p-i-nInP/In_(0.53)Ga_(0.47)As/InP探测器结构优化

利用半导体仿真工具Silvaco对p-i-n InP/In_(0.53)Ga_(0.47)As/InP近红外光探测器进行优化仿真.参考实际器件对红外探测器进行建模,并将其暗电流、光谱响应仿真结果与实验结果进行拟合,保证仿真结果的有效性.以减小探测器的暗电流为目的,优化其结构.针对探测器吸收层厚度和吸收层掺杂浓度对暗电流、光响应的影响进行研究,发现当吸收层厚度大于0.3μm后,暗电流不再上升,但光响应随着吸收层厚度的增加而增大;当吸收层掺杂浓度不断上升时,器件暗电流不断降低,当掺杂浓度上升到2×1017/cm3时,暗电流达到最低值.本文还研究了p-i-n型探测器的瞬态响应,探究了响应速度与反偏电压之间的关系,发现提高反偏电压能减小探测器响应时间.     

In0.83Al0.17As倍增层对In0.83Ga0.17As/GaAs雪崩光电探测器的特性影响

倍增层对雪崩光电探测器内部载流子的碰撞电离至关重要,因此,采用三元化合物In_0.83Al_0.17As作为倍增层材料,借助器件仿真工具Silvaco-TCAD,详细探究了In_0.83Ga_0.17As/GaAs雪崩光电探测器的倍增层厚度及掺杂浓度对其内部电场强度、电流特性和电容特性的影响规律。研究表明,随着倍增层厚度的增加,器件的电场强度和电容呈减小趋势。同时,倍增层掺杂浓度的增大会引起电容和倍增层内的电场强度峰值增加。进一步研究发现,随着倍增层厚度的增加,器件的穿通电压线性增大,击穿电压先减小后增大,但倍增层掺杂浓度的增加会引起器件击穿电压的减小。此外,用电场分布和倍增因子的结合解释了器件穿通电压与击穿电压的变化。     

In_(0.53)Ga_(0.47)As/InP雪崩光电二极管响应及电学特性

通过分子束外延生长和开管式Zn扩散方法,制备了低暗电流、宽响应范围的In_(0.53)Ga_(0.47)As/InP雪崩光电二极管.在0.95倍雪崩击穿电压下,器件暗电流小于10nA;-5V偏压下电容密度低至1.43×10~(-8) F/cm~2.在1 310nm红外光照及30V反向偏置电压下,雪崩光电二极管器件的响应范围为50nW~20mW,响应度达到1.13A/W.得到了电荷层掺杂浓度、倍增区厚度结构参数与击穿电压和贯穿电压的关系:随着电荷层电荷密度的增加,器件贯穿电压线性增加,而击穿电压线性降低;电荷层电荷面密度为4.8×10~(12)cm~(-2)时,随着倍增层厚度的增加,贯穿电压线性增加,击穿电压增加.通过对器件结构优化,雪崩光电二极管探测器实现25V的贯穿电压和57V的击穿电压,且具有低暗电流和宽响应范围等特性.     

晶格匹配In_(0.17)Al_(0.83)N/GaN异质结电容散射机制

制备了晶格匹配In_(0.17)Al_(0.83)N/GaN异质结圆形平面结构肖特基二极管,通过测试和拟合器件的电容-频率曲线,研究了电容的频率散射机制.结果表明:在频率高于200 kHz后,积累区电容随频率出现增加现象,而传统的电容模型无法解释该现象.通过考虑漏电流、界面态和串联电阻等影响对传统模型进行修正,修正后的电容频率散射模型与实验结果很好地符合,表明晶格匹配In_(0.17)Al_(0.83)N/GaN异质结电容随频率散射是漏电流、界面态和串联电阻共同作用的结果.     

Al_(0.17)Ga_(0.83)As/GaAs(001)薄膜退火过程的热力学分析

在As_4束流等效压强为1.2×10~(-3)Pa、退火60 min条件下改变退火温度,对Al_(0.17)Ga_(0.83)As/GaAs薄膜表面平坦化的条件进行了探讨.定量分析了薄膜表面坑、岛与平台的覆盖率和台阶-平台间薄膜粗糙度随退火温度变化的规律,得到最合适的退火温度为545℃(±1℃);根据退火模型发现退火温度的改变会影响参与熟化的原子的数量,熟化原子比θ正比于退火温度,即θ∝Τ.退火温度540℃条件下退火约60 min,薄膜表面达到基本平坦,推测此时0.20θ0.25;退火温度为545℃时,推测退火时间约为55-60 min.本实验得到的结论可以为生长平坦的Al_(0.17)Ga_(0.83)As/GaAs薄膜提供理论与实验指导.     

