基于AlN膜结构VCSEL热特性的研究(英文)

本文用ANSYS有限元热分析软件模拟了基于AlN膜钝化层和Si O2膜钝化层的高功率垂直腔面发射半导体激光器(VCSEL)器件内部的热场分布和热矢量分布.目的是证明Al N膜钝化层要比SiO2膜钝化层有具更好的特性,使器件能更稳定的工作,提高器件的特性,经模拟得到基于Al N膜钝化层的VCSEL热阻为3.12℃/W,而基于SiO2膜钝化层的VCSEL的热阻为4.77℃/W.经实验测得基于Al N膜钝化层的VCSEL热阻为3.59℃/W而基于SiO2膜钝化层的VCSEL的热阻为4.82℃/W,模拟结果和实验结果吻合较好.说明AlN膜钝化层要比SiO2膜钝化层具有更好的热特性.     

基于AlN膜钝化层VCSEL激光器热特性的研究

 用ANSYS有限元热分析软件模拟了基于AlN膜钝化层和SiO2膜钝化层的高功率垂直腔面发射半导体激光器(VCSEL)器件内部的热场分布和热矢量分布。经模拟得到基于AlN膜钝化层的VCSEL热阻为3.123℃/W,而基于SiO2膜钝化层的VCSEL的热阻为4.377℃/W。经实验测得基于AlN膜钝化层的VCSEL热阻为3.54℃/W,而基于SiO2膜钝化层的VCSEL的热阻为4.75℃/W,模拟结果与实验结果吻合较好。     

808 nm InGaAsP-InP单量子阱激光器热特性研究

从InGaAsP-InP单量子阱激光器结构分析入手，采用自行设计的热封闭系统对808 nm InGaAsP-InP单量子阱激光器热特性进行了研究.实验表明，在23-70℃的温度范围内，器件的功率由1.74 W降到0.51 W，斜率效率由1.08 W/A降到0.51 W/A.实验测得其特征温度T0为325 K.激射波长随温度的漂移dλ/dT为 0.44 nm/℃.其芯片的热阻为3.33℃/W.     

基于拉曼热测量技术的铜基复合物法兰GaN基晶体管的热阻分析

采用拉曼热测量技术结合有限元热仿真模型,分析比较新型铜/石墨复合物法兰封装与传统铜钼法兰封装的GaN器件的结温与热阻,发现前者的整体热阻比铜钼法兰器件的整体热阻低18.7%,器件内部各层材料的温度分布显示铜/石墨复合物法兰在器件中的热阻占比相比铜钼法兰在器件中的热阻占比低13%,这证明使用高热导率铜/石墨复合物法兰封装提高GaN器件热扩散性能的有效性.通过对两种GaN器件热阻占比的测量与分析,发现除了封装法兰以外,热阻占比最高的是GaN外延与衬底材料之间的界面热阻,降低界面热阻是进一步提高器件热性能的关键.同时,详细阐述了使用拉曼光热技术测量GaN器件结温和热阻的原理和过程,展示了拉曼光热技术作为一种GaN器件热特性表征方法的有效性.     

原位等离子体逐层氧化a-Si:H/SiO2多层膜的光致发光研究

采用在等离子体增强化学汽相沉积系统中沉积a-Si:H和原位等离子体逐层氧化的方法制备a-Si:H/SiO2多层膜.改变a-Si:H层的厚度，首次在室温下观察到来自a-Si:H/SiO2多层膜较强的蓝色光致发光和从465到435nm的蓝移.x射线能谱证明，SiO2层是化学配比的SiO2；C-V特性表明，a-Si:H/SiO2界面得到了很好的钝化；透射电子显微镜表明，样品形成了界面陡峭的多层结构.结合光吸收谱和光致发光谱的研究，对其发光机理进行了讨论.用一维量子限制模型对光致发光峰随着a-Si:H层厚度的减小 关键词： a-Si:H/SiO2多层膜 光致发光     

