生长温度对6H-SiC上SiCGe薄膜发光特性的影响

利用低压化学气相淀积工艺在6H-SiC衬底成功制备了SiCGe薄膜。通过光致发光(PL)谱研究了生长温度对SiCGe薄膜发光特性的影响。结果表明:生长温度为980,1030,1060℃的SiCGe薄膜的室温光致发光峰分别位于2.13,2.18,2.31eV处;通过组分分析和带隙计算,认定该发光峰来自于带间辐射复合,证实了改变生长温度对SiCGe薄膜带隙的调节作用。同时,对SiCGe薄膜进行了变温PL测试,发现当测试温度高于200K时,发光峰呈现出蓝移现象。认为这是不同机制参与发光所造成的。     

低温制备微晶硅薄膜生长机制的研究

采用热丝化学气相沉积技术制备了一系列处于不同生长阶段的薄膜样品，用原子力显微镜系 统地研究生长在单晶硅衬底和玻璃衬底上薄膜表面形貌的演化.按照分形理论分析得到：在 玻璃衬底上的硅薄膜以零扩散随机生长模式生长；而在单晶硅衬底上，薄膜早期以有限扩散 生长模式生长，当膜厚超过某一临界厚度时转变为零扩散随机生长模式.岛面密度与膜厚的 依赖关系表明，在临界厚度时硅衬底和玻璃衬底上的岛面密度均出现了极大值.Raman谱的测 量证实，玻璃衬底上薄膜临界厚度与非晶/微晶相变之间存在密切的关系.不同的衬底材料直 接影响反应 关键词： 生长机制 微晶硅薄膜 表面形貌 热丝化学气相沉积     

HW-MWECR-CVD法制备氢化微晶硅薄膜及其微结构研究

用热丝辅助微波电子回旋共振化学气相沉积方法制备出高晶化体积分数的氢化微晶硅(μc-Si:H)薄膜.拉曼散射和X射线衍射技术对样品的微观结构测量分析表明，当反应气体中SiH₄浓度在3.6%—50%之间大范围变化时，μc-Si:H薄膜均具有高的晶化体积分数.进一步的分析表明，在SiH₄浓度较大时制备的薄膜，其结构以非晶-微晶的过渡相为主.薄膜易于晶化或生长为过渡相的主要原因是微波电子回旋共振使SiH₄气体高度分解，等离子体高度电离. 关键词： 微波电子回旋共振化学气相沉积 氢化微晶硅薄膜 拉曼散射 X射线衍射     

生长温度对AlGaInN四元合金薄膜性质的影响

利用金属有机物化学气相沉积（MOCVD）方法在c面蓝宝石（α-Al₂O₃）衬底上外延生长了铝镓铟氮（AlGaInN）四元合金薄膜.合金薄膜的生长温度设置为800,850,900 ℃,对获得的样品进行对比分析发现：随着生长温度的升高,合金中的In组分单调降低,而Al组分则基本保持恒定.当合金薄膜的生长温度升高到850 ℃时,薄膜表面开始出现V型缺陷;生长温度进一步升高到900 ℃时,偏析In原子的脱吸附作用加剧,V型缺陷成核被弱化,使V型缺陷的特征尺 关键词： AlGaInN 金属有机物化学气相沉积 生长温度     

缓冲层生长温度对In0.82Ga0.18As 薄膜结构及电学性能的影响

采用低压金属有机化学气相沉积(LP-MOCVD)技术,两步生长法在InP衬底上制备In_0.82Ga_0.18As材料。研究缓冲层的生长温度对In_0.82Ga_0.18As薄膜的结构及电学性能的影响。固定外延薄膜的生长条件,仅改变缓冲层生长温度(分别为410,430,450,470 ℃),且维持缓冲层其他生长条件不变。用拉曼散射研究样品的结构性能,测量四个样品的拉曼散射光谱,得到样品的GaAs的纵向光学(LO)声子散射峰的非对称比分别为1.53,1.52,1.39和1.76。测量样品的霍耳效应表明,载流子浓度随缓冲层生长温度变化而改变,同时迁移率也随缓冲层生长温度变化而改变。通过实验得出:缓冲层的生长温度能够影响In_0.82Ga_0.18As薄膜的结构及电学性能。最佳的缓冲层生长温度为450 ℃。     

