等离子体金属表面氮化中放电温度对氮原子态粒子的影响

采用快电子和重粒子(N₂⁺,N⁺,N_f)混合的Monte Carlo模型,研究了氮直流辉光放电等离子体金属表面氮化过程中.e-N_2s及N₂⁺-N_2s两种碰撞离解过程产生的原子态粒子(N⁺,N)的产生率和氮化粒子(N⁺,N_f)轰击靶表面的能量、粒子数密度及入射角分布随气体温度的变化规律.结果表明,使阴极靶处活性粒子(N⁺,N_f)的能量高且粒子数密度大,存在一个最佳放电温度;粒子(N⁺,N)的产生率及在靶表面的密度数都随着放电气体温度的升高而减少;有大量中性快原子N_f在工件表面小角入射,且粒子(N⁺,N_f)角分布受温度的影响很小.     

Sr/Si界面沉积SrTiO3初始生长阶段的扫描遂道显微术研究

本文工作利用脉冲激光沉积术(PLD)和超高真空扫描隧道显微术(UHV-STM),研究了在Sr/Si(001)-(2×1)衬底表面上真空室温沉积几个单层SrTiO₃薄膜的初始生长过程.经660 ℃退火处理后,Sr/Si衬底表面上形成了纳米岛状结构.经分析,这些纳米小岛为C49-TiSi₂和 C54-TiSi₂.实验结果表明,在没有氧气的情况下退火,Sr/Si界面无法有效阻止SrTiO₃薄膜与Si衬底之间的相互作用. 关键词： 脉冲激光沉积术(PLD) 扫描隧道显微镜(STM) 3')" href="#">SrTiO₃ 2')" href="#">C54-TiSi₂     

FeOx上AsH3吸附净化的密度泛函研究

基于密度泛函理论研究了AsH₃和O₂分子在α-Fe₂O₃(001)表面和FeO(100)表面的吸附及共吸附性质.结果表明：AsH₃和O₂分子在α-Fe₂O₃(001)表面最稳定的吸附构型都是Hollow吸附位点. AsH₃分子在FeO(100)表面最稳定的吸附位点为Top O吸附位点. O₂分子在FeO(100)表面最稳定的吸附位点为Hollow吸附位点. O₂分子在α-Fe₂O₃(001)和FeO(100)表面吸附后均被活化从而促进AsH₃分子的催化氧化. AsH₃分子在α-Fe₂O₃(001)表面最小的吸附能为-0.7991 eV,在FeO(100)表面最小的吸附能为-0.9117 eV.吸附值数据表明AsH     

C60分子在GaAs(001)表面的外延生长的扫描隧道显微镜研究

利用扫描隧道显微镜（STM）系统地研究了C₆₀薄膜在GaAs（001）表面的异质外延生长．在GaAs（001）2×4-β相表面，观察到C₆₀薄膜以非密排面进行生长，并在生长中有结构相变产生．实验数据表明，薄膜下层面心立方（fcc）的晶格常数比C₆₀晶体的晶格常数要大13%；而薄膜的表层结构则展示了非理想的六角密堆（hcp）结构，其表面为hcp（1100）面，生长过程是非理想的层状生长模式．在GaAs（001）-c（4×4）衬底上，C₆₀薄膜的表面仍然是fcc（111）面，其结构参数与C₆₀晶体一致，但C₆₀薄膜采用了三维模式进行生长 关键词：     

GaAs(001)衬底上分子束外延生长立方和六方GaN薄膜

采用分子束外延方法在GaAs(001)衬底上生长出了03微米厚的GaN薄膜,X射线双晶衍射和室温光荧光测试结果表明,采用GaAs氮化表面作为成核层可获得高纯度立方GaN薄膜而采用AlAs氮化表面作为成核层可获得高纯度六方GaN薄膜.这一研究结果表明在GaAs衬底上生长GaN薄膜的相结构可以通过选择不同的成核层来控制. 关键词：     

P2S5/NH4OH处理GaAs(100)表面的电子能谱研究

采用俄歇电子能谱(AES)和X射线光电子能谱(XPS)研究了P₂S₅/NH₄OH钝化液处理的GaAs(100)表面的微观特性。AES测量表明,在钝化膜和GaAs衬底之间的界面处无O组分,只有P和S组分。XPS测量分析指出,经过P₂S₅/NH₄OH溶液处理后,GaAs表面处Ga₂O₃和As₂O_{3关键词：}     

SrTiO3(001)表面上Au和N原子相互作用的第一性原理研究

采用基于密度泛函理论的第一性原理平面波赝势方法研究了SrTiO₃(001)表面上Au和N原子间相互作用的微观机理.通过比较分析N置换表面层O原子前后SrTiO₃(001)表面吸附Au原子体系的相关能量和电子结构,发现SrTiO₃(001)表面吸附Au原子和N替代表面层O原子的置换过程二者之间存在明显的"协同效应",即N原子置换SrTiO₃(001)表面层O原子的过程增强了相应表面吸附Au原子的稳定性,而SrTiO关键词： 表面结构 相互作用 第一性原理     

