使用SiNx原位淀积方法生长的GaN外延膜中的应力研究

采用低压MOCVD系统,在生长过程中使用SiNx原位淀积的方法产生纳米掩模,并在纳米掩模上进行选区生长和侧向外延制备了GaN外延薄膜.使用拉曼光谱和光荧光的手段对GaN外延膜中的残余应力进行了研究.研究发现,用SiNx原位淀积出纳米掩模后,GaN生长将由二维向三维转变,直到完全合并为止.利用拉曼光谱和光荧光谱分别研究了薄膜中的残余应力,两者符合得很好;这种方法生长出的GaN薄膜的应力分布较传统的侧向外延更加均匀;并且从中发现随着生长过程中SiNx原位淀积时间的增加,生长在其上的GaN外延膜中的残余应力减小.这是因为,随着SiNx原位淀积时间的增加,SiNx纳米掩模的覆盖度也增大.因此侧向外延区的比例增大,残余应力随之减小.     

纳米尺度下Si/Ge界面应力释放机制的分子动力学研究

采用分子动力学方法研究了纳米尺度下硅(Si)基锗(Ge)结构的Si/Ge界面应力分布特征,以及点缺陷层在应力释放过程中的作用机制.结果表明:在纳米尺度下, Si/Ge界面应力分布曲线与Ge尺寸密切相关,界面应力下降速度与Ge尺寸存在近似的线性递减关系;同时,在Si/Ge界面处增加一个富含空位缺陷的缓冲层,可显著改变Si/Ge界面应力分布,在此基础上对比分析了点缺陷在纯Ge结构内部引起应力变化与缺陷密度的关系,缺陷层的引入和缺陷密度的增加可加速界面应力的释放.参考对Si/Ge界面结构的研究结果,可在Si基纯Ge薄膜生长过程中引入缺陷层,并对其结构进行设计,降低界面应力水平,进而降低界面处产生位错缺陷的概率,提高Si基Ge薄膜质量,这一思想在研究报道的Si基Ge膜低温缓冲层生长方法中初步得到了证实.     

极紫外多层膜残余应力初步研究

 针对极紫外多层膜在激光等离子体诊断、极紫外光刻等方面的应用,进行了Mo/Si多层膜残余应力的实验研究,讨论了多层膜残余应力的成因。实验结果表明：Mo单层膜表现为张应力, Si单层膜表现为压应力;通过传统方法制备的13.0 nm处高反射率的40对Mo/Si多层膜会产生-500 MPa左右的压应力,其压应力主要是由膜层之间的贯穿扩散引起的;通过改变膜层比率可以在一定程度上补偿因贯穿扩散产生的压应力,但是以牺牲多层膜反射率为代价。     

磁控溅射制备的W,WSi2,Si单层膜和W/Si,WSi2/Si多层膜应力

采用直流磁控溅射技术制备了厚度约100 nm的W,WSi2,Si单层膜和周期约为20 nm,Si膜层厚度与周期的比值为0.5的W/Si,WSi2/Si周期多层膜.利用台阶仪对镀膜前后基底表面的面形进行了测试,计算并比较了不同膜系的应力值.结果表明:W单层膜表现出较大的压应力,而W/Si周期膜则表现为张应力.WSi2单层...     

低温退火的X射线W/Si多层膜应力和结构性能

W/Si多层膜反射镜在硬X射线天文望远镜中有重要应用. 为减小其应力对反射镜面形和望远镜分辨率的影响, 同时保证较高的反射率, 采用150, 175和200 ℃ 的低温退火工艺对采用磁控溅射镀制的W/Si周期多层膜进行后处理. 利用掠入射X射线反射测试和样品表面面形测试对退火前后W/Si多层膜的应力和结构进行表征. 结果表明, 在150 ℃ 退火3 h 后, 多层膜1级峰反射率和膜层结构几乎没有发生变化, 应力减少约27%; 在175 ℃ 退火3 h后, 多层膜膜层结构开始发生变化, 应力减少约50%; 在200 ℃退火3 h 后, 多层膜应力减小超过60%, 但1级布拉格峰反射率相对下降17%, 且膜层结构发生了较大变化. W, Si界面层的增大和相互扩散加剧是应力和反射率下降的主要原因.     

