6H碳化硅衬底上硅碳锗薄膜的生长特性研究

采用低压热壁化学气相沉积法,在6H-SiC衬底(0001)面上生长了不同温度(1100—1250℃),不同GeH₄流量比(6.3%—25%)的SiCGe薄膜样品,研究了SiCGe薄膜的表面形貌、生长特性以及样品中Ge组分含量的变化. 扫描电镜测试结果表明,SiCGe薄膜在低温下倾向于岛状生长模式,随着生长温度提高,岛状生长逐渐过渡到层状生长模式,同时伴有岛形状和密度的变化. X射线光电子能谱测试得出SiCGe样品中的Ge含量约为0.15％—0.62％,在其他参数不变的情况下,样品的G 关键词： 碳化硅 化学气相沉积 反相边界 岛状生长     

CHN薄膜的制备方法与工艺研究

 采用空心阴极等离子化学气相沉积方法，以NH₃/H₂的混合气体及CH4气体为原料反应气体，成功地制备了非晶的CHN薄膜，研究了CHN薄膜的沉积速率与直流电压及反应气体流量的关系。同时用X射线光电子能谱(XPS)确定了不同条件下薄膜中N原子的百分比，用原子力显微镜(AFM)对薄膜的表面粗糙度及表面形貌进行了测量和表征。结果表明：薄膜中N原子的百分比最大为12%，薄膜的表面结构光滑、致密，表面粗糙度小于1 nm。     

Ge-Sb-Se硫系薄膜制备及光学特性研究

介绍了几种常见的硫系薄膜制备方法, 根据现有实验条件采用热蒸发法和磁控溅射法制备出Ge-Sb-Se三元体系硫系薄膜, 通过台阶仪测试薄膜的厚度和表面粗糙度, 计算出两种制备方法的成膜速率, 并通过X射线光电子能谱测试了两种制备方法所得薄膜与块体靶材组分的差别. 利用Z扫描技术和分光光度计测试了热蒸发法制备所得薄膜的三阶非线性性能和透过光谱, 计算出非线性折射率、非线性吸收系数和薄膜厚度等参数. 结果表明热蒸发法制备Ge-Sb-Se薄膜具有良好的物理结构和光学特性, 在集成光学器件方面很高的应用潜力.     

靶压对磁控溅射GeC薄膜折射率的影响

采用磁控溅射技术,以碳氢气体和氩气为工作气体,在Ge基底上制备了GeC薄膜。研究了靶压对薄膜折射率的影响,发现在较高的靶压下制备的GeC薄膜具有较低的折射率,而在较低的靶压下则得到了高折射率的薄膜。通过控制溅射靶压,制备了折射率在2．5～3．8之间可变的GeC薄膜。利用拉曼光谱研究了GeC薄膜的结构。薄膜样品的硬度测试表明,较低折射率的GeC薄膜具有较高的硬度。     

一种新型硅基3C-SiC的生长方法及光谱学表征

采用LPCVD技术, 以CH4和H2混合气体为反应源气, 在n-Si（111）衬底上生长3C-SiC晶体薄膜。H2在反应过程中作为稀释气体和运输气体, CH4作为碳源, 硅源有衬底硅来提供。利用X射线衍射分析仪、场发射扫描电子显微镜、激光拉曼光谱和傅里叶变换红外光谱分别研究3C-SiC薄膜的晶相结构、表面形貌及其光谱性质。结果表明此生长方法可以成功的成长出3C-SiC薄膜。     

低温等离子体增强化学气相沉积法制备Ge反opal三维光子晶体及其光学性能

通过溶剂蒸发对流自组装法制备SiO2三维有序胶体晶体模板,采用等离子体增强化学气相沉积法在200℃低温条件下填充高折射率材料Ge,获得了Ge反opal三维光子晶体.实现了低于GeH4热分解温度的低温填充.通过扫描电镜、X射线衍射仪和傅里叶变换显微红外光谱仪对Ge反opal的形貌、成分和光学性能进行了表征.结果表明:沉积得到无定型态Ge,退火后形成多晶Ge,Ge在SiO2微球空隙内填充致密均匀.Ge反opal的反射光谱有明显的光学反射峰,表现出光子带隙效应,其带隙中心波长为1650nm和2640nm,测试的光学性能与理论计算基本符合.采用SU-8光刻胶薄膜也进行了Ge沉积,证实了SU-8模板可以耐受这一沉积温度.低温沉积降低了Ge的填充温度,可以直接采用不耐高温的高分子材料作为初始模板,单次复型制备得到多种构型的完全带隙三维光子晶体.     

