Effect of Si doping in wells of A1GaN/GaN superlattice on the characteristics of epitaxial layer

An A1GaN/GaN superlattice grown on the top of a GaN buffer induces the broadening of the full width at half maximum of （102） and （002） X-ray diffraction rocking curves. With an increase in the Si-doped concentration in the GaN wells, the full width at half maximum of the （102） rocking curves decreases, while that of the （002） rocking curves increases. A significant increase of the full width at the half maximum of the （002） rocking curves when the doping concentration reaches 2.5 × 10^19 cm-3 indicates the substantial increase of the inclined threading dislocation. High level doping in the A1GaN/GaN superlattice can greatly reduce the biaxial stress and optimize the surface roughness of the structures grown on the top of it.     

A simple method of extracting the polarization charge density in the A1GaN/GaN heterostructure from current-voltage and capacitance-voltage characteristics

An Ni Schottky contact on the AlGaN/GaN heterostructure is fabricated. The flat-band voltage for the Schottky contact on the AlGaN/GaN heterostructure is obtained from the forward current-voltage characteristics. With the measured capacitance-voltage curve and the flat-band voltage, the polarization charge density in the AlGaN/GaN heterostructure is investigated, and a simple formula for calculating the polarization charge density is obtained and analyzed. With the approach described in this paper, the obtained polarization charge density agrees well with the one calculated by self-consistently solving Schrodinger’s and Poisson’s equations.     

Neutron irradiation effects on A1GaN//GaN high electron mobility transistors

AlGaN/GaN high electron mobility transistors(HEMTs) were exposed to 1 MeV neutron irradiation at a neutron fluence of 1 × 10 15 cm 2.The dc characteristics of the devices,such as the drain saturation current and the maximum transconductance,decreased after neutron irradiation.The gate leakage currents increased obviously after neutron irradiation.However,the rf characteristics,such as the cut-off frequency and the maximum frequency,were hardly affected by neutron irradiation.The AlGaN/GaN heterojunctions have been employed for the better understanding of the degradation mechanism.It is shown in the Hall measurements and capacitance-voltage tests that the mobility and concentration of two-dimensional electron gas(2DEG) decreased after neutron irradiation.There was no evidence of the full-width at half-maximum of X-ray diffraction(XRD) rocking curve changing after irradiation,so the dislocation was not influenced by neutron irradiation.It is concluded that the point defects induced in AlGaN and GaN by neutron irradiation are the dominant mechanisms responsible for performance degradations of AlGaN/GaN HEMT devices.     

Sodium beta-alumina thin films as gate dielectrics for A1GaN/GaN metal-insulator-semiconductor high-electron-mobility transistors

<正>Sodium beta-alumina（SBA） is deposited on AlGaN/GaN by using a co-deposition process with sodium and Al₂O₃ as the precursors.The X-ray diffraction（XRD） spectrum reveals that the deposited thin film is amorphous.The binding energy and composition of the deposited thin film,obtained from the X-ray photoelectron spectroscopy（XPS） measurement,are consistent with those of SBA.The dielectric constant of the SBA thin film is about 50.Each of the capacitance-voltage characteristics obtained at five different frequencies shows a high-quality interface between SBA and AlGaN.The interface trap density of metal-insulator-semiconductor high-electron-mobility transistor（MISHEMT） is measured to be（3.5～9.5）×10¹⁰ cm^-2·eV^-1 by the conductance method.The fixed charge density of SBA dielectric is on the order of 2.7×10¹² cm^-2.Compared with the AlGaN/GaN metal-semiconductor heterostructure high-electronmobility transistor（MESHEMT）,the AlGaN/GaN MISHEMT usually has a threshold voltage that shifts negatively. However,the threshold voltage of the AlGaN/GaN MISHEMT using SBA as the gate dielectric shifts positively from—5.5 V to—3.5 V.From XPS results,the surface valence-band maximum（VBM-E_F） of AlGaN is found to decrease from 2.56 eV to 2.25 eV after the SBA thin film deposition.The possible reasons why the threshold voltage of AlGaN/GaN MISHEMT with the SBA gate dielectric shifts positively are the influence of SBA on surface valence-band maximum （VBM-E_F）,the reduction of interface traps and the effects of sodium ions,and/or the fixed charges in SBA on the two-dimensional electron gas（2DEG）.     