氮分压对氮化铜薄膜结构及光学带隙的影响

在不同的氮分压r(r=N₂/［N₂+Ar］)和射频功率P下，使用反应射频磁控溅射法，在玻璃基片上制备了氮化铜薄膜样品.用台阶仪测得了薄膜的厚度，用原子力显微镜、X射线衍射仪、紫外-可见光谱仪对薄膜的表面形貌、结构及光学性质进行了表征分析.结果表明，薄膜的沉积速率随P和r的增加而增大.薄膜表面致密均匀，晶粒尺寸为30nm左右.随着r的增加，薄膜颗粒增大，且薄膜由(111)晶面转向(100)晶面择优生长.薄膜的光学带隙E_g在1.47—1.82eV之间，随r的增加而增大. 关键词： 氮化铜薄膜 反应射频磁控溅射 晶体结构 光学带隙     

GaAs(100)表面硫钝化的新方法:CH3CSNH2/NH4OH处理

建立了一种硫钝化GaAs(100)表面的新方法,即CH₃CSNH₂/NH₄OH溶液处理,应用同步辐射光电子能谱(SRPES)和X射线光电子能谱(XPS)表征了该钝化液处理的n-GaAs(100)表面的成键,特性和电子态.结果表明,经过处理的n-GaAs(100)表面,S既与As成键也与Ga成键,形成S与GaAs的新界面,并且Ga和As的氧化物被移走,这标志着CH₃CSNH₂/NH_{4关键词：}     

Li掺杂对MgH2(001)表面H2分子扩散释放影响的第一性原理研究

本文利用基于密度泛函理论的第一性原理分别研究了MgH₂(001)表面H原子扩散形成H₂分子释放出去的可能路径及金属Li原子掺杂对其影响. 研究结果表明: 干净MgH₂(001)表面第一层释放H原子形成H₂分子有两种可能路径, 其释放能垒分别为2.29和2.50 eV; 当将Li原子替代Mg原子时, 两种H原子扩散释放路径的能垒分别降到了0.31和0.22 eV, 由此表明Li原子掺杂使MgH₂(001)表面H原子扩散形成H₂释放更加容易.     

用N2-H2等离子体氮化GaAs衬底对ECR-PEMOCVD生长立方GaN的影响

我们研究了采用电子回旋共振等离子体增强金属有机化学气相沉积(ECR-PEMOCVE)技术在GaAs(001)衬底上外延生长立方GaN的过程中衬底氮化条件对外延膜生长的影响.发现氮化时在氮等离子体中加入氢等离子体对于立方GaN薄膜生长具有显著影响.和氮化过程中不加入氢等离子体相比,氮化过程中加入氢等离子体生长出的外延膜其X射线衍射(XRD)半高宽(FWHM)可以最高降低40%以上.原子力显微镜(AFM)观察表明:在N2-H2混合等离子中氮化过的衬底上外延的缓冲层表面变得更为平滑,晶粒也变得粗大.最后,我们提出了一个化学模型对上述结果进行了分析和解释..     

Synthesis and structural characterization of Zn_3N_2 powder

1 Introduction In the field of wide band gap semiconductors, many studies have been carried out on zinc compounds. For example, ZnO, as a semiconductor material of n-type with a wide direct band gap of 3.37 eV[1—3], can function as transparent conducting films of low cost; ZnO, with an extremely large exciton binding energy of 60 meV and a strong ultra- violet (UV) stimulated emission at room temperature, has enormous potential for serving as short-wave light devices[4], such as light-emit…     

Improvement of Atomic-Layer-Deposited Al2O3/GaAs Interface Property by Sulfuration and NH3 Thermal Nitridation

Fermi level pinning at the interface between high-h gate dielectric and GaAs induced by unstable native oxides is a major obstacle for high performance GaAs-based metal-oxide-semiconductor （MOS） devices. We demonstrate the improved Al2O3/GaAs interracial characteristics by （NH4）2S immersion and NH3 thermal pretreatment prior to A1203 deposition. X-ray photoelectron spectroscopy （XPS） analysis confirms that sulfuration of GaAs surface by （NH4 ）2S solution can effectively reduce As-O bonds while Ga-O bonds and elemental As still exist at Al2O3 /GaAs interface. However, it is found that N incorporation during the further thermal nitridation on sulfurated GaAs can effectively suppress the native oxides and elemental As in the sequent deposition of Al2O3. Atomic force microscopy （AFM） shows that the further thermal nitridation on sulfurated GaAs surface can also improve the surface roughness.     