微波等离子体化学气相沉积法制备C3N4薄膜的结构研究

采用微波等离子体化学气相沉积法,用高纯氮气（99．999％）和甲烷（99．9％）作反应气体,在单晶Si(100)基片上沉积C3N4薄膜,利用扫描电子显微镜观察薄膜形貌,表明薄膜由密排的六棱晶棒组成,X射线衍射和透射电子显微镜结构分析说明该薄膜主要由β－C3N4和α－C3N4组成,并且这些结果与a-C3N4相符合较好,由虎克定律近似关系式计算了α－和β－C3N4的傅里叶变换红外光谱和Raman光谱,实验结果支持C－N共价键的存在。     

电子束蒸发制备HfO2高k薄膜的结构特性

使用高真空电子束蒸发在p型Si（100）衬底上制备了高k HfO2薄膜.俄歇电子能谱证实薄膜组分符合化学配比；x射线衍射测量表明刚沉积的薄膜是近非晶的，高温退火后发生部分晶化；原子力显微镜和扫描电子显微镜检测显示在高温退火前后薄膜均具有相当平整的表面，表明薄膜具有优良的热稳定性；椭偏测得在600?nm处薄膜折射率为2.09；电容电压测试得到的薄膜介电常数为19.这些特性表明高真空电子束蒸发是一种很有希望的制备作为栅介质的HfO2薄膜的方法. 关键词： 高k薄膜 HfO2 电子束蒸发     

Zn1-xCoxO稀磁半导体薄膜的结构及其磁性研究

利用X射线吸收精细结构、X射线衍射和磁性测量等技术研究脉冲激光气相沉积法制备的Zn1-zCoxO(x=0.01,0.02)稀磁半导体薄膜的结构和磁性.磁性测量结果表明Zn1-xCoxO样品都具有室温铁磁性.X射线衍射结果显示其薄膜样品具有结晶良好的纤锌矿结构.荧光X射线吸收精细结构测试结果表明,脉冲激光气相沉积法制备的样品中的Co离子全部进入ZnO晶格中替代了部分Zn的格点位置,生成单一相的Zn1-xCoxO稀磁半导体.通过对X射线吸收近边结构谱的分析,确定Zn1-xCoxO薄膜中存在O空位,表明Co离子与O空位的相互作用是诱导Zn1-xCoxO产生室温铁磁性的主要原因.     

脉冲高能量密度等离子体沉积(Ti,Al)N薄膜组织及其性能研究

利用脉冲高能量密度等离子体技术在室温条件下在45＃钢基材表面沉积了高硬度耐腐蚀(Ti, Al)N薄膜. 利用扫描电子显微镜、X射线衍射、X射线光电子能谱、俄歇电子能谱分析了薄膜的显微组织.利用纳米压痕仪测试了薄膜的纳米硬度.测试了薄膜在05mol/L H2SO4水溶液中的耐蚀性. 测试结果表明：薄膜主要组成相为(Ti, Al)N，同时含有少量的AlN,薄膜的纳米硬度高达26 GPa,薄膜具有良好的耐蚀性，与1Cr18Ni9Ti奥氏体不锈钢相比，耐蚀性提高了一个数量级. 关键词： 脉冲高能量密度等离子体 薄膜 纳米硬度 耐蚀性     

