HfO2薄膜生长应力演化研究

薄膜应力的存在是薄膜材料的本征特性,对过程中薄膜应力的测量与精确控制具有重要意义.搭建了基于双光束偏转基底曲率测量装置,再结合薄膜厚度的实时监控,实现了对薄膜应力演化过程的观测.对HfO2薄膜的生长过程做了实时研究.结果显示,在所研究条件下,HfO2薄膜的生长应力随厚度的增加,在360～660 MPa范围内变化;沉积温度越高,沉积真空度越高,张应力越大;在真空度较高的沉积条件下,薄膜应力强烈地受到基底表面的影响,随着薄膜厚度的增加,应力也趋于稳定.     

ZrO2薄膜残余应力实验研究

采用ZYGO MarkⅢ-GPI数字波面干涉仪对电子束蒸发方法制备的ZrO2薄膜中的残余应力进行了研究,讨论了沉积温度、沉积速率等工艺参量对ZrO2薄膜残余应力的影响。实验结果表明：随着沉积温度及沉积速率的升高,ZrO2薄膜中残余应力状态由张应力变为压应力,且压应力值随着沉积温度升高而增大。同时用X射线衍射技术测量分析了不同沉积条件下ZrO2薄膜的微结构组织,探讨了ZrO2薄膜微结构与其应力的对应关系。     

热蒸发YbF3薄膜的机械特性

 实验研究了热蒸发YbF₃薄膜在大气中的应力和附着力。利用Veeco干涉仪,测试了各种工艺条件下单层YbF₃薄膜的应力。结果发现:YbF₃薄膜的残余应力为张应力,热应力在残余应力中的比重较大;沉积方式对薄膜应力的影响不大;薄膜应力在大气中有一个释放的过程。热处理后,YbF₃薄膜应力增大。     

直流脉冲磁控反应溅射技术制备掺铝氧化锌薄膜的研究

文章采用直流脉冲磁控反应溅射(DCPsputtering)技术,在不同氧氩比(GFR)条件下玻璃衬底上制备了一系列掺铝氧化锌(AZO)薄膜,并利用X射线衍射、扫描电子显微镜和分光光度计从宏观应力和微观晶格畸变的角度研究了GFR对薄膜结构、表面形貌和光学特性的影响.制备的多晶AZO薄膜呈现了明显的ZnO-(103)择优取向,这归结于3小时薄膜沉积过程中伴随的退火引起的薄膜晶面能转变.随着GFR的增大,AZO薄膜内宏观拉应力先增大到最大值,随后宏观压应力随着GFR的继续增大而增大.薄膜中的宏观应力明显随着GFR从拉应力向压应力转变.这与晶格微观畸变诱导的微观应力的研究结果趋势恰恰相反.随着GFR的增加,薄膜在可见光区的平均透射率先增加后减小,薄膜晶粒尺寸诱导的晶界散射是影响薄膜透射率的主导机制.     

硅衬底GaN基LED薄膜芯片的应力调制

将Si衬底GaN基LED外延薄膜经晶圆键合、去硅衬底等工艺制作成垂直结构GaN基LED薄膜芯片,并对其进行不同温度的连续退火,通过高分辨X射线衍射(HRXRD)研究了连续退火过程中GaN薄膜芯片的应力变化。研究发现:垂直结构LED薄膜芯片在160~180℃下退火应力释放明显,200℃时应力释放充分,GaN的晶格常数接近标准值。继续升温应力不再发生明显变化,GaN薄膜的晶格常数只在标准晶格常数值附近波动。扫描电子显微镜给出的bonding层中Ag-In合金情况很好地解释了薄膜芯片应力的变化。     

SiN插入层对GaN外延膜应力和光学质量的影响

研究了MOCVD系统中原位SiN插入层对GaN薄膜应力和光学性质的影响。采用SiN插入层后,GaN薄膜的裂纹数量大大减少,薄膜所承受的张应力得到了一定的释放。同时,GaN薄膜的缺陷密度降低一倍,晶体质量得到了极大的改善。研究表明,位错密度的降低在GaN薄膜中留存较大的残余应力,补偿了降温过程中所引入的张应力。同样,随着SiN插入层的应用,低温PL谱的半峰宽降低,薄膜光学质量提高。最后研究了PL谱发光峰与应力的关系,得到了一个-13.8的线性系数。     

应力对铋系铁电薄膜性能影响的研究进展

应力普遍存在于铁电薄膜中，是影响薄膜性能和薄膜电子器件可靠性的一个重要参数。本文系统介绍了本小组近年来所进行的应力对铋系铁电薄膜（Bi3.25La0.75Ti3O12，Bi3.15Nd0.85Ti3O12和SrBi2Ta2O9）的铁电性能及与铁电存储有关的开关、疲劳性能等影响的研究。结果表明：张应力有利于增大薄膜的剩余极化和开关电荷量，而压应力却使得两者都降低。还发现：应力对薄膜的开关时间、矫顽场、疲劳性能等都有影响。其结果都与“应力作用下薄膜内铁电畴的重新取向”有关。     

