石墨片作辅助热沉的高功率半导体激光器热传导特性

为使边发射高功率单管半导体激光器有源区温度降低,增加封装结构的散热性能,降低器件封装成本,提出一种采用高热导率的石墨片作为辅助热沉的高功率半导体激光器封装结构。利用有限元分析研究了采用石墨片作辅助热沉后,封装器件的工作热阻更低,散热效果更好。研究分析过渡热沉铜钨合金与辅助热沉石墨的宽度尺寸变化对半导体激光器有源区温度的影响。新型封装结构与使用铜钨合金作为过渡热沉的传统结构相比,有源区结温降低4.5 K,热阻降低0.45 K/W。通过计算可知,激光器的最大输出功率为20.6 W。在研究结果的指导下,确定铜钨合金与石墨的结构尺寸,以达到最好的散热效果。     

Al/GaN/Al_2O_3微纳米多层结构界面热阻实验重构

通过GaN基微纳米器件中纳米尺度界面的热输运成为微系统热管理和热设计的热点和难点,而通过GaN/Al_2 O_3之间界面热阻尚未测试。首先采用双波长TDTR方法测量了Al膜与GaN薄膜之间的界面热阻,然后借助热阻抗网络和参数敏感性分析,利用宽频3ω法对Al/GaN/Al_2 O_3多层薄膜结构内部界面热阻进行实验重构。两种方法测量的GaN/Al_2 O_3之间界面热阻量级相同,相互验证了测试结果的合理性。两种方法结合可实现微纳米多层结构多个热物性参数的精细描述。     

AlGaN/GaN 高速电子迁移率晶体管器件电流坍塌效应与界面热阻和温度的研究

本文系统研究了AlGaN/GaN基高速电子迁移率晶体管器件界面热阻和工作温度对器件在高功率下的电流坍塌效应的影响规律.研究发现低漏极电压下热电子是导致负微分输出电导的重要因素,器件工作温度变高会使负微分输出电导减小.高漏极电压下自加热效应是导致电流坍塌的一个重要因素.随着界面热阻的增加,器件跨导降低,阈值电压增大.同时,由于工作环境温度的增高,器件随之温度增高,载流子迁移率会显著降低. 最终这两种因素会引起AlGaN/GaN基高速电子迁移率晶体管器件显著的电流坍塌效应,从而降低了器件整体性能. 关键词： AlGaN/GaN HEMT 器件 热电子效应 自加热效应 电流坍塌效应     

加载功率与壳温对AlGaN/GaN高速电子迁移率晶体管器件热阻的影响

结温是制约器件性能和可靠性的关键因素, 通常利用热阻计算器件的工作结温. 然而, 器件的热阻并不是固定值, 它随器件的施加功率、温度环境等工作条件的改变而变化. 针对该问题, 本文以CREE公司生产的高速电子迁移率晶体管(HEMT)器件为研究对象, 利用红外热像测温法与Sentaurus TCAD模拟法相结合, 测量研究了AlGaN/GaN HEMT器件在不同加载功率以及管壳温度下热阻的变化规律. 研究发现: 当器件壳温由80 ℃升高至130 ℃时, 其热阻由5.9 ℃/W变化为6.8 ℃/W, 增大15%, 其热阻与结温呈正反馈效应; 当器件的加载功率从2.8 W增加至14 W时, 其热阻从5.3 ℃/W变化为6.5 ℃/W, 增大22%. 对其热阻变化机理的研究发现: 在不同的管壳温度以及不同的加载功率条件下, 由于材料导热系数的变化导致其热阻随温度与加载功率的变化而变化.     

大功率LED纳米银烧结界面热阻和发光性能

利用纳米银烧结工艺制备大功率LED,重点探究了纳米银键合层的界面热阻及器件发光性能。通过将纳米银膏在不同温度下烧结,系统地研究了烧结温度对纳米银烧结后电阻率及接头剪切强度的影响,并分析了烧结后银膏的晶体结构及接头断口微观形貌。结果表明,接头键合强度和银膜导电率均随纳米银烧结温度的升高而增大。实验中还对比分析了纳米银烧结LED和传统锡银铜（SAC305）焊膏封装LED的界面热阻、结温以及发光性能。与纳米银烧结LED样品相比,传统焊膏封装LED的界面热阻和结温分别提高了8.9%和29.6%,说明纳米银键合层拥有更好的导热性并可及时为芯片散热降温。此外,通过高温老化实验,深入探讨了不同焊膏烧结LED的界面热阻及发光效率变化。实验表明,经过100℃下点亮500 h,纳米银和传统焊膏烧结LED样品的总热阻分别增大了0.03 K/W和4.28 K/W,但纳米银键合层界面热阻比老化前有所降低,同时纳米银烧结LED样品在不同电流下的发光效率始终高于传统焊膏封装LED样品。     

