Electronic structure of Yb/H－Si (111) interface

Photoemission spectra are measured for Yb covered surface of wet-chemically-etched H－Si (111). The results reveal that the lattice structure of the H－Si (111) surface is stable against the deposition of Yb atoms. X-ray photoemission spectra indicate the formation of a polarized (dipole) surface layer, with the silicon negatively charged. Ultraviolet photoemission spectra exhibit the semiconducting property of the interface below one monolayer coverage. Work function variation during the formation of the Yb/H－Si (111) interface is measured by the secondary-electron cutoff in the ultraviolet photoemission spectral line. The largest decrease of work function is ～1.65eV. The contributions of the dipole surface layer and the band bending to the work function change are determined to be ～1.15eV and ～0.5eV, respectively. The work function of metal Yb is determined to be ～2.80±0.05eV.     

Ultrathin Pb film growth on Cu（111） studied by photoemission

The valence bands and the Pb 5d,Cu 3p core levels of Pb films evaporated on Cu(111) were measured by synchrotron radiation photoemission and characterized by low-energy electron diffraction(LEED) and Auger electron spectroscopy(AES).The variation of the surafce state at the center of the surface Brillouin zone (SBZ) of Cu(111) with Pb coverage shows that the submonolayer Pb grows on Cu(111) at room temperature(RT) as two-dimensional(2D) islands.With the Pb coverage increasing,the Pb 5d5/2 core level shifts to higher binding energy monotonically.While the Cu 3p3/2 core level is shifted toward higher binding energy by about 120 meV due to the deposition of 1.0ML Pb.At low Ph coverage,subsequent annealing at 200℃ gives rise to Pb-Cu surface alloy formation in the first layer of Cu(111).The Pb 5d core level is shifted toward Fermi level by 20-30 meV due to the surface alloying.An assumption about electron charge transfer from Cu to Pb was adopted to interpret the observed cored level shifts.2001 Published by Elsevier Science Ltd.     

Growth studies of m-GaN layers on LiAlO2 by MOCVD

This paper reports that the m-plane GaN layer is grown on （200）-plane LiAlO2 substrate by metal-organic chemical wpour deposition （MOCVD） method. Tetragonal-shaped crystallites appear at the smooth surface. Raman measurement illuminates the compressive stress in the layer which is released with increasing the layer＇s thickness. The high transmittance （80%）, sharp band edge and excitonic absorption peak show that the GaN layer has good optical quality. The donor acceptor pair emission peak located at -3.41 eV with full-width at half maximum of 120 meV and no yellow peaks in the photoluminescence spectra partially show that no Li incorporated into GaN layer from the LiAlO2 substrate.     

INTERFACE FORMATION OF Ge/ZnSe(100) AND Ge/ZnS(111) HETEROJUNCTIONS STUDIED BY SYNCHROTRON RADIATION PHOTOEMISSION

The microscopic evolution of interface formation between Ge and Ⅱ-Ⅵ compounds such as ZnSe and ZnS single crystals has been studied by synchrotron radiation photoemission spectroscopy and low energy electron diffraction. Core level intensity measurements from the substrate as well as from the overlayer show a nearly ideal two-dimensional growth mode for the deposition of Ge on ZnSe(100) surface. How-ever, there is a certain deviation from the ideal two-dimensional mode in the case of Ge/ZnS(111) due to the diffusion of substrate atoms into Ge overlayer. Surface semi-tire core level spectra indicate that the reaction of Ge with S atoms at Ge/ZnS(111) interfaces is much stronger than that of Ge with Se atoms at Ge/ZnSe(100) interfaces.     

