零砷压下Ga液滴在AlGaAs表面扩散行为的研究

本文研究了Ga液滴在Al_(0.4)Ga_(0.6)As表面的扩散行为.在衬底温度为380℃时,在Al_(0.4)Ga_(0.6)As薄膜上沉积3 MLGa液滴;在零砷压下,通过改变退火时间(0 s, 150 s, 300 s, 450 s, 600 s)观察液滴形貌变化,利用剖面线、坑洞和液滴的比例变化分析发现液滴高度随时间延长越来越低,直至形成坑洞,Ga液滴内部的原子在Al_(0.4)Ga_(0.6)As表面上首先向外扩散,而后与表面As原子结合成环,约在退火时间到500 s时扩散模式逐步变化为向下溶蚀.利用公式计算出最初Ga覆盖率约为2.6 ML,并且在380℃下Ga液滴在Al_(0.4)Ga_(0.6)As表面的液滴消耗速率为0.0065 ML/s.     

Al_xGa_(1-x)As(100)表面性质的研究

用紫外光电子能谱研究了Al_(0.7)Ga_(0.3)As的表面态结构,观察到Al_(0.7)Ga_(0.3)As在价带中的两个表面态结构。在1500L原子氢吸附后消失。研究了这两个表面态结构在热退火消除表面损伤过程中的变化。结合LEED和XPS的实验结果,确定在450℃左右的热退火可以有效地消除损伤,获得一个完整的Al_(0.7)Ga_(0.3)As(100)表面。     

衬底温度对Ga液滴在Al_(0.4)Ga_(0.6)As表面形成纳米结构的影响

本文研究了不同衬底温度对Ga液滴在Al_(0.4)Ga_(0.6)As表面形成纳米结构的影响,当300℃≤T≤380℃时,Ga液滴演化成纳米孔(Nanohole)和盘状结构(diffusion halo),纳米结构的尺寸随温度升高而增大.当T≥385℃时,盘状结构消失,形成一定平坦的Al_xGa_(1-x)As薄膜,Ga液滴在界面处继续向下刻蚀直至耗尽,形成平均直径为75 nm,平均孔深为5.52 nm的纳米孔.本文还通过盘状结构测出平均扩散长度△R,并拟合出Ga原子在Al_(0.4)Ga_(0.6)As表面的激活能E_A=0.78(±0.01) eV和扩散前因子D_0=0.15(×4.1~(±1))10~(-2 ) cm~2s~(-1).     

生长温度对In_(0.5)Ga_(0.5)As/GaAs量子点尺寸的影响

采用分子束外延(MBE)技术制备In_(0.5)Ga_(0.5)As/GaAs量子点,利用扫描隧道显微镜(STM)对不同衬底温度下生长的样品进行表征分析.研究表明量子点密度随温度升高先增大后减小,其尺寸随温度的升高而增大.另外,量子点以S-K模式生长并受Ostwald熟化机制影响,其尺寸增大所需的能量来自应变能和温度提供的能量,高温条件下表面原子的解吸附作用会限制量子点的生长.     

生长温度对In_(0.5)Ga_(0.5)As/GaAs量子点尺寸的影响

采用分子束外延(MBE)技术制备In_(0.5)Ga_(0.5)As/GaAs量子点,利用扫描隧道显微镜(STM)对不同衬底温度下生长的样品进行表征分析.研究表明量子点密度随温度升高先增大后减小,其尺寸随温度的升高而增大.另外,量子点以S-K模式生长并受Ostwald熟化机制影响,其尺寸增大所需的能量来自应变能和温度提供的能量,高温条件下表面原子的解吸附作用会限制量子点的生长.     

生长温度对In_(0.5)Ga_(0.5)As/GaAs量子点尺寸的影响

采用分子束外延(MBE)技术制备In_(0.5)Ga_(0.5)As/GaAs量子点,利用扫描隧道显微镜(STM)对不同衬底温度下生长的样品进行表征分析.研究表明量子点密度随温度升高先增大后减小,其尺寸随温度的升高而增大.另外,量子点以S-K模式生长并受Ostwald熟化机制影响,其尺寸增大所需的能量来自应变能和温度提供的能量,高温条件下表面原子的解吸附作用会限制量子点的生长.     

