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为了改善GaN HEMT的自热效应,集成高热导率的金刚石衬底有助于增强器件有源区的热量耗散。然而,化学气相淀积(CVD)生长的多晶金刚石(PCD)具有柱状晶粒结构,导致了各向异性的材料热导率,且其热导率值与生长厚度有关。为此,通过建模金刚石生长过程中晶粒尺寸的演变过程,计算了金刚石沿面内和截面方向的热导率。基于该PCD热导率模型,利用计入材料非线性热导率的GaN器件热阻解析模型,计算得到了GaN HEMT沟道温度的波动范围,并分析了其与器件结构(栅长、栅宽、栅间距、衬底厚度)和功耗的依赖关系。最后,通过与有限元(FEM)仿真结果对比,分区域提取了GaN HEMT器件中PCD衬底的有效热导率,分别为260~310 W/(m·K)和1 250~1 450 W/(m·K)。本文的计算为预测金刚石衬底上GaN HEMT器件的沟道温度提供了快速、有效的方法。 相似文献
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Simulation of near-infrared photodiode detectors based on β-FeSi_2/4H-SiC heterojunctions 总被引:1,自引:0,他引:1 下载免费PDF全文
In this paper,we propose a near-infrared p-type β-FeSi2/n-type 4H-SiC heterojunction photodetector with semiconducting silicide(β-FeSi2) as the active region for the first time.The optoelectronic characteristics of the photodetector are simulated using a commercial simulator at room temperature.The results show that the photodetector has a good rectifying character and a good response to near-infrared light.Interface states should be minimized to obtain a lower reverse leakage current.The response spectrum of the β-FeSi2/4H-SiC detector,which consists of a p-type β-FeSi2 absorption layer with a doping concentration of 1×1015cm-3 and a thickness of 2.5 μm,has a peak of 755 mA/W at 1.42 μm.The illumination of the SiC side obtains a higher responsivity than that of the β-FeSi2 side.The results illustrate that the β-FeSi2/4H-SiC heterojunction can be used as a near-infrared photodetector compatible with near-infrared optically-activated SiC-based power switching devices. 相似文献
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Optically controlled SiCGe/SiC heterojunction transistor with charge-compensation layer 总被引:1,自引:0,他引:1 下载免费PDF全文
A novel optically controlled SiCGe/SiC heterojunction transistor with charge-compensation technique has been simulated by using commercial simulator.This paper discusses the electric field distribution,spectral response and transient response of the device.Due to utilizing p-SiCGe charge-compensation layer,the responsivity increases nearly two times and breakdown voltage increases 33%.The switching characteristic illustrates that the device is latch-free and its fall time is much longer than the rise time.With an increase of the light power density and wavelength,the rise time and fall time will become shorter and longer,respectively.In terms of carrier lifetime,a compromise should be made between the responsivity and switching speed,the ratio of them reaches maximum value when the minority carrier lifetime equals 90 ns. 相似文献
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SiC1-xGex/SiC 异质结光电二极管特性的研究 总被引:5,自引:5,他引:0
使用二维器件模拟软件Medici, 对SiC1-xGex/SiC异质结的光电特性进行了模拟.设计了N型重掺杂SiC层的厚度为1 μm, P型轻掺杂SiC1-xGex层厚为0.4 μm, 二者之间形成突变异质结.在反向偏压3 V、光强度为 0.23 W/cm2的条件下, p-n+ SiC0.8Ge0.2/SiC和p-n+ SiC0.7Ge0.3/SiC敏感波长λ分别可以达到0.64 μm和0.7 μm, 光电流分别为7.765×10-7 A/μm和7.438×10-7 A/μm; 为了进一步提高SiC1-xGex/SiC 异质结的光电流, 我们把p-n+两层结构改进为p-i-n三层结构.在同样的偏压、光照条件下, p-i-n SiC0.8Ge0.2/SiC和p-i-n SiC0.7Ge0.3/SiC的光电流分别达到1.6734×10-6 A/μm和1.844×10-6 A/μm. 相似文献
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在对SiC1-xGex三元合金主要特性的研究基础上,利用器件仿真器MEDICI模拟和分析SiCGe/SiC异质结光电二极管的光电特性。计算表明, SiC1-xGex 在Ge组分为0.3时与3C-SiC晶格失配较小,此时的SiCGe/SiC异质结对可见光和近红外光有较好的光谱响应。当P型SiC1-xGex层杂质浓度为1×1015cm-3、厚度1.6μm、x=0.3时,SiC1-xGex /SiC异质结光电二极管对0.52μm可见光有250mA/W左右的响应度,对0.7μm近红外光也有102mA/W左右的响应度。 相似文献
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采用低压热壁化学气相沉积法,在6H-SiC衬底(0001)面上生长了不同温度(1100—1250℃),不同GeH4流量比(6.3%—25%)的SiCGe薄膜样品,研究了SiCGe薄膜的表面形貌、生长特性以及样品中Ge组分含量的变化. 扫描电镜测试结果表明,SiCGe薄膜在低温下倾向于岛状生长模式,随着生长温度提高,岛状生长逐渐过渡到层状生长模式,同时伴有岛形状和密度的变化. X射线光电子能谱测试得出SiCGe样品中的Ge含量约为0.15%—0.62%,在其他参数不变的情况下,样品的G
关键词:
碳化硅
化学气相沉积
反相边界
岛状生长 相似文献
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PVT法生长SiC单晶生长腔的温场分布是影响晶体质量的重要因素.采用数值模拟研究了保温层和坩埚结构以及线圈位置对6英寸SiC晶体生长温场的影响,优化出了适合高品质6英寸SiC晶体生长温场分布,在此条件下生长无裂纹的6英寸N型4H-SiC晶体.用高分辨率X射线衍射、拉曼光谱和缺陷检测系统对所加工的SiC衬底片的质量进行了表征.测试结果表明,晶型为单一的4H-SiC,微管密度小于1 cm-2,电阻率范围为0.02~0.022Ω·cm,X射线摇摆曲线半高宽为21.6″. 相似文献