Total ionizing dose effect in an input/output device for flash memory

Input/output devices for flash memory are exposed to gamma ray irradiation. Total ionizing dose has been shown great influence on characteristic degradation of transistors with different sizes. In this paper, we observed a larger increase of off-state leakage in the short channel device than in long one. However, a larger threshold voltage shift is observed for the narrow width device than for the wide one, which is well known as the radiation induced narrow channel effect. The radiation induced charge in the shallow trench isolation oxide influences the electric field of the narrow channel device. Also, the drain bias dependence of the off-state leakage after irradiation is observed, which is called the radiation enhanced drain induced barrier lowing effect. Finally, we found that substrate bias voltage can suppress the off-state leakage, while leading to more obvious hump effect.     

Radiation induced inter-device leakage degradation

The evolution of inter-device leakage current with total ionizing dose in transistors in 180 nm generation technologies is studied with an N-type poly-gate field device (PFD) that uses the shallow trench isolation as an effective gate oxide. The overall radiation response of these structures is determined by the trapped charge in the oxide. The impacts of different bias conditions during irradiation on the inter-device leakage current are studied for the first time in this work, which demonstrates that the worst condition is the same as traditional NMOS transistors. Moreover, the two-dimensional technology computer-aided design simulation is used to understand the bias dependence.     

超深亚微米器件总剂量辐射效应三维数值模拟

本文分析了浅槽隔离(STI)结构辐射诱导电荷的分布情况,给出一种模拟超深亚微米器件总剂量辐射效应的新方法.研究结果表明,如果在栅附近沿着STI侧墙不加辐照缺陷,仿真出的0.18 μm超深亚微米晶体管亚阈区I-V特性没有反常的隆起,并且能够很好地反映试验结果.在研究总剂量辐照特性改善方面,在剂量不是很大的情况下,采用超陡倒掺杂相对于均匀掺杂能有效地减小辐照所引起的泄漏电流.如果采用峰值(Halo)掺杂,不仅有利于提高超深亚微米器件的抗辐照能力,而且在大剂量的情况下,可以得到明显的效果. 关键词： 总剂量 超陡倒掺杂 Halo掺杂 辐射效应     

绝缘体上硅金属氧化物半导体场效应晶体管中辐射导致的寄生效应研究

基于⁶⁰Co γ射线源研究了总剂量辐射对绝缘体上硅（silicon on insulator,SOI）金属氧化物半导体场效应晶体管器件的影响.通过对比不同尺寸器件的辐射响应,分析了导致辐照后器件性能退化的不同机制.实验表明：器件的性能退化来源于辐射增强的寄生效应;浅沟槽隔离（shallow trench isolation,STI）寄生晶体管的开启导致了关态漏电流随总剂量呈指数增加,直到达到饱和;STI氧化层的陷阱电荷共享导致了窄沟道器件的阈值电压漂移,而短沟道器件的阈值电压漂移则来自于背栅阈值耦合;在同一工艺下,尺寸较小的器件对总剂量效应更敏感.探讨了背栅和体区加负偏压对总剂量效应的影响,SOI器件背栅或体区的负偏压可以在一定程度上抑制辐射增强的寄生效应,从而改善辐照后器件的电学特性.     

Impact of substrate bias on radiation-induced edge effects in MOSFETs

This paper investigates the effects of gamma-ray irradiation on the Shallow-Trench Isolation (STI) leakage currents in 180-nm complementary metal oxide semiconductor technology. No hump effect in the subthreshold region is observed after irradiation, which is considered to be due to the thin STI corner oxide thickness. A negative substrate bias could effectively suppress the STI leakage, but it also impairs the device characteristics. The three-dimensional simulation is introduced to understand the impact of substrate bias. Moreover, we propose a simple method for extracting the best substrate bias value, which not only eliminates the STI leakage but also has the least impact on the device characteristics.     