低As压退火对GaAs(001)表面形貌与重构的影响

在低As压条件下退火处理原子级平坦的GaAs(001) βup 2(2×4)重构表面. 利用扫描隧道显微镜对表面进行研究, 发现随着低As压退火时间的延长, 表面形貌与表面重构的演变同步进行. 表面形貌经历了从有序平坦转变为无序平坦, 然后逐渐恢复到有序平坦状态的过程. 表面重构则由βup 2(2×4)重构逐渐转变为(2×6)重构, 然后再转变为锯齿状的(2×6)重构, 并且表面形貌与表面重构的演变存在一定的相互关系.     

InAlAs浓度对In_(0.83)Al_(0.17)As/In_(0.83)Ga_(0.17)As红外探测器特性的影响北大核心CSCD

红外探测器的性能受内部结构各层掺杂浓度的影响,而倍增层掺杂浓度会明显改变器件的性能。为了降低暗电流,提高器件性能,采用三元化合物In_(0.83)Al_(0.17)As作为倍增层材料,借助仿真软件Silvaco详细研究了In_(0.83)Al_(0.17)As/In_(0.83)Ga_(0.17)As红外探测器的倍增层掺杂浓度对器件电场强度、电流特性和光响应度的影响规律。结果表明,随着倍增层掺杂浓度的增加,器件倍增层内的电场强度峰值增加,同时,器件的暗电流与光响应度减小。进一步研究发现,当倍增层掺杂浓度为2×10^(16) cm^(−3)时,器件获得最优性能,暗电流密度为0.62144 A/cm^(2),在波长为1.5μm时,光响应度和比探测率分别为0.9544 A/W和1.9475×10^(9) cmHz^(1/2)W^(−1)。     

锰的硅化物薄膜在Si(100)-2×1表面生长的STM研究

锰的硅化物在微电子器件、自旋电子学器件等领域具有良好的应用前景, 了解锰的硅化物薄膜在硅表面的生长规律是其走向实际应用的关键步骤之一. 本文采用分子束外延方法在Si(100)-2× 1表面沉积了约4个原子层的锰薄膜, 并利用超高真空扫描隧道显微镜研究了该薄膜与硅衬底之间在250-750℃范围内的固相反应情况. 室温下沉积在硅衬底表面的锰原子与衬底不发生反应, 薄膜由无序的锰团簇构成; 当退火温度高于290℃时, 锰原子与衬底开始发生反应, 生成外形不规则的枝晶状锰硅化物和富锰的三维小岛; 325℃时, 衬底上开始形成平板状的MnSi小岛; 525℃时, 枝晶状锰硅化物完全消失, 出现平板状的MnSi_1.7大岛; 高于600℃时, 富锰的三维小岛和平板状的MnSi小岛全部消失, 仅剩下平板状的MnSi_1.7大岛. 这些结果说明退火温度决定了薄膜的形态和结构. 在大约600℃退火时岛的尺寸随着退火时间的延长而逐渐增大, 表明岛的生长遵从扩散限制的Ostwald熟化机理.     

形成半导体量子线结构的质子注入方法研究

用20keV的质子(H~+)注入到Al_(0.3)Ga_(0.7)As/GaAs/Al_(0.3)Ga_(0.7)As单量子阱,经快速退火,促使势垒上的Al向量子阱内扩散,尝试制备了线宽从0.5μm到0.1μm的量子线结构.由低温(14K)下阴极射线发光谱测量,观察到量子线中发光谱峰的蓝移,并通过与理论计算比较,讨论注入区内外Al的内扩散及掩膜区边缘横向离散的影响. 关键词：     

Improved thermal property of strained InGaAlAs/AlGaAs quantum wells for 808-nm vertical cavity surface emitting lasers

