PVA栅绝缘层浓度对P3HT有机场效应晶体管性能的影响

采用溶液制备法制备了用PVA作为绝缘层、P3HT作为有源层的有机场效应晶体管,,研究了不同浓度PVA栅绝缘层对器件性能的影响。实验结果显示,以质量分数为8%的PVA溶液制备的栅绝缘层具有最好的性能,器件的场效应迁移率为0.31 cm²·V^-1·s^-1,阈值电压为-6 V。进一步分析了PVA栅绝缘层浓度对器件性能提高的原因,结果表明,对于制备溶液化的有机场效应晶体管,选取合适的PVA栅绝缘层浓度非常重要。     

ZnMgO/n-ZnO/ZnMgO/p-GaN异质结LED的紫外电致发光

利用等离子体辅助分子束外延( P-MBE)技术制备了ZnMgO/n-ZnO/ZnMgO/p-GaN异质结LED.Ni/Au电极与p-GaN、In电极与ZnMgO之间都形成了良好的欧姆接触.在ZnMgO/n-ZnO/ZnMgO/p-GaN异质结器件中观察到了明显的整流特性.异质结的电致发光强度随着注入电流的增大而逐渐增强...     

生长在p-GaAs衬底上的ZnO基异质结二极管电致发光(英文)

利用等离子体辅助分子束外延在p型砷化镓衬底上制备了ZnO异质结发光二极管。实验表明:GaAs与ZnO之间的氧化镁绝缘层能够有效改善器件光电性能,I-V特性的研究表明该器件具有良好的整流特性,开启电压为3 V,电致发光光谱由一个紫外发光峰和一个可见发光带构成,其来源分别为ZnO层中近带边缺陷以及深能级缺陷相关的辐射复合。     

Ta2O5绝缘层厚度对ZnO基薄膜晶体管器件性能的影响

报道了不同厚度TaO5栅绝缘层对氧化锌薄膜晶体管器件性能的影响.在室温下用射频磁控溅射分别制备了100,85,60,40 nm厚度的Ta2O5薄膜作为绝缘层的一组底栅氧化锌薄膜晶体管器件.从实验结果可以得出如下结论:随着Ta2O5栅绝缘层厚度的增加,相应器件的场效应迁移率下降,其数值分别是50.5,59.3,63.8,...     

ZnMgO/ZnO异质结构中二维电子气的研究

论文根据ZnMgO/ZnO异质结构二维电子气的能带结构及相关理论模型, 采用一维Poisson-Schrodinger方程的自洽求解, 模拟计算了ZnMgO/ZnO异质结构中二维电子气的分布及其对ZnMgO势垒层厚度及Mg组分的依赖关系. 研究发现该异质结构中ZnMgO势垒层厚度存在一最小临界值: 当垒层厚度小于该临界值时, 二维电子气消失, 当垒层厚度大于该临界值时, 其二维电子气密度随着该垒层厚度的增加而增大; 同时研究发现ZnMgO势垒层中Mg组分的增加将显著增强其二维电子气的行为, 导致二维电子气密度的明显增大; 论文对模拟计算获得的结果与相关文献报道的实验结果进行了比较, 并从极化效应和能带结构的角度进行了分析和讨论, 给出了合理的解释. 关键词： 氧化锌 二维电子气 异质结构 理论计算     

Ta2O5-PMMA复合栅绝缘层对OFETs性能的影响

选用五氧化二钽（Ta₂O₅）-聚甲基丙烯酸甲酯（PMMA）复合材料作为栅绝缘层制备了并五苯有机场效应晶体管（OFETs）。通过在Ta₂O₅表面旋涂一层PMMA可以降低栅绝缘层的表面粗糙度,增大其场效应晶体管的迁移率。研究了厚度在20~60 nm范围内的PMMA对复合绝缘层表面形貌、粗糙度以及器件电学性能的影响。结果表明,当PMMA厚度为40 nm时,器件的电学性能最佳。与单一的Ta₂O₅栅绝缘层器件相比,其场效迁移率由4.2×10^-2 cm²/（V·s）提高到0.31 cm²/（V·s）;栅电压增加到-20 V时,开关电流比由2.9×10²增大到2.9×10⁵。     