InP/In_(0.53)Ga_(0.47)As/InP双异质结双极型晶体管的仿真与分析

运用Silvaco-TCAD软件构建了InP/In_(0.53)Ga_(0.47)As/InP双异质结双极型晶体管模型,研究了掺杂浓度、厚度以及温度对器件特性的影响.结果表明:双异质结双极型晶体管DHBT的开启电压能达到约0.4V,当浓度达到4×10^(19) cm^(-3)的时候,电流增益可以达到一个最佳状态,其峰值能达到约125左右,且浓度对截止频率以及最高振荡频率没有太大的影响;当增大基区厚度时,电流增益会减小,改变厚度能够使DHBT输出特性得以提升,并且提高基区电流的注入;双异质结双极型晶体管具有很好的温度稳定性.     

调制掺杂的应变In_(0.60)Ga_(0.40)As/In_(0.52)Al_(0.48)As多量子阱结构的光致发光谱研究

报道了调制掺杂的应变In_(0.60)Ga_(0.40)As/In_(0.52)Al_(0.48)As多量子阱中室温光致发光光谱.观察到n=1和2电子子带到n=1重空穴子带的强发光峰.在低温下可以观察到n=1电子子带到n=1轻空穴弱发光肩胛.通过对发光强度随激发功率及温度依赖关系以及理论模型的分析研究,认为该调制掺杂量子阱中辐射复合效率降低的主要机制是应变失配位错对载流子的陷阱作用.界面上的失配位错是陷阱的主要来源.并用静态的光致发光理论模型对实验结果进行了解释.     

超薄介质插层调制的氧化铟锡/锗肖特基光电探测器

本文通过在氧化铟锡(indium tin oxide, ITO)透明电极和锗(germanium, Ge)之间引入超薄氧化物介质层以调节其接触势垒高度,制备出低暗电流、高响应度的锗肖特基光电探测器.比较研究了采用不同种类介质Al_2O_3和MoO_3,以及不同掺杂浓度的锗和硅衬底上外延锗材料制作的ITO/Ge肖特基二极管特性.发现2 nm厚的Al_2O_3插层可有效提高ITO与n-Ge和i-Ge的接触势垒高度,而MoO_3插层对ITO与不同Ge材料的接触势垒高度影响不明显. ITO/Al_2O_3/i-Ge探测器由于其增大的势垒高度表现出性能最佳,暗电流(–4 V)密度低至5.91 mA/cm~2, 1310 nm波长处光响应度高达4.11 A/W.而基于硅基外延锗(500 nm)材料制作的ITO/Al_2O_3/Ge-epi光电探测器的暗电流(–4 V)密度为226.70 mA/cm~2, 1310 nm处光响应度为0.38 A/W.最后,使用二维位移平台对ITO/Al_2O_3/i-Ge光电探测器进行了单点成像实验,在1310 nm, 1550 nm两个波段得到了清晰可辨的二维成像图.     

具有高光开关比和高响应度的单根In2O3纳米线紫外光电晶体管

In_2O_3纳米线由于其独特性质而成为紫外光电探测器的潜力候选者,目前,In_2O_3纳米线基紫外光电探测器已被广泛研究,但较大的暗电流限制了其进一步应用。本文制备了In_2O_3纳米线紫外光电晶体管,通过背栅电压的调制作用,器件中的暗电流几乎被全部耗尽,同时,由于光照下的阈值偏移,栅压对光电流的影响较小。最终得到具有高光开关比(1.07×10~8)和高响应度(5.58×10~7 A/W)的单根In_2O_3纳米线紫外光电晶体管,性能明显优于之前报道的In_2O_3纳米结构光电探测器。本工作促进了In_2O_3纳米线在下一代纳米光电子器件和集成电路中的应用。     

