近红外波段InAs量子点结构与光学特性

采用分子束外延技术,分别在480,520℃的生长温度下,制备了淀积厚度2.7ML的InAs/GaAs量子点。用原子力显微镜对样品进行形貌测试和统计分布。结果表明,在相应的生长温度下,量子点密度分别为8.0×10¹⁰,5.0×10⁹cm^-2,提高生长温度有利于获得大尺寸的量子点,并且量子点按高度呈双模分布。结合光致发光谱的分析,在480℃的生长条件下,最近邻量子点之间的合并导致了量子点尺寸的双模分布;而在525℃的生长温度下,In偏析和InAs解析是形成双模分布的主要原因。     

SIMOX SOI埋氧注氮工艺对埋氧中固定正电荷密度的影响

在SIMOX SOI材料的埋氧中注氮是为了增强该类材料的抗辐射能力.通过C-V研究表明，对于埋氧层为150 nm的SIMOX SOI材料来说，当在其埋氧中注入4×10¹⁵cm^-2剂量的氮后，与未注氮埋氧相比，注氮埋氧中的固定正电荷密度显著增加了；而对于埋氧层为375nm的SIMOX SOI材料来说，当注氮剂量分别为2×10¹⁵cm^-2和3×10¹⁵cm^{-2关键词： SIMOX 埋氧 注氮 固定正电荷密度}     

退火对AlGaInP/GaInP多量子阱 LED外延片性能的影响

采用LP-MOCVD技术在n-GaAs衬底上生长了AlGaInP/GaInP多量子阱红光LED外延片.研究表明退火对外延片性能有重要影响.与未退火样品相比,460℃退火15min,外延片p型GaP层的空穴浓度由5.6×10¹⁸cm^-3增大到6.5×10¹⁸cm^-3,p型AlGaInP层的空穴浓度由6.0×10¹⁷cm^-3增大到1.1×10¹⁸cm^-3.但退火温度为780℃时,p型GaP层和p型AlGaInP层的空穴浓度分别下降至8×10¹⁷cm^-3和1.7×10¹⁷cm^-3,且Mg原子在AlGaInP系材料中的扩散加剧,导致未掺杂AlGaInP/GaInP多量子阱呈现p型电导.在460～700℃退火范围内,并没有使AlGaInP/GaInP多量子阱的发光性能发生明显变化.但退火温度为780℃时,AlGaInP/GaInP多量子阱的发光强度是退火前的2倍.     

厚度对MOCVD生长InN薄膜位错特性与光电性质的影响

研究了金属有机物化学气相沉积法制备的不同厚度InN薄膜的位错特性与光电性质.基于马赛克微晶模型,通过X射线衍射非对称面摇摆曲线测量,拟合出样品刃型位错密度分别为4.2×10¹⁰cm^-2和6.3×10¹⁰cm^-2,并发现样品的微晶扭转角与位错密度随薄膜厚度增加而减小.通过室温霍尔效应测量得到样品载流子浓度分别为9×10¹⁸cm^-3和1.2×10¹⁸cm关键词： 氮化铟 位错 载流子起源 局域态     

梯度掺杂与均匀掺杂GaN光电阴极的对比研究

为了提高负电子亲和势(NEA)GaN光电阴极的量子效率,利用金属有机化合物化学气相淀积(MOCVD)外延生长了梯度掺杂反射式GaN光电阴极,其掺杂浓度由体内到表面依次为1×10¹⁸ cm^-3,4×10¹⁷ cm^-3,2×10¹⁷ cm^-3和6×10¹⁶ cm^-3,每个掺杂浓度区域的厚度约为45 nm,总的厚度为180 nm.在超高真 关键词： NEA GaN光电阴极 梯度掺杂 量子效率 能带结构     