微晶硅薄膜的制备及结构和稳定性研究

采用甚高频等离子体增强化学气相沉积技术制备了不同衬底温度的微晶硅薄膜.利用傅里叶变换红外吸收对制备薄膜进行了结构方面的测试分析.结果表明：随衬底温度的升高，材料 中的氢含量总的趋势下降；傅里叶变换红外吸收和二次离子质谱测试结果都显示薄膜中氧含 量随衬底温度的升高而增加（在10¹⁹cm^-3量级）；与高衬底温度相 比，低衬底温度制备的材料易于后氧化，这说明低温制备材料的稳定性不好. 关键词： 甚高频等离子体增强化学气相沉积 微晶硅薄膜 傅里叶变换红外吸收     

拉曼光谱和红外光谱分析沉积气压对微晶硅薄膜微结构的影响

采用射频等离子体增强化学气相沉积法(RF-PECVD),在玻璃和硅衬底上以230—310Pa之间的沉积气压生长微晶硅(μc-Si:H)薄膜。利用拉曼光谱和红外光谱分析样品的微结构。结果发现样品的微结构强烈依赖于沉积气压,并且存在着最佳沉积气压250Pa,在此条件下的微晶硅薄膜晶化率为60.6%,氢含量为最小值9.1%。     

外延在蓝宝石衬底上的非掺杂GaN研究

采用改变生长条件的方法制备GaN薄膜,在(0001)面蓝宝石衬底上利用金属有机物化学气相沉积技术制备了不同样品,并借助X射线双晶衍射仪(XRD)、PL谱测试仪和光学显微镜对材料进行了分析。XRD(0002)面和(1012)面测试均表明TMGa流量为70 cm3/min时样品位错密度最低。利用该TMGa流量进一步制备了改变生长温度的样品。XRD和PL谱测试结果表明,提高生长温度有利于提高GaN样品的晶体质量和光学性能。最后,利用光学显微镜对样品的表面形貌进行了分析。     

螺旋波等离子体增强化学气相沉积氮化硅薄膜

利用螺旋波等离子体增强化学气相沉积(HWP-CVD)技术，以SiH4和N2为反应气体进行了氮化硅(SiN)薄膜沉积，并研究了实验参量对薄膜特性的影响.利用傅里叶变换红外光谱、紫外—可见光谱和椭偏光检测等技术对薄膜的结构、厚度和折射率等参量进行了测量.结果表明，采用HWP-CVD技术能在低衬底温度条件下以较高的沉积速率制备低H含量的SiN薄膜，所沉积的薄膜主要表现为Si—N键合结构.采用较低的反应气体压强将提高薄膜沉积速率，并使薄膜的致密性增加.适当提高N2/SiH4比例有利于薄膜中H含量的降低. 关键词： 螺旋波等离子体 化学气相沉积 氮化硅薄膜     

Ge纳米结构的形貌与铁磁性研究

利用等离子体增强化学气相沉积技术制备了厚度不同的Ge薄膜, 随着样品厚度的减小, 样品表现出了室温铁磁性. 厚度为12 nm样品经过300 ℃退火后, 由于颗粒细化, 颗粒之间的界面增加, 界面缺陷增加, 样品表现出最大的铁磁性 (50 emu/cm³). 场冷却和零场冷却曲线测试表明居里温度约为350 K. 进行600 ℃退火后, 颗粒团聚, 样品的铁磁性最小. 当样品厚度进一步减小为6 nm时, 沉积态样品表现出铁磁性和顺磁性共存. 对6 nm厚的样品进行300 ℃退火后, 样品只具有铁磁性. 进行600 ℃退火后, 样品却只具有顺磁性. 12 nm 和6 nm 厚的Ge纳米结构薄膜随退火温度变化表现出不同的磁性规律, 我们认为是由于样品的颗粒大小和颗粒分布不同造成的. 样品越薄, Si基底与Ge薄膜之间的界面缺陷越明显, 界面缺陷以及Ge颗粒之间的界面缺陷为样品提供了未配对电子, 未配对电子的铁磁性耦合强度与样品颗粒的分布以及颗粒之间的结合有一定的关系. 颗粒之间分散或颗粒之间的融合程度大都将会降低样品的铁磁性.     