Electronic structure of single-crystalline graphene grown on Cu/Ni(111) alloy film

Graphene with a Dirac cone-like electronic structure has been extensively studied because of its novel transport properties and potential application for future electronic devices. For epitaxially grown graphene, the process conditions and the microstructures are strongly dependent on various substrate materials with different lattice constants and interface energies. Utilizing angle-resolved photoemission spectroscopy, here we report an investigation of the electronic structure of single-crystalline graphene grown on Cu/Ni(111) alloy film by chemical vapor deposition. With a relatively low growth temperature, graphene on Cu/Ni(111) exhibits a Dirac cone-like dispersion comparable to that of graphene grown on Cu(111). The linear dispersions forming Dirac cone are as wide as 2 e V, with the Fermi velocity of approximately 1.1×10~6 m/s. Dirac cone opens a gap of approximately 152 meV at the binding energy of approximately 304 meV. Our findings would promote the study of engineering of graphene on different substrate materials.     

Band Gap Energies and Refractive Indices of Epitaxial Pb1-xSrxTe Thin Films

Pb1-x Srx Te thin films with different strontium （St） compositions axe grown on BaF2 （111） substrates by molecular beam epitaxy （MBE）. Using high resolution x-ray diffraction （HPLXRD）, we obtain Pb1-xSrxTe lattice constants, which vary in the range 6.462-6.492 A. According to the Vegard law and HRXRD data, Sr compositions in Pb1-xSrxTe thin films range from 0.0-8.0%. The Pb1-xSrxTe refractive index dispersions are attained from infrared transmission spectrum characterized by Fourier transform infrared （FTIR） transmission spectroscopy. It is found that refractive index decreases while Sr content increases in Pb1-xSrx Te. We also simulate the Pb1-xSrxTe transmission spectra theoretically to obtain the optical band gap energies which range between 0.320 e V and 0.449 e V. The simulated results are in good agreement with the FTIR data. Finally, we determine the relation between Pb1-xSrx Te band gap energies and Sr compositions （Eg = 0.320＋0.510x-0.930x^2 ＋184x^3 （eV））.     

Ohmic Contact at Al/TiO_2/n-Ge Interface with TiO_2 Deposited at Extremely Low Temperature

TiO_2 deposited at extremely low temperature of 120°C by atomic layer deposition is inserted between metal and n-Ge to relieve the Fermi level pinning. X-ray photoelectron spectroscopy and cross-sectional transmission electron microscopy indicate that the lower deposition temperature tends to effectively eliminate the formation of GeO_x to reduce the tunneling resistance. Compared with TiO_2 deposited at higher temperature of 250°C,there are more oxygen vacancies in lower-temperature-deposited TiO_2, which will dope TiO_2 contributing to the lower tunneling resistance. Al/TiO_2/n-Ge metal-insulator-semiconductor diodes with 2 nm 120°C deposited TiO_2 achieves 2496 times of current density at-0.1 V compared with the device without the TiO_2 interface layer case, and is 8.85 times larger than that with 250°C deposited TiO_2. Thus inserting extremely low temperature deposited TiO_2 to depin the Fermi level for n-Ge may be a better choice.     

Influence of Interface Structure of Co/Cu （100） Superlattices on Electronic Structure and Giant Magnetoresistance

Electronic structures and magnetoresistance （MR） of Co3 Cu5 and Co3 Cur models as well as their interface atom exchange models Co2 CuCoCu4 and Co2 CuCoCu6 are investigated by the tlrst-principles pseudopotential planewave method based on density functional theory. Charge transfer, magnetic moment, density of states, spin asymmetry factor, and MR ratio are discussed. The results show that the values of charge transfer and spin asymmetry factor at the Fermi level of Co layers are closely related to the neighbouring background of the Co layer. The Co layer with two sides adjacent to the Cu layer would transfer more charge to the Cu layer than other neighbouring background and have the largest spin asymmetry factor at the Fermi level. The Co layer with two neighbouring Co layers （interior Co） would gain a little charge and have the smallest spin asymmetry factor at the Fermi level. Two-current model is used to evaluate the MR ratio of Co2CuCoCu4 （Co2CuCoCu6） to be larger than that of Co3 Cu5 （Co3 CUT）, which can be explained by the charge transfer and spin asymmetry factor.     