霍尔离子源辅助制备长波红外碳化锗增透膜

为了提高锗基底的透过率和环境适应性,镀制了增透保护膜。应用电子枪蒸发加霍尔离子源辅助的方法沉积了碳化锗(Ge_1-xC_x)薄膜。通过固定霍尔离子源参数,控制沉积速率的工艺得到了不同光学常数的碳化锗薄膜。X射线衍射(XRD)测试表明,所制备的碳化锗薄膜在不同的沉积速率下均为无定形结构。采用傅立叶变换红外(FTIR)光谱仪测量了试片的透过率,使用包络法获得了相应工艺条件下的光学常数。在锗基底上双面镀制碳化锗增透膜后,长波红外7.5～11.5 μm波段的平均透过率T_ave>85%。经过环境实验之后的碳化锗膜层完好,证明碳化锗增透膜具有良好的环境适应性。     

低磁控溅射率MCP防离子反馈膜工艺研究

为消除反馈正离子对三代微光夜视器件光阴极的有害轰击,提高微光像增强器的工作寿命,开展了低磁控溅射率法沉积微通道板（MCP）Al₂O₃防离子反馈膜的工艺研究。通过优化制备工艺,获得了制备MCP防离子反馈膜的最佳沉积条件：溅射电压1000V,溅射气压(4～5)×10^-2 Pa,沉积速率0.5nm/min等。研究结果表明：在此工艺条件下,能够制备出均匀、致密且通孔满足质量要求的MCP防离子反馈膜。如果偏离这一最佳工艺条件,制备出的MCP防离子反馈膜膜层疏松、不连续,且通孔不能满足要求。     

双离子束溅射沉积薄膜的光学特性与激光损伤研究

对氧化物薄膜的双离子束溅射沉积作用了系统地实验研究。考察了离子束溅射工艺参数对薄膜光学特性的影响。制备了折射率接近于块材料的ＴｉＯ２和ＺｒＯ２薄膜，显著降低了ＴｉＯ２，ＺｒＯ２和ＳｉＯ２薄膜的光吸收损耗，ＴｉＯ２和ＺｒＯ２薄膜的抗激光损伤阈值得到显著提高。用双离束溅射沉积１．０６μｍ多层高反，是到了大于９９．５％的高反射率，经高温退火处理的双离子束溅射沉积高反膜的抗激光损伤阈值同热蒸发沉积的高反膜     

Raman spectra and XPS studies of phase changes in Ge2Sb2Te5 films

Ge_2Sb_2Te_5 film was deposited by RF magnetron sputtering on Si (100) substrate. The structure of amorphous and crystalline Ge_2Sb_2Te_5 thin films was investigated using XRD, Raman spectra and XPS. XRD measurements revealed the existence of two different crystalline phases, which has a FCC structure and a hexagonal structure, respectively. The broad peak in the Raman spectra of amorphous Ge_2Sb_2Te_5 film is due to the amorphous －Te－-Te－ stretching. As the annealing temperature increases, the broad peak separates into two peaks, which indicates that the heteropolar bond in GeTe_4 and the Sb－Sb bond are connected with four Te atoms, and other units such as (TeSb) Sb－Sb (Te_2) and (Sb_2) Sb－Sb (Te_2), where some of the four Te atoms in the above formula are replaced by Sb atoms, remain in crystalline Ge_2Sb_2Te_5 thin film. And from the results of Raman spectra and XPS, higher the annealing temperature, more Te atoms bond to Ge atoms and more Sb atoms substitute Te in (Te_2) Sb－Sb (Te_2).     

Some features of chalcohalide glassy Ge–S–AgI thin films

Novel amorphous bulk materials from the chalcohalide Ge–S–AgI system were synthesized. From the as-prepared materials, thin amorphous films were evaporated by conventional thermal evaporation in vacuum onto different substrates. The amorphous nature of the bulk and layered materials was proved using X-ray diffraction.The morphology and uniformity of the deposited layers were investigated using scanning electron microscopy; the surface topology and roughness were studied by atomic force microscopy.The compositional dependence of the microhardness of the studied thin chalcohalide coatings was established and the influence of the third component (AgI) was determined.Stress measurements of the thin films deposited on special silicon cantilevers were performed in a period of 3 months and the relation between AgI content and stress was defined. In addition, the compositional dependence of the stress relaxation of the studied glassy Ge–S–AgI coatings was elucidated and the most probable reasons for the stress formation were proposed.     

