等离子体氧轰击硅生成缺陷的研究

本文对等离子体氧轰击硅产生的缺陷进行了研究。发现等离子体氧轰击在硅中引入两个缺陷E₁(E_c—0.46eV)及E₂(E_c—0.04eV)。测量了缺陷的光电离截面谱,分析表明,缺陷E₂的电子声子相互作用很强,其Frank-Condon移动达0.76eV,缺陷E₁的电子声子相互作用较小,其Frank-Condon移动为0.04eV。由实验结果得到与缺陷E₁、E₂相耦合的声子模分别为hω_p⁽¹⁾=28meV,hω_p⁽²⁾=20meV。 关键词：     

高温电子辐照硅中缺陷的研究

本文对高温电子辐照硅中产生的缺陷进行了研究,发现缺陷的引进率随电子辐照温度的增加而增加,在达到极值温度T_m后,缺陷的引进率将随之而下降,T_m值与缺陷的退火激活能有关。E₃缺陷(E_c—0.36eV)浓度在高温电子辐照中显著增加,在330℃高温电子辐照时,E₃缺陷浓度为室温电子辐照的6倍。研究结果表明,E₃缺陷的可能结构为与多空位和氧有关的复合体。 关键词：     

n型气相外延GaAs层中中子辐照感生缺陷的研究

本文研究了1MeV中子辐照在气相外延n-GaAs有源层中深能级缺陷的特性和热退火性能。结果表明,大多数感生缺陷是与两个以上原子位移有关的缺陷。另外,当H₁能级通火时,出现了一个新的缺陷能级E₅(E_c-0.73eV)。研究表明GaAs MESFET参数的变化主要是由于载流子去除。 关键词：     

硅中三空位V3-的超精细相互作用的理论计算

利用Koster-Slater的格林函数方法,计算了硅中三空位V₃^-的电子态能级和波函数.结果表明,V₃^-在禁带中有五条能级:E_(A2)=0.417eV,E_(B1)=0.492eV,E_(B2¹)=0.512ev, E_(A1)=0.532eV,E_(B2²)=0.608eV.根据算得的超精细相互作用常数同实验值的比较,定出V₃^-处于B₁态.V₃^-的B₁态点据第1壳层的几率为60.2％,但主要集中在三空位所确定的平面内的二个原子上. 关键词：     

注硅半绝缘GaAs的深能级

用深能级瞬态谱(DLTS)详细研究了硅离子注入Liquid-encapsulated Czochralski(缩写为LEC)半绝缘GaAs的深中心。结果表明,在注硅并经高温退火的有源区中观测到4个多子(电子)陷阱,E₀₁,E₀₂,E₀₃和E₀₄。它们的电子表观激活能分别为0.298,0.341,0.555和0.821eV。其中E₀₄与EL2有关,但不是EL2缺陷。E₀₄的电子 关键词：     

深能级对AlGaInP/GaAs异质结双极晶体管性能的影响

用深能级瞬态光谱和光致发光(PL)方法研究了AlGaInP/GaAs异质结双极晶体管(HBT)发射区AlGaInP中的深能级.得到了两个深能级,分别为E_c-E_t1＝0.42eV和E_c-E_t2＝0.59eV,其复合截面为σ_n1＝6.27×10^-17cm²和σ_n2＝6.49×10^-20cm². 关键词：     

赝配GaAs/In0.2Ga0.8As量子阱导带不连续量的C-V和电容瞬态测量

分别采用二种不同方法测量分子束外延(MBE)生长GaAs/In_0.2Ga_0.8As单量子阱结构的导带不连续量ΔE_c:1) 考虑样品界面电荷修正的电容-电压(C-V)分布；2) 量子阱载流子热发射产生的电容瞬态(DLTS).C-V测得的ΔE_c=0.227eV,大约相当于89% ΔE_g.DLTS测得的ΔE_c=0.229eV,大约相当于89.9% ΔE_g.结果 关键词：     