Antiferromagnetic ferromagnetic transition in zigzag graphene nanoribbons induced by substitutional doping

Using first-principles calculations based on density functional theory, we show that the ground state of zigzag-edged graphene nanoribbons(ZGNRs) can be transformed from antiferromagnetic(AFM) order to ferromagnetic(FM) order by changing the substitutional sites of N or B dopants. This AFM–FM transition induced by substitutional sites is found to be a consequence of the competition between the edge and bulk states. The energy sequence of the edge and bulk states near the Fermi level is reversed in the AFM and FM configurations. When the dopant is substituted near the edge of the ribbon, the extra charge from the dopant is energetically favorable to occupy the edge states in AFM configuration. When the dopant is substituted near the center, the extra charge is energetically favorable to occupy the bulk states in FM configuration. Proper substrate with weak interaction is necessary to maintain the magnetic properties of the doped ZGNRs. Our study can serve as a guide to synthesize graphene nanostructures with stable FM order for future applications to spintronic devices.     

Interfacial electronic structure at a metal–phthalocyanine/graphene interface:Copper–phthalocyanine versus iron–phthalocyanine

The energy level alignment of CuPc and FePc on single-layer graphene/Ni(111)(SLG/Ni)substrate was investigated by using ultraviolet and X-ray photoelectron spectroscopy(UPS and XPS).The highest occupied molecular orbitals(HOMOs)in a thick layer of CuPc and FePc lie at 1.04 eV and 0.90 eV,respectively,below the Fermi level of the SLG/Ni substrate.Weak adsorbate–substrate interaction leads to negligible interfacial dipole at the CuPc/SLG/Ni interface,while a large interfacial dipole(0.20 eV)was observed in the case of FePc/SLG/Ni interface,due to strong adsorbate–substrate coupling.In addition,a new interfacial electronic feature was observed for the first time in the case of FePc on SLG/Ni substrate.This interfacial state can be attributed to a charge transfer from the SLG/Ni substrate to unoccupied orbitals of FePc.     

Modifying Quantum Well States of Pb Thin Films via Interface Engineering

We demonstrate the importance of interface modification on improving electron confinement by preparing Pb quantum islands on Si（111） substrates with two different surface reconstructions, i.e., Si（111）-7 ×7 and Si（111）- Root3×Root3-Pb （hereafter, 7 ×7 and R3）. Characterization with scanning tunneling microscopy/spectroscopy shows that growing Pb films directly on a 7 × 7 surface will generate many interface defects, which makes the lifetime of quantum well states （QWSs） strongly dependent on surface locations. On the other hand, QWSs in Pb films on an R3 surface are well defined with small variations in linewidth on different surface locations and are much sharper than those on the 7 × 7 surface. We show that the enhancement in quantum confinement is primarily due to the reduced electron-defect scattering at the interface.     

Effect of Trimethyl Aluminium Surface Pretreatment on Atomic Layer Deposition Al2O3 Ultra-Thin Film on Si Substrate

Ultra-thin Al2O3 dielectric films have been deposited on Si substrates by using trimethyl aluminium （TMA） and water as precursors in an atomic layer deposition （ALD） system. Growth of the interracial layer between ultra-thin Al2O3 and the Si substrate is effectively suppressed by a long-time TMA surface pretreatment of the Si substrate prior to A1203 atomic layer deposition. High resolution transmission electron microscopy （TEM） images show that the thickness of the interracial layer is reduced to be 0.5nm for the sample with TMA pretreatment lasting 3600s. The x-ray photoelectron spectroscopy results indicate that the A1203 film deposited on the TMApretreated Si surface exhibits very good thermal stability. However, a hysteresis of about 50mV is observed in the C- V curve of the samples with the TMA pretreatment.     

