激光干涉结晶法制备一维周期结构的纳米硅阵列

利用激光干涉结晶方法,采用周期为400 nm的一维(1D)移相光栅掩模调制KrF准分子激光器的脉冲激光束斑的能量分布,在不同厚度的超薄氢化非晶硅(a-Si:H)膜内直接制备1D有序纳米硅(nc-Si)阵列.拉曼散射谱表明,样品上呈条状分布的受辐照区域发生晶化.原子力显微镜和透射电子显微镜测试结果表明：1D的nc-Si阵列的周期和移相光栅掩模一样.随着a-Si:H膜厚度从10nm降至4nm,通过控制激光的能量密度,每个周期中nc-Si条状分布区宽度可达到30nm.nc-Si条状分布区的高分辨电子显微镜照片显 关键词： 纳米硅 激光干涉结晶 移相光栅 定域晶化     

二维移相光栅光强分布的计算及在制备有序纳米硅阵列中的应用

从菲涅耳衍射积分的一般形式出发,结合二维（2D）移相光栅掩模(PSGM)的具体参数,通过数值计算得到了作用于样品表面的光强分布.实验上,采用激光干涉晶化的方法,利用周期为400 nm的2D-PSGM调制KrF准分子激光器的脉冲激光束斑的能量分布,在氢化非晶硅（a-Si:H）薄膜上直接制备了2D的有序纳米硅（nc-Si）阵列.测试结果表明：2D的nc-Si阵列的周期和PSGM的相一致,晶化区域与理论模拟的结果符合得很好. 关键词： 纳米硅 激光干涉晶化 移相光栅 菲涅耳衍射     

nc-Si/SiO2多层膜的制备及蓝光发射

在等离子体增强化学气相淀积(PECVD)系统中，采用a-Si∶H层淀积与原位等离子体氧化相结合的逐层生长的方法成功制备出a-Si∶H/SiO2多层膜 (ML)；利用限制性结晶原理通过两步退火处理使a-Si∶H层晶化获得尺寸可控的nc-Si/SiO2 ML，并观察到室温下的蓝光发射；结合Raman散射和剖面透射电子显微镜技术分析了nc-Si/SiO2 ML的结构特性；通过对晶化样品光致发光谱和紫外-可见光吸收谱的研究，探讨了蓝光发射的起源. 关键词： 纳米硅多层膜 等离子体氧化 蓝光发射 热退火     

尺寸可控的纳米硅的生长模型和实验验证

基于经典热力学理论，对a-SiN_x/a-Si:H/a-SiN_x三明治结构或a-Si:H/a-SiN_x多层膜结构中纳米硅成核，以及从球形到鼓形的生长过程进行了研究. 建立了限制性晶化理论模型：在纳米硅生长过程中，由于界面能增大将导致生长停止，给出限制性晶化条件——a-Si:H子层厚度小于34 nm. 在激光晶化和常规热退火两种方法形成的a-SiN_x/nc-Si/a-SiN_x三明治结构和nc-Si/a-SiN_x多层膜结构中验证了该理论模型. 关键词： 非晶硅 纳米硅 激光辐照 结晶     

激光限制结晶技术制备nc-Si/SiO2多层膜

在等离子体增强化学气相淀积系统中，采用aSi:H层淀积和原位等离子体氧化相结合的逐层生长技术制备了aSi:H/SiO_2多层膜.在激光诱导限制结晶原理基础上，使用KrF准分子脉冲激光为辐照源，对aSi:H/SiO_2多层膜进行辐照，使纳米级厚度的aSi:H子层晶化.Raman散射谱和电子衍射谱的结果表明，经过激光辐照后纳米Si颗粒在原始的aSi:H子层内形成，晶粒尺寸可以根据aSi:H层的厚度精确控制.还研究了样品的光致发光（PL）特性以及激光辐照能量密度对PL性质的影响. 关键词： 脉冲激光 多层膜 限制结晶     

非晶态异质结构a-Si:H/a-SiNx:H和a-Si:H,a-SiNx:H薄膜的应力研究

实验发现在一定Si—H键浓度下,相对于平坦的硅衬底而言,在其上沉积的a-Si:H薄膜具有压缩应力,a-SiN_x:H薄膜具有伸张应力。当a-Si:H和a-SiN_x:H层厚度比近似于1:2时,硅衬底上生长的a-Si:H/a-SiN_x:H/c-Si样品,弯曲最小,并能保持很长时间。文中还给出了应力随退火变化的情况,并对实验结果进行了讨论。 关键词：     

a-Si:H/a-SiNx:H超晶格的掺杂效应

采用带有可转动掩板的沉积系统,合成出一类新的a-Si:H/掺杂a-SiN_x:H超晶格。样品中各子层厚度及a-SiN_x:H子层中N/Si比固定,仅改变掺杂浓度。结果发现:此类超晶格中的费密能级可以通过a-SiN_x:H层中的掺杂来控制,即a-Si:H/a-SiN_x:H超晶格可以从n型转变为p型,依赖于a-SiN_x:H子层中B的掺杂比。然而,a-SiN_x:H子层中P的掺杂对a-Si:H/a-SiN_x:H超晶格传输特性影响并不大。 关键词：     

a-Si/SiO2多量子阱材料制备及其晶化和发光

本文研究用等离子体增强化学气相淀积(PECVD)方法淀积SiO2和非晶硅(a-Si)时淀积速率和薄膜折射率与淀积条件的关系。选择合适的淀积条件制备了a-Si/SiO2多量子阱结构材料。用激光扫描退火方法使其晶化,当a-Si和SiO2层厚度分别为4nm和6nm时,形成了颗粒大小为3.8nm的硅晶粒。晶化后的样品在10K下可以观察到较强的光荧光发射,三个峰值波长分别为810、825和845nm.     