SiO2的赝晶化及AIN/SiO2纳米多层膜的超硬效应

采用反应磁控溅射法制备了一系列不同SiO2 层厚度的A1N/SiO2 纳米多层膜,利用X射线衍射仪、高分辨透射电子显微镜和微力学探针表征了多层膜的微结构和力学性能,研究了SiO2 层在多层膜中的晶化现象及其对多层膜生长方式及力学性能的影响.结果表明,由于受AIN六方晶体结构的模板作用,溅射条件下以非晶态存在的SiO2层在其厚度小于0.6 nm时被强制晶化为与AlN相同的六方结构赝晶体并与AlN形成共格外延生长.由于不同模量的两调制层存在晶格错配度,多层膜中产生了拉、压交变的应力场,使得多层膜产生硬度升高的超硬效应.SiO2随层厚的进一步增加又转变为以非晶态生长,多层膜的外延生长结构受到破坏,其硬度也随之降低.     

AlGaInP-LED微阵列单元的热效应分析

对AlGaInP-LED微型阵列发光单元的内部自发热机制进行了分析,并通过对具有回型上电极的发光单元的理论分析与计算,得到了其内量子效率与注入电流的变化关系及器件温度与所加偏压的变化关系。为保证内量子效率取值范围大于85%,得到了器件的最佳工作电流和最佳驱动电压范围以及微阵列各层结构在最佳驱动电压下的热阻分布。通过计算得出器件在2.2 V电压下,从p-n结到外部环境的有效热阻为96.7 ℃/W。讨论了减小器件热阻的方法,计算得出在理想情况下,添加热沉结构后有效热阻降为30.6 ℃/W,表明所设计的热沉结构对器件的散热起到了明显的改善作用。     

51 V GaN基高压LED的热分析

设计并制备了51 V高压LED。对器件进行了大电流冲击试验并对器件的损毁原因进行了分析。运用有限元分析软件ANSYS对LED关键结构部位进行参数化建模及热分布模拟,得到其稳态的温度场分布;然后经过与红外热像仪成像图对比,得出电极烧毁的原因在于芯粒连接处的电极过薄过窄而导致的电阻过大,为后续设计更可靠的高压LED提供了参考。对芯片分别进行蓝光及色温5 000 K的白光封装,并分别测量了热阻,涂覆荧光粉的白光灯珠的热阻要比没有涂覆荧光粉的蓝光灯珠高约4℃/W。同时,51 V高压LED的热阻比1 W大功率LED要高,说明高压LED的散热性能比常规LED要差,这可能与高压LED具有深沟槽及众多的互联电极结构有关。     

51V GaN基高压LED的热分析

设计并制备了51 V高压LED。对器件进行了大电流冲击试验并对器件的损毁原因进行了分析。运用有限元分析软件ANSYS对LED关键结构部位进行参数化建模及热分布模拟,得到其稳态的温度场分布;然后经过与红外热像仪成像图对比,得出电极烧毁的原因在于芯粒连接处的电极过薄过窄而导致的电阻过大,为后续设计更可靠的高压LED提供了参考。对芯片分别进行蓝光及色温5 000 K的白光封装,并分别测量了热阻,涂覆荧光粉的白光灯珠的热阻要比没有涂覆荧光粉的蓝光灯珠高约4℃/W。同时,51 V高压LED的热阻比1 W大功率LED要高,说明高压LED的散热性能比常规LED要差,这可能与高压LED具有深沟槽及众多的互联电极结构有关。     

Si/SiO2多层膜的Ⅰ-Ⅴ特性研究

用射频磁控溅射法制备了Si/SiO2多层膜,并对多层膜的Ⅰ-Ⅴ特性实验结果进行了拟合.分析表明,Si/SiO2多层膜的Ⅰ-Ⅴ特性由多种因素决定,单一的电流输运模型不能控制Si/SiO2多层膜的Ⅰ-Ⅴ特性,多层膜结构及氧化硅层的厚度是影响薄膜Ⅰ-Ⅴ特性的主要因素.     