基体对应力诱导的纳米晶W膜开裂行为的影响

采用磁控溅射方法同时在Si(100)和聚酰亚胺(PI)基体上沉积W膜,对比研究不同基体约束对纳米晶W膜微观结构及应力诱导的开裂行为的影响.结果发现,在两种基体上W膜的裂纹形态明显不同.在Si基体上W膜的裂纹呈楔形,而在PI基体上W膜的裂纹呈半圆柱形凸起于薄膜表面.这种裂纹形态的差异源于两种基体上W膜的变形机理不同.在刚性Si基体上,W膜的裂纹扩展是通过晶粒平面内的转动实现的,而在柔性PI基体上W膜裂纹扩展是通过排列晶粒在平面内、外的转动协调完成的.分析表明,两种截然不同的开裂行为与不同基体上薄膜内应力的变 关键词： W膜 残余应力 裂纹 晶粒     

微波ECR磁控溅射制备SiNx薄膜的XPS结构研究

利用微波电子回旋共振等离子体增强非平衡磁控溅射法在不同N2流量下制备无氢SiNx薄膜.通过X光电子能谱、纳米硬度仪等表征技术,研究了不同N2流量下制备的SiNx薄膜的化学键结构、化学键含量、元素配比及各元素沿深度分布.研究结果表明,N2流量是影响SiNx薄膜化学键结构、元素配比、元素延深度分布等性质的主要因素.在N2流量为1 sccm的条件下制备的SiNx薄膜呈富Si态;在N2流量为2 sccm的条件下制备的SiNx薄膜中Si-N键含量最高,可达到94.8%,化学吸附主要发生在薄膜表面,同时薄膜具有较好的机械性能,硬度值可达到22.9 GPa;在N2流量为20 sccm条件下制备的SiNx薄膜,薄膜表面含有46.8%的N-Si-O键及18.6%的Si-O键结构,薄膜内部含有36.8%的N-Si-O键及12.5%的Si-O键结构,表明薄膜结构疏松,在空气中易被氧化,化学吸附在薄膜表面及内部同时发生,因此薄膜具有较差的机械性能,硬度值仅为12 GPa.     

金属在半导体表面上的吸附

对近年来金属在半导体表面上吸附的理论和实验进展进行了评论。着重讨论了亚单层覆盖体系中存在的争议之处及最新进展。贵金属在Si（111）表面上的吸附，情况相当复杂。例如对Ag/Si(111)，虽然理论和实验 上提出了许多模型，但目前还存在许多争议，尚没有定论。还讨论了碱金属和稀土金属在Si表面上的吸附。对K在Si(100)表面及K和O在Si（100）表面上的共吸附模型进行了详细讨论。另外，对碱金属在GaAs表面上的吸附的一些最新的结果进行了讨论。     

5kW/4.5K氦制冷系统外纯化器吸附筒设计

纯化器设计的关键是求解吸附剂对吸工质的吸附容量。文中根据朗格缪尔方程式,对活性炭在78K温度下对氮、氧等杂质的吸附容量进行了计算与分析,研究杂质气体中氮、氢比例对吸附容量的影响。在计算结果基础上,对吸附筒进行机械结构设计和应力分析。     

Sb/Si(001)表面的半经验研究

用基于Chadi模型和格林函数方法的一种计算表面应力的半经验方法研究了Sb吸附在Si(001) 衬底上的性质.结果显示,Sb原子在Si(001)表面形成对称的dimer,其键长为0.293nm,表 面以下层的弛豫很小.Sb/Si(001)2×1表面沿着dimer方向的张应力为1.0eV/(1×1cell),而 沿垂直于dimer方向的压应力为-1.1eV/(1×1cell).Sb/Si(001)表面应力的主要贡献来自于 最上面三层表面. 关键词： 表面应力 异质生长 格林函数方法     

磁控溅射法沉积SiN_x非晶薄膜的生长机制及结构分析

利用磁控溅射技术在单晶Si衬底上沉积了Six非晶薄膜.样品的傅里叶变换红外吸收光谱(FTIR)显示,SNx非晶薄膜在812～892 cm-1范围内存在一个较强的吸收谱带.该吸收谱带对应于Si-N-Si键的伸缩振动吸收(stretching vibration mode),其吸收峰峰位随着溅射功率的增大明显红移;但退火后,该吸收峰又逐渐蓝移.结合中心力模型和自由结合模型,分析了磁控溅射过程中Six非晶薄膜的生长机制和内部结构.研究认为,随着溅射功率的提高,薄膜中先后形成Si-N4四面体,Si-N-Si3,Si-N2-S2及Si-N3-Si等结构,这几种结构分别对应着Si-N-Si键的不同模式的振动吸收.随着退火温度的升高,分子热运动逐渐加剧,非晶SiNx薄膜发生相分离,生成Si3N4和Si纳米晶颗粒,因此,S-N-Si键的吸收峰逐渐向Si3N4的特征振动吸收峰位870 cm-1靠近.     