用正电子湮没技术研究a-Si:H/a-SiNx:H多层膜中的界面缺陷

本文报道应用正电子湮没技术(PAT)对a-Si:H/a-SiN_x:H(x≈0.5)多层膜系列样品所进行的研究。发现,由于a-Si:H和a-SiN_x:H在结构方面的失配,导致在a-Si:H/a-SiN_x:H多层膜中的界面区,产生大量缺陷。在a-Si:H子层中,紧靠界面的是应变层,厚度约为8?;在应变层之后是过渡层,厚度约为50?。在过渡层中存在大量缺陷,这就是所谓界面缺陷。 关键词：     

a-Si:H/a-SiNx:H超晶格薄膜的光学性质

本文介绍,当a-SiN_x:H层的厚度一定,a-Si:H层的厚度不同时,a-Si:H/a-SiN_x:H超晶格薄膜的光吸收系数、光学禁带宽度以及折射率随之变化的规律。 关键词：     

Microstructures of patterned nc-Si superlattices made by pulsed laser interference crystallization

We employed atomic force microscopy, cross-section transmission electron microscopy and high-resolution electron microscopy to investigate the microstructures and surface morphology of laser interference crystallized a-Si : H/a-SiN_x : H superlattices. The experimental results show that Si nanocrystallites (nc-Si) are formed within the initial a-Si : H sublayers and are patterned in certain regions with the same periodicity of 2.0 μ m as the phase-shifting mask grating. The size of nc-Si is limited by adjacent a-SiN _x: H sublayers due to the constrained crystallization effect so it is possible to use this crystallization method to get a three-dimensional ordered nc-Si array.     

FABRICATION AND CHARACTERIZATION OF THE SIZE-CONTROLLED AND PATTERNED nc-Si DOTS

A new method of phase-modulated excimer laser crystallization is adopted to fabricate the patterned nanometer-sized crystalline silicon (nc-Si) dots within the sandwiched structure (a-SiN_x:H/a-Si:H/a-SiN_x:H) films. The results of transmission electron microscopy, electron diffraction and Raman scattering show the ultra-thin and single-layer nc-Si films were patterned in the lateral direction and the size of crystallites is controlled by the thickness of as-deposited a-Si film in the longitudinal direction. The effects of the laser energy density on the structures of the samples and the crystallization mechanism are discussed.     

Thermal annealing of a-Si:H/a-SiNx:H multilayers

The crystallinity of Si/SiN_x multilayers annealed by a rapid thermal process and furnace annealing is investigated by a Raman-scattering technique and transmission electron microscopy. It is found that the crystallization temperature varies from 900 °C to 1000 °C when the thickness of a-Si:H decreases from 4.0 nm to 2.0 nm. Raman measurements imply that the high crystallization temperature for the a-Si:H sublayers originates from the confinement modulated by the interfaces between a-Si:H and a-SiN_x:H. In addition to the annealing temperature, the thermal process also plays an important role in crystallization of a-Si sublayers. The a-Si:H sublayers thinner than 4.0 nm can not be crystallized by furnace annealing for 30 min, even when the annealing temperature is as high as 1000 °C. In contrast, rapid thermal annealing is advantageous for nucleation and crystallization. The origin of process-dependent crystallization in constrained a-Si:H is briefly discussed. Received: 11 April 2001 / Accepted: 20 June 2001 / Published online: 30 August 2001     

The charge storage of the nc—Si layer

Sandwiched structures (a-SiN_x/a-Si/a-SiN_x) have been fabricated by the plasma enhanced chemical vapour deposition technique. A Si nanocrystal (nc-Si) layer was formed by crystallization of an a-Si layer according to the constrained crystallization principle after quasi-static thermal annealing at 1100℃ for 30 min. Transmission electron microscopy (TEM) and Raman scattering spectroscopy clearly demonstrated that nc-Si grains were formed in the as-deposited a-Si layer after annealing. The density of nc-Si grains is about 10¹¹cm^-2 as shown by TEM photographs. Using capacitance－voltage (C－V) measurements we investigated the electrical characteristics of the sandwiched structures. The charge storage phenomenon of the nc-Si layer was observed from the shift of flat-band voltage (V_FB) in C－V curves at a high frequency (1 MHz). We estimated the density of nc-Si grains to be about 10¹¹cm^-2 from the shift value of V_FB, which is in agreement with the result of TEM photographs. At the same time, we found that the shift of V_FB increased with the increase of the applied constant dc voltage or the thickness of the nc-Si layer.