BCxN薄膜的紫外透过光谱研究

利用射频磁控溅射方法以不同的溅射功率(80～130 W)制备出具备紫外增透性能的BCN,BC2N和BC3N薄膜.傅里叶红外吸收光谱和X射线光电子能谱测量发现样品的组成原子之间均实现了原子级化合.溅射功率对薄膜的组分和紫外增透性能有很大影响,其通过改变薄膜组分而影响紫外增透性能,且碳原子数小的样品紫外增透性能好.以110 W条件下制备的BCN薄膜中碳原子数最小,它的紫外增透性能最好,在200～350 nm波段附近平均透过率比玻璃提高了将近40%.     

柔性有机电致发光器件导电基板的工艺性能

在聚对苯二甲酸乙二醇酯(PET)柔性衬底上采用直流磁控溅射技术制备了氧化铟锡(ITO)透明导电薄膜,研究了衬底温度、溅射功率和溅射压强等工艺条件对薄膜光电性能的影响,并利用原子力显微镜(AFM)表征了衬底及ITO薄膜的表面形貌。结果表明,在PET衬底温度50℃、溅射功率100W和溅射压强2.66×10-1Pa的条件下,可以得到低方阻(50Ω/□)和高透过率(>90%)的透明导电薄膜。以此柔性ITO衬底为阳极,制备了结构为PET/ITO/NPB/Alq3/Mg∶Ag的柔性有机电致发光器件,在驱动电压为13V时,器件的发光亮度达到了2834cd/m2。     

高择优取向铌酸锶钡薄膜的射频磁控溅射制备

采用溶胶-凝胶法在(100)Si单晶上预先制备出掺钾(K)的铌酸锶钡(SBN)缓冲层,利用射频磁控溅射法在缓冲层KSBN上沉积出高择优取向的铌酸锶钡薄膜,获得了磁控溅射法制备择优取向铌酸锶钡薄膜的相关工艺参数,研究发现,KSBN缓冲层能够很有效地克服衬底与SBN薄膜之间较大的晶格失配,在氧气氩气的比例为1∶2,工作气压为10 Pa,溅射功率300 W,衬底温度300℃,退火温度为800℃的工艺条件下,能够获得c轴高度择优取向的铌酸锶钡铁电薄膜.利用X射线衍射仪,原子力显微镜等仪器分析了薄膜 关键词： 磁控溅射 高择优取向 p-n结效应     

柔性PI衬底上ITO薄膜的制备及性能研究

利用射频磁控溅射的方法在柔性PI衬底上制备ITO薄膜,通过SEM(扫描电子显微镜)、XRD(X射线衍射仪)、四探针测试仪、分光光度计,分析了通氧量、溅射功率、工作气压及衬底温度对ITO薄膜表面形貌、成膜质量和光电特性的影响。结果显示:在纯氩气环境下,溅射功率为200W,工作气压为1.5Pa,在衬底温度为185℃~225℃时,薄膜的光电特性最好,ITO薄膜的电阻率为3.64×10-4Ω·cm,透过率为97%。     

高择优取向铌酸锶钡薄膜的射频磁控溅射制备

采用溶胶-凝胶法在(100)Si单晶上预先制备出掺钾(K)的铌酸锶钡(SBN)缓冲层，利用射频磁控溅射法在缓冲层KSBN上沉积出高择优取向的铌酸锶钡薄膜，获得了磁控溅射法制备择优取向铌酸锶钡薄膜的相关工艺参数，研究发现，KSBN缓冲层能够很有效地克服衬底与SBN薄膜之间较大的晶格失配，在氧气氩气的比例为1∶2，工作气压为10 Pa，溅射功率300 W，衬底温度300℃，退火温度为800℃的工艺条件下，能够获得c轴高度择优取向的铌酸锶钡铁电薄膜.利用X射线衍射仪，原子力显微镜等仪器分析了薄膜     

