetism, while magnetic moment increases distinctly in the Fe and C ions sequentially implanted film. Results from structural measurements reveal that Fe nanoparticles are formed in the Fe singly implanted ZnO film. The post C implantation induces dissolution of Fe nanoparticles and promotes Fe atoms to substitute Zn atoms in the lattice. Based on the structural results, the effect of magnetic enhancement has been tentatively interpreted.     

94MeV Xe离子辐照引起的薄膜硅光学带隙变化研究

室温下,用94MeV的Xe离子辐照纳米晶和非晶硅薄膜以及单晶硅样品,辐照量分别为1.0×1011,1.0×1012和1.0×1013ions/cm2。所有样品均在室温下用UV/VIS/NIR光谱仪进行检测分析。通过对比研究了纳米晶、非晶、单晶硅样品的光学带隙随Xe离子辐照量的变化。结果表明,不同结构的硅材料中Xe离子辐照引起的光学带隙变化规律差异显著:随着Xe离子辐照量的增加,单晶硅的光学带隙基本不变,非晶硅薄膜的光学带隙由初始的约1.78eV逐渐减小到约1.54eV,而纳米晶硅薄膜的光学带隙则由初始的约1.50eV快速增大至约1.81eV,然后再减小至约1.67eV。对硅材料结构影响辐照效应的机理进行了初步探讨。     

Cl/HN3/I2全气相化学激光体系的化学动力学模拟计算

 对Cl/HN₃/I₂产生NCl(a)/I激光的过程进行了化学动力学计算，主要考察了Cl,HN₃和I₂的初始粒子数密度及其配比对小信号增益系数的影响。结果发现,当温度为400K, 初始Cl粒子数密度为1×10¹⁵，1×10¹⁶和1×10¹⁷cm^-3时,小信号增益系数分别达到1.6×10^-4,1.1×10^-3和1.1×10^-2cm^-1，获得最佳小信号增益系数的HN₃和I₂的初始粒子数密度分别为初始Cl粒子数密度的1～2倍和2%～4%。同时，对Cl，HN₃和I₂配比对小信号增益系数和增益持续时间的影响进行了讨论。     

离子注入/辐照引起Al2O3单晶的改性研究

600K温度下用110keV的He^＋,Ne^＋,Ar^＋离子注入及320K温度下用230MeV的^208Pb^27＋辐照Al2O3单晶样品,研究了离子注入和辐照对Al2O3单晶样品结构和光学特性的影响。从测得的光致发光谱可以清楚地看到,所有样品在波长为375,413和450nm处出现了强的发光峰。且所有5×10^16ion／cm^2注入样品的发光峰均最强。经过高能Pb辐照后的样品,在390nm处出现了新的发光峰。透射电镜分析发现在注入氖样品100nm入射深度以内形成了高浓度的小空洞（1-2nm）,在Ne沉积区域有少量大空洞形成。傅立叶变换红外光谱分析发现,波数在460-510cm^-1间的振动吸收带经过离子辐照后展宽,随着辐照量的增大,该振动吸收强度显著减弱。1000—1300cm^-1对应Al-O-Al桥氧伸缩振动模式的吸收带,辐照后向高波数方向移动。对离子注入和辐照对Al2O3单晶样品结构损伤机理进行了初步探讨。Single crystal sapphire （Al2O3 ） samples were implanted at 600 K by He, Ne and Ar ions with energy of 110 keV to doses ranging from 5 × 10^16 to 2× 10^17 ion/cm^2 or irradiated at 320 K by ^208Pb^27＋ ion with energy of 1.1 MeV/u to the fluences ranging from 1 × 10^12 to 5 × 10^14 ion/cm^2. The modification of structure and optical properties induced by ion implantation or irradiation were analyzed by using photoluminescence（PL） and Fourier transformation infrared spectrum（FIR） spectra and transmission electron microscopy（ TEM ） measurements. The PL measurements showed that absorption peaks located at 375,413 and 450 nm appeared in all the implanted or irradiated samples, the PL intensities reached up to the maximum for the 5 × 10^16 ion/cm^2 implanted samples. After Pb-ion irradiation, a new peak located at 390 nm formed. TEM analyses showed that small size voids,（ 1--2 nm） with high density were formed in the region from the surface till to about 100 nm in depth and also large size Nebubble formed in the Ne-doped region. From the obtained FTIR spectra, it was found that Pb-ion irradiation induced broadening of the absorption band in 460-510 cm^-1 and position shift of the absorption band in 1 000- 1 300 cm^- 1 towards to high wavenumber. The possible damage mechanism in single crystal sapphire induced by energetic ion implantation or irradiation was briefly discussed.     

FORMATION OF A BURIED LAYER OF ALUMINIUM NITRIDE BY HIGH DOSE N2+ IMPLANTATION INTO ALUMINIUM

Aluminium films with various thickness between 700 nm and 1μm were deposited on Si (100) substrates, and 400 keV N₂⁺ ions with doses ranging from 4.3×10¹⁷ to 1.8×10¹⁸ N/cm² were implanted into the alu-minium films on silicon, Rutherford Backscattering (RBS) and channeling, secondary ion mass spectroscopy (SIMS), Fourier transform infrared spectra (FTIR), X-ray diffraction (XRD), transmission electron microscopy (TEM) and spreading resistance probes (SRP) were used to characterize the synthesized aluminium nitride. The experiments showed that when the implantation dose was higher than a critical dose N_c, a buried stoichiometric AlN layer with high resistance was formed, while no apparent AlN XRD peaks in the as-implanted samples were observed; however, there was a strong AlN(100) diffraction peak appearing after annealing at 500 ℃ for 1h. The computer program, Implantation of Reactive Ions into Silicon (IRIS), has been modified and used to simulate the formation of the buried AlN layer as N₂⁺ is implanted into aluminium. We find a good agreement between experimental measurements and IRIS simulation.