电子束、离子辅助和离子束溅射三种工艺对光学薄膜性能的影响

 运用电子束、离子辅助和离子束溅射三种镀膜工艺分别制备光学薄膜，包括单层氧化物薄膜和增透膜，然后采取一系列测试手段，如Zygo轮廓仪、原子力显微镜、表面热透镜技术和X射线衍射等技术，来分析和研究不同的工艺对这些薄膜性能的不同影响，以判断合理的沉积工艺。     

格兰泰勒棱镜高性能宽带减反射膜的优化设计及性能测试

格兰泰勒棱镜在光学领域有着重要的应用,透过比的高低和有效带宽的大小,直接影响着棱镜的品质.为了提高棱镜的透射率,拓宽有效使用带宽,借助于计算机辅助设计方法,设计了高性能多层减反射膜系:选用合适的光学薄膜材料,利用电子束蒸镀,借助于离子源辅助蒸镀,制作了高性能的宽带减反射膜.测试结果表明:平均剩余反射率小于0.5%,有效使用带宽在可见光区大于100 nm,达到了设计要求,提升了棱镜的品质.     

Ultra-smooth metal surfaces generated by pressure-induced surface deformation of thin metal films

We present a mechanical pressing technique for generating ultra-smooth surfaces on thin metal films by flattening the bumps, asperities, rough grains and spikes of a freshly vacuum deposited metal film. The method was implemented by varying the applied pressure from 100 MPa to 600 MPa on an e-beam evaporated silver film of thickness 1000 Å deposited on double-polished (100)-oriented silicon surfaces, resulting in a varying degree of film smoothness. The surface morphology of the thin film was studied using atomic force microscopy. Notably, at a pressure of ～600 MPa an initial silver surface with 13-nm RMS roughness was plastically deformed and transformed to an ultra-flat plane with better than 0.1 nm RMS. Our demonstration with the e-beam evaporated silver thin film exhibits the potential for applications in decreasing the scattering-induced losses in optical metamaterials, plasmonic nanodevices and electrical shorts in molecular-scale electronic devices.     

溶胶-凝胶法制备高折射率TiO2薄膜

 采用溶胶- 凝胶法制备了TiO₂纳米晶溶胶,并以旋涂法（spin-coating）镀制了高折射率光学薄膜。借助光散射技术和透射电镜研究了溶胶的微结构。采用原子力显微镜、场发射扫描电镜、紫外-可见-近红外光谱仪、椭偏仪、漫反射吸收光谱及强激光辐照实验,对膜层的结构、光学性能及抗激光损伤性能进行了系统的表征。结果显示:纳米晶薄膜的折射率达到了1.9,而传统的溶胶-凝胶薄膜折射率只有1.6;同时纳米晶薄膜的抗激光损伤阈值与传统的溶胶-凝胶薄膜相差不大,在1 064 nm处分别为16.3 J/cm²(3 ns脉冲) 和16.6 J/cm²(3 ns脉冲);纳米晶溶胶薄膜可以在保持较高抗激光损伤阈值情况下,大幅度提高薄膜折射率。     

Grain size of nanocrystalline YSZ buffer layers fabricated by ion beam deposition

Amorphous or nanocrystalline thin films are capable to be efficient diffusion barrier layers for YBCO coated conductors of ion beam assisted deposition route. Nanocrystalline Yttria-Stabilized Zirconia (YSZ) buffer layers were fabricated by the ion beam deposition. Kr and Ar gases were utilized for the dual Kaufman type sputtering ion sources sequently. Both of the ion beams were fixed at 200 mA, while the ion energy was in the range of 450–2000 eV. The thickness of the YSZ buffer layers was several hundreds of nanometers. The grain size of YSZ thin films, which varied from 2 to 20 nm, was calculated by Scherrer Formulation based on the X-ray diffraction measurement results. The grain size always decreased at first and then increased when the ion energy was increased. In the cases Kr gas was utilized and Ar gas was utilized, the grain size reached its minimum value at the ion energy of about 1800 eV and 1000 eV, respectively. Such phenomenon was discussed using the thermodynamic theory of thin film nucleation. Deposition rate and substrate temperature were the two chief variables of the critical nuclei concentration and grain size.