射频磁控溅射法制备ZnS多晶薄膜及其性质

实验采用射频磁控溅射法在玻璃衬底上沉积了ZnS多晶薄膜,研究了沉积气压、退火温度和衬底温度对ZnS薄膜质量的影响.利用X射线衍射(XRD)分析了薄膜的微结构,并计算了内应力值.通过紫外-可见光分光光度计测量了薄膜的透过谱,计算了Urbach能量和禁带宽度.利用扫描电子显微镜(SEM)观察了薄膜的表面形貌.结果表明: 衬底温度为室温时沉积的ZnS薄膜具有较大的压应力,并且内应力值随着工作气压增大而增大,在300 ℃下进行退火处理后内应力松弛,衬底温度为350 ℃时制备的ZnS薄膜内应力小,透过率高,经300 ℃退火处理后结晶质量有所提高. 关键词： ZnS薄膜 射频磁控溅射 内应力     

射频磁控溅射制备硼碳氮薄膜的拉曼光谱研究

硼碳氮(BCN)三元化合物薄膜具有原子可调组成比,并且能够展现出相应的材料特性,因此在力、热、光、电子学等领域拥有广阔的应用前景。本文采用射频磁控溅射法在硅衬底上通过调节通入的氮气流量,合成了一系列不同组分的BCN薄膜。发现随氮气流量的增加,所制备的BCN薄膜中氮原子浓度最高可达～14 at.%。为探讨BCN三元体系中的结构性质变化,利用拉曼光谱系统地研究了不同氮气流量所制备的BCN薄膜。结果表明,随氮的逐渐引入,除常见的拉曼D峰和G峰外,光谱中还出现了N=N的拉伸振动模式。另外,样品的无序度也导致了拉曼光谱发生了整体的变化。     

退火温度和溅射时间对磁控溅射法制备Mg2Si薄膜的影响

采用磁控溅射法和原位退火工艺在钠钙玻璃衬底上制备 Mg2Si 薄膜。首先在钠钙玻璃衬底上交替溅射沉积两层Si、Mg 薄膜,冷却至室温后原位退火4 h,制备出一系列 Mg2Si 薄膜样品。通过 X 射线衍射仪(XRD) 、 扫描电子显微镜(SEM)对所得薄膜样品的晶体结构和表面形貌进行表征, 讨论了退火温度和溅射Si/Mg/Si/Mg 时间对制备 Mg2Si 薄膜的影响。结果表明,采用磁控溅射法在钠钙玻璃衬底上交替溅射两层Si、Mg 薄膜, 通过原位退火方式成功制备出单一相的 Mg2Si 薄膜,溅射Si/Mg/Si/Mg 的时间为12.5/9/12.5/9 min,退火温度为550 ℃ 时,制备的 Mg2Si 薄膜结晶度最好,连续性和致密性最强。这对后续 Mg2Si 薄膜器件的设计与制备提供了重要的参考。 积两层Si、Mg 薄膜, 冷却至室温后原位退火4 h, 制备出一系列 Mg2Si 薄膜样品. 通过 X 射线衍射仪(XRD) 、 扫描 电子显微镜(SEM)对所得薄膜样品的晶体结构和表面形貌进行表征, 讨论了退火温度和溅射Si/Mg/Si/Mg 时间 对制备 Mg2Si 薄膜的影响. 结果表明, 采用磁控溅射法在钠钙玻璃衬底上交替溅射两层Si、Mg 薄膜, 通过原位退火 方式成功制备出单一相的 Mg2Si 薄膜, 溅射Si/Mg/Si/Mg 的时间为12.5/9/12.5/9 min, 退火温度为550 ℃ 时, 制 备的 Mg2Si 薄膜结晶度最好, 连续性和致密性最强. 这对后续 Mg2Si 薄膜器件的设计与制备提供了重要的参考.     

脉冲阴极弧放电制备碳氮薄膜及其分析

采用高压点火的方式触发脉冲阴极弧放电,在Si(100)衬底上制备出较为光滑、均匀、致密的碳氮薄膜. 研究发现在不同的放电电压与距离对薄膜的沉积起到了很重要的作用. 扫描电镜及电子能谱分析表明,薄膜为非晶碳氮薄膜,并且随沉积能量的增大,氮的含量有所增大. 放电溅射过程分析与实验结果相吻合.     