Ta_2O_5-PMMA复合栅绝缘层对OFETs性能的影响（英文）

选用五氧化二钽(Ta_2O_5)-聚甲基丙烯酸甲酯(PMMA)复合材料作为栅绝缘层制备了并五苯有机场效应晶体管(OFETs)。通过在Ta_2O_5表面旋涂一层PMMA可以降低栅绝缘层的表面粗糙度,增大其场效应晶体管的迁移率。研究了厚度在20~60 nm范围内的PMMA对复合绝缘层表面形貌、粗糙度以及器件电学性能的影响。结果表明,当PMMA厚度为40 nm时,器件的电学性能最佳。与单一的Ta_2O_5栅绝缘层器件相比,其场效迁移率由4.2×10~(-2)cm~2/(V·s)提高到0.31 cm~2/(V·s);栅电压增加到-20 V时,开关电流比由2.9×10~2增大到2.9×10~5。     

室温下溅射法制备高迁移率氧化锌薄膜晶体管

为降低氧化锌薄膜晶体管(ZnO TFT)的工作电压,提高迁移率,采用磁控溅射法在氧化铟锡(ITO)导电玻璃基底上室温下依次沉积NbLaO栅介质层和ZnO半导体有源层,制备出ZnO TFT,对器件的电特性进行了表征。该ZnO TFT呈现出优异的器件性能:当栅电压为5 V、漏源电压为10 V时,器件的饱和漏电流高达2.2 m A;有效场效应饱和迁移率高达107 cm~2/(V·s),是目前所报道的室温下溅射法制备ZnO TFT的最高值,亚阈值摆幅为0.28 V/decade,开关电流比大于107。利用原子力显微镜(AFM)对NbLaO和ZnO薄膜的表面形貌进行了分析,分析了器件的低频噪声特性,对器件呈现高迁移率、低亚阈值摆幅以及迟滞现象的机理进行了讨论。     

用卢瑟福背散射/沟道技术研究ZnO/Zn0.9Mg0.1O/ZnO异质结的弹性应变

利用卢瑟福背散射/沟道技术对射频等离子体辅助分子束外延法生长在蓝宝石衬底上的ZnO/Zn_0.9Mg_0.1O/ZnO异质结进行了组分分析，并得到了异质结弹性应变随深度的变化，应变由界面向表面逐渐释放，并由负变正，且在ZnO与Zn_0.9Mg_0.1O界面处轻微增大.负的应变是由于ZnO与衬底的晶格失配和热失配，而逐渐变为正值是Zn_0.9Mg_0.1O与ZnO的晶格常数差异及弹性应变的 关键词： 异质结 卢瑟福背散射/沟道 弹性应变 ZnMgO     

氧分压对Mg掺杂ZnO薄膜结晶质量和光学特性的影响

利用脉冲激光沉积技术,通过改变沉积过程中的氧气压力,在蓝宝石(0001)基片上制备了一系列ZnMgO合金.通过X射线衍射、反射和透射光谱以及室温和变温荧光光谱,对薄膜的结构和光学性能进行了系统地表征,分析了工作气压对ZnMgO合金薄膜的结晶质量及光学特性的影响.研究结果表明:随着沉积环境中氧气压力的增大,ZnMgO薄膜的结晶质量下降,富氧环境下,与蓝宝石晶格平行的ZnO晶粒的出现是导致薄膜结晶质量下降的主要原因;相对于本征ZnO,不同氧气环境下沉积的ZnMgO薄膜的紫外荧光峰均出现了不同程度的蓝移.随着工 关键词： ZnO Mg掺杂 脉冲激光沉积 薄膜生长 光学特性     

Self-aligned-gate AlGaN/GaN heterostructure field-effect transistor with titanium nitride gate

Self-aligned-gate heterostructure field-effect transistor(HFET) is fabricated using a wet-etching method.Titanium nitride(TiN) is one kind of thermal stable material which can be used as the gate electrode.A Ti/Au cap layer is fixed on the gate and acts as an etching mask.Then the T-shaped gate is automatically formed through over-etching the TiN layer in 30% H_2O_2 solution at 95 ℃.After treating the ohmic region with an inductively coupled plasma(ICP) method,an Al layer is sputtered as an ohmic electrode.The ohmic contact resistance is approximately 0.3 Ω·mm after annealing at a low-temperature of 575 ℃ in N_2 ambient for 1 min.The TiN gate leakage current is only 10~(-8) A after the low-temperature ohmic process.The access region length of the self-aligned-gate(SAG) HFET was reduced from 2 μm to 0.3 μm compared with that of the gate-first HFET.The output current density and transconductance of the device which has the same gate length and width are also increased.     