The 808-nm vertical cavity surface emitting laser (VCSEL) with strained In_0.13Ga_0.75Al_0.12As/Al_0.3Ga_0.7As quantum wells is designed and fabricated. Compared with the VCSELs with Al_0.05Ga_0.95As/Al_0.3Ga_0.7As quantum wells, the VCSEL with strained In_0.13Ga_0.75Al_0.12As/Al_0.3Ga_0.7As quantum wells is demonstrated to possess higher power conversion efficiency (PCE) and better temperature stability. The maximum PCE of 43.8% for 10-μm VCSEL is achieved at an ambient temperature of 30 ℃. The size-dependent thermal characteristics are also analyzed by characterizing the spectral power and output power. It demonstrates that small oxide-aperture VCSELs are advantageous for temperature-stable performance.     

Surface deformation phenomena induced by electron-beam irradiation in strained InGaAs/AlGaAs layers on GaAs (1 0 0) and (3 1 1)B substrates

The strained InGaAs/AlGaAs layer structures have been grown on GaAs ( 10 0) and (3 1 1)B substrates in a horizontal low-pressure metalorganic vapor-phase epitaxy system at a temperature of 800°C. In the surface observation using a high-resolution scanning electron microscope, we have found that surface deformation phenomena induced by electron-beam irradiation in strained In_0.36Ga_0.64As,/Al_0.3Ga_0.7As layers on GaAs (1 0 0) and (3 1 1)B substrates. The change of the surface morphology was observed in real time on the display of SEM with the accelerating voltage of 30 kV and the irradiated time of 60–120 s. The surface deformation through mass transport seems to be the cause of the residual strain relaxation due to electron-beam irradiation.     

First-principles study of stability of point defects and their effects on electronic properties of GaAs/AlGaAs superlattice

When the GaAs/AlGaAs superlattice-based devices are used under irradiation environments, point defects may be created and ultimately deteriorate their electronic and transport properties. Thus, understanding the properties of point defects like vacancies and interstitials is essential for the successful application of semiconductor materials. In the present study, first-principles calculations are carried out to explore the stability of point defects in GaAs/Al_0.5Ga_0.5As superlattice and their effects on electronic properties. The results show that the interstitial defects and Frenkel pair defects are relatively difficult to form, while the antisite defects are favorably created generally. Besides, the existence of point defects generally modifies the electronic structure of GaAs/Al_0.5Ga_0.5As superlattice significantly, and most of the defective SL structures possess metallic characteristics. Considering the stability of point defects and carrier mobility of defective states, we propose an effective strategy that Al_As, Ga_As, and Al_Ga antisite defects are introduced to improve the hole or electron mobility of GaAs/Al_0.5Ga_0.5As superlattice. The obtained results will contribute to the understanding of the radiation damage effects of the GaAs/AlGaAs superlattice, and provide a guidance for designing highly stable and durable semiconductor superlattice-based electronics and optoelectronics for extreme environment applications.     

GaAs薄膜的有效量子限制长度及其极化子特性

本文用分数维方法研究Al_xGa_1-xAs衬底上GaAs薄膜中的极化子特性, 提出了确定GaAs薄膜的有效量子限制长度的一个新方法, 解决了原来方法中在衬底势垒处有效量子限制长度发散的困难, 得到了Al_xGa_1-xAs衬底上GaAs薄膜中的极化子的维数和结合能. 关键词： 分数维方法 极化子 GaAs薄膜     

空间用GaInP/GaAs/In0.3Ga0.7 As(1 eV)倒装三结太阳电池研制

采用阶变缓冲层技术 (step-graded) 外延生长了具有更优带隙组合的倒装GaInP/GaAs/In_0.3Ga_0.7As(1.0 eV) 三结太阳电池材料, TEM和HRXRD测试表明晶格失配度为2%的In_0.3Ga_0.7As 底电池具有较低的穿透位错密度和较高的晶体质量, 达到太阳电池的制备要求. 通过键合、剥离等工艺制备了太阳电池芯片. 面积为 10.922 cm² 的太阳电池芯片在空间光谱条件下转换效率达到32.64% (AM0, 25 ℃), 比传统晶格匹配的 GaInP/GaAs/Ge(0.67 eV) 三结太阳电池的转换效率提高3个百分点. 关键词： 太阳电池 三结 倒装结构     