Si衬底GaN基LED外延薄膜转移至金属基板的应力变化

采用电镀金属基板及湿法腐蚀衬底的方法将硅衬底上外延生长的GaNMQWLED薄膜转移至不同结构的金属基板,通过高分辨X射线衍射(HRXRD)和光致发光(PL)研究了转移的GaN薄膜应力变化。研究发现:(1)转移至铜基板、铬基板、铜/镍/铜叠层基板等三种基板的GaN薄膜张应力均减小,其中转移至铬基板的GaN薄膜张应力最小。(2)随着铬基板中铬主体层厚度的增加,转移后的GaN薄膜应力不发生明显变化。     

Y_2O_3缓冲层对YBCO超导转变温度的影响（英文）

超导薄膜所受的应力对其临界转变温度Tc具有重要的影响,研究应力对超导薄膜Tc的影响对获得更高Tc材料具有重要意义.本文采用溶胶-凝胶法,在LAO单晶基板上制备了Y2O3/YBCO薄膜,并研究了Y2O3缓冲层对不同厚度YBCO超导薄膜的临界转变温度的影响.研究发现,当YBCO薄膜厚度为90nm时,由于Y2O3和YBCO薄膜的晶格错配,在YBCO/Y2O3薄膜的a-b面内引入了压应力,增加了c轴的晶格常数,结果提高了YBCO薄膜的临界转变温度.当YBCO薄膜的厚度较大时(如230nm),由晶格错配引起的应力通过位错的形式得以释放,YBCO薄膜的Tc变化不大.     

光学薄膜参数测试

采用ZYGO Markm一GPI数字波面干涉仪对电子束蒸发方法制备的ZrO:薄膜中的残余应力进行了研究,讨论了沉积温度、沉积速率等工艺参量对ZrO:薄膜残余应力的影响。实验结果表明,随着沉积温度及沉积速率的升高,Zr():薄膜中残余应力状态由张应力变为压应力,且压应力值随着沉积温度升高而增大。同时     

金刚石膜厚度尺寸对热残余应力的影响

 采用有限元方法对钼基体上不同厚度（20~1 000 μm）金刚石膜的热残余应力进行了全面的模拟与分析，得出了它们在膜内分布的等值线图，研究了金刚石膜厚度尺寸对整个膜内的最大主拉应力和界面处每个应力分量最大值的影响。结果表明：在整个膜内，最大主拉应力的位置出现在膜的表面、界面或侧面，其值随膜厚度的增加而增大；在界面处，最大轴向应力随膜厚度的增加而增大，而最大径向压应力、最大周向压应力和最大剪应力则随膜厚度的增加而减小，其中最大剪应力减幅较小；膜厚度越大时，以上各量随厚度增（减）的速度越慢。其结论对于在金刚石膜的制备中合理地选择厚度、有效地进行应力控制有一定的参考价值。     

沉积温度对氧化钇稳定氧化锆薄膜残余应力的影响

采用自制掺摩尔分数12%的YzO2的ZrO2混合颗粒料为原料,在不同的沉积温度下用电子束蒸发方法沉积氧化钇稳定氧化锆(YSZ)薄膜样品.利用ZYGO MarkⅢ-GPI数字波面干涉仪对氧化钇稳定氧化锆薄膜的残余应力进行了研究,讨论了沉积温度对残余应力的影响.实验结果表明:随沉积温度升高,氧化钇稳定氧化锆薄膜中残余应力状态由张应力变为压应力.且压应力值随着沉积温度升高而增大;用X射线衍射仪表征了不同沉积温度下氧化钇稳定氧化锆薄膜的微观结构,探讨了薄膜微观结构与其应力的对应关系,并对比了纯ZrO2薄膜表现出的应力状念.     

射频磁控溅射法制备ZnS多晶薄膜及其性质

实验采用射频磁控溅射法在玻璃衬底上沉积了ZnS多晶薄膜,研究了沉积气压、退火温度和衬底温度对ZnS薄膜质量的影响.利用X射线衍射(XRD)分析了薄膜的微结构,并计算了内应力值.通过紫外-可见光分光光度计测量了薄膜的透过谱,计算了Urbach能量和禁带宽度.利用扫描电子显微镜(SEM)观察了薄膜的表面形貌.结果表明: 衬底温度为室温时沉积的ZnS薄膜具有较大的压应力,并且内应力值随着工作气压增大而增大,在300 ℃下进行退火处理后内应力松弛,衬底温度为350 ℃时制备的ZnS薄膜内应力小,透过率高,经300 ℃退火处理后结晶质量有所提高. 关键词： ZnS薄膜 射频磁控溅射 内应力     

磁控溅射硅基薄膜应力演化实时研究

采用多光束应力实时测量装置监控并分析了磁控溅射Si和SiNx薄膜的总力及应力演化过程。在两种膜层中均观察到了应力释放及恢复现象。Si膜中应力是可逆的,而SiNx膜中应力是部分可逆的。物理吸附和解吸附分别是应力释放和恢复的主要原因。不可逆的应力分量来源于化学吸附,基于吸附机制建立了一个应力释放模型。     