磁控溅射法结合异位退火制备MgB_2超导薄膜的研究

采用磁控溅射法,结合真空异位退火,成功制备MgB_2超导薄膜,探索了退火温度、退火时间、磁控溅射功率和溅射气压对MgB_2薄膜超导特性的影响。通过XRD、SEM和PPMS测量的结果来分析退火及溅射的工艺参数对MgB_2超导薄膜的晶体结构、表面形貌及超导性能的影响。研究表明,退火温度为670℃,退火时间为2h,MgB_2靶溅射功率控制在300W,Ar溅射气压保持为2Pa,MgB_2薄膜表现出最优的超导特性,其临界电流密度Jc为1.8×105A/cm2。     

Preparation of boron carbon nitride thin films by radio frequency magnetron sputtering

Boron carbon nitride films were deposited by radio frequency magnetron sputtering using a composite target consisting of h-BN and graphite in an Ar-N₂ gas mixture. The samples were characterized by X-ray diffraction, Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy. The results suggest that the films are atomic-level hybrids composed of B, C and N atoms. The boron carbon nitride films prepared in the present experiment have a disordered structure. The sputtering power varied from 80 W to 130 W. This sputtering power was shown to have regular effect on the composition of boron carbon nitride films. The samples deposited at 80 W and 130 W are close to the stoichiometry of BC₃N. The sample deposited at 110 W is close to the stoichiometry of BCN. The samples deposited at 100 W and 120 W approach to BC₂N. It is very significant for us to synthesize boron carbon nitride compound with controllable composition by changing the sputtering power.     

Fabrication of particular structures of hexagonal boron nitride and boron–carbon–nitrogen layers by anisotropic etching

Anisotropic etching of hexagonal boron nitride (h-BN) and boron–carbon–nitrogen (BCN) basal plane can be an exciting platform to develop well-defined structures with interesting properties. Here, we developed an etching process of atomically thin h-BN and BCN layers to fabricate nanoribbons (NRs) and other distinct structures by annealing in H₂ and Ar gas mixture. BCN and h-BN films are grown on Cu foil by chemical vapor deposition (CVD) using solid camphor and ammonia borane as carbon, nitrogen and boron source, respectively. Formation of micron size well-defined etched holes and NRs are obtained in both h-BN and BCN layers by the post growth annealing process. The etching process of h-BN and BCN basal plane to fabricate NRs and other structures with pronounced edges can open up new possibilities in 2D hybrid materials.     

Effect of deposition power and pressure on rate deposition and resistivity of titanium thin films grown by DC magnetron sputtering

ABSTRACT

Based on magnetron sputtering deposition technology, titanium (Ti) thin films are deposited on silicon (Si) substrate using different preparation conditions such as sputtering power and pressure. The influence of altering these conditions on deposition rate and microstructure is studied. The results show that sputtering power significantly affects the rate of deposition and the resistivity. The deposition rate of the Ti thin film increases when the resistivity decreases under sputtering powers of 150–225?W with a pressure of 0.8?Pa and Argon (Ar) flux of 80 sccm. As sputtering power was increased further (from 225 to 250?W), the deposition rate reduced and the resistivity augmented. Pressure also has influence on the deposition rate and resistivity – when pressure increases from 0.6 to 0.8?Pa, the deposition rate escalates while the resistivity reduces; when the pressure is raised from 0.8 to 1.0?Pa with Ar flux of 100 sccm, the deposition rate decreases and resistivity increases. The surface chemical compositions and the structures of the Ti film were studied by using X-ray photoelectron spectroscopy (XPS) and X-ray diffractometer (XRD). Observing the cross-section of the thin-film samples produced by scanning electron microscope (SEM) reveals the influence of the preparation conditions used on the microstructure and confirms the influence of sputtering power and pressure on the resistivity.     

