Influence of Vacuum Organic Contaminations on Laser-Induced Damage of 1064 nm Anti-Reflective Coatings

We investigate the influence of vacuum organic contaminations on laser-induced damage threshold （LIDT） of optical coatings. Anti-reflective （AIR） coatings at 1064 nm made by Ta2 O5/SiO2 are deposited by the ion beam sputtering method. The LIDTs of AR coatings are measured in vacuum and in atmosphere, respectively. It is exhibited that contaminations in vacuum are easily to be absorbed onto optical surface because of lower pressure, and they become origins of damage, resulting in the decrease of LIDT from 24.5J/cm^2 in air to 15.TJ/cm^2 in vacuum. The LIDT of coatings in vacuum has is slightly changed compared with the value in atmosphere after the organic contaminations are wiped off. These results indicate that organic contaminations are the main reason of the LIDT decrease in vacuum. Additionally, damage morphologies have distinct changes from vacuum to atmosphere because of the differences between the residual stress and thermal decomposability of filmy materials.     

Influence of Different Substrates on Laser Induced Damage Thresholds at 1064nm of Ta2O5 Films

Ta2O5 films are prepared on Si, BK7, fused silica, antireflection （AR） and high reflector （HR） substrates by electron beam evaporation method, respectively. Both the optical property and laser induced damage thresholds （LIDTs） at 1064 nm of Ta2O5 films on different substrates are investigated before and after annealing at 673 K for 12 h. It is shown that annealing increases the refractive index and decreases the extinction index, and improves the O/Ta ratio of the Ta2O5 films from 2.42 to 2.50. Moreover, the results show that the LIDTs of the Ta2O5 films are mainly correlated with three parameters： substrate property, substoichiometry defect in the films and impurity defect at the interface between the substrate and the films. Details of the laser induced damage models in different cases are discussed.     

Quantitative ferroelectric characterization of single submicron grains in Bi-layered perovskite thin films

The local polarization state and the electromechanical properties of ferroelectric thin films can be probed via the converse piezoelectric effect using scanning force microscopy (SFM) combined with a lock-in technique. This method, denominated as piezoresponse SFM, was used to characterize at the nanoscale level ferroelectric SrBi₂Ta₂O₉ and Bi₄Ti₃O₁₂ thin films, grown by pulsed laser deposition. Two types of samples were studied: polycrystalline films, with grains having random orientations, and epitaxial films, consisting of (100)_orth- or (110)_orth-oriented crystallites, 100 nm to 2 7m in lateral size, which are embedded into a (001)-oriented matrix. The ferroelectric domain structure was imaged and the piezoelectric response under different external conditions was locally measured for each type of sample. Different investigation procedures are described in order to study the ferroelectric properties via the electromechanical response. A distinct ferroelectric behavior was found for single grains of SrBi₂Ta₂O₉ as small as 200 nm in lateral size, as well as for 1.2 7m쏿 nm crystallites of Bi₄Ti₃O₁₂. By probing separately the crystallites and the matrix the investigations have demonstrated at the nanoscale level that SrBi₂Ta₂O₉ has no spontaneous polarization along its crystallographic c-axis, whereas Bi₄Ti₃O₁₂ exhibits a piezoelectric behavior along both the a- and c-directions. The electrostriction coefficients were estimated to be 3᎒^-2 m⁴/C² for polycrystalline SrBi₂Ta₂O₉ and 7.7᎒^-3 m⁴/C² for c-orientedBi₄Ti₃O₁₂. Quantitative measurements at the nanoscale level, within the experimental errors give the same values for remanent polarization and coercive field as macroscopic ferroelectric measurements performed on the same samples.     