AIGaN／GaN高速电子迁移率晶体管器件电流坍塌效应与界面热阻和温度的研究

本文系统研究了A1GaN／GaN基高速电子迁移率晶体管器件界面热阻和工作温度对器件在高功率下的电流坍塌效应的影响规律．研究发现低漏极电压下热电子是导致负微分输出电导的重要因素,器件工作温度变高会使负微分输出电导减小．高漏极电压下自加热效应是导致电流坍塌的一个重要因素．随着界面热阻的增加,器件跨导降低,阂值电压增大．同时,由于工作环境温度的增高,器件随之温度增高,载流子迁移率会显著降低．最终这两种因素会引起A1GaN／GaN基高速电子迁移率晶体管器件显著的电流坍塌效应,从而降低了器件整体性能．     

GaN基异质结缓冲层漏电分析

通过对GaN基异质结材料C-V特性中耗尽电容的比较,得出AlGaN/GaN异质结缓冲层漏电与成核层的关系.实验结果表明,基于蓝宝石衬底低温GaN成核层和SiC衬底高温AlN成核层的异质结材料比基于蓝宝石衬底低温AlN成核层异质结材料漏电小、背景载流子浓度低.深入分析发现,基于薄成核层的异质结材料在近衬底的GaN缓冲层中具有高浓度的n型GaN导电层,而基于厚成核层的异质结材料的GaN缓冲层则呈高阻特性.GaN缓冲层中的n型导电层是导致器件漏电主要因素之一,适当提高成核层的质量和厚度可有效降低GaN缓冲层的背景载流子浓度,提高GaN缓冲层的高阻特性,抑制缓冲层漏电. 关键词： AlGaN/GaN异质结 GaN缓冲层 漏电 成核层     

C-mount封装激光器热特性分析与热沉结构优化研究

为了降低单管半导体激光器的结温、提高器件的散热效果,基于C-mount热沉的热特性分析提出了一种优化的台阶热沉结构,研究了单管激光器结温和腔面侧向温度分布曲线的影响。在热沉温度298 K和连续输出功率10 W的条件下,腔长为1.5 mm的典型C-mount封装结构激光器的结温为343.6 K,热阻为4.6 K/W。通过在典型C-mount热沉中引入台阶结构,使封装激光器的结温降低为333.8 K,热阻减小到3.5 K/W。计算表明,其输出功率可提高近20%。     

微纳米电子器件散热过程中的物理问题

微纳米电子器件的散热问题是目前制约半导体工业发展的重要瓶颈.将电子器件工作时产生的热量传输到封装外壳后再耗散到环境中去需要好几个步骤,每个步骤需要不同的方法,其中有些步骤涉及到了固体中的界面热传导问题和高性能导热材料.文章先介绍了近期关于微纳米尺度器件散热问题中碰到的热传导问题在理论和实验两方面的研究进展.在热传导理论和计算方法方面,作者讨论了傅里叶定律在微纳米尺度的适用性,介绍了玻尔兹曼方程、分子动力学模拟和格林函数方法.在热传导实验方面,介绍了用扫描热显微镜测量样品表面温度和用超快激光反射法测量薄膜材料的热导率及其界面热阻.然后介绍了界面热传导问题,包括界面热阻的计算以及电子—声子相互作用对界面热阻的影响.最后作者介绍了关于高性能导热材料方面的最新进展,包括碳基导热材料、晶格结构类似于石墨烯的氮化硼材料、高分子有机材料以及界面热阻材料.     