磁控溅射制备氧化硅薄膜生长速率

氧化硅薄膜是半导体工业中常见的薄膜材料,通常采用化学气相沉积方法制备。但是这种制备方法存在缺欠。采用磁控溅射的方法首先在石英衬底上制备了氧化硅薄膜。研究了射频功率、氧气含量和溅射压强对氧化硅薄膜沉积速率的影响。发现沉积速率随着射频功率的增加而增加;随着氧气含量的增加,先减小后增大;当溅射压强在0.4~0.8 Pa之间变化时,沉积速率变化很小,当溅射压强超过0.8 Pa时沉积速率迅速下降。讨论了不同生长条件下造成氧化硅薄膜生长速率变化的原因。     

Optical properties of hexagonal boron nitride thin films deposited by radio frequency bias magnetron sputtering

The optical properties of hexagonal boron nitride (h-BN) thin films were studied in this paper. The films were characterized by Fourier transform infrared spectroscopy, UV--visible transmittance and reflection spectra. h-BN thin films with a wide optical band gap E_g (5.86 eV for the as-deposited film and 5.97 eV for the annealed film) approaching h-BN single crystal were successfully prepared by radio frequency (RF) bias magnetron sputtering and post-deposition annealing at 970~K. The optical absorption behaviour of h-BN films accords with the typical optical absorption characteristics of amorphous materials when fitting is made by the Urbach tail model. The annealed film shows satisfactory structure stability. However, high temperature still has a significant effect on the optical absorption properties, refractive index n, and optical conductivity σ of h-BN thin films. The blue-shift of the optical absorption edge and the increase of E_g probably result from stress relaxation in the film under high temperatures. In addition, it is found that the refractive index clearly exhibits different trends in the visible and ultraviolet regions. Previous calculational results of optical conductivity of h-BN films are confirmed in our experimental results.     

衬底材料对制备立方氮化硼薄膜的影响

较系统地研究了不同衬底材料对制备氮化硼薄膜的影响。用热丝增强射频等离子体CVD法,以NH3,B2H6和H2为反应气体,在Si,Ni,Co和不锈钢等衬底材料上,成功生长出高质量的立方氮化硼薄膜,还用13.56MHz的射频溅射系统将c-BN薄膜沉积在Si衬底上,靶材为h-BN(纯度为99.99％）,溅射气体为氩气和氮气的混合气体,所得到的氮化硼薄膜中立方相含量高于90%,用X射线衍射谱和傅里叶变换红谱对样品进行了分析表明,衬底材料与c-BN的晶格匹配情况,对于CVD生长立方氮化硼薄膜影响很大,而对溅射生长立方氮化硼薄膜影响不大。     

Gas flow sputtering: Versatile process for the growth of nanopillars, nanoparticles, and epitaxial thin films

Gas flow sputtering is a sputter-deposition method that enables soft and high-rate deposition even for oxides or nitrides. It involves sputtering at a high pressure of around 100 Pa and hollow cathode discharge in a tubular or parallel plate target with forced Ar flow. Depending on the sputtering conditions, various structures of magnetic materials are obtained, and some examples are shown in this paper. Co-Pt and Fe nanopillars are fabricated using a tubular target with a large inner diameter (6-40 mm). Fe nanoparticles with diameters ranging from a few nanometers to 150 nm are fabricated using a tubular target with a small inner diameter (5 mm). Magnetite epitaxial thin films are fabricated on MgO and GaAs substrates by substrate heating.     

直流磁控溅射制备AlN薄膜的结构和表面粗糙度

采用直流磁控反应溅射法,在Si(111)基底上成功制备了多晶六方相AlN薄膜.研究了溅射过程中溅射气压对薄膜结构和表面粗糙度的影响.结果表明:当溅射气压低于0.6 Pa时,薄膜为非晶态,在傅里叶变换红外光谱中,没有明显的吸收峰;当溅射气压不低于0.6 Pa时,薄膜的X射线衍射图中均出现了六方相的AlN(100)、(11...     

STRESS ANALYSIS IN CUBIC BORON NITRIDE FILMS BY X-RAY DIFFRACTION USING sin2 ψ METHOD

The boron nitride (BN) films containing cubic boron nitride (c-BN) and hexagonal boron nitride (h-BN) were prepared by radio frequency a ssisted thermal filament chemical vapor deposition. The stress and strain in BN films were investigated by X-ray diffraction analysis using the sin² ψ method. The results showed that both c-BN and h-BN in the same film have similar values of elastic strain, however, the compressive stress in c-BN is much greater than that in h-BN for the same film. Both stress and strain gradually decre ased with the increase of substrate temperature (T_s). The effective stress in the films calculated by the effective stress model increased with the increase of T_s. Furthermore, the dependence of effective stress in the films on T_s was also investigated.