铁电单晶0.62Pb(Mg1/3Nb2/3)O3-0.38PbTiO3折射率的研究

用最小偏向角法在20℃下精确测量了0.62Pb(Mg_1/3Nb_2/3)O_{3< /sub>-0.38PbTiO3( 0.62PMN-0.38PT)单晶的折射率，给出了该温度下折射率色散的Sellmeier方程.研究了能带 结构与折射率的关系，计算了样品的Sellmeier光学系数：对no，E0=5.50eV,λ0=0.2 26μm，Ｓ０=1.004×10¹⁴m^-2，Ed=28.1 0eV；对ne，Ｅ0=5.57eV,λ 0=0.223μm，S0=1.017×10¹⁴m^-2，Ed=28.10eV.A BO3型钙钛矿材料中，BO6八面体基元决定了晶体的能带结构，对折 射率产生重要影响. 关键词： PMNT单晶 折射率 Sellmeier光学系数}     

本征缺陷对β-Ga2O3光催化性质影响的第一性原理研究

运用第一性原理杂化泛函研究了本征缺陷(O空位和Ga空位)对于β-Ga₂O₃的几何结构和电子性质的影响.计算结构表明:杂化泛函B3LPY能很好的描述β-Ga₂O₃的几何结构和电子结构,能与实验符合.含O缺陷的形成能在富氧和贫氧下分别为4.04和0.92 eV,优于含Ga缺陷的体系.空位缺陷的出现对于理想Ga₂O₃的晶格参数影响不显著,只是在O空位体系中,空位附近Ga-O键长有0.1?变化.含空位缺陷的体系的禁带中都有缺陷能级的出现,含Ga和O空位缺陷的Ga₂O₃的光跃迁能分别为1.93 eV(β自旋)和2.92 eV,有很明显的光吸收的拓展,从理论上解释了Ga₂O₃作为光催化材料的潜在应用.     

Li2Mo2O6多晶材料的结构与电性能的研究

本文用固相反应烧结制备出Li₂Mo₂O₆多晶材料。经X射线分析、红外光谱和电子顺磁共振谱(EPR)的研究,确定了它的结构是Li₂Mo₂O₄和MoO₂两个晶相组成的烧结体。钼离子以四价状态存在于MoO₂晶相结构中。采用交流阻抗谱分析了晶界与温度变化的相关性。测得了样品的ln(σ_总T)-1/T 曲线是由两段直线和一段曲线所组成;总电导率化能σ_27℃=1.36×10^-3(Ω·cm)^-1,σ_115℃=1.49×10^-3(Ω·cm)^-1,σ_300℃=9.71×10^-3(Ω·cm)^-1,σ_370℃=2.42×10^-3(Ω·cm)^-1;电导活化能E₁=0.043eV,E₂=0.235eV,E_平均=0.76eV。采用维格纳极化电池法测得电子电导率σ_e,σ_e27℃=2.240×10^-5(Ω·cm)^-1,σ_e300℃=4.476×10^-3(Ω·cm)^-1。实验证明,室温下材料为固体电解质,300℃附近为良好的离子与电子混合导体。 关键词：     

Studies of deep levels in He+-irradiated silicon

9 to 10¹³ particles/cm² have been investigated by the deep level transient spectroscopy technique and capacitance-voltage profiling. Under low fluence irradiation at least four main electron traps have been observed. With further increase in irradiation fluence, two new levels located at E_c-0.56 eV and E_c-0.64 eV appear on the high-temperature side of the DLTS signal. The slope change observed in the amplitude variations of the singly negative charge state of the divacancy versus the dose takes place when these two new levels appear. This suggests that both are multivacancy-related defects. After annealing at 350 °C for 15 min, all electron traps have disappeared. Moreover, no shallow levels are created during the annealing. Received: 12 December 1996/Accepted: 6 May 1997     