GaN基白光发光二极管失效机理分析

对小功率白光GaN基发光二极管(LED)在室温、40 ℃和70 ℃下进行温度加速老化寿命实验,通过对老化前后不同时间段器件的电学、光学和热学特性进行测量来分析器件的失效机理,着重分析器件的芯片和荧光粉的失效机理.器件老化前后的I-V特性表明:老化过程中,器件的串联电阻和低正向偏压下的隧道电流增大,这是由于器件工作时其芯片的欧姆接触退化和半导体材料的缺陷密度升高而引起的.器件的热特性表明:高温度应力下器件的热阻迅速变大,封装材料迅速退化,这是器件退化的主要原因;光谱曲线表明温度加速了器件的     

Evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistors by structure function method

The evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistor (HEMT) by structure function method is proposed in this paper.The evaluation is based on the transient heating measurement of the AlGaN/GaN HEMT by pulsed electrical temperature sensitive parameter method.The extracted chip-level and package-level thermal resistances of the packaged multi-finger AlGaN/GaN HEMT with 400-μm SiC substrate are 22.5 K/W and 7.2 K/W respectively,which provides a non-invasive method to evaluate the chip-level thermal resistance of packaged AlGaN/GaN HEMTs.It is also experimentally proved that the extraction of the chiplevel thermal resistance by this proposed method is not influenced by package form of the tested device and temperature boundary condition of measurement stage.     

氮化镓基感光栅极高电子迁移率晶体管器件设计与制备

GaN基高电子迁移率晶体管(HEMT)作为栅控器件,具有AlGaN/GaN异质结处高浓度的二维电子气(2DEG)及对表面态敏感等特性,在栅位置处与感光功能薄膜的结合是光探测器领域重要的研究方向之一.本文首先提出在GaN基HEMT栅电极上引入光敏材料锆钛酸铅(PZT),将具有光伏效应的铁电薄膜PZT与HEMT栅极结合,提出一种新的"金属/铁电薄膜/金属/半导体(M/F/M/S)"结构;然后在以蓝宝石为衬底的AlGaN/GaN外延片上制备感光栅极HEMT器件.最后,通过PZT的光伏效应来调控沟道中的载流子浓度和通过源漏电流的变化来实现对可见光和紫外光的探测.在365 nm紫外光和普通可见光条件下,对比测试有/无感光栅极的HEMT器件,在较小V_(gs)电压时,可见光下测得前者较后者的饱和漏源电流I_(ds)的增幅不下降,紫外光下前者较后者的I_(ds)增幅大5.2 mA,由此可知,感光栅PZT在可见光及紫外光下可作用于栅极GaN基HEMT器件并可调控沟道电流.     

Improvement of breakdown characteristics of an A1GaN/GaN HEMT with a U-type gate foot for millimeter-wave power application

<正>In this study,the physics-based device simulation tool Silvaco ATLAS is used to characterize the electrical properties of an AlGaN/GaN high electron mobility transistor(HEMT) with a U-type gate foot.The U-gate AlGaN/GaN HEMT mainly features a gradually changed sidewall angle,which effectively mitigates the electric field in the channel, thus obtaining enhanced off-state breakdown characteristics.At the same time,only a small additional gate capacitance and decreased gate resistance ensure excellent RF characteristics for the U-gate device.U-gate AlGaN/GaN HEMTs are feasible through adjusting the etching conditions of an inductively coupled plasma system,without introducing any extra process steps.The simulation results are confirmed by experimental measurements.These features indicate that U-gate AlGaN/GaN HEMTs might be promising candidates for use in miltimeter-wave power applications.     

A unified drain current 1/f noise model for GaN-based high electron mobility transistors

In this work, we present a theoretical and experimental study on the drain current 1/f noise in the AIGaN/GaN high electron mobility transistor （HEMT）. Based on both mobility fluctuation and carrier number fluctuation in a two- dimensional electron gas （2DEG） channel of AlGaN/GaN HEMT, a unified drain current 1/f noise model containing a piezoelectric polarization effect and hot carrier effect is built. The drain current 1/f noise induced by the piezoelectric polarization effect is distinguished from that induced by the hot carrier effect through experiments and simulations. The simulation results are in good agreement with the experimental results. Experiments show that after hot carrier injection, the drain current 1/f noise increases four orders of magnitude and the electrical parameter degradation Agm/gm reaches 54.9%. The drain current 1/f noise degradation induced by the piezoelectric effect reaches one order of magnitude; the electrical parameter degradation Agm/gm is 11.8%. This indicates that drain current 1/f noise of the GaN-based HEMT device is sensitive to the hot carrier effect and piezoelectric effect. This study provides a useful reliability characterization tool for the A1GaN/GaN HEMTs.     