氮化铝薄膜的硅热扩散掺杂研究

采用热扩散方法,对AlN薄膜进行了Si掺杂。利用电子能量散射谱(EDS)以及高温变温电导对薄膜进行了分析。EDS测试结果表明:在1 250 ℃的温度下,氮化硅(SiN_x)作为Si的扩散源,可以实现对AlN薄膜的Si热扩散掺杂。高温电流-电压(I-V)测试表明:在460 ℃测试温度下,AlN薄膜在热扩散掺杂以后,其电导从1.9×10^-3 S·m^-1增加到2.1×10^-2 S·m^-1。高温变温电导测试表明:氮空位(V³⁺_N)和Si在AlN中的激活能为1.03 eV和0.45 eV。     

Luminescent-wavelength tailoring silicon-rich silicon nitride LED

Wavelength tunable photoluminescence （PL） of Si-rich silicon nitride （SRSN） film with buried Si nanocrystals （Si-ncs） grown by plasma enhanced chemical vapor deposition （PECVD） under Sill4 and NH3 environment is investigated. Intense broadband visible emissions tunable from blue to red can be obtained from the as-deposited SiNs thin films with increasing NH3 flow rate from 150 to 250 sccm and detuning the SiH4/NH3 flow ratio during deposition. To date, the normalized PL wavelength of SiNx films after anneal- ing could be detuned over the range of 385-675 nm by decreasing the NH3 flow rate, corresponding to an enlargement on Si-nc size from 1.5-2 to 4-5 nm. The PL linewidth is decreased with increasing ammonia flow rate due to the improved uniformity of Si-ncs under high NH3 flow rate condition. In addition, the PL intensity is monotonically increasing with the blue shift of PL wavelength due to the increasing density of small-size Si-ncs. The ITO/SiNx/p-Si/Al diode reveals highly resistive property with the turn-on voltage and power-voltage slope of only 20 V and 0.18 nW/V, respectively. The turn-on voltage can further reduce from 20 to 3.8 V by improving the carrier injection efficiency with p-type Si nano-rods.     

射频等离子体增强化学气相沉积SiNx薄膜的研究

采用射频等离子体增强化学气相沉积技术,以N2和SiH4作为反应气体,在P型硅基片上进行SiNx薄膜的沉积.使用椭偏仪对薄膜厚度和光学常量进行了测量, 用傅里叶变换红外光谱仪对SiNx薄膜的化学键合结构进行了分析.研究了基片温度、射频功率以及N2和SiH4的气体流量比率等实验工艺参量对薄膜沉积速率和光学常量的影响.结果表明,射频等离子体增强化学气相沉积技术沉积的SiNx薄膜是低含氢量的SiNx薄膜,折射率在1.65~2.15之间,消光系数k在0.2~0.007之间,当SiNx薄膜为富氮时k≤0.01,最高沉积速率高达6.0 nm/min,N2和SiH4气体流量比率等于10是富硅和富氮SiNx薄膜的分界点.     

Origins of growth stresses in amorphous semiconductor thin films

Stress evolution during deposition of amorphous Si and Ge thin films is remarkably similar to that observed for polycrystalline films. Amorphous semiconductors were used as model materials to study the origins of deposition stresses in continuous films, where suppression of both strain relaxation and epitaxial strain inheritance provides considerable simplification. Our data show that bulk compression is established by surface stress, while a subsequent return to tensile stress arises from elastic coalescence processes occurring on the kinetically roughened surface.     

α-Si：H/SiNx叠层薄膜对晶体硅太阳电池的钝化

利用等离子增强化学气相沉积法在硅衬底上制备了 α-Si:H/SiN_x叠层薄膜用来钝化晶体硅太阳电池. 用有效少子寿命表征薄膜的钝化效果, 通过模拟高频电容-电压测试结果分析薄膜钝化的机理. 将α-Si:H/SiN_x薄膜的钝化效果与使用相同方法制备的 α-Si:H薄膜进行对比, 发现 α-Si:H/SiN_x 薄膜的钝化效果明显优于 α-Si:H薄膜. 不同温度下热处理后, α-Si:H/SiN_x薄膜的钝化效果随着温度的上升先提高后降低. 在最佳热处理温度300 ℃下进行热处理, α-Si:H/SiN_x 薄膜的钝化效果能在90 min内始终保持优于 α-Si:H薄膜. 模拟计算结果表明, α-Si:H/SiN_x薄膜的钝化效果与 α-Si:H/Si界面处的态密度有关. 关键词： 太阳电池 钝化 α-Si：H/SiN_x薄膜')" href="#">α-Si：H/SiN_x薄膜 热处理     