On the recombination behaviour of iron in moderately boron-doped p-type silicon

The recombination lifetime and diffusion length of intentionally iron-contaminated samples were measured by the Surface Photo Voltage (SPV) and the Elymat technique. The lifetime results from these techniques for intentionally iron-contaminated samples were analysed, in particular for the aspect of the injection-level dependency of recombination lifetime. Based on theoretical considerations, a method for the analysis of deep-level parameters combining constant photon flux SPV and Elymat measurements has been developed. This method is based on a detailed numerical analysis of the Elymat technique, including the Dember electric field, the characteristics of the laser beam, the transport parameters of the semiconductor and multilevel Shockley-Read-Hall (SRH) recombination kinetics. The results of the numerical simulation are applied to the analysis of recombination lifetime measurements on intentionally iron-contaminated samples. We compared numerical simulations and experimental results from SPV and Elymat for p-type samples using the classical acceptor level atE _v +0.1 eV and the donor level of FeB pairs atE _c -0.3 eV as recombination centre. Better consistency in the interpretation of the results has been found in the doping range 10¹⁴–10¹⁶ cm^–3 supposing theE _c -0.3 eV level as predominant recombination centre. An attempt to extract the electron and hole capture cross-sections for this defect is made.     

The defects produced by electron irradiation in tellurium-doped germanium

Abstract

The nature of the irradiation induced defects in germanium single crystal doped with tellurium was studied by DLTS and electrical measurements.

The E_c-0.21 eV level produced by irradiation with 1.5 MeV electrons was studied by DLTS technique. It was found that the defect associated with the E_c-0.21 eV level is divacancy. The E-center like defect (group V impurity-vacancy pair) introduces the E_c-0.20 eV level in samples doped with group V impurity. The level introduced by tellurium (group VI impurity)-vacancy pair is located at deeper than E_c-0.21 eV.

The E_c-0.16 eV level was generated by the annealing at 430 K. A model for the defect associated with the level is proposed to be a tellurium-vacancies complex.     

Defect annealing in phosphorus implanted silicon: A D.L.T.S. study

Deep-level transient spectroscopy (D.L.T.S.) has been applied to the determination of defects in ion implanted silicon. Preliminary results concerning defects introduced by 130 KeV phosphorous ion implantation are described. Four electron traps are found: atE _c -0.21 eV,E _c -0.39 eV,E _c -0.52 eV andE _c -0.58 eV and their cross-sections estimated. The annealing behaviour in the range 450–800°C of these traps is described. Work supported in part by the Institute of Physics, Polish Academy of Science, Warsaw. Laboratoire associé au C.N.R.S.     

Inductively coupled plasma induced deep levels in epitaxial n-GaAs

The electronic properties of defects introduced by low energy inductively coupled Ar plasma etching of n-type (Si doped) GaAs were investigated by deep level transient spectroscopy (DLTS) and Laplace DLTS. Several prominent electron traps (E_c—0.046 eV, E_c—0.186 eV, E_c—0.314 eV. E_c—0.528 eV and E_c—0.605 eV) were detected. The metastable defect E_c—0.046 eV having a trap signature similar to E1 is observed for the first time. E_c—0.314 eV and E_c—0.605 eV are metastable and appear to be similar to the M3 and M4 defects present in dc H-plasma exposed GaAs.     

注氮GaAs中的深能级及其对自由载流子的补偿

详细研究了注氮n型GaAs中深的和浅的杂质缺陷的电学性质。深能级瞬态谱(DLTS)技术测量表明,能量为140keV和剂量为1×10¹³cm^-2的氮离子注入并经800℃退火30min的GaAs中存在四个电子陷阱,E₁(0.111),E₂(0.234),E₃(0.415),E₄(0.669)和一个空穴陷阱H(0.545),而在能量为20keV和剂量为5×10^{14关键词：}     

Electrical characterization of deep levels in n-type GaAs after hydrogen plasma treatment

Deep level transient spectroscopy (DLTS) and Laplace-DLTS (L-DLTS) have been used to investigate defects in an n-type GaAs before and after exposure to a dc hydrogen plasma (hydrogenation). DLTS revealed the presence of three prominent electron traps in the material in the temperature range 20-300 K. However, L-DLTS with its higher resolution enabled the splitting of two narrowly spaced emission rates. Consequently four electron traps at, E_C—0.33 eV, E_C—0.36 eV, E_C—0.38 eV and E_C—0.56 eV were observed in the control sample. Following hydrogenation, all these traps were passivated with a new complex (presumably the M3), emerging at E_C—0.58 eV. Isochronal annealing of the passivated material between 50 and 300 °C, revealed the emergence of a secondary defect, not previously observed, at E_C—0.37 eV. Finally, the effect of hydrogen passivation is completely reversed upon annealing at 300 °C, as all the defects originally observed in the reference sample were recovered.     