Low-temperature preparation of SrxBi2+yTa2O9 ferroelectric thin film by pulsed laser deposition and its application to a metal–ferroelectric–nitride–oxide–semiconductor structure

Preferentially (105)-oriented Sr_xBi_2+yTa₂O₉ (SBT) thin films on SiN/SiO₂/p-Si(100) prepared by the pulsed laser deposition (PLD) method at a temperature as low as 400 °C, which is the lowest process temperature for growing SBT ferroelectric thin films on a silicon nitride film. Excess Bi promotes crystallization of the SBT film. A metal-ferroelectric-nitride-oxide-semiconductor (MFNOS) structure, which is very important in ferroelectric gate memory FET, has been fabricated by depositing the SBT film on silicon nitride-oxide-silicon. The MFNOS structures show capacitance-voltage (C-V) hysteresis corresponding to ferroelectric hysteresis. A memory window of the C-V hysteresis is improved, to be as high as 3.5 V in the SBT(400 nm)/SiN_x(7 nm)/SiO₂(18 nm)/Si compared with the window of 2.7 V in the SBT(400 nm)/SiO₂(27 nm)/Si (MFOS), where the thicknesses of their insulator layers are nearly the same. Little degradation is induced in the C-V characteristics of the SiN_x/SiO₂/p-Si structure when depositing the SBT film by PLD at low temperature. It is also found that the SiN_x layer acts as a diffusion barrier against component atoms in the SBT film during its deposition. Finally, the MFNOS structure prepared at the low temperature is very promising for a next-generation ferroelectric gate memory FET.     

Performance Improvement of Organic Thin Film Transistors Based on Gate Insulator Polymethyl-Methacrylate-co-Glyciclyl-Methacrylate

Organic thin transistors （OTFTs） on indium tin oxide glass substrates are prepared with polymethyl-methacrylate-co-glyciclyl-methacrylate （PMMA-GMA） as the gate insulator layer and copper phthalocyanine as the organic semiconductor layer. By controlling the thickness, the average roughness of surface is reduced and the OTFT performance is improved with leak current decreasing to 10^-11 A and on/off ratio of 10^4. Under the condition of drain-source voltage -20 V, a threshold voltage of -3.5 V is obtained. The experimental results show that PMMA-GMA is a promising insulator material with a dielectric constant in a range of 3.9-5.0.     

High-Temperature Characteristics of Ti/Al/Ni/Au Ohmic Contacts to n-GaN

We present the high-temperature characteristics of Ti/Al/Ni/Au（15 nm/220 nm/40 nm/50 nm） multiplayer contacts to n-type GaN （Nd = 3.7 × 10^17 cm^-3, Nd = 3.0 × 10^18 cm^-3）. The contact resistivity increases with the measurement temperature. Furthermore, the increasing tendency is related to doping concentration. The higher the doped, the slower the contact resistivity with decreasing measurement temperature. Ti/Al/Ni/Au ohmic contact to heavy doping n-GaN takes on better high temperature reliability. According to the analyses of XRD and AES for the n-GaN/Ti/Al/Ni/Au, the Au atoms permeate through the Ni layer which is not thick enough into the AI layer even the Ti layer.     

Pulsed-laser deposition of Ta-doped PZT ferroelectric films for memory applications using conductive oxide La0.25Sr0.75CoO3 and SrRuO3 electrodes

New methods for fabricating highly 𘚡¢-oriented and complete 𘜏¢-textured Pb(Ta_0.05Zr_0.48Ti_0.47)O₃ (PTZT) films on Pt/TiO₂/SiO₂/Si(001) substrates by pulsed-laser deposition have been developed using conductive oxide La_0.25Sr_0.75CoO₃ and SrRuO₃ electrodes. The 𘚡¢-preferred orientated PTZT ferroelectric capacitor was not subjected to loss of its polarization after 1᎒¹⁰ switching cycles at an applied voltage of 5 V and a frequency of 1 MHz, and the 𘜏¢-textured PTZT film capacitor retains 94.7% of its polarization after 1.5᎒¹⁰ switching cycles at 5 V and 50 kHz. The PTZT capacitors using these conductive oxide electrodes have low leakage current dominated by Schottky field emission mechanism.     

Design and Fabrication of Chirped Mirror

Chirped mirrors （CMs） are designed and manufactured. The optimized CM provides a group delay dispersion （ODD） of around -60fs^2 and average reflectivity of 99.4% with bandwidth 200 nm at a central wavelength of 800nm. The CM structure consists of 52 layers of alternating high refractive index Ta2O5 and low refractive index SiO2. Measurement results show that the control of CM manufacturing accuracy can meet our requirement through time control with ion beam sputtering. Because the ODD of CMs is highly sensitive to small discrepancies between the layer thickness of calculated design and those of the manufactured mirror, we analyze the error sources which result in thickness errors and refractive index inhomogeneities in film manufacture.     