975 nm量子阱激光二极管的质子位移损伤

针对典型卫星轨道辐射环境下激光二极管(LD)的可靠性评估问题，对自研的975 nm GaAs基量子阱(QW)LD开展了10 MeV质子、3×10⁸～3×10¹¹ cm^-2注量的地面模拟辐照实验。结合蒙特卡罗软件仿真模拟和数学分析方法，全面研究了器件位移损伤退化规律，以及不同注量、不同辐照缺陷对器件功率特性、电压特性和波长特性等关键参数的影响。结果显示，质子辐照会引入非辐射复合中心等缺陷并破坏界面结构，导致载流子浓度降低、光电限制能力下降，宏观上体现为器件阈值电流增加、输出功率下降、波长红移和单色性受损。同时，3×10¹⁰ cm^-2以上注量的10 MeV质子等效位移损伤剂量辐照会对975 nm QW LD性能产生较大影响。     

GaAs体材料及其量子阱的光学极化退相特性

采用飞秒时间分辨瞬态简并四波混频技术，在室温下测量了GaAs体材料及其量子阱材料GaAs/Al_0.3Ga_0.7As的光学极化超快退相时间，当激光中心波长为785nm，受激载流子浓度为10¹¹cm^-2时，它们的退相时间分别为28fs和46fs.量子阱材料的退相时间比体材料的长，这是由于量子阱中的载流子在垂直于GaAs/AlGaAs界面的运动受到限制，运动呈现二维特性，大大减小了载流子的散射概率.实验中观察到瞬态简并四波混 关键词： 时间分辨简并四波混频 飞秒激光脉冲 退相 密度矩阵     

生物大分子杂化处理的CdSe/ZnS核/壳量子点多层膜的超快三阶非线性研究

利用静电自组装技术，以生物大分子材料壳聚糖杂化处理具有稳定结构的CdSe/ZnS核/壳量子点，形成复合多层薄膜. 与薄膜的吸收谱线比较，在375nm飞秒激光激发下测量的量子点的光致发光谱存在Stokes位移. 采用Z扫描技术，利用790nm飞秒激光研究了其三阶非线性吸收和折射特性，发现饱和吸收信号来自CdSe/ZnS量子点，而自聚焦的折射信号则部分来自壳聚糖. 测出多层膜的三阶非线性系数分别是β＝6.5×10^-6cm/W，n₂＝1.5×10^-10cm²/W. 关键词： CdSe/ZnS量子点 非线性性能 光致发光谱     

透射式负电子亲和势GaN光电阴极的光谱响应研究

利用金属有机化合物化学气相淀积(MOCVD)生长了发射层厚度为150 nm、掺杂浓度为1.6×10¹⁷ cm^-3的透射式GaN光电阴极,并在超高真空激活系统中对其进行了激活.通过多信息量测试系统进行了测试,发现透射式负电子亲和势(NEA)GaN光电阴极的量子效率曲线成一个"门"的形状,在255—355 nm波段有较大且平坦的响应,在290 nm处取得最大值为13%,由于AlN缓冲层对短波段光的吸收系数较大,在小于255 nm的波段量子效率出现了下降,当波长大于3 关键词： 透射式 NEA GaN光电阴极 量子效率     

自组织InAs/GaAs量子点垂直排列生长研究

利用自组织生长InAs/GaAs量子点的垂直相关排列机制，生长了上下两层用6.5nm GaAs间隔的InAs结构.下层InAs已经成岛，由于应力传递效应，上层InAs由二维生长向三维成岛生长的转变提前发生，临界厚度从1.7ML变成小于1.5ML.透射电子显微镜截面象显示形成上下两层高度差别很大的InAs量子点，但是由于两层量子点之间存在强烈的电子耦合，光致发光谱中只有与包含大量子点的InAs层相对应的一个发光峰.     

