蘇聯的电介質和半导体研究工作

一.电介质 在本世纪的初年,电机工程上所用的全部材料可以分成两类:导体和绝缘体或电介质。大家知道,并不是所有的电介质都是完全的绝缘体;在电介质中亦有电流流过;这样的电流已在十九世纪末年为法国物理学家Fousserau和JacquesCurie研究过。二十世纪初年,电介质的研究在德国和俄国得到很大的发展。电流在电介质中所显现的特殊性使人们认为这样的电流仅仅是电介质的反常(表徵弹性反常和磁性反常的落后、滞后等现象)。     

表面复合速度对于锗的光电导光谱分布的影响(二)

The continuity equation of minority carriers in n-type germanium is solved for the stationary case, in which the volume recombination is assumed to be of the recombination-center type and the surface recombination is introduced in the boundary condition. An expression for the photoconductivity is obtained from this solution.By substituting the known absorption data and the volume lifetime of minority carrier in the sample into the expression of photoconductivity and by choosing suitable values of surface recombination velocity, photoconductive spectra are calculated and are compared with the experimental curves. The agreement is satisfactory for wave-lengths greater than 1.2 μ. Below 1.2 μ, the experimental curves fall well below the calculated curves. It is thought that other types of volume recombination may exist.The photoconductive spectra usually have a maximum outside the absorption edge. By measuring the relative height of the maximum, the surface recombination velocity can be obtained. This method is suitable for medium and large values of surface recombination velocity.The photoconductivity drops sharply on both sides of the maximum in case of large values of recombination velocity. In such cases, the energy gap of the semiconductor can be obtained in a simple way. For germanium the energy gap is 0.83 eV for direct transition and 0.635 eV for indirect transition.From this investigation, the energy gap of CdS is reestimated to be 2.53 eV and that of Cu₂O greater than 2.10 eV.     

PHOTOLUMINESCENCE STUDY ON Hg1-xCdxTe THIN FILM IMPLANTED WITH As ION

Photoluminescence spectra of a series of MBE-grown Hg_1-xCd_xTe samples with the same mole fraction of about x≈0.39 have been measured at different temperatures from 5 to 100 K. By aid of the temperature and exciting laser power dependence of photoluminescence peak energy and relative intensity, as well as of the comparison with other measurements, four main structures dominating in the photoluminescence spectra are attributed to band to band, D^oX, A^oX and D^oA^o transitions. A deep donor state level located at about 8.5meV below the bottom of the conduction band has been observed and is determined to be due to the arsenic-occupied mercury vacancies. Two acceptor levels located at about 14.5 meV and about 31.5 meV above the top of the valance band have also been found from the measuements, which are identified as the mercury vacancies and As in anion site, respectively.     

Hg1－_xCd_xTe外延薄膜的自由载流子吸收

讨论了Ｈｇ１－ｘＣｄｘＴｅ外延薄膜的自由载流子吸收光谱，分析了外延层的纵向组分分布及Ｔｅ沉淀物对吸收曲线的影响．结果表明，由于外延薄膜存在着纵向组分的不均匀性，其吸收特性与体材料有区别；对某些透过率较低的样品，则应考虑Ｔｅ沉淀物对吸收的贡献     

p-HgCdTe反型层中子能带电子的基态能量

用变分自洽方法求解了ｐ－ＨｇＣｄＴｅ金属－绝缘体－半导体（ＭＩＳ）结构Ｎ型反型层子能带的基态能量Ｅ₀及其与表面电子浓度的关系，计算中考虑了窄禁带半导体Hg_1-xCd_xTe带间相互作用所引起的非抛物带结构、波函数平均效应、共振缺陷态、Ｚｅｎｅｒ隧穿、以及电场在屏蔽长度内的衰减等因素，导出了子能带基态能量Ｅ₀的计算公式并获得了与实验符合较好的结果。     

n型碲镉汞MIS器件动态存储时间研究

通过对动态存储时间的测量，分析了ｘ＝０．３１的ｎ型碲镉汞（Ｈ_1-xＣｄ_xＴｅ）ＭＩＳ器件的少子暗电流机理．理论计算和实验结果都表明，在其工作温度区域（～７７Ｋ），通过禁带中深能级中心辅助的间接隧道电流将限制器件的电学性能。 关键词：     

低补偿度n-Hg1-xCdxTe的磁致金属-绝缘体相变和相变后的温度激活输运行为

报道了ｘ＝０．２１４组份、低补偿度（Ｋ《１）ｎ－Ｈｇ_1-xＣｄ_xＴｅ晶体在０．３─３０Ｋ温度范围，０─７Ｔ强磁场下的横向磁阻、电子霍耳迁移率、霍耳系数测量结果，观测到了磁致金属－绝缘体相变和相变后的温度激活输运行为。分析实验数据，提出：低补偿度、组份：ｘ＝０．２附近的ｎ－Ｈｇ_1-xＣｄ_xＴｅ，磁致金属－绝缘体相变（ＭＩＴ）发生的机理是载流子在浅施主杂质态上的磁冻结；发生磁冻结的前提是热冻出（ｔｈｅｒｍａｌ ｆｒｅｅｚｅ 关键词：     

赝形InGaAs/InAlAs渐变异质结中的零磁场自旋分裂

在赝形渐变InGaAs/In_0.52Al_0.48As异质结的二维电子气中,发现了自旋方向向上的电子和自旋向下的电子在零磁场下存在着自旋分裂.利用Shubnikov-de Haas振荡研究了异质结中的自旋分裂行为,通过振荡中的拍频现象,发现了零磁场下的自旋分裂量为8.76meV. 关键词：     

氮对类金刚石薄膜的微观结构内应力与附着力的影响

采用原子力显微镜(AFM)、俄歇电子能谱(AES)和显微压痕分析等手段对射频等离子体增强化学气相沉积法制备的掺氮类金刚石(DLC：N)薄膜的微观结构和力学性能进行了研究.结果表明,随着含氮量的增加,DLC薄膜的AFM表面形貌中出现了几十纳米的颗粒,原子侧向力显微镜和AES分析表明这种纳米颗粒是x大于0.126的非晶氮化碳CN_x结构.这种非晶DLC/CN_x的纳米复合结构,减小了薄膜的内应力,从而提高了薄膜与衬底的附着力. 关键词： 类金刚石碳膜 微观结构 附着特性     

类金刚石薄膜碲镉汞红外器件钝化膜的研究

采用等离子增强化学气相法(PECVD)在碲镉汞(MCT)衬底上沉积出纳米团聚的类金刚石薄膜(DLC).用原子力显微镜(AFM )和侧向力显微镜(LFM)对DLC和MCT表面形貌进行表征;用俄歇电子能谱(AES)对DLC/MCT界面附近各元素含量的分布进行分析研究.结果表明:当膜厚达到25nm以上,这种DLC膜就能够有效地抑制MCT中HgTe的分解和Hg与Te的外扩散.AFM 和LFM的观察结果表明,原始MCT晶片经100℃在氮气气氛中退火30min,表面区域出现了不同与MCT的微米量级的新相,而由DLC膜保护的MCT晶片表面就没有观察到这种由分解反应引起的相变.