Island-growth of SiCGe films on SiC

SiCGe ternary alloys have been grown on SiC by hot-wall low-pressure chemical vapour deposition. It has been found that the samples cxhibit an island configuration, and the island growth of SiCGe epilayer depends on the processing parameters such as the growth temperature. When the growth temperature is comparatively low, the epilayer has two types of islands： onc is spherical island; another is cascading triangular island. With the increase of the growth temperature, the islands change from spherical to cascading triangular mode. The size and density of the islands depend on the growth duration and GeH4 flow-rate. A longer growth time and a larger GeH4 flow-rate can increase the size and density of the island in thc initial stage of the epitaxy. In our case, The optimal growth for a high density of uniform islands occurred at a growth temperature of 1100℃ for l-minute growth, with 10 SCCM GeH4, resulting in a narrow size distribution （about 30nm diameter） and high density （about 3.5 ×10^10 dots/cm2）. The growth follows Stranski- Krastanov modc （2D to 3D modc）, both of the islands and the 2D growth layer have face-centred cubic structure, and the critical thickness of the 2D growth layer is only 2.5 nm.[第一段]     

Formation of Ge nanocrystals and evolution of the oxide matrix in as-deposited and annealed LPCVD SiGeO films

SiGeO films were deposited by LPCVD using Si₂H₆, GeH₄ and O₂ as reactive gases and furnace annealed to segregate the possible excess of Si and Ge in the form of nanocrystals embedded in an oxide matrix. For low GeH₄:Si₂H₆ flow ratios and deposition temperatures of 450 ^°C or lower, the deposited film consists of a SiO₂ matrix incorporating Ge. No Ge oxides and no nanocrystals are detected. After annealing of the samples with SiO₂ matrices at temperatures of 600 ^°C or higher, quasi-spherical isolated Ge nanocrystals with diameters ranging from 4.5 to 9 nm and homogeneously distributed throughout the whole film thickness are formed. In the samples deposited with low GeH₄:Si₂H₆ flow ratios, the original SiO₂ matrix holds its composition.     

Peculiarities of the growth kinetics of silicon-germanium alloy layers from silane and germane with an additional heated element in the vacuum chamber

To study the disintegration of the molecules of hydrides at the surface of the growing layer and their influence on the rate of the epitaxial process a model of the growth kinetics of Si_1?x Ge_x alloy layers from silane and germane by the molecular beam epitaxy method with SiH₄ and GeH₄ gas sources is considered. Through comparison of numerical simulation data and experimental relationships, the steady-state growth kinetics has been studied and a comparative analysis carried out of the efficiency of entry of Ge(Si) atoms into the growing layer both in the presence of Si and Ge atomic flows in the reactor (the so-called hot-wire method) and in their absence. The growth rates obtained with this method of epitaxial growth and with one of its modifications where the use is made of a sublimating silicon bar as an additional heated element have been compared. Peculiarities in the behavior of the dependence of the layer growth rate on its composition have been revealed and explained.     

Self-assembled growth of nanostructural Ge islands on bromine-passivated Si(111) surfaces at room temperature

We have deposited relatively thick (∼60 nm) Ge layers on Br-passivated Si(111) substrates by thermal evaporation under high vacuum conditions at room temperature. Ge has grown in a layer-plus-island mode although it is different from the Stranski-Krastanov growth mode observed in epitaxial growth. Both the islands and the layer are nanocrystalline. This appears to be a consequence of reduction of surface free energy of the Si(111) substrate by Br-passivation. The size distribution of the Ge nanoislands has been determined. The Br-Si(111) substrates were prepared by a liquid treatment, which may not produce exactly reproducible surfaces. Nevertheless, some basic features of the nanostructural island growth are reasonably reproducible, while there are variations in the details of the island size distribution.     

Interaction of germanium with silicon dioxide

The interaction of germanium (Ge) adatoms with SiO₂ (silica) plays an important role in selective, heteroepitaxial growth of Ge(100) through windows created in silica on Si(100) and in the selective growth of Ge nanoparticles on hafnia, located at the bottom of pores etched through silica. Both processes rely on the inability of Ge to accumulate on silica. In hot wire chemical vapor deposition of Ge nanoparticles from GeH₄, etching of the silica has been invoked as one path to prevent accumulation of Ge on silica; whereas dense silica is not etched when Ge atoms are incident on the surface in molecular beam processes. Surface studies were conducted to determine the nature of oxidized Ge on SiO₂, to reconcile the etching claim with GeH₄, and to look for the additional etching product that must accompany GeO, namely SiO. Etching of silica is not found with GeH₄ or GeH_x fragments. A more complete examination of the Ge isotopes reveals instead the m/e 90 signal, previously attributed to GeO, originates from interactions between iron oxide impurities in the molybdenum holder, and hydrogen and GeH_x fragments. Coating the Mo with gold eliminates m/e 90 from Ge TPD spectra. The high temperature m/e 74 and m/e 2 peaks observed from 800 to 900 K are attributed to GeH_x decomposition to Ge and H followed by their desorption, while the appearance of GeO_x is attributed to possible reactions between GeH_x species with hydroxyl groups and/or oxidation of Ge clusters by background oxidants.     