Epitaxial growth and air-stability of monolayer Cu_2Te

A new two-dimensional atomic crystal, monolayer cuprous telluride(Cu_2Te) has been fabricated on a grapheneSi C(0001) substrate by molecular beam epitaxy(MBE). The low-energy electron diffraction(LEED) characterization shows that the monolayer Cu_2Te forms ■ superstructure with respect to the graphene substrate. The atomic structure of the monolayer Cu_2Te is investigated through a combination of scanning tunneling microscopy(STM) experiments and density functional theory(DFT) calculations. The stoichiometry of the Cu_2Te sample is verified by x-ray photoelectron spectroscopy(XPS) measurement. The angle-resolved photoemission spectroscopy(ARPES) data present the electronic band structure of the sample, which is in good agreement with the calculated results. Furthermore, air-exposure experiments reveal the chemical stability of the monolayer Cu_2Te. The fabrication of this new 2D material with a particular structure may bring new physical properties for future applications.     

Direct observation of the f–c hybridization in the ordered uranium films on W(110)

A key issue in metallic uranium and its related actinide compounds is the character of the f electrons, whether it is localized or itinerant.Here we grew well ordered uranium films on a W(110) substrate.The surface topography was investigated by scanning tunneling microscopy.The Fermi surface and band structure of the grown films were studied by angle-resolved photoemission spectroscopy.Large spectral weight can be observed around the Fermi level, which mainly comes from the f states.Additionally, we provided direct evidence that the f bands hybridize with the conduction bands in the uranium ordered films, which is different from previously reported mechanism of the direct f–f interaction.We propose that the above two mechanisms both exist in this system by manifesting themselves in different momentum spaces.Our results give a comprehensive study of the ordered uranium films and may throw new light on the study of the 5 f-electron character and physical properties of metallic uranium and other related actinide materials.     

Large Storage Window in a-SiNx/nc-Si/a-SiNx Sandwiched Structure for Nanocrystalline Silicon Floating Gate Memory Application

An a-SiNx/nanocrystalline silicon [（nc-Si）/a-SiNx] sandwiched structure is fabricated in a plasma enhanced chemical vapour deposition （PECVD） system at low temperature （250℃）. The nc-Si layer is fabricated from a hydrogen-diluted silane mixture gas by using a layer-by-layer deposition technique. Atom force microscopy measurement shows that the density of nc-Si is about 2 ×10^11 cm^-2. By the pretreatment of plasma nitridation, low density of interface states and high-quality interface between the Si substrate and a-SiNs insulator layer are obtained. The density of interface state at the midgap is calculated to be 1 ×10^10 cm^-2eV^-1 from the quasistatic and high frequency C - V data. The charging and discharging property of nc-Si quantum dots is studied by capacitance-voltage （C- V） measurement at room temperature. An ultra-large hysteresis is observed in the C - V characteristics, which is attributed to storage of the electrons and holes into the nc-Si dots. The long-term charge-loss process is studied and ascribed to low density of interface states at SiNx/Si substrate.     

Improved performance of microcrystalline silicon solar cell with graded-band-gap silicon oxide buffer layer

Microcrystalline silicon(μc-Si:H) solar cell with graded band gap microcrystalline silicon oxide(μc-Si Ox:H) buffer layer is prepared by plasma enhanced chemical vapor deposition and exhibits improved performance compared with the cell without it. The buffer layer moderates the band gap mismatch by reducing the barrier of the p/i interface, which promotes the nucleation of the i-layer and effectively eliminates the incubation layer, and then enhances the collection efficiency of the cell in the short wavelength region of the spectrum. The p/i interface defect density also decreases from 2.2 × 1012cm-2to 5.0 × 1011cm-2. This graded buffer layer allows to simplify the deposition process for the μc-Si:H solar cell application.     