InGaAs探测器的盲元分析及P电极优化

采用扫描电容显微镜分析了平面型PIN In_(0.52)Al_(0.48)As/In_(0.53)Ga_(0.47)As/In_(0.52)Al_(0.48)As短波红外探测器盲元产生的原因,利用半导体器件仿真工具Sentaurus TCAD对探测器中的盲元特性进行了模拟,并利用制备的Au/P-In_(0.52)Al_(0.48)As传输线结构芯片对P电极的欧姆接触进行优化.研究结果表明,P电极与扩散区外的N~--In_(0.52)Al_(0.48)As帽层形成导电通道导致了盲元的产生,优化后Au与P-In_(0.52)Al_(0.48)As帽层之间具有更低的比接触电阻为3.52×10~(-4)Ω·cm~(-2),同时Au在高温快速热退火过程中的流动被抑制,从而降低了盲元产生的概率.     

悬空氧化铟纳米线晶体管制备与光电性能表征

一维(1D)半导体纳米线在纳米电子学和纳米光子学中表现出色。然而,纳米线晶体管的电特性对纳米线与衬底之间的相互作用非常敏感,而优化器件结构可以改善纳米线晶体管的电学和光电检测性能。本文报道了通过一步式光刻技术制造的悬浮式In₂O₃纳米线晶体管,显示出54.6 cm²V^?1s^?1的高迁移率和241.5 mVdec^?1的低亚阈值摆幅。作为紫外光电探测器,光电晶体管显示出极低的暗电流(~10?13 A)和高响应度1.6×10⁵ A?W^?1。悬浮晶体管的沟道材料的这种简单而有效的制备方法可广泛用于制造高性能微纳米器件。     

Hot electron relaxation in In0.53Ga0.47As

We have determined the hot carrier energy loss rate to the lattice by measuring the cooling curve of a photoexcited hot plasma in In_0.53Ga_0.47As. These measurements were made by using a sensitive upconversion technique to measure the infrared (1.2−1.6 μm) luminescence with 10 ps time resolution. We find the carrier energy loss rate to be about an order of magnitude smaller than predicted by a simple model, and surprisingly insensitive to carrier density at high densities.     

空间用GaInP/GaAs/In0.3Ga0.7 As(1 eV)倒装三结太阳电池研制

采用阶变缓冲层技术 (step-graded) 外延生长了具有更优带隙组合的倒装GaInP/GaAs/In_0.3Ga_0.7As(1.0 eV) 三结太阳电池材料, TEM和HRXRD测试表明晶格失配度为2%的In_0.3Ga_0.7As 底电池具有较低的穿透位错密度和较高的晶体质量, 达到太阳电池的制备要求. 通过键合、剥离等工艺制备了太阳电池芯片. 面积为 10.922 cm² 的太阳电池芯片在空间光谱条件下转换效率达到32.64% (AM0, 25 ℃), 比传统晶格匹配的 GaInP/GaAs/Ge(0.67 eV) 三结太阳电池的转换效率提高3个百分点. 关键词： 太阳电池 三结 倒装结构     

Interband Stark effects in InxGa1−xAs/InyAl1−yAs coupled step quantum wells

The effects of an electric field on the interband transitions in In_xGa_1−xAs/In_yAl_1−yAs coupled step quantum wells have been investigated both experimentally and theoretically. A In_xGa_1−xAs/In_yAl_1−yAs coupled step quantum well sample consisted of the two sets of a 50 Å In_0.53Ga_0.47As shallow quantum well and a 50 Å In_0.65Ga_0.35As deep step quantum well bounded by two thick In_0.52Al_0.48As barriers separated by a 30 Å In_0.52Al_0.48As embedded potential barrier. The Stark shift of the interband transition energy in the In_xGa_1−xAs/In_yAl_1−yAs coupled step quantum well is larger than that of the single quantum well, and the oscillator strength in the In_xGa_1−xAs/In_yAl_1−yAs coupled step quantum well is larger than that in a coupled rectangular quantum well. These results indicate that In_xGa_1−xAs/In_yAl_1−yAs coupled step quantum wells hold promise for potential applications in optoelectron devices, such as tunable lasers.     