深亚微米器件沟道长度对总剂量辐照效应的影响

研究了180 nm 互补金属氧化物半导体技术下的器件沟道长度对总剂量辐照效应的影响. 在其他条件如辐照偏置、器件结构等不变的情况下, 氧化层中的陷阱电荷决定了辐照响应. 浅沟槽隔离氧化层中的陷阱电荷使得寄生的侧壁沟道反型, 从而形成大的关态泄漏电流. 这个电流与沟道长度存在一定的关系, 沟道长度越短, 泄漏电流越大. 首次发现辐照会增强这个电流的沟道长度调制效应, 从而使得器件进一步退化.     

0.18 μm窄沟NMOS晶体管总剂量效应研究

为明确深亚微米NMOS器件抗辐照能力以及研究其加固措施, 本文对0.18 μm窄沟NMOS晶体管进行了⁶⁰Coγ总剂量辐射效应研究. 结果表明: 和宽沟器件不同, 阈值电压、跨导、漏源电导对总剂量辐照敏感, 此现象被称之为辐射感生窄沟道效应; 相比较栅氧化层, 器件隔离氧化层对总剂量辐照更敏感; 窄沟道NMOS器件阈值电压不仅和沟道耗尽区电荷有关, 寄生晶体管耗尽区电荷对其影响也不可忽略, 而辐照引起源漏之间寄生晶体管开启, 形成漏电通道, 正是导致漏电流、亚阈斜率等参数变化的原因. 关键词： 0.18μmm 窄沟NMOS晶体管 60Coγ辐照')" href="#">⁶⁰Coγ辐照 辐射感生窄沟道效应     

0.18 μm MOSFET器件的总剂量辐照效应

对0.18 μm metal-oxide-semiconductor field-effect-transistor (MOSFET)器件进行γ射线辐照实验,讨论分析器件辐照前后关态漏电流、阈值电压、跨导、栅电流、亚阈值斜率等特性参数的变化,研究深亚微米器件的总剂量效应. 通过在隔离氧化物中引入等效陷阱电荷,三维模拟结果与实验结果符合很好. 深亚微米器件栅氧化层对总剂量辐照不敏感,浅沟槽隔离氧化物是导致器件性能退化的主要因素. 关键词： 总剂量效应 浅沟槽隔离 氧化层陷阱正电荷 MOSFET     

Bias Dependence of Radiation-Induced Narrow-Width Channel Effects in 65 nm NMOSFETs

The bias dependence of radiation-induced narrow-width channel effects(RINCEs) in 65-nm n-type metal-oxidesemiconductor field-effect transistors(NMOSFETs) is investigated. The threshold voltage of the narrow-width65 nm NMOSFET is negatively shifted by total ionizing dose irradiation, due to the RINCE. The experimental results show that the 65 nm narrow-channel NMOSFET has a larger threshold shift when the gate terminal is kept in the ground, which is contrary to the conclusion obtained in the old generation devices. Depending on the three-dimensional simulation, we conclude that electric field distribution alteration caused by shallow trench isolation scaling is responsible for the anomalous RINCE bias dependence in 65 nm technology.     

超深亚微米互补金属氧化物半导体器件的剂量率效应

对0.18 μm互补金属氧化物半导体(CMOS)工艺的N型金属氧化物半导体场效应晶体管(NMOSFET)及静态随机存储器(SRAM)开展了不同剂量率下的电离总剂量辐照试验研究. 结果表明: 在相同累积剂量, SRAM的低剂量率辐照损伤要略大于高剂量率辐照的损伤, 并且低剂量率辐照损伤要远大于高剂量率辐照加与低剂量率辐照时间相同的室温退火后的损伤. 虽然NMOSFET 低剂量率辐照损伤略小于高剂量率辐照损伤, 但室温退火后, 高剂量率辐照损伤同样要远小于低剂量率辐照损伤. 研究结果表明0.18 μm CMOS工艺器件的辐射损伤不是时间相关效应. 利用数值模拟的方法提出了解释CMOS器件剂量率效应的理论模型.     