GaN1-xPx薄膜的结构特性研究

用金属有机物化学气相沉积技术在蓝宝石衬底上外延了高P组分的GaN1-xPx 薄膜.利用x射线衍射仪和拉曼光谱仪研究了P对GaN1-xPx晶体结构的影响.研究结果表明:随着P组分比的增加,GaN1-xPx(0002)衍射峰逐渐向小角度移动,即晶格常数变大;与非掺杂GaN相比,GaN1-xPx薄膜的拉曼光谱中出现了4个新的振动模式,将它们分别归因于P族团引起的准局部振动模式、Ga-P键振动引起的间隙模,以及来自缺陷引起的无序激活散射.同时,随着P组分比的增加,A1(LO)模式的频率向低频方向移动,这种红移现象起因于合金化和应变的影响.     

Effects of SiNx on two-dimensional electron gas and current collapse of A1GaN/GaN high electron mobility transistors

SiNx is commonly used as a passivation material for AlGaN/GaN high electron mobility transistors (HEMTs). In this paper, the effects of SiN x passivation film on both two-dimensional electron gas characteristics and current collapse of AlGaN/GaN HEMTs are investigated. The SiNx films are deposited by high- and low-frequency plasma-enhanced chemical vapour deposition, and they display different strains on the AlGaN/GaN heterostructure, which can explain the experiment results.     

DLTS study of n-type GaN grown by MOCVD on GaN substrates

Electron traps in n-type GaN layers grown homoepitaxially by MOCVD on free-standing GaN substrates have been characterized using DLTS for vertical Schottky diodes. Two free-standing HVPE GaN substrates (A and B), obtained from two different sources, are used. The Si-doped GaN layers with the thickness of 5 μm are grown on an area of 0.9×0.9 cm² of substrate A and on an area of 1×1 cm² of substrate B. Two traps labeled B1 and B2 are observed with trap B2 dominant in GaN on both substrates. There exist no dislocation-related traps which have been previously observed in MOCVD GaN on sapphire. This might be correlated to the reduction in dislocation density due to the homoepitaxial growth. However, it is found that there is a large variation, more than an order of magnitude, in trap B2 concentration and that the B2 spatial distributions are different between the two substrates used.     

The influence of A1GaN/GaN superlattices as electron blocking layers on the performance of blue InGaN light-emitting diodes

P-A1GaN/P-GaN superlattices are investigated in blue InGaN light-emitting diodes as electron blocking layers. The simulation results show that efficiency droop is markedly improved due to two reasons： （i） enhanced hole concentration and hole carrier transport efficiency in A1GaN/GaN superlattices, and （ii） enhanced blocking of electron overflow between multiple quantum-wells and A1CaN/GaN superlattices.     

Hexagonal (wurtzite) GaN inclusions as a defect in cubic (zinc-blende) GaN

The dependence of the hexagonal fraction with thickness in MBE-grown bulk cubic (c-) GaN epilayer is presented in this paper. A number of c-GaN epilayers with different thicknesses were characterized via PL and XRD measurements. From the PL spectra, the signal due to h-GaN inclusions increases as the thickness of the c-GaN increases. On the contrary, in the XRD diffractogram, c-GaN shows a dominant signal at all thicknesses, and only a weak peak at ∼35° is observed in the diffractogram, implying the existence of a small amount of h-GaN in the c-GaN layer. The best quality of c-GaN is observed in the first 10 μm of GaN on the top of GaAs substrate. Even though the hexagonal content increases with the thickness, the average content remains below 20% in c-GaN layers up to 50 μm thick. The surface morphology of thick c-GaN is also presented.     

GaN及AlGaN薄膜透射光谱的研究

利用透射光谱矩阵光学原理,对三种GaN或AlGaN外延薄膜的透射光谱进行了分析.在传统的透射光谱拟合方法的基础上,添加了表征材料表面粗糙度、膜内散射情况的拟合参量,拟合曲线与实验曲线达到了准确的吻合.结果表明:外延薄膜透射光谱的拟合可以准确提取出材料的消光系数、表面状况、散射情况、折射率及厚度,从而对样品质量作出详细的分析.     

纳米晶粒团聚GaN纳米线A1(LO) Raman峰的非对称展宽

氮化镓(GaN)是一种直接带隙Ⅲ～Ⅴ族半导体化合物,具有较宽的禁带宽度(Eg=3.4eV),较高的热稳定性,以及抗辐照等特性[1-4],是制备近紫外和蓝光光电子器件、高速微电子器件的理想材料.制备低维纳米结构,研究其物理性质既是理解低维量子现象的要求,也是未来纳米电子器件发展的需要.近年来,很多小组已经通过不同的方法成功地制备出GaN纳米棒、纳米线等一系列一维材料.这些方法包括碳纳米管辅助的方法[5]、电弧放电的方法[6]、激光刻蚀的方法[7]、升华法[8]、高温分解法以及化学气相沉积(CVD)[9-15].其中CVD方法以其制备过程简单,制备材料晶…     