Interactions of germanium atoms with silica surfaces

GeH₄ is thermally cracked over a hot filament depositing 0.7-15 ML Ge onto 2-7 nm SiO₂/Si(1 0 0) at substrate temperatures of 300-970 K. Ge bonding changes are analyzed during annealing with X-ray photoelectron spectroscopy. Ge, GeH_x, GeO, and GeO₂ desorption is monitored through temperature programmed desorption in the temperature range 300-1000 K. Low temperature desorption features are attributed to GeO and GeH₄. No GeO₂ desorption is observed, but GeO₂ decomposition to Ge through high temperature pathways is seen above 750 K. Germanium oxidization results from Ge etching of the oxide substrate. With these results, explanations for the failure of conventional chemical vapor deposition to produce Ge nanocrystals on SiO₂ surfaces are proposed.     

Shape, facet evolution and photoluminescence of Ge islands capped with Si at different temperatures

We investigate the embedding of Ge islands in a Si matrix by means of atomic force microscopy and photoluminescence (PL) spectroscopy. The Ge islands were grown between 360°C and 840°C and subsequently capped with Si at different temperatures. For the highest Ge growth temperature (840°C), we show that the surface flattens at high Si capping temperatures while new facets can be identified at the island base for intermediate capping temperatures (650–450°C). At low capping temperatures (300–350°C), the island morphology is preserved. In contrast to the observed island shape changes, the decreasing Si capping temperature causes only a small redshift of the island related PL signal for islands grown on high temperatures. This redshift increases for Ge islands grown at lower temperatures due to an increased Ge content in the islands. By applying low-temperature capping (300°C) on the different island types, we show that the emission wavelength can be extended up to 2.06 μm for hut clusters grown at 400°C. Further decreasing of the island growth temperature to 360°C leads to a PL blueshift, which is explained by charge carrier confinement in Ge quantum dots.     

In-situ monitoring and control of hydrogenated amorphous silicon–germanium band-gap profiling during plasma deposition process

In-situ germanium content monitoring and its characteristics in SiH₄/GeH₄/H₂ plasmas was studied during hydrogenated amorphous silicon–germanium (a-SiGe:H) film depositions. Since an appropriate band-gap profiling in a-SiGe:H deposition is very important to achieve high efficiency solar cell, the accurate monitoring and control of Ge contents are required. In this work, we found the spectral intensity ratio of silicon atom (288.2 nm) and germanium atom (303.9 nm) emission has strong relation with Ge content in plasmas. In typical, band-gap energy of films was decreased with the increasing of gas flow ratio GeH₄/SiH₄. However, at different total flow rate of GeH₄, the band-gap was different for same gas flow ratio cases because the Ge content in plasmas was changed due to the changes of electron temperature by hydrogen dilution. On the other hand, the emission intensity ratio Ge/Si detected the band-gap variation. Using this method, therefore, we measured and control Ge/Si to make a U-shape band-gap profile which was proved by an ellipsometer and Auger electron spectroscopy depth profile analysis.     

Diffusion effects in ion implanted germanium

During isochronal anneal sequences the number of Hg, Tl and Bi atoms implanted into Ge has been found to decrease. This decrease occurs for all three species and has been observed for samples implanted at room temperature as well as for hot implants (300—350°C). The decrease starts at anneal temperatures of 350—550°C. Similar results have been obtained for In and Sb implanted Ge. For samples implanted with Hg to doses leading to amorphous layers, the decrease in the number of implanted atoms seems to be related to the reordering of the amorphous layer. The experiments show that no diffusion of the implanted atoms into the bulk material occurs and the decrease observed is attributed to be a diffusion of the atoms to the surface followed by outdiffusion, thermal etching or both.