Influence of cationic stoichiometry of the bottom electrode La1-xSrxCoO3 on the microstructures of Pb(Ta0.05Zr0.48Ti0.47)O3 ferroelectric films using Pt/TiO2 conducting barrier

The heterostructures La_1-xSr_xCoO₃/Pb(Ta_0.05 Zr_0.48Ti_0.47)O₃(PTZT)/La_1-x Sr_xCoO₃ have been deposited on SiO₂/Si(001) substrates using Pt/TiO₂ as conductive barrier by pulsed-laser deposition. La_0.25Sr_0.75CoO₃(25/75) bottom electrodes with a pseudo-cubic perovskite structure favors (001)-textured growth of PTZT films. The ferroelectric capacitor LSCO(25/75)/PTZT/LSCO(25/75) remains about 96% of its polarization after 5᎒¹⁰ switching cycles at an applied voltage of 5 V and a frequency of 500 kHz. The cross-section morphology of scanning electron microscopy and Rutherford backscattering spectra show that no obvious interdiffusion occurs across the interfaces.     

Laser Induced Damage Threshold at 355 and 1064nm of Ta2O5 Films of Different Phases

Ta2O5 films axe deposited on fused silica substrates by conventional electron beam evaporation method. By annealing at different temperatures, Ta2 O5 films of amorphous, hexagonal and orthorhombic phases are obtained and confirmed by x-ray diffractometer （XRD） results. X-ray photoelectron spectroscopy （XPS） analysis shows that chemical composition of all the films is stoichiometry. It is found that the amorphous Ta2 O5 film achieves the highest laser induced damage threshold （LIDT） either at 355 or 1064nm, followed by hexagonal phase and finally orthorhombic phase. The damage morphologies at 355 and 1064nm are different as the former shows a uniform fused area while the latter is centred on one or more defect points, which is induced by different damage mechanisms. The decrease of the LIDT at 1064nm is attributed to the increasing structural defect, while at 355nm is due to the combination effect of the increasing structural defect and decreasing band gap energy.     

Raman Investigation of Sodium Titanate Nanotubes under Hydrostatic Pressures up to 26.9GPa

High pressure behavior of sodium titanate nanotubes （Na2Ti2O5） is investigated by Raman spectroscopy in a diamond anvil cell （DAC） at room temperature. The two pressure-induced irreversible phase transitions are observed under the given pressure. One occurs at about 4.2 GPa accompanied with a new Raman peak emerging at 834 cm-1 which results from the lattice distortion of the Ti-O network in titanate nanotubes. It can be can be assigned to Ti-O lattice vibrations within lepidocrocite-type （H0.7Ti1.825V0.175O4＆#12539;H2O）TiO6 octahedral host layers with V being vacancy. The structure of the nanotubes transforms to orthorhombic lepidocrocite structure. Another amorphous phase transition occurs at 16.7 GPa. This phase transition is induced by the collapse of titanate nanotubes. All the Raman bands shift toward higher wavenumbers with a pressure dependence ranging from 1.58-5.6 cm-1/GPa.     

Blue-to-Orange Tunable Luminescence from Europium Doped Yttrium--Silicon--Oxide--Nitride Phosphors

Europium-doped yttrium-silicon-oxide-nitride phosphors are synthesized by carbothermal reduction and nitridation method. The crystal structure of the phosphors changed gradually from oxide Y2Si2O7 to nitride YSi3N5 state with increasing dosage of Si3N4 and carbon powder. The Y2Si2O7：Eu phosphor shows a blue emission at 465 nm with 300 nm excitation and a characteristic red emission of Eu^3＋ at 612 nm with 230 nm excitation. The YSi3N5：EU phosphor shows a broad emission band centred at 595nm with some sharp peaks of Eu^3＋ with 325nm excitation. The absorption of the studied phosphors increases from 450 to 700hm with an increment in nitrogen content. Blue-to-orange tunable luminescence is observed with 390 nm excitation.     