Demonstration of diamond field effect transistors by AlN/diamond heterostructure

This is the first report on an AlN/diamond heterojunction field effect transistor (HFET). The AlN epilayer is grown on oxygen‐terminated (111) diamond substrates using metalorganic vapor phase epitaxy at a temperature as high as 1240 °C. The transistor and gate capacitance–voltage characteristics indicate that the HFET behaves as a p‐channel FET with a normally‐on depletion mode. The HFET channel is located at the AlN/diamond interface, and holes are accumulated in diamond close to the interface. The development of the AlN/diamond HFET creates a new possibility for diamond‐based power electronics. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Low specific on-resistance GaN-based vertical heterostructure field effect transistors with nonuniform doping superjunctions

A novel Ga N-based vertical heterostructure field effect transistor(HFET) with nonuniform doping superjunctions(non-SJ HFET) is proposed and studied by Silvaco-ATLAS,for minimizing the specific on-resistance(R_(on)A) at no expense of breakdown voltage(BV).The feature of non-SJ HFET lies in the nonuniform doping concentration from top to bottom in the n-and p-pillars,which is different from that of the conventional Ga N-based vertical HFET with uniform doping superjunctions(un-SJ HFET).A physically intrinsic mechanism for the nonuniform doping superjunction(non-SJ) to further reduce R_(on)A at no expense of BV is investigated and revealed in detail.The design,related to the structure parameters of non-SJ,is optimized to minimize the R_(on)A on the basis of the same BV as that of un-SJ HFET.Optimized simulation results show that the reduction in R_(on)A depends on the doping concentrations and thickness values of the light and heavy doping parts in non-SJ.The maximum reduction of more than 51% in R_(on)A could be achieved with a BV of 1890 V.These results could demonstrate the superiority of non-SJ HFET in minimizing R_(on)A and provide a useful reference for further developing the Ga N-based vertical HFETs.     

An approach of open-path gas sensor based on tunable diode laser absorption spectroscopy

Tunable diode laser absorption spectroscopy (TDLAS) is a new method to detect trace-gas qualitatively or quantificationally based on the scan characteristic of the diode laser to obtain the absorption spectroscopy in the characteristic absorption region. A time-sharing scanning open-path TDLAS system using two near infrared distributed feedback (DFB) tunable diode lasers is designed to detect CH4 and H2S in leakage of natural gas. A low-cost Fresnel lens is used in this system as receiving optics which receives the laser beam reflected by a solid corner cube reflector with a distance of up to about 60 m. High sensitivity is achieved by means of wavelength-modulation spectroscopy with second-harmonic detection. The minimum detection limits of 1.1 ppm·m for CH4 and 15 ppm·m for H2S are demonstrated with a total optical path of 120 m. The simulation monitoring experiment of nature gas leakage was carried out with this system. According to the receiving light efficiency of optical system and detectable minimum light intensity of detection, the detectable optical path of the system can achieve 1 - 2 km. The sensor is suitable for natural gas leakage monitoring application.     

Normally-off AlGaN/GaN heterojunction field-effect transistors with in-situ AlN gate insulator

AlGaN/GaN heterojunction field-effect transistors (HFETs) with p-GaN cap layer are developed for normally-off operation, in which an in-situ grown AlN layer is utilized as the gate insulator. Compared with the SiN_x gate insulator, the AlN/p-GaN interface presents a more obvious energy band bending and a wider depletion region, which helps to positively shift the threshold voltage. In addition, the relatively large conduction band offset of AlN/p-GaN is beneficial to suppress the gate leakage current and enhance the gate breakdown voltage. Owing to the introduction of AlN layer, normally-off p-GaN capped AlGaN/GaN HFET with a threshold voltage of 4 V and a gate swing of 13 V is realized. Furthermore, the field-effect mobility is approximately 1500 cm²·V^-1·s^-1 in the 2DEG channel, implying a good device performance.     