Surface passivation in n-type silicon and its application in silicon drift detector

Based on the surface passivation of n-type silicon in a silicon drift detector(SDD), we propose a new passivation structure of SiO2/Al2O3/SiO2 passivation stacks. Since the SiO2 formed by the nitric-acid-oxidation-of-silicon(NAOS)method has good compactness and simple process, the first layer film is formed by the NAOS method. The Al2O3 film is also introduced into the passivation stacks owing to exceptional advantages such as good interface characteristic and simple process. In addition, for requirements of thickness and deposition temperature, the third layer of the SiO2 film is deposited by plasma enhanced chemical vapor deposition(PECVD). The deposition of the SiO2 film by PECVD is a low-temperature process and has a high deposition rate, which causes little damage to the device and makes the SiO2 film very suitable for serving as the third passivation layer. The passivation approach of stacks can saturate dangling bonds at the interface between stacks and the silicon substrate, and provide positive charge to optimize the field passivation of the n-type substrate.The passivation method ultimately achieves a good combination of chemical and field passivations. Experimental results show that with the passivation structure of SiO2/Al2O3/SiO2, the final minority carrier lifetime reaches 5223 μs at injection of 5×10¹⁵ cm^-3. When it is applied to the passivation of SDD, the leakage current is reduced to the order of nA.     

SiO2对多层GaN外延片热应力分布影响的仿真分析

为了研究SiO2对多层结构GaN外延片的热应力的影响,以直径d为40 mm的GaN外延片为研究对象,利用有限元分析法分别对蓝宝石/AlN/GaN和蓝宝石/SiO2/AlN/GaN这两种光阴极组件外延片表面热应力进行理论计算和仿真。在其他结构参数相同的情况下,分别分析了两种光阴极组件外延片径向和厚度方向的应力分布,分析了外延片热应力分布及影响因素。分析结果显示:在1 200 ℃的生长温度下,径向区域内的热应力分布比较均匀,厚度方向的热应力均在衬底和外延层的界面上发生突变。最后分析了外延片生长温度、蓝宝石衬底和GaN、AlN过渡层厚度对表面热应力的影响。     

On the characterization of a new type of oxide-confined 850 nm GaAs-based vertical-cavity surface-emitting laser

Using simulation tools, results are presented for a new type of oxide-confined vertical-cavity surface-emitting laser (VCSEL) to be operated at 850 nm region of the electromagnetic spectrum. The structural details for the device are illustrated. The novelty of the device lies in that the low-doped DBR layers as well as the barrier reduction layers within the DBRs are introduced for the device fabrication, which finally provide much better efficiency of the proposed VCSEL structure. Simulations have been performed for the analyses of several features of the VCSEL that primarily govern the operational characteristics of the device. A very small deviation from the proposed structure will essentially affect the features of the output light.     

Effects of an AlN passivation layer on the microstructure and electronic properties of AlGaN/GaN heterostructures

Effects of an AlN passivation layer on the microstructure and electronic properties of AlGaN/GaN heterostructures were investigated by X-ray diffraction and Hall effect measurements. AlN passivation induced an additional compressive stress in an AlGaN barrier layer instead of an additional tensile stress induced by Si₃N₄ passivation. The change of strain after passivation contributes in a relatively small proportion to the variation of the carrier concentration in AlGaN/GaN heterostructures compared with the contribution from passivation of surface traps. The results from Hall effect measurements show that the AlN passivation layer has a better effect on passivation of deep levels than the Si₃N₄ film and also results in a remarkable increase in mobility of the two-dimensional electron gas. PACS 73.40.Kp; 71.55.Eq; 81.65.Rv; 81.05.Ea; 61.05.cp     

Enhanced thermal stability of VCSEL array by thermoelectric analysis-based optimization of mesas distribution

The thermal stability of a vertical-cavity surface-emitting laser(VCSEL) array is enhanced by redesigning the mesa arrangement. Based on a thermoelectric coupling three-dimensional(3D) finite-element model, an optimized VCSEL array is designed. The effects of this optimization are studied experimentally. Power density characteristics of VCSEL arrays with different mesa configuration are obtained under different thermal stress in which the optimized device shows improved performance. Optimized device also shows better stability from measured spectra and calculated thermal resistances. The experimental results prove that our simulation model and optimization is instructive for VCSEL array design.     

