Spectroscopic and scanning probe analysis on large-area epitaxial graphene grown under pressure of 4 mbar on 4H-SiC （0001） substrates

We produced epitaxial graphene under a moderate pressure of 4 mbar(about 400 Pa) at temperature 1600℃. Raman spectroscopy and optical microscopy were used to confirm that epitaxial graphene has taken shape continually with slight thickness variations and regularly with a centimeter order of magnitude on 4H-SiC(0001) substrates. Then using X-ray photoelectron spectroscopy and Auger electron spectroscopy, we analyzed the chemical compositions and estimated the layer number of epitaxial graphene. Finally, an atomic force microscope and a scanning force microscope were used to characterize the morphological structure. Our results showed that under 4-mbar pressure, epitaxial graphene could be produced on a SiC substrate with a large area, uniform thickness but a limited morphological property. We hope our work will be of benefit to understanding the formation process of epitaxial graphene on SiC substrate in detail.     

The effect of substrate doping on the flatband and threshold voltages of a strained-Si pMOSFET

The effect of substrate doping on the flatband and threshold voltages of a strained-Si/SiGe p metal-oxide semiconductor field-effect transistor(pMOSFET) has been studied.By physically deriving the models of the flatband and threshold voltages,which have been validated by numerical simulation and experimental data,the shift in the plateau from the inversion region to the accumulation region as the substrate doping increases has been explained.The proposed model can provide a valuable reference to the designers of strained-Si devices and has been implemented in software for extracting the parameters of a strained-Si MOSFET.     

碘量法测定复杂含硒物料中常量硒

用碘量法测定复杂含硒物料中常量硒并对测定条件做试验。试样经硝酸及硫酸溶解、蒸发至冒烟后,盐类溶于盐酸中。在酒石酸存在下加盐酸羟胺,于70℃保温1h,放置1.5h使硒还原为单质硒并陈化。过滤,将单质硒溶于盐酸中,溶解温度为90℃,溶解时间为5min,滴定时溶液酸度宜在0.2~0.5mol·L-1(盐酸介质)。滴定时采用分步滴加碘化钾溶液,随即用硫代硫酸钠标准溶液滴定至淀粉指示剂所显蓝色消失,至再次加入碘化钾无蓝色出现为终点。按所耗硫代硫酸钠标准溶液的体积计算试样的含硒量。     

非故意掺杂4H-SiC外延材料本征缺陷的热稳定性

采用电子顺磁共振（ESR）和低温光致发光（PL）技术,研究了退火温度对低压化学气相沉积法（LPCVD）制备的非故意掺杂 4H-SiC材料中本征缺陷稳定性的影响.结果发现,当退火时间为10 min和30 min时,本征缺陷浓度均随着退火温度的升高而增大,当退火温度达到1573 K时材料中本征缺陷浓度达到最大,继续升高退火温度将使材料中本征缺陷浓度迅速降低.退火温度对材料中本征缺陷的影响主要是由于退火中本征缺陷的稳定化过程及本征缺陷之间发生强烈的相互作用引起的. 关键词： 高温退火 本征缺陷 电子顺磁共振谱 光致发光     

套刻偏差对4H-SiC 浮动结结势垒肖特基二极管的影响研究

4H-SiC浮动结结势垒肖特基二极管与常规结势垒肖特基二极管相比在 相同的导通电阻条件下具有更高的击穿电压. 由p⁺埋层形成的浮动结与主结p⁺区 之间的套刻对准是实现该结构的一项关键技术. 二维模拟软件ISE的模拟结果表明, 套刻偏差的存在会明显影响器件的击穿特性, 随着偏差的增大击穿电压减小. 尽管主结和埋层的交错结构与对准结构具有相似的击穿特性, 但是当正向电压大于2 V后, 交错结构的串联电阻更大.     

Investigation of a 4H-SiC metal-insulationsemiconductor structure with an A1203/SiO2 stacked dielectric

Atomic layer deposited （ALD） Al2O3/dry-oxidized ultrathin SiO2 films as a high-k gate dielectric grown on 8° off-axis 4H-SiC （0001） epitaxial wafers are investigated in this paper. The metal-insulation-semiconductor （MIS） capacitors, respectively with different gate dielectric stacks （Al2O3/SiO2, Al2O3, and SiO2） are fabricated and compared with each other. The I-V measurements show that the Al2O3/SiO2 stack has a high breakdown field （≥12 MV/cm） comparable to SiO2, and a relatively low gate leakage current of 1 × 10-7 A/cm2 at an electric field of 4 MV/cm comparable to Al2O3. The 1-MHz high frequency C-V measurements exhibit that the Al2O3/SiO2 stack has a smaller positive flat-band voltage shift and hysteresis voltage, indicating a less effective charge and slow-trap density near the interface.     

界面态电荷对6H碳化硅N沟MOSFET阈值电压和跨导的影响

针对界面态密度在禁带中的不均匀分布,并且考虑到碳化硅材料中杂质的不完全离化,分析了界面态电荷对N沟6H碳化硅MOSFET阈值电压和跨导的影响.结果显示界面态密度的不均匀分布不仅使阈值电压增大,而且还会导致器件跨导变低,它是影响SiCMOSFET特性的一个重要因素 关键词： 碳化硅 界面态 阈值电压 跨导     

4H-SiC pn结型二极管击穿特性中隧穿效应影响的模拟研究

基于4H-SiC材料特性，建立了4H-SiC pn结型二极管的击穿模型.该模型在碳化硅器件中引入 雪崩倍增效应和隧穿效应.利用该模型，分析了隧穿效应对器件击穿特性的影响；解释了不 同的温度和掺杂条件下，器件的击穿机理.该模型较好地反映了实际器件的击穿特性. 关键词： 4H-SiC 二极管 击穿特性 隧穿效应 碰撞离化 模型     

涡轮叶片冷却新方法

现代先进航空发动机涡轮叶片一般采用冲击 对流 气膜复合冷却方法,叶片构造愈来愈复杂,冷气量也愈用愈大。为了进一步提高涡轮进口温度,应该寻求新的冷却途径。本文建议采用强化叶片的内冷过程和利用添加剂减弱燃气向叶片放热两措施来改善冷却。下面分别叙述这些措施的依据和对斯贝MK202发动机一级导叶的温度计算。     

180°连续折转流道的强化传热和阻力特性研究

一、前言 180°连续折转且沿流动方向具有不同截面几何的流道是高温透平叶片中腔典型的冷却结构,在高效换热器及其它高温部件冷却中均有类似的设计。目前,这种复杂流道传热和流动阻力的研究还为数不多,尤其扰流柱在弯曲、变截面流道中强化传热的研究更为少见。本文对扰流柱在180°连续折转、气流依次流经扩展流道、梯形截面