Improved thermal property of strained InGaAlAs/AlGaAs quantum wells for 808-nm vertical cavity surface emitting lasers

The 808-nm vertical cavity surface emitting laser (VCSEL) with strained In_0.13Ga_0.75Al_0.12As/Al_0.3Ga_0.7As quantum wells is designed and fabricated. Compared with the VCSELs with Al_0.05Ga_0.95As/Al_0.3Ga_0.7As quantum wells, the VCSEL with strained In_0.13Ga_0.75Al_0.12As/Al_0.3Ga_0.7As quantum wells is demonstrated to possess higher power conversion efficiency (PCE) and better temperature stability. The maximum PCE of 43.8% for 10-μm VCSEL is achieved at an ambient temperature of 30 ℃. The size-dependent thermal characteristics are also analyzed by characterizing the spectral power and output power. It demonstrates that small oxide-aperture VCSELs are advantageous for temperature-stable performance.     

High performance uncooled InAsSbP/InGaAs photodiodes for the 1.8–3.4 μm wavelength range

Room temperature In_0.97Ga_0.03As photodiodes with an InAs_0.36Sb_0.20P_0.44 transparent window layer operating in the mid-infrared region over the wavelength range 1.8–3.4 μm are reported. The InAs_0.36Sb_0.20P_0.44/In_0.97Ga_0.03As heterojunction photodiodes were grown on p-type (100) InAs substrates by liquid phase epitaxy (LPE). Basic detector characteristics have been measured and compared with other detectors in this wavelength range. The typical detectivity of the photodiodes is 1.2 × 10¹⁰ cm Hz^1/2/W at room temperature, which compares very favourably with that of TE cooled HgCdTe and is at least three times that of cooled PbSe photoconductors. The InAs_0.36Sb_0.20P_0.44/In_0.97Ga_0.03As heterojunction photodiodes offer the advantage of increased sensitivity and extended wavelength response at room temperature compared with that of currently available commercial photodetectors, making them an attractive alternative for a number of mid-infrared applications including optical gas sensors and infrared spectrometers.     

Numerical analysis of In0.53Ga0.47As/InP single photon avalanche diodes

A rigorous theoretical model for In 0.53 Ga 0.47 As/InP single photon avalanche diode is utilized to investigate the dependences of single photon quantum efficiency and dark count probability on structure and operation condition.In the model,low field impact ionizations in charge and absorption layers are allowed,while avalanche breakdown can occur only in the multiplication layer.The origin of dark counts is discussed and the results indicate that the dominant mechanism that gives rise to dark counts depends on both device structure and operating condition.When the multiplication layer is thicker than a critical thickness or the temperature is higher than a critical value,generation-recombination in the absorption layer is the dominative mechanism;otherwise band-to-band tunneling in the multiplication layer dominates the dark counts.The thicknesses of charge and multiplication layers greatly affect the dark count and the peak single photon quantum efficiency and increasing the multiplication layer width may reduce the dark count probability and increase the peak single photon quantum efficiency.However,when the multiplication layer width exceeds 1 μm,the peak single photon quantum efficiency increases slowly and it is finally saturated at the quantum efficiency of the single photon avalanche diodes.     

Growth condition optimization and mobility enhancement through inserting AlAs monolayer in the InP-based In_xGa_(1-x)As/In_(0.52)Al_(0.48)As HEMT structures

The structure of In P-based In_xGa_(1-x) As/In0.52Al0.48 As pseudomorphic high electron mobility transistor(PHEMT)was optimized in detail.Effects of growth temperature,growth interruption time,Si δ-doping condition,channel thickness and In content,and inserted Al As monolayer(ML) on the two-dimensional electron gas(2DEG) performance were investigated carefully.It was found that the use of the inserted Al As monolayer has an enhancement effect on the mobility due to the reduction of interface roughness and the suppression of Si movement.With optimization of the growth parameters,the structures composed of a 10 nm thick In0.75Ga0.25 As channel layer and a 3 nm thick Al As/In0.52Al0.48 As superlattices spacer layer exhibited electron mobilities as high as 12500 cm~2·V-1·s~(-1)(300 K) and 53500 cm~2·V~(-1_·s~(-1)(77 K) and the corresponding sheet carrier concentrations(Ns) of 2.8×10~(12)cm~(-2)and 2.9×1012cm~(-2),respectively.To the best of the authors' knowledge,this is the highest reported room temperature mobility for In P-based HEMTs with a spacer of 3 nm to date.