Polymer thin-film transistors with high dielectric constant gate insulators

Field-effect transistors consisting of poly(3-hexylthiophene) have been fabricated with high dielectric constant SrBi₂Ta₂O₉ films working as the gate insulator. Significantly enhanced gate effects were observed in these devices compared to similar transistors with conventional SiO₂ gate dielectric. Our devices exhibited operating voltages around 10 V, as compared to about 100 V for devices employing SiO₂ as the gate dielectric. Moreover, inverters based on such polymer transistors were demonstrated with nice input–output characteristics. PACS 82.35.Cd     

Memory Effect of Metal--Insulator--Silicon Capacitors with SiO2/HfO2/Al2O3 Dielectrics

Charge trapping characteristics of the metal-insulator-silicon （MIS） capacitors with Si02/HfO2//A12O3 stacked dielectrics are investigated for memory applications＇. A capacitance-voltage hysteresis memory window as large as 7.3 V is achieved for the gate voltage sweeping of ±12 V, and a fiat-band voltage shift of 1.5 V is observed in terms of programming under 5 V and I ms. Furthermore, the time- and voltage-dependent charge trapping characteristics are also demonstrated, the former is related to charge trapping saturation and the latter is ascribed to variable tunnelling barriers for electron injecting and discharging under different voltages.     

Large Storage Window in a-SiNx/nc-Si/a-SiNx Sandwiched Structure for Nanocrystalline Silicon Floating Gate Memory Application

An a-SiNx/nanocrystalline silicon [（nc-Si）/a-SiNx] sandwiched structure is fabricated in a plasma enhanced chemical vapour deposition （PECVD） system at low temperature （250℃）. The nc-Si layer is fabricated from a hydrogen-diluted silane mixture gas by using a layer-by-layer deposition technique. Atom force microscopy measurement shows that the density of nc-Si is about 2 ×10^11 cm^-2. By the pretreatment of plasma nitridation, low density of interface states and high-quality interface between the Si substrate and a-SiNs insulator layer are obtained. The density of interface state at the midgap is calculated to be 1 ×10^10 cm^-2eV^-1 from the quasistatic and high frequency C - V data. The charging and discharging property of nc-Si quantum dots is studied by capacitance-voltage （C- V） measurement at room temperature. An ultra-large hysteresis is observed in the C - V characteristics, which is attributed to storage of the electrons and holes into the nc-Si dots. The long-term charge-loss process is studied and ascribed to low density of interface states at SiNx/Si substrate.     

Enhanced Efficiency of Polymer： Fullerene Bulk Heterojunction Solar Cells with the Insertion of Thin TiO2 Layer near the LiF/A1 Electrode

The insertion layer of TiO2 between polymer-fullerene blend and LiF/AI electrode is used to enhance the shortcircuit current Isc and fill factor （FF）. The solar cell based on the blend of poly[2-methoxy-5-（2＇-ethylhexyloxy）- 1,4-phenylenevinylene] （MEH-PPV） and C60 with the modifying layer of TiO2 （about 20nm） shows the open- circuit Voc of about 0.62 V, short circuit current Isc of about 2.35 mA/cm^2, filling factor FF of about 0.284, and the power conversion efficiency （PCE） of about 2.4% under monochromatic light （50Onto） photoexcitation of about 17mW/cm^2. Compared to ceils without the TiO2 layer, the power conversion efficiency increases by about 17.5%. Similar effect is also obtained in cells with the undoped MEH-PPV structure of ITO/PEDOT：PASS/MEH- PPV/（TiO2）LiF/AI. The improved solar cell performance can be attributed to enhanced carrier extraction efficiency at the active layer/electrode interfaces when TiO2 is inserted.     

（Na0.52K0.44Li0.04）Nb0.9-xSbxTa0.1O3 Lead-Free Piezoelectric Ceramics with High Performance and High Curie Temperature

（Na0.52K0.44Li0.04）Nb0.9-x Sbx Ta0.1O3 lead-free piezoelectric ceramics are prepared by a solid-state reaction method. With increasing Sb content, the transition temperature from orthorhombic to tetragonal polymorphic phase decreased. A composition （Na0.52K0.44Li0.04）Nb0.863Sb0.037Ta0.1O3 is found to possess excellent piezo- electric and electromechanical performances （d33 = 306pC/N, kp =48%, and kt=50%）, and high Curie temperature （Tc = 320 ℃）. These results indicate that （Na0.52K0.44Li0.04）Nb0.863Sb0.037 Ta0.1O3 is a promising lead-free piezoceramics replacement for lead zirconate titanate.     