Annealing behavior ot trap-centers in silicon containing A-swirl defects

The annealing behavior of trap-centers was studied in float-zone silicon wafers containing A-swirl defects. Samples from areas of high and low A-swirl density were annealed in nitrogen ambient between 100° and 900 °C, and analysed using the Deep Level Transient Spectroscopy. The results indicate, that two levels atE _c }-0.07 eV, _n=4.6×10^–16 cm², andE _c–0.49eV, _n=6.6×10^–16cm² are caused by one defect, for which the silicon di-selfinterstitial is a likely interpretation. A level atE _c }-0.11 eV was assigned to interstitial carbon. Both defects annealed out at about 170 °C. After 600 °C annealing an additional level atE _c–0.2 eV was detected, which was attributed to an interstitial silicon carbon complex. Heat treatment at 800 °C generated a new level atE _c–0.49 eV, _n=2.9×10^–16cm² only in the area of high A-swirl defect density. This level was also observed after oxidation and subsequent annealing of silicon.     

Transition metal impurities in silicon: New defect reactions

Recent investigations on transition-metal impurities in silicon emphasizing the effect of the combined diffusion of two transition metals are presented and briefly discussed. The electronic properties and basic thermal kinetics are analysed by DLTS. The conversion of a Pd-related multivalent defect atE _c-0.35 eV andE _c-0.57 eV to the Pd-related defect atE _c –0.22 eV is observed, and a Pd-Fe complex level atE _c –0.32 eV is identified. The annealing characteristics of the multivalent Rh levels atE _c-0.33 eV andE _c-0.57 eV are observed, and used to analyse the influence of prior Rh doping on the Au diffusion. A complex formed by the codiffusion of Au and Cu is observed atE _v+0.32eV andE _v+0.42 eV, and shown to exhibit bistable behavior as does a similarly produced Au-Ni complex observed atE _v + 0.35 eV andE _v+0.48 eV.     

Hydrostatic pressure effects on oxygen-related irradiation-produced defects in silicon

Abstract

Hydrostatic pressure has been used as a variable to investigate the E_c-0.164 eV acceptor level for the oxygen-vacancy (O—V) defect in γ-ray irradiated Si, and the annealing/formation of oxygen-related defects in neutron-irradiated Si. The acceptor level is found by deep level transient spectroscopy to move closer to the conduction band and away from the valence band at rates of 3.9 meV/kbar and 2.4 meV/kbar, respectively, i.e., the level moves higher in the gap. There is also a relatively large inward (outward) breathing mode lattice relaxation (4.6±1.2 ų/electron) accompanying electron emission (capture) from this level. Both results reflect the antibonding nature of the level and are qualitatively consistent with the Watkins—Corbett model for the O—V defect. The annealing rate was found by infrared absorption to increase with pressure for the O—V defect at 350°C with a derived activation volume of ?4.5 ų/defect, where the negative sign implies inward relaxation (contraction) on annealing. Pressure has relatively little effect on annealing of the C—Si—O C(3) defect which is interstitial in nature, but strongly favors the formation of the dioxygen (2 oxygen atoms per vacancy, i.e., O₂—V) defect. The intensity of the O₂—V band after annealing at 20 kbar is 5 times higher than that following similar annealing at 0 kbar. Additionally, this intensity at 20 kbar is higher than that achievable by any isochronal or isothermal annealing steps at 0 kbar. These annealing/formation results are discussed qualitatively in terms of models for the various defects.