基于GaN同质衬底的高迁移率AlGaN/GaNHEMT材料

研究了表面预处理对GaN同质外延的影响,获得了高电子迁移率AlGaN/GaN异质结材料.通过NH_3/H_2混合气体与H_2交替通入反应室的方法对GaN模板和GaN半绝缘衬底进行高温预处理.研究结果表明,NH_3/H_2能够抑制GaN的分解,避免粗糙表面,但不利于去除表面的杂质,黄光带峰相对强度较高;H_2促进GaN分解,随时间延长GaN分解加剧,导致模板表面粗糙不平,AlGaN/GaN HEMT材料二维电子气迁移率降低.采用NH_3/H_2混合气体与H_2交替气氛模式处理模板或衬底表面,能够清洁表面,去除表面杂质,获得平滑的生长表面和外延材料表面,有利于提高AlGaN/GaN HEMT材料电学性能.在GaN衬底上外延AlGaN/GaN HEMT材料,2DEG迁移率达到2113 cm~2/V·s,电学性能良好.     

Simulation design of normally-off AlGaN/GaN high-electron-mobility transistors with p-GaN Schottky hybrid gate

A novel normally-off AlGaN/GaN high-electron-mobility transistor (HEMT) with a p-GaN Schottky hybrid gate (PSHG) is proposed, and compared with the conventional p-GaN normally-off AlGaN/GaN HEMTs. This structure can be realized by selective etching of p-GaN layer, which enables the Schottky junction and PN junction to control the channel charge at the same time. The direct current (DC) and switching characteristics of the PSHG HEMTs are simulated by Slivaco TCAD, and the p-GaN HEMTs and conventional normally-on HEMTs are also simulated for comparison. The simulation results show that the PSHG HEMTs have a higher current density and a lower on-resistance than p-GaN HEMTs, which is more obvious with the decrease of p-GaN ratios of the PSHG HEMTs. The breakdown voltage and threshold voltage of the PSHG HEMTs are very close to those of the p-GaN HEMTs. In addition, the PSHG HEMTs have a higher switching speed than the conventional normally-on HEMTs, and the p-GaN layer ratio has no obvious effect on the switching speed.     

Characteristics of AlGaN/GaN high electron mobility transistors on metallic substrate

We have successfully prepared GaN based high electron mobility transistors(HEMTs)on metallic substrates transferred from silicon substrates by electroplating technique.GaN HEMTs on Cu substrates are demonstrated to basically have the same good electric characteristics as the chips on Si substrates.Furthermore,the better heat dissipation of HEMTs on Cu substrates compared to HEMTs on Si substrates is clearly observed by thermoreflectance imaging,showing the promising potential for very high-power and high-temperature operation.This work shows the outstanding ability of HEMT chips on Cu substrates for solving the self-heating effect with the advantages of process simplicity,high yield,and low production requirement.     

阶梯AlGaN外延新型Al0.25Ga0.75N/GaNHEMTs器件实验研究

本文报道了作者提出的阶梯AlGaN外延层新型AlGaN/GaN HEMTs结构的实验结果. 实验利用感应耦合等离子体刻蚀(ICP)刻蚀栅边缘的AlGaN外延层, 形成阶梯的AlGaN 外延层结构, 获得浓度分区的沟道2DEG, 使得阶梯AlGaN外延层边缘出现新的电场峰, 有效降低栅边缘的高峰电场, 从而优化了AlGaN/GaN HEMTs器件的表面电场分布. 实验获得了阈值电压-1.5 V的新型AlGaN/GaN HEMTs器件. 经过测试, 同样面积的器件击穿电压从传统结构的67 V提高到新结构的106 V, 提高了58%左右; 脉冲测试下电流崩塌量也比传统结构减少了30%左右, 电流崩塌效应得到了一定的缓解.     

High-field-induced electron detrapping in An AlGaN/GaN high electron mobility transistor

A step stress test is carried out to study the reliability characteristics of an AlGaN/GaN high electron mobility transistor(HEMT).An anomalous critical drain-to-gate voltage with a negative temperature coefficient is observed in the stress sequence,beyond which the HEMT device starts to recover from degradation induced by early lower voltage stress.While the performance degradation featuring the drain current slump stems from electron trapping in the surface or bulk states during low-to-medium bias stress,the recovery is attributed to high field induced electron detrapping.The carrier detrapping mechanism could be helpful for lessening the trapping-related performance degradation of a GaN-based HEMT.