Comparative Analysis of Temperature-dependent .Raman Spectra of GaN and GaN/Mg Films

The Raman spectra of unintentionally doped gallium nitride (GaN) and Mg-doped GaN films were investigated and compared at room temperature and low temperature. The differences of E₂ and A₁(LO) mode in two samples are discussed. Stress relaxation is observed in Mg-doped GaN, and it is suggested that Mg-induced misfit dislocation and electron–phonon interaction are the possible origins. A peak at 247 cm⁻¹ is observed in both the Raman spectra of GaN and Mg-doped GaN. Temperature-dependent Raman scattering experiment of Mg-doped GaN shows the frequency and intensity changes of this peak with temperature. This peak is attributed to the defect-induced vibrational mode. Translated from Chinese Journal of Semiconductors, 2005, 26(4) (in Chinese)     

负电子亲和势GaN光电阴极激活机理研究

利用自行研制的光电阴极激活评估实验系统,给出了GaN光电阴极Cs激活及Cs/O激活的光电流曲线.针对GaN光电阴极的负电子亲和势（NEA）特性的成因,结合激活过程中光电流变化规律和成功激活后的阴极表面模型,研究了NEA GaN光电阴极激活机理.实验表明：GaN光电阴极在单独导入Cs激活时就可获得明显的NEA特性,Cs/O激活时引入O后光电流的增长幅度不大.用双偶极层模型［GaN（Mg）：Cs］：O—Cs较好地解释了激活成功后GaN光电阴极NEA特性的成因. 关键词： 负电子亲和势 GaN 激活 光电流     

高击穿电压的AIGaN/GaN FP-HEMT研究与分析

就蓝宝石衬底上制备的AlGaN／GaN场（field plate）HEMT器件、常规HEMT器件性能进行了分析对比．结果证明两种结构的器件直流参数变化不大，但是采用场板后器件的击穿电压从52V提高到了142V．在此基础上利用Sivaco软件对两种器件进行模拟仿真，深入分析了FP对器件击穿电压的影响．     

Improvement of breakdown characteristics of an A1GaN/GaN HEMT with a U-type gate foot for millimeter-wave power application

<正>In this study,the physics-based device simulation tool Silvaco ATLAS is used to characterize the electrical properties of an AlGaN/GaN high electron mobility transistor(HEMT) with a U-type gate foot.The U-gate AlGaN/GaN HEMT mainly features a gradually changed sidewall angle,which effectively mitigates the electric field in the channel, thus obtaining enhanced off-state breakdown characteristics.At the same time,only a small additional gate capacitance and decreased gate resistance ensure excellent RF characteristics for the U-gate device.U-gate AlGaN/GaN HEMTs are feasible through adjusting the etching conditions of an inductively coupled plasma system,without introducing any extra process steps.The simulation results are confirmed by experimental measurements.These features indicate that U-gate AlGaN/GaN HEMTs might be promising candidates for use in miltimeter-wave power applications.     

GaN紫外光探测器

评述了近年来在ＧａＮ紫外光探测器方面的研究进展。介绍了ＧａＮ光电导探测器、ｐ－ｎ结二极管探测器、肖特基势垒探测器以及ＭＳＭ结构探测器的制备方法、光电参数及研究现状。     

Mg+注入对GaN晶体辐射损伤的研究

在蓝宝石衬底上通过金属有机物化学气相沉积(metal-organic chemical vapor deposition,MOCVD)方法外延生长的GaN薄膜具有良好的结晶品质,xmin达到2.00%.结合卢瑟福背散射/沟道(Rutherford backscattering/channeling,RBS/C)和高分辨X射线衍射(high-resolution X-ray diffraction,HXRD)的实验测量,研究了不同剂量和不同角度Mg+注入GaN所造成的辐射损伤.实验结果表明,随注入剂量的增大,晶体的辐射损伤也增大,注入剂量在1×1015atom/cm2以下,xmix小于4.78%,1×1016atom/cm2是Mg+注入GaN的剂量阈值,超过这个阈值,结晶品质急剧变差,xmin达到29.5%;随机注入比沟道注入的辐射损伤大,且在一定范围内随注入角度的增大,损伤也增大,在4×1015atom/cm2剂量下偏离〈0001〉沟道0°,4°,6°,9°时的xmin(%)分别为6.28,8.46,10.06,10.85;经过700℃/10min+1050℃/20s两步退火和1000℃/30s高温快速退火后,晶体的辐射损伤都有一定程度的恢复,而且1000℃/30s高温快速退火的效果更好,晶体的辐射损伤可以得到更好的恢复.