Evolution of stress and strain relaxation of Ge and SiGe alloy films on Si(0 0 1)

The growth of Ge and SiGe alloy films on Si substrates has attracted considerable interest in the last years because of their importance for optoelectronic devices as well as Si-based high speed transistors. Here we give a short overview on our recent real time stress measurements of Ge and SiGe alloy films on Si(0 0 1) performed with a sensitive cantilever beam technique and accompanied by structural investigations with atomic force microscopy. Characteristic features in the stress curves provide detailed insight into the development and relief of the misfit strain. For the Stranski–Krastanow system Ge/Si(0 0 1) as well as for SiGe films with Si contents below 20%, the strain relaxation proceeds mainly into two steps: (i) by the formation of 3D islands on top of the Ge wetting layer; (ii) via misfit dislocations in larger 3D islands and upon their percolation.     

First-principles calculation of Mg(0 0 0 1) thin films: Quantum size effect and adsorption of atomic hydrogen

We have carried out first-principles calculation of Mg(0 0 0 1) free-standing thin films to study the oscillatory quantum size effect exhibited in the surface energy, work function, interlayer relaxation, and adsorption energy of the atomic hydrogen adsorbate. The quantum well states have been shown. The calculated energetics and interlayer relaxation of clean and H-adsorbed Mg films are clearly featured by quantum oscillations as a function of the thickness of the film, with oscillation period of about eight monolayers, consistent with recent experiments. The calculated quantum size effect in H adsorption can be verified by observing the dependence of H coverage on the thickness of Mg(0 0 0 1) thin films gown on Si(1 1 1) or W(1 1 0) substrate which has been experimentally accessible.     

Dependence of Optical Absorption in Silicon Nanostructures on Size of Silicon Nanoparticles

The amorphous silicon nanoparticles (Si NPs) embedded in silicon nitride (SiN_x) films prepared by helicon wave plasma-enhanced chemical vapor deposition (HWP-CVD) technique are studied. From Raman scattering investigation, we determine that the deposited film has the structure of silicon nanocrystals embedded in silicon nitride (nc-Si/SiNx) thin film at a certain hydrogen dilution amount. The analysis of optical absorption spectra implies that the Si NPs is affected by quantum size effects and has the nature of an indirect-band-gap semiconductor. Further, considering the effects of the mean Si NP size and their dispersion on oscillator strength, and quantum-confinement, we obtain an analytical expression for the spectral absorbance of ensemble samples. Gaussian as well as lognormal size-distributions of the Si NPs are considered for optical absorption coefficient calculations. The influence of the particlesize-distribution on the optical absorption spectra was systematically studied. We present the fitting of the optical absorption experimental data with our model and discuss the results.     

Studies of diamond-like carbon （DLC） films deposited on stainless steel substrate with Si/SiC intermediate layers

In this work, diamond-like carbon （DLC） films were deposited on stainless steel substrates with Si/SiC intermediate layers by combining plasma enhanced sputtering physical vapour deposition （PEUMS-PVD） and microwave electron cyclotron resonance plasma enhanced chemical vapour deposition （MW-ECRPECVD） techniques. The influence of substrate negative self-bias voltage and Si target power on the structure and nano-mechanical behaviour of the DLC films were investigated by Raman spectroscopy, nano-indentation, and the film structural morphology by atomic force microscopy （AFM）. With the increase of deposition bias voltage, the G band shifted to higher wave-number and the integrated intensity ratio ID/IG increased. We considered these as evidences for the development of graphitization in the films. As the substrate negative self-bias voltage increased, particle bombardment function was enhanced and the sp^3-bond carbon density reducing, resulted in the peak values of hardness （H） and elastic modulus （E）. Silicon addition promoted the formation of sp^3 bonding and reduced the hardness. The incorporated Si atoms substituted sp^2- bond carbon atoms in ring structures, which promoted the formation of sp^3-bond. The structural transition from C-C to C-Si bonds resulted in relaxation of the residual stress which led to the decrease of internal stress and hardness. The results of AFM indicated that the films was dense and homogeneous, the roughness of the films was decreased due to the increase of substrate negative self-bias voltage and the Si target power.