Formation of AlxGa1−xAs periodic array of micro-hexagonal pillars and air holes by selective area MOVPE

A two-dimensional (2D) periodic array having air/semiconductor interfaces can be applied to photonic crystals (PCs), which are expected to control spontaneous emission and optical transports in the next-generation devices. In this paper, we report on the selective area metal-organic vapor phase epitaxial (SA-MOVPE) growth of a Al_xGa_1−xAs 2D periodic array on a GaAs (1 1 1)B substrate for application to 2DPCs having GaAs/AlGaAs heterostructures. Al_xGa_1−xAs (x=0, 0.25 and 0.50) growth was carried out on triangular lattice array of hexagonal GaAs openings and hexagonal SiN_x masks. A uniform Al_0.50Ga_0.50As hexagonal pillar array and a GaAs hexagonal air-hole array with a 1 μm-period were successfully obtained. The important growth parameter for uniform 2DPC structure formation by SA-MOVPE was clarified. Furthermore, we describe the successful demonstration of a 400 nm-period pillar array and an air-hole array, which corresponds to the optical communication wavelength λ=1.3–1.55 μm. The results indicate that SA-MOVPE method is very promising for the formation of uniform semiconductor 2DPCs without the occurrence of process-induced damages.     

GaAs/Al0.23Ga0.77As双量子阱的带边不连续性和阱间耦合

本文报道在300和77K对一组具有不同垒宽L_b0.23Ga_0.77As双量子阱样品的光调制反射谱(PR)的研究结果。除观察到11H,11L和22H等容许跃迁外,同时还识别一个从Al_0.23Ga_0.77As价带顶至量子阱第一电子束缚能级的跃迁,另一个从量子阱第一轻空穴束缚能级至Al_0.23Ga_0.77As导带底的跃迁。利用这些跃迁确定导带边不连续性为0.63。对L_{b关键词：}     

Non-destructive characterisation of (Ga,In,Al,As,P)-based ternary multilayer structures using spectroscopic ellipsometry

Spectroscopic ellipsometry has been used to measure compositions and layer thicknesses of two-, three- and four-layer structures consisting of Al_0.2Ga_0.8As/GaAs and In_0.53Ga_0.47As/Al_0.48In_0.52As/InP materials. A simple procedure has been developed to obtain Al_0.48In_0.52As dielectric functions by scaling InP values. Very good agreement has been obtained with destructive techniques.     

不同散射机理对 Al2O3/InxGa1-xAs nMOSFET 反型沟道电子迁移率的影响

通过考虑体散射、界面电荷的库仑散射以及 Al₂O₃/In_xGa_1-xAs 界面粗糙散射等主要散射机理, 建立了以 Al₂O₃为栅介质In_xGa_1-xAs n 沟金属-氧化物-半导体场效应晶体管 (nMOSFETs) 反型沟道电子迁移率模型, 模拟结果与实验数据有好的符合. 利用该模型分析表明, 在低至中等有效电场下, 电子迁移率主要受界面电荷库仑散射的影响; 而在强场下, 电子迁移率则取决于界面粗糙度散射. 降低界面态密度, 减小 Al₂O₃/In_xGa_1-xAs 界面粗糙度, 适当提高In含量并控制沟道掺杂在合适值是提高 InGaAs nMOSFETs 反型沟道电子迁移率的主要途径. 关键词： InGaAs MOSFET 反型沟道电子迁移率 散射机理     

利用In0.82Ga0.18As与InP衬底之间的应力制作结构材料的缓冲层

采用低压金属有机化学气相淀积(LP-MOCVD)技术,在InP(100)衬底上生长In0.82Ga0.18As,研究生长温度对In0.82Ga0.18As材料表面形貌、结晶质量和电学性能的影响.利用InP(100)衬底与In0.82Ga0.18As材料晶格失配所产生的应变,在不同的生长温度下应变释放程度不同,进而在In...