具有高开启/关断电流比的Al2O3/AlGaN/GaN金属氧化物半导体高电子迁移率晶体管

采用原子层淀积(ALD)方法,制备了Al₂O₃为栅介质的高性能AlGaN/GaN金属氧化物半导体高电子迁移率晶体管(MOS-HEMT)。在栅压为-20 V时,MOS-HEMT的栅漏电比Schottky-gate HEMT的栅漏电低4个数量级以上。在栅压为+2 V时,Schottky-gate HEMT的栅漏电为191μA;在栅压为+20 V时,MOS-HEMT的栅漏电仅为23.6 nA,比同样尺寸的Schottky-gate HEMT的栅漏电低将近7个数量级。AlGaN/GaN MOS-HEMT的栅压摆幅达到了±20 V。在栅压V_gs=0 V时, MOS-HEMT的饱和电流密度达到了646 mA/mm,相比Schottky-gate HEMT的饱和电流密度(277 mA/mm)提高了133%。栅漏间距为10μm的AlGaN/GaN MOS-HEMT器件在栅压为+3 V时的最大饱和输出电流达到680 mA/mm,特征导通电阻为1.47 mΩ·cm²。Schottky-gate HEMT的开启与关断电流比仅为10⁵,MOS-HEMT的开启与关断电流比超过了10⁹,超出了Schottky-gate HEMT器件4个数量级,原因是栅漏电的降低提高了MOS-HEMT的开启与关断电流比。在V_gs=-14 V时,栅漏间距为10μm的AlGaN/GaN MOS-HEMT的关断击穿电压为640 V,关断泄露电流为27μA/mm。     

衬底温度对TiOPc光敏有机场效应管的影响

制备了基于酞菁氧钛(TiOPc)的有机光敏场效应管,对氧化铟锡(ITO)衬底器件进行温度优化。实验结果表明,随着衬底温度(T_(sub))的增加,器件载流子迁移率(μ)、光暗电流比(P)和光响应度(R)先增加后减小,在T_(sub)=140℃时达到最大。T_(sub)=140℃的ITO衬底器件,在波长808 nm、光功率密度190 m W·cm~(-2)的近红外光照下,最大载流子迁移率达到1.35×10~(-2)cm~2·V~(-1)·s~(-1),最大光暗电流比为250,栅压为-50 V时的最大光响应度为1.51 m A/W。     

Current collapse and reliability of III‐N heterostructure field effect transistors

Measurements of GaN HFET lifetime as a function of temperature show that different degradation mechanisms are involved at low temperatures (close to room temperature) and high temperatures (above 150 °C). The degradation at low temperatures is linked to the trap generation and can be explained using the current collapse model. At higher tempe‐ ratures, other degradation mechanisms become important or even dominant. The current collapse related degradation can be diminished by using improved device design, which will greatly increase the overall lifetime (up to long lifetimes obtained by extrapolating high temperature data to room temperature). (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

聚3-己基噻吩-b-聚十六烷氧基联烯嵌段聚合物的制备及其场效应性能

以溴代十六烷、丙炔醇为原料通过取代反应、还原重排反应制备了十六烷氧基联烯,然后以氯化(三环己基膦)镍作为催化剂,通过控制加料顺序一锅制备了聚3-己基噻吩-b-聚十六烷氧基联烯的嵌段聚合物。通过核磁共振氢谱和体积排除色谱对产物进行了表征和确证。对聚3-己基噻吩-b-聚十六烷氧基联烯嵌段聚合物的热学性能、光学性能及电学性能进行了研究。差示扫描量热法和热重分析结果表明,嵌段共聚物具有两个玻璃化转变温度及两个热分解温度,说明其具有明显相分离。以嵌段共聚物为半导体活性材料,制备了场效应晶体管器件。使用热退火对器件进行热处理,发现迁移率随退火温度的上升而提高。器件在200℃退火温度下的平均迁移率为7.03×10~(-4)cm~2·V~(-1)·s~(-1),最大迁移率为1.3×10~(-3)cm~2·V~(-1)·s~(-1),阈值电压为5.44 V。     

钠氟石温致结构变化的拉曼光谱研究

本文测定了钠氟石(NaF·2CaO·SiO2)的常温拉曼光谱, 并运用Dmol3密度泛函(DFT) 理论对其晶体中主要结构单元的简正振动模式进行了计算。通过实验值与计算值的比较, 确定了其特征峰的归属。同时, 采用高温拉曼光谱仪原位实测了钠氟石在不同的升温速率下的变温拉曼光谱。研究表明, 钠氟石在缓慢升温过程中会分解成NaF和Ca2SiO4; 快升至熔点附近, 熔化成液态, 快冷至室温, 仍分解成β- Ca2SiO4。