Al_(0.17)Ga_(0.83)As/GaAs(001)薄膜退火过程的热力学分析

在As_4束流等效压强为1.2×10~(-3)Pa、退火60 min条件下改变退火温度,对Al_(0.17)Ga_(0.83)As/GaAs薄膜表面平坦化的条件进行了探讨.定量分析了薄膜表面坑、岛与平台的覆盖率和台阶-平台间薄膜粗糙度随退火温度变化的规律,得到最合适的退火温度为545℃(±1℃);根据退火模型发现退火温度的改变会影响参与熟化的原子的数量,熟化原子比θ正比于退火温度,即θ∝Τ.退火温度540℃条件下退火约60 min,薄膜表面达到基本平坦,推测此时0.20θ0.25;退火温度为545℃时,推测退火时间约为55-60 min.本实验得到的结论可以为生长平坦的Al_(0.17)Ga_(0.83)As/GaAs薄膜提供理论与实验指导.     

XPS study of the formation of ultrathin GaN film on GaAs(1 0 0)

The nitridation of GaAs(1 0 0) surfaces has been studied using XPS spectroscopy, one of the best surface sensitive techniques. A glow discharge cell was used to produce a continuous plasma with a majority of N atomic species. We used the Ga3d and As3d core levels to monitor the chemical state of the surface and the coverage of the species. A theoretical model based on stacked layers allows to determine the optimal temperature of nitridation. Moreover, this model permits the determination of the thickness of the GaN layer. Varying time of nitridation from 10 min to 1 h, it is possible to obtain GaN layers with a thickness between 0.5 nm and 3 nm.     

高In组分InGaNAs/GaAs量子阱的生长及发光特性

采用分子束外延技术(MBE)在Ga As衬底上外延生长高In组分(40%)In Ga NAs/Ga As量子阱材料,工作波长覆盖1.3~1.55μm光纤通信波段。利用室温光致发光(PL)光谱研究了N原子并入的生长机制和In Ga NAs/Ga As量子阱的生长特性。结果表明:N组分增加会引入大量非辐射复合中心;随着生长温度从480℃升高到580℃,N摩尔分数从2%迅速下降到0.2%;N并入组分几乎不受In组分和As压的影响,黏附系数接近1;生长温度在410℃、Ⅴ/Ⅲ束流比在25左右时,In_(0.4)Ga_(0.6)N_(0.01)As_(0.99)/Ga As量子阱PL发光强度最大,缺陷和位错最少;高生长速率可以获得较短的表面迁移长度和较好的晶体质量。     

New Ga-enriched reconstructions on the GaAs(001) surface

To prepare structure-ordered GaAs(001) surfaces at low temperatures, GaAs(001) surfaces coated with native oxides were exposed in an atomic hydrogen flow in the temperature range 280–450 °C. The new Ga-enriched GaAs(001) surfaces with the (4 × 4) and (2 × 4)/c(2 × 8) reconstructions were prepared and studied by the methods of X-ray photoelectron spectroscopy, low-energy electron diffraction, and high-resolution characteristic electron energy loss spectroscopy. For the GaAs(001)-(2 × 4) surface, the structure of the Ga-stabilized surface has been proposed and ab initio computed within the (2 × 4) Ga-trimer unit cell model.     

Time-evolution of the GaAs(0 0 1) pre-roughening process

The GaAs(0 0 1) surface is observed to evolve from being perfectly flat to a surface half covered with one-monolayer high spontaneously formed GaAs islands. The dynamics of this process are monitored with atomic-scale resolution using scanning tunneling microscopy. Surprisingly, pit formation dominates the early stages of island formation. Insight into the nucleation process is reported.     

GaAs半导体表面的等离子氮钝化特性研究

采用射频(RF)等离子方法,对Ga As样品进行了150 W高功率等离子氮钝化及快速退火处理。经过该方法钝化后的样品,光致发光(PL)强度上升了91%。XPS分析得出,Ga As样品表面的氮化效果随着氮等离子体功率的增加而逐渐趋于明显。氮化后的样品表面未发现氧化物残余。样品在空气中加热放置30 d,PL强度下降不明显,说明表面钝化层具有良好的稳定性。     

Optical anisotropy of cyclopentene terminated GaAs(001) surfaces

Up to now most of the experimental work regarding the adsorption of organic molecules has been concerned with silicon. Here we study the interface formation on a III–V-semiconductor, GaAs(001). We show that reflectance anisotropy spectroscopy (RAS) is a sensitive technique for investigating the interface formation between organic molecules and semiconductor surfaces. With RAS it is possible to determine the surface reconstruction and the structural changes at the interface during the deposition of organic molecules. These changes and the underlying adsorption process are discussed here for the adsorption of cyclopentene on GaAs(001)c(4×4), (2×4) and (4×2). PACS 61.66.Hq; 72.80.Le; 34.50.Dy; 68.47.Fg