Influence of Gamma-Ray Irradiation on Absorption and Fluorescent Spectra of Nd：YAG and Yb：YAG Laser Crystals

We investigate the influence of gamma-ray irradiation on the absorption and fluorescent spectra of Nd^3＋：Y3A15 O12 （Nd： YAG） and Yb^3＋ ： Y3A15 O12 （Yb： YAG） crystals grown by the Czochralski method. Two additional absorption （AA） bands induced by gamma-ray irradiation appear at 255nm and 340nm. The former is contributed due to Fe^3＋ impurity, the latter is due to Fe^2＋ ions and F-type colour centres. The intensity of the excitation and emission spectra as well as the fluorescent lifetime of Nd：YAG crystal decrease after the irradiation of 100 Mrad gamma-ray. In contrast, the same dose irradiation does not impair the fluorescent properties of Yb：YAG crystal. These results indicate that Yb： YA G crystal possesses the advantage over Nd： YA G crystal that has better reliability for applications in harsh radiant environment.     

Role of bismuth precursor in crystallization of SrBi2Ta2O9 thin films

Crystallization of SrBi₂Ta₂O₉ (SBT) thin films was studied as a function of viscosity of bismuth precursor and baking temperature, in order to fabricate capacitors with improved ferroelectric properties. SBT thin films were deposited on to Pt substrates using a chemical solution deposition (CSD) technique. Post-deposition anneal at 750 °C for 1 h in oxygen atmosphere revealed a significant influence of baking temperature and the viscosity of bismuth precursor on the microstructure and the ferroelectric properties of SBT thin films. A high baking temperature (350 °C) and a low viscosity of bismuth precursor (8 cp) yielded larger amounts of Bi₂O₃ secondary phase, smaller SBT grains (104 nm), and lower remanent polarization (P_r=2.0 7c/cm²). Additionally, these films exhibited a very high rate of ageing (>45% reduction in P_r after 7 days). A modified CSD process is suggested, which could suppress the formation of Bi₂O₃ secondary phase. Films fabricated using modified CSD technique exhibited a much larger grain size of 165 nm, higher P_r of 7.2 7c/cm², and significantly improved ageing characteristics (<1% reduction in P_r after 7 days). A qualitative model to describe the ageing in SBT-based capacitors is also suggested.     

Electrical characteristics of Ta2O5 based capacitors with different gate electrodes

Al, W and TiN gate stacks using reactively sputtered thin (15–35 nm) Ta₂O₅ as a high-k dielectric have been investigated. It has been established that the type and the deposition technique of the gate electrode strongly affect the parameters of the structures. RF sputtered tungsten has been established as the most suitable electrode material (giving a nonreactive contact) providing a low leakage current (∼10^-8 A/cm² at 1 MV/cm) through capacitors and a high dielectric constant. The application of Al gate electrodes in the advanced DRAM devices is impeded by the chemical interaction of Al with the Ta₂O₅ films deteriorating the performance of the structures. The radiation-induced defects during the TiN deposition increase the leakage currents for TiN/Ta₂O₅/Si capacitors. A modified Poole–Frenkel conduction mechanism with a tendency for a reduction of the compensation level with increasing Ta₂O₅ thickness was found for W-gate capacitors. Schottky emission at low applied fields and modified Poole–Frenkel mechanism at high fields define the J–V characteristics of Al capacitors. The current through TiN capacitors is governed by ohmic and space charge limited conduction. The post metallization annealing in H₂ reduces the oxide charge but deteriorates both the breakdown fields and the leakage currents for all capacitors studied. The effect is stronger for Al and TiN structures and is accompanied by a reduction of the dielectric constant. PACS 72.80.Sk; 73.40.Qv; 77.55+f; 81.15 Cd