具有二氧化硅温度补偿层的薄膜体声波谐振器的建模与分析（英）

薄膜体声波谐振器(FBAR)的谐振频率会受到外界环境温度的影响而产生漂移,对于FBAR滤波器而言,这种温度-频率漂移特性会导致其中心频率、插入损耗、带内纹波等性能发生变化,降低其在电学应用中的可靠性。应用ANSYS有限元分析软件,对一个典型Mo-AlN-Mo三层结构的FBAR进行了温度-频率漂移特性的仿真,得到其在［－50 ℃, 150 ℃］温度范围内的频率温度系数(TCF)约为－3510－6/℃。在FBAR叠层薄膜结构中添加了一层具有正温度系数的二氧化硅温度补偿层,分析了该补偿层厚度对FBAR的温度-频率漂移特性、谐振频率和机电耦合特性的影响。设计了具有一层二氧化硅温度补偿层的FBAR叠层,由Mo/AlN/SiO2/Mo多层薄膜构成,仿真得到其频率温度系数为0.87210－6/℃;与没有温度补偿层的FBAR相比,温度稳定性得以显著改善。关键词: Abstract: Key words:     

高速850 nm垂直腔面发射激光器的优化设计与外延生长

利用传输矩阵理论和TFCalc薄膜设计软件分析了分布布拉格反射镜和垂直腔面发射激光器(VCSEL)的反射率谱特性,对比了从谐振腔入射与从表面入射时反射率谱的差异,为白光反射谱表征VCSEL外延片提供了依据.利用Crosslight软件模拟了InGaAs/AlGaAs应变量子阱的增益谱随温度的变化特性及VCSEL器件内部温度分布,设计了增益-腔模调谐的VCSEL.采用金属有机物化学气相淀积设备外延生长了顶发射VCSEL,制作了氧化孔径为7.5μm的氧化限制型VCSEL器件,测试了器件的直流特性、光谱特性和眼图特性;6 mA,2.5 V偏置条件下输出光功率达5 mW,4级脉冲幅度调制传输速率达50 Gbit/s.     

Nonpolar a-plane GaN grown on r-plane sapphire using multilayer AlN buffer by metalorganic chemical vapor deposition

Mirror-like and pit-free non-polar a-plane (1 1 −2 0) GaN films are grown on r-plane (1 −1 0 2) sapphire substrates using metalorganic chemical vapor deposition (MOCVD) with multilayer high-low-high temperature AlN buffer layers. The buffer layer structure and film quality are essential to the growth of a flat, crack-free and pit-free a-plane GaN film. The multilayer AlN buffer structure includes a thin low-temperature-deposited AlN (LT-AlN) layer inserted into the high-temperature-deposited AlN (HT-AlN) layer. The results demonstrate that the multilayer AlN buffer structure can improve the surface morphology of the upper a-plane GaN film. The grown multilayer AlN buffer structure reduced the tensile stress on the AlN buffer layers and increased the compressive stress on the a-plane GaN film. The multilayer AlN buffer structure markedly improves the surface morphology of the a-plane GaN film, as revealed by scanning electron microscopy. The effects of various growth V/III ratios was investigated to obtain a-plane GaN films with better surface morphology. The mean roughness of the surface was 1.02 nm, as revealed by atomic force microscopy. Accordingly, the multilayer AlN buffer structure improves the surface morphology and facilitates the complete coalescence of the a-plane GaN layer.