Leed,aes and photoemission measurements of epitaxially grown GaAs(001), (111)A and (1̄1̄1̄)B surfaces and their behaviour upon cs adsorption

Epitaxially grown GaAs(001), (111) and (1?1?1?) surfaces and their behaviour on Cs adsorption are studied by LEED, AES and photoemission. Upon heat treatment the clean GaAs(001) surface shows all the structures of the As-stabilized to the Ga-stabilized surface. By careful annealing it is also possible to obtain the As-stabilized surface from the Ga-stabilized surface, which must be due to the diffusion of As from the bulk to the surface. The As-stabilized surface can be recovered from the Ga-stabilized surface by treating the surface at 400°C in an AsH₃ atmosphere. The Cs coverage of all these surfaces is linear with the dosage and shows a sharp breakpoint at 5.3 × 10¹⁴ atoms cm^?2. The photoemission reaches a maximum precisely at the dosage of this break point for the GaAs(001) and GaAs(1?1?1?) surface, whereas for the GaAs(111) surface the maximum in the photoemission is reached at a higher dosage of 6.5 × 10¹⁴ atoms cm^?2. The maximum photoemission from all surfaces is in the order of 50μA Im^?1 for white light (T = 2850 K). LEED measurements show that Cs adsorbs as an amorphous layer on these surfaces at room temperature. Heat treatment of the Cs-activated GaAs (001) surface shows a stability region of 4.7 × 10¹⁴ atoms cm^?2 at 260dgC and one of 2.7 × 10¹⁴ atoms cm^?2 at 340°C without any ordering of the Cs atoms. Heat treatment of the Cs-activated GaAs(111) crystal shows a gradual desorption of Cs up to a coverage of 1 × 10¹⁴ atoms cm^?2, which is stable at 360°C and where LEED shows the formation of the GaAs(111) (√7 × √7)Cs structure. Heat treatment of the Cs-activated GaAs(1?1?1?) crystal shows a stability region at 260°C with a coverage of 3.8 × 10¹⁴ atoms cm^?2 with ordering of the Cs atoms in a GaAs(1?1?1?) (4 × 4)Cs structure and at 340°C a further stability region with a coverage of 1 × 10¹⁴ at cm^?2 with the formation of a GaAs(1?1?1?) (√21 × √21)Cs structure. Possible models of the GaAs(1?1?1?) (4 × 4)Cs, GaAs(1?1?1?)(√21 × √21)Cs and GaAs(111) (√7 × √7)Cs structures are given.     

Photoluminescence as a tool for the study of the electronic surface properties of gallium arsenide

Electronic surface parameters of GaAs have been determined from a qualitative and quantitative analysis of the relative photoluminescence intensity at 300 K. Characteristics of etched (100) surfaces ofn- andp-type liquid phase epitaxial GaAs have been found to be governed by negative surface charges. A density of charged surface states of about 10¹² cm⁻² and a band bending of 0.59 eV have been found forn-type material with an electron concentration of 1.1×10¹⁷ cm⁻³. Forp-type samples with hole densities ranging from 6×10¹⁵ to 4.3×10¹⁸ cm⁻³ the estimated density of negatively charged surface states was below 2×10¹¹ cm⁻², and the band bending was not more than a few kT.     

GaSb layers with low defect density deposited on (001) GaAs substrate in two-dimensional growth mode using molecular beam epitaxy

We report on the growth of fully relaxed and smooth GaSb layers with reduced density of threading dislocations, deposited on GaAs substrate. We prove that three parameters have to be controlled in order to obtain applicable GaSb buffers with atomically smooth surface: interfacial misfit (IMF), the etch pit density (EPD) and the growth mode.The GaSb/GaAs interfacial misfit array and reduced EPD ≤1.0 × 10⁷ cm^?2 were easily obtained using As-flux reduction for 3 min and Sb-soaking surface for 10 s before the GaSb growth initiation. The successive growth of GaSb layer proceeded under the technological conditions described by the wide range of the following parameters: r_G ∈ (1.5 ÷ 1.9) Å/s, T_G ∈ (400 ÷ 520)°C, V/III ∈ (2.3 ÷ 3.5). Unfortunately, a spiral or 3D growth modes were observed for this material resulting in the surface roughness of 1.1 ÷ 3.0 nm. Two-dimensional growth mode (layer by layer) can only be achieved under the strictly defined conditions. In our case, the best quality 1-μm-thick GaSb buffer layer with atomically smooth surface was obtained for the following set of parameters: r_G = 1.5 Å/s, T_G = 530 °C, V/III = 2.9. The layer was characterized by the strain relaxation over 99.6%, 90° dislocations array with the average distance of 5.56 nm, EPD ～8.0 × 10⁶ cm^?2 and 2D undulated terraces on the surface with roughness of about 1 ML. No mounds were observed. We belive that only thin and smooth GaSb layer with reduced EPD may be applied as the buffer layer in complex device heterostructures. Otherwise, it may cause the device parameters deterioration.     