Study of total ionizing dose radiation effects on enclosed gate transistors in a commercial CMOS technology

This paper studies the total ionizing dose radiation effects on MOS (metal-oxide-semiconductor) transistors with normal and enclosed gate layout in a standard commercial CMOS (compensate MOS) bulk process. The leakage current, threshold voltage shift, and transconductance of the devices were monitored before and after $\gamma $-ray irradiation. The parameters of the devices with different layout under different bias condition during irradiation at different total dose are investigated. The results show that the enclosed layout not only effectively eliminates the leakage but also improves the performance of threshold voltage and transconductance for NMOS (n-type channel MOS) transistors. The experimental results also indicate that analogue bias during irradiation is the worst case for enclosed gate NMOS. There is no evident different behaviour observed between normal PMOS (p-type channel MOS) transistors and enclosed gate PMOS transistors.     

部分耗尽SOI MOSFET总剂量效应与偏置状态的关系

实验表明SOI MOSFET掩埋氧化层中的总剂量辐射效应与辐射过程中的偏置状态有关. 对诱发背沟道泄漏电流的陷阱电荷进行了研究. 建立一个数值模型来模拟不同偏置下陷进电荷的建立, 它包括辐射产生的载流子复合和俘获的过程. 模拟结果与实验结果相符, 解释了总剂量辐射效应受偏置状态影响的机理.     

Hot-Carrier Effects on Total Dose Irradiated 65 nm n-Type Metal-Oxide-Semiconductor Field-Effect Transistors

The influence of total dose irradiation on hot-carrier reliability of 65 nm n-type metal-oxide-semiconductor fieldeffect transistors(nMOSFETs) is investigated.Experimental results show that hot-carrier degradations on irradiated narrow channel nMOSFETs are greater than those without irradiation.The reason is attributed to radiation-induced charge trapping in shallow trench isolation(STI).The electric field in the pinch-off region of the nMOSFET is enhanced by radiation-induced charge trapping in STI,resulting in a more severe hot-carrier effect.     

65 nm互补金属氧化物半导体场效应和晶体管总剂量效应及损伤机制

对65 nm互补金属氧化物半导体工艺下不同尺寸的N型和P型金属氧化物半导体场效应晶体管(NMOSFET和PMOSFET)开展了不同偏置条件下电离总剂量辐照实验.结果表明:PMOSFET的电离辐射响应与器件结构和偏置条件均有很强的依赖性,而NMOSFET表现出较强的抗总剂量性能;在累积相同总剂量时,PMOSFET的辐照损伤远大于NMOSFET.结合理论分析和数值模拟给出了PMOSFET的辐射敏感位置及辐射损伤的物理机制.     

微电路FPGA的γ电离总剂量效应与加固技术

 讨论了Actel公司的FPGA芯片A1280XL在有偏置和无偏置条件下的γ电离总剂量效应，试验结果表明偏置条件对FPGA芯片电离总剂量效应有较大影响，在有偏置下FPGA芯片A1280XL失效阈最小，为12.16 Gy(Si)；无偏置时FPGA失效阈最大，为33.2 Gy(Si)。对芯片内部结构进行了辐射效应分析，并提出一些加固方法提高器件的抗总剂量能力，如电路设计中采用冗余技术来实现对故障的检测和隔离，以及选取适当的屏蔽材料对器件进行屏蔽。     

Positive gate bias stress-induced hump-effect in elevated-metal metal-oxide thin film transistors

Under the action of a positive gate bias stress, a hump in the subthreshold region of the transfer characteristic is observed for the amorphous indium–gallium–zinc oxide thin film transistor, which adopts an elevated-metal metal–oxide structure. As stress time goes by, both the on-state current and the hump shift towards the negative gate-voltage direction.The humps occur at almost the same current levels for devices with different channel widths, which is attributed to the parasitic transistors located at the channel width edges. Therefore, we propose that the positive charges trapped at the backchannel interface cause the negative shift, and the origin of the hump is considered as being due to more positive charges trapped at the edges along the channel width direction. On the other hand, the hump-effect becomes more significant in a short channel device(L = 2 μm). It is proposed that the diffusion of oxygen vacancies takes place from the high concentration source/drain region to the intrinsic channel region.     