Synergistic effects of total ionizing dose on single event upset sensitivity in static random access memory under proton irradiation

Nitrogen plasma passivation （NPP） on （111） germanium （Ge） was studied in terms of the interface trap density, roughness, and interfacial layer thickness using plasma-enhanced chemical vapor deposition （PECVD）. The results show that NPP not only reduces the interface states, but also improves the surface roughness of Ge, which is beneficial for suppressing the channel scattering at both low and high field regions of Ge MOSFETs. However, the interracial layer thickness is also increased by the NPP treatment, which will impact the equivalent oxide thickness （EOT） scaling and thus degrade the device performance gain from the improvement of the surface morphology and the interface passivation. To obtain better device performance of Ge MOSFETs, suppressing the interfacial layer regrowth as well as a trade-off with reducing the interface states and roughness should be considered carefully when using the NPP process.     

Growth of a Novel Periodic Structure of SiC/AIN Multilayers by Low Pressure Chemical Vapour Deposition

A novel lO-period SiC/A1N multilayered structure with a SiC cap layer is prepared by low pressure chemical vapour deposition （LPCVD）. The structure with total film thickness of about 1.45~m is deposited on a Si （111） substrate and shows good surface morphology with a smaller rms surface roughness of f.3 nm. According to the secondary ion mass spectroscopy results, good interface of the 10 period SiC/A1N structure and periodic changes of depth profiles of C, Si, A1, N components are obtained by controlling the growth procedure. The structure exhibits the peak reflectivity close to 30% near the wavelength of 322 nm. To the best of our knowledge, this is the first report of growth of the SiC/AIN periodic structure using the home-made LPCVD system.     

Stress Analysis of ZnO Film with a GaN Buffer Layer on Sapphire Substrate

A 5.35-μm-thick ZnO film is grown by chemical vapour deposition technique on a sapphire （0001） substrate with a GaN buffer layer. The surface of the ZnO film is smooth and shows many hexagonal features. The full width at half maximum of ZnO （0002） u-rocking curve is 161 arcsec, corresponding to a high crystal quality of the ZnO film. From the result of x-ray diffraction 0 - 20 scanning, the stress status in ZnO film is tensile, which is supported by Raman scattering measurement. The reason of the tensile stress in the ZnO film is analysed in detail. The lattice mismatch and thermal mismatch are excluded and the reason is attributed to the coalescence of grains or islands during the growth of the ZnO film.     

Enhanced interface properties of diamond MOSFETs with Al_2O_3 gate dielectric deposited via ALD at a high temperature

The interface state of hydrogen-terminated(C–H) diamond metal–oxide–semiconductor field-effect transistor(MOSFET) is critical for device performance. In this paper, we investigate the fixed charges and interface trap states in C–H diamond MOSFETs by using different gate dielectric processes. The devices use Al_2O_3 as gate dielectrics that are deposited via atomic layer deposition(ALD) at 80℃ and 300℃, respectively, and their C–V and I–V characteristics are comparatively investigated. Mott–Schottky plots(1/C~2–VG) suggest that positive and negative fixed charges with low density of about 1011 cm~(-2) are located in the 80-℃-and 300-℃ deposition Al_2O_3 films, respectively. The analyses of direct current(DC)/pulsed I–V and frequency-dependent conductance show that the shallow interface traps(0.46 e V–0.52 e V and0.53 e V–0.56 e V above the valence band of diamond for the 80-℃ and 300-℃ deposition conditions, respectively) with distinct density(7.8 × 10~(13) e V~(-1)·cm~(-2)–8.5 × 10~(13) e V-1·cm~(-2) and 2.2 × 1013 e V~(-1)·cm~(-2)–5.1 × 10~(13) e V~(-1)·cm~(-2) for the80-℃-and 300-℃-deposition conditions, respectively) are present at the Al_2O_3/C–H diamond interface. Dynamic pulsed I–V and capacitance dispersion results indicate that the ALD Al_2O_3 technique with 300-℃ deposition temperature has higher stability for C–H diamond MOSFETs.