Modified dislocation filter method: toward growth of GaAs on Si by metal organic chemical vapor deposition

In this paper, metamorphic growth of GaAs on (001) oriented Si substrate, with a combination method of applying dislocation filter layer (DFL) and three-step growth process, was conducted by metal organic chemical vapor deposition. The effectiveness of the multiple InAs/GaAs self-organized quantum dot (QD) layers acting as a dislocation filter was researched in detail. And the growth conditions of the InAs QDs were optimized by theoretical calculations and experiments. A 2-μm-thick buffer layer was grown on the Si substrate with the three-step growth method according to the optimized growth conditions. Then, a 114-nm-thick DFL and a 1-μm-thick GaAs epilayer were grown. The results we obtained demonstrated that the DFL can effectively bend dislocation direction via the strain field around the QDs. The optimal structure of the DFL is composed of three-layer InAs QDs with a growth time of 55 s. The method could reduce the etch pit density from about 3 × 10⁶ cm^?2 to 9 × 10⁵ cm^?2 and improve the crystalline quality of the GaAs epilayers on Si.     

GaSb/AlSb/GaAs应变层结构的分子束外延生长

本文以反射式高能电子衍射(RHEED)和其强度振荡为监测手段,在半绝缘GaAs衬底上成功地生长GaSb/AlSb/GaAs应变层结构,RHEED图样表明,GaSb正常生长时为Sb稳定的C(2×6)结构,AlSb为稳定的(1×3)结构,作者观察并记录GaSb,AlSb生长时的RHEED强度振荡,并利用它成功地生长10个周期的GaSb/AlSb超晶格,透射电子显微镜照片显示界面平整、清晰,采用较厚的AlSb过渡层及适当的生长条件,可在半绝缘GaAs衬底上生长出质量好的GaSb外延层,其X射线双晶衍射半峰宽小于 关键词：     

Electrical characteristics of GaAs MOS capacitor and field effect transistor with atomic layer-deposited TiO2/Al2O3 dielectrics

The (NH₄)₂S treatment can reduce native oxides and passivate GaAs. Atomic layer-deposited Al₂O₃ can further remove the residue native oxides by self-cleaning. Stacked with high dielectric constant TiO₂ prepared by atomic layer deposition on Al₂O₃/(NH₄)₂S-treated GaAs MOS capacitor, the leakage current densities can reach 4.5 × 10^?8 and 3.4 × 10^?6 A/cm² at ±2 MV/cm. The net effective dielectric constant of the entire stack is 18 and the interface state density is about 4.2 × 10¹¹/cm²/eV. The fabricated enhancement-mode n-channel GaAs MOSFET exhibited good electrical characteristics with a maximum g _m of 122 mS/mm and electron mobility of 226 cm²/V s.     