Degradation mechanisms for polycrystalline silicon thin-film transistors with a grain boundary in the channel under negative gate bias stress

The negative gate bias stress (NBS) reliability of n-type polycrystalline silicon (poly-Si) thin-film transistors (TFTs) with a distinct defective grain boundary (GB) in the channel is investigated. Results show that conventional NBS degradation with negative shift of the transfer curves is absent. The on-state current is decreased, but the subthreshold characteristics are not affected. The gate bias dependence of the drain leakage current at V_ds of 5.0 V is suppressed, whereas the drain leakage current at V_ds of 0.1 V exhibits obvious gate bias dependence. As confirmed via TCAD simulation, the corresponding mechanisms are proposed to be trap state generation in the GB region, positive-charge local formation in the gate oxide near the source and drain, and trap state introduction in the gate oxide.     

A numerical model for the leakage characteristics in ferroelectric thin films under ionizing radiation

A numerical model is developed to describe the leakage characteristics in ferroelectric thin films under ionizing radiation. The trap-controlled space-charge-limited conduction mechanism is modified by considering radiation-induced charge carriers and changes in the relative dielectric constant. The effect of dose rate is related to the changes in the carrier mobility. Numerical simulation using this model reveals a radiation hardness of 10 Mrad(Si) for barium strontium titanate (BST) thin films at a constant dose rate of 10 Krad(Si)/s. Differences in the leakage behavior under radiation for different conduction regions are also discussed. This model provides a useful tool in predicting the leakage behavior under ionizing radiation and estimating the radiation hardness for ferroelectric materials.     

基于环形栅和半环形栅N沟道金属氧化物半导体晶体管的总剂量辐射效应研究

在商用0.35 μm互补金属氧化物半导体工艺上制备了两种栅氧化层厚度(t_ox)的条形栅、环形栅和半环形栅N沟道金属氧化物半导体 (n-channel metal oxide semiconductor, 简记为NMOS) 晶体管, 并进行了2000 Gy(Si)的总剂量辐射效应实验. 实验结果显示, 栅氧厚度对阈值电压漂移的影响大于栅氧厚度的3次方. 对于t_ox为11 nm的低压NMOS晶体管, 通过环形栅或半环形栅的加固方式能将其抗总剂量辐射能力从300 Gy(Si)提高到2000 Gy(Si)以上; 而对于t_ox为26 nm的高压NMOS晶体管, 通过环栅或半环栅的加固方式, 则只能在低于1000 Gy(Si)的总剂量下, 一定程度地抑制截止漏电流的增加. 作为两种不同的版图加固方式, 环形栅和半环形栅对同一t_ox的NMOS器件加固效果类似, 环形栅的加固效果略优于半环形栅. 对于上述实验结果, 进行了理论分析并阐释了产生这些现象的原因. 关键词： 环形栅 半环形栅 总剂量 辐射效应     

偏置条件对NPN及PNP双极晶体管电离辐射损伤的影响研究

本文采用低能电子辐照源对NPN及PNP晶体管进行辐照试验. 在辐照试验过程中, 针对NPN及PNP晶体管发射结施加不同的偏置条件, 研究偏置条件对NPN及PNP晶体管辐射损伤的影响. 使用Keithley 4200-SCS半导体特性测试仪在原位条件下测试了双极晶体管电性能参数随低能电子辐照注量的变化关系. 测试结果表明, 在相同的辐照注量条件下, 发射结反向偏置时双极晶体管的辐照损伤程度最大; 发射结正向偏置时双极晶体管的辐照损伤程度最小; 发射结零偏时双极晶体管的辐照损伤程度居于上述情况之间. 关键词： 双极晶体管 低能电子 电离辐射