Thin film stress measurement by instrumented optical fibre displacement sensor

Residual stress can adversely affect the mechanical, electronic, optical and magnetic properties of thin films. This work describes a simple stress measurement instrument based on the bending beam method together with a sensitive non-contact fibre optical displacement sensor. The fibre optical displacement sensor is interfaced to a computer and a Labview programme enables film stress to be determined from changes in the radius of curvature of the film-substrate system. The stress measurement instrument was tested for two different kinds of thin film, hard amorphous carbon nitride (CN) and soft copper (Cu) films on silicon substrates deposited by RF magnetron sputtering. Residual stress developed in 500 nm thick CN thin films deposited at substrate temperatures in the range 50-550 °C was examined and it was found that stress in CN films decreased from 0.83 to 0.44 GPa compressive with increase of substrate temperature. Residual stress was found to be tensile (121 MPa) for Cu films of thickness 1500 nm deposited at room temperature.     

STRESS ANALYSIS IN CUBIC BORON NITRIDE FILMS BY X-RAY DIFFRACTION USING sin2 ψ METHOD

The boron nitride (BN) films containing cubic boron nitride (c-BN) and hexagonal boron nitride (h-BN) were prepared by radio frequency a ssisted thermal filament chemical vapor deposition. The stress and strain in BN films were investigated by X-ray diffraction analysis using the sin² ψ method. The results showed that both c-BN and h-BN in the same film have similar values of elastic strain, however, the compressive stress in c-BN is much greater than that in h-BN for the same film. Both stress and strain gradually decre ased with the increase of substrate temperature (T_s). The effective stress in the films calculated by the effective stress model increased with the increase of T_s. Furthermore, the dependence of effective stress in the films on T_s was also investigated.     

Electronic and optical properties in ZnO:Ga thin films induced by substrate stress

The effects of biaxial stress in ZnO:Ga thin films on different substrates, e.g., sapphire(0001), quartz, Si(001), and glass have been investigated by X-ray diffraction, atomic force microscopy, and electrical transport and ellipsometric measurements. A strong dependence of orientation, crystallite size, transport, and electronic properties upon the substrate-induced stress has been found. The structural properties indicate that a tensile stress exists in epitaxial ZnO:Ga films grown on sapphire, Si, and quartz, while a compressive stress appears in films grown on glass. The resistivity of the films decreased with increasing biaxial stress, which is inversely proportional to the product of the carrier concentration and Hall mobility. The refractive index n was found to decrease with increasing biaxial stress, while the optical band gap E₀ increased with stress. These behaviors are attributed to lattice contraction and the increase in the carrier concentration that is induced by the stress. Our experimental data suggest that the mechanism of substrate-induced stress is important for understanding the properties of ZnO:Ga thin films and for the fabrication of devices which use these materials.     

Thickness effect on stress,structural, electrical and sensing properties of (0 0 2) preferentially oriented undoped ZnO thin films

Preferentially oriented (0 0 2) ZnO thin films with c-axis-oriented wurtzite structure have been grown on Si (1 0 0) and glass substrates using radio frequency magnetron sputtering. The residual stresses have been determined and calculated via the Stoney formalism. The ZnO thin films have been also characterised by X-ray diffraction and scanning electron microscope, and their stoichiometry was verified by Rutherford backscattering spectroscopy. The evolution of the residual stress was studied as a function of film thickness in the 10–1200 nm range. A growth scenario is proposed and a possible correlation between the residual stress, film’s texture and crystallographic orientation is highlighted. The crystalline quality was found to improve, while the stress values decreased with increasing thickness, and as a ramification the thicker films developed better sensing response to gases. The mechanical (stress) and electrical properties of the films were also investigated as a function of the film thickness, which tended to manifestly improve in dependence on thickness as well. We attribute this to the fact that the thinner films are under vehement misfit stress that declines with increasing the film thickness further.     

Al2O3陶瓷衬底碳离子预注入对金刚石薄膜应力的影响研究

通过对Al2O3陶瓷衬底进行碳离子预注入，大大降低了Al2O3陶瓷衬底上金刚石薄膜的应力，且金刚石薄膜中的压应力随碳离子注入剂量的增加而线性下降.通过对Al2O3陶瓷衬底注入前后的对比分析表明，高能量的碳离子注入Al2O3陶瓷衬底以后，并没有产生过渡层性质的新相，而是大量累积在Al2O3晶格的间隙位，使Al2O3晶格发生畸变.而且，随着碳离子注入剂量的增加，Al2O3基体内晶格畸变加剧，注入层残余压应力也随之上升.当金刚石薄膜沉积以后，在降温的过程中衬底这部分残余应力得到释放，从而部分弛豫了金刚石薄膜中的 关键词： 金刚石薄膜 应力 离子注入 Al2O3陶瓷