Effects of silicon negative ion implantation in semi-insulating gallium arsenide

ABSTRACT

In the present work, effects of silicon negative ion implantation into semi-insulating gallium arsenide (GaAs) samples with fluences varying between 1?×?10¹⁵ and 4?×?10¹⁷?ions?cm^?2 at 100?keV have been described. Atomic force microscopic images obtained from samples implanted with fluence up to 1?×?10¹⁷?ion?cm^?2 showed the formation of GaAs clusters on the surface of the sample. The shape, size and density of these clusters were found to depend on ion fluence. Whereas sample implanted at higher fluence of 4?×?10¹⁷?ions?cm^?2 showed bump of arbitrary shapes due to cumulative effect of multiple silicon ion impact with GaAs on the same place. GXRD study revealed formation of silicon crystallites in the gallium arsenide sample after implantation. The silicon crystallite size estimated from the full width at half maxima of silicon (111) XRD peak using Debye-Scherrer formula was found to vary between 1.72 and 1.87?nm with respect to ion fluence. Hall measurement revealed the formation of n-type layer in gallium arsenide samples. The current–voltage measurement of the sample implanted with different fluences exhibited the diode like behavior.     

Probing charge carrier compensation in high energy ion irradiated III–V semiconductor by Raman spectroscopy and Hall measurements

Raman spectroscopy and Hall measurements have been carried out to investigate the differences in near‐surface charge carrier modulation in high energy (~100 MeV) silicon ion (Si⁸⁺) and oxygen ion (O⁷⁺) irradiated n‐GaAs. In the case of O ion irradiation, the observed decrease in carrier concentration with increase in ion fluence could be explained in the view of charge compensation by possible point defect trap centers, which can form because of elastic collisions of high energy ions with the target nuclei. In Si irradiated n‐GaAs one would expect the carrier compensation to occur at a fluence of 2.5 × 10¹³ ions/cm², if the same mechanism of acceptor state formation, as in case of O irradiation, is considered. However, we observe the charge compensation in this system at a fluence of 5 × 10¹² ions/cm². We discuss the role of the complex defect states, which are formed because of the interaction of the primary point defects, in determining carrier concentration in a Si irradiated n‐GaAs wafer. The above results are combined with the reported data from the literature for high energy silver ion irradiated n‐GaAs, in order to illustrate the effect of both electronic and nuclear energy loss on trap creation and charge compensation. Copyright © 2016 John Wiley & Sons, Ltd.     

GaAs/AlGaAs多量子阱中载流子动力学的实验研究

利用瞬态光栅激光光谱技术测量了(110)方向生长的本征GaAs/AlGaAs多量子阱的双极扩散系数.室温下,光激发的载流子浓度n_ex=3.4×10¹⁰/cm²时,测得双极扩散系数D_a=13.0 cm²/s,载流子的寿命τ_R=1.9 ns.改变光激发的载流子浓度(n_{ex关键词： 瞬态光栅 量子阱 空穴输运}     

Estimation of various scattering parameters and 2-DEG mobilities from electron mobility calculations in the three conduction bands Γ, L and X of gallium arsenide

The electron drift mobility in Γ conduction band of GaAs has been calculated before, but for the first time, we have made attempts to estimate the electron mobilities in higher energy L and X minima. We have also calculated the value of mobility of two-dimensional electron gas needed to predict hetero-structure device characteristics using GaAs. Best scattering parameters have been derived by close comparison between experimental and theoretical mobilities. Room temperature electron mobilities in Γ, L and X valleys are found to be nearly 9094, 945 and 247 cm²/V-s respectively. For the above valleys, the electron masses, deformation potentials and polar phonon temperatures have been determined to be (0.067, 0.22, 0.39m ₀), (8.5, 9.5, 6.5 eV), and (416, 382, 542 K) as best values, respectively. The 2-DEG electron mobility in Γ minimum increases to 1.54 × 10⁶ from 1.59 × 10⁵ cm²/V-s (for impurity concentration of 10¹⁴ cm⁻³) at 10 K. Similarly, the 2-DEG electron mobility values in L and X minima are estimated to be 2.28 × 10⁵ and 1.44 × 10⁵ cm²/V-s at 10 K, which are about ∼4.5 and ∼3.9 times higher than normal value with impurity scattering present.