InP中深能级缺陷的产生与抑制现象

研究了原生和高温退火处理后非掺n型和半绝缘InP单晶材料中产生的缺陷.在磷气氛下退火后，n型和半绝缘InP单晶中均明显产生相当数量的深能级缺陷，而在磷化铁气氛下退火后，InP的缺陷数量明显减少.在退火过程中缺陷的产生与磷和铁的内扩散有直接关系.向内扩散的磷原子和铁原子占据晶格中铟位后，分别产生反位缺陷和铁深受主.实验结果表明，铁通过扩散充分占据了铟位，抑制了铟空位、磷反位等缺陷的形成，而磷气氛下退火后产生的缺陷有铟空位、磷反位等.对InP中的缺陷属性进行了分析. 关键词： 磷化铟 退火 缺陷     

高温电子辐照硅中缺陷的研究

本文对高温电子辐照硅中产生的缺陷进行了研究,发现缺陷的引进率随电子辐照温度的增加而增加,在达到极值温度T_m后,缺陷的引进率将随之而下降,T_m值与缺陷的退火激活能有关。E₃缺陷(E_c—0.36eV)浓度在高温电子辐照中显著增加,在330℃高温电子辐照时,E₃缺陷浓度为室温电子辐照的6倍。研究结果表明,E₃缺陷的可能结构为与多空位和氧有关的复合体。 关键词：     

磷化铟中铁原子替位与填隙的热致转变及其对材料性质的影响

高温退火后掺铁半绝缘(SI)InP单晶转变为n型低阻材料.利用霍尔效应(Hall)，热激电流谱(TSC)，深能级瞬态谱(DLTS)，X射线衍射等方法分别研究了退火前后InP材料的性质和缺陷.结果表明受高温热激发作用部分铁原子由替位转变为填隙，导致InP材料缺少深能级补偿中心而发生导电类型转变.通过比较掺杂、扩散和离子注入过程Fe原子的占位和激活情况分析了这一现象的机理和产生原因. 关键词： 磷化铟 铁激活 退火 半绝缘     

深能级缺陷对半绝缘InP材料电学补偿的影响

对铁掺杂和高温退火非掺杂磷化铟制备的两种半绝缘材料的电学补偿和深能级缺陷进行了分析和比较.根据热激电流谱(TSC)测得的深能级缺陷结果，分析了这两种半绝缘InP材料中深能级缺陷对电学补偿的影响.在掺铁半绝缘InP材料中，由于存在高浓度的深能级缺陷参与电学补偿，降低了材料的补偿度和电学性能.相比之下，利用磷化铁气氛下高温退火非掺InP获得的半绝缘材料的深能级缺陷浓度很低，通过扩散掺入晶格的铁成为唯一的深受主补偿中心钉扎费米能级，材料表现出优异的电学性质.在此基础上给出了一个更为广泛的半绝缘InP材料的电学补偿模型.     

电子辐照硅层中缺陷能级的研究

用12MeV电子辐照硅p⁺n结,在硅中除引入氧空位E₁(E_c-0.19eV),双空位E₂(E_c-0.24eV)和E₄(E_c-0.44eV)外,还引入缺陷E₃(E_c-0.37eV)。用DLTS方法和反向恢复时间测量研究了这些能级的退火行为,可以看到,E₃的退火温度最高(≈520℃)。由退火特 关键词：     

InP/SiO2纳米复合膜的微观结构和光学性质

应用射频磁控共溅射方法在石英玻璃和抛光硅片上制备了InP/SiO₂复合薄膜,并在几种条件下对这些薄膜进行退火.X射线光电子能谱和卢瑟福背散射实验结果表明,复合薄膜中InP和SiO₂的化学组分都大体上符合化学计量配比.X射线衍射和激光喇曼谱实验结果都证实了复合薄膜中形成了InP纳米晶粒.磷气氛保护下的高温(520℃)退火可以消除复合薄膜中残存的In和In₂O₃并得到了纯InP/SiO₂纳米复合薄膜.实验观察到了室温下纳米复合薄膜的明显的光学吸收边蓝移现象和光学非线性的极大增强 关键词： InP 纳米晶粒 微观结构 光学性质     

磷化铟高电子迁移率晶体管外延结构材料抗电子辐照加固设计

为研究磷化铟高电子迁移率晶体管(InP HEMT)外延结构材料的抗电子辐照加固设计的效果,本文采用气态源分子束外延法制备了系列InP HEMT外延结构材料.针对不同外延结构材料开展了1.5 MeV电子束辐照试验,在辐照注量为2×10¹⁵ cm^-2条件下,并测试了InP HEMT外延结构材料二维电子气辐照前后的电学特性,获得了辐照前后不同外延结构InP HEMT材料二维电子气归一化浓度和电子迁移率随外延参数的变化规律,分析了InP HEMT二维电子气辐射损伤与Si-δ掺杂浓度、InGaAs沟道厚度和沟道In组分以及隔离层厚度等结构参数的关系.结果表明:Si-δ掺杂浓度越大,隔离层厚度较薄,InGaAs沟道厚度较大,沟道In组分低的InP HEMT外延结构二维电子气辐射损伤相对较低,具有更强的抗电子辐照能力.经分析原因如下:1)电子束与材料晶格发生能量传递,破坏晶格完整性,且在沟道异质界面引入辐射诱导缺陷,增加复合中心密度,散射增强导致二维电子气迁移率和浓度降低;2)高浓度Si-δ掺杂和薄隔离层有利于提高量子阱二维电子气浓度,降低二维电子气受辐射...     

应力对(GaP)1/(InP)1(111)超晶格体内和表面电子结构的影响

考虑到应力对超薄层(GaP)₁/(InP)₁(111)结构中Ga-P和In-P键长的作用为均匀分布的情况,本文提出在紧束缚近似下,将应力的影响直接反映到Harrison的交迭积分项中,并利用Recursion方法全面计算了由Keating模型确定的稳定(GaP)₁/(InP)₁(111)超晶格体内和表面的电子结构,结果表明,这种材料的带隙为1.88eV,它比体材料GaP(2.91eV)和InP(1.48eV)的平均值小 关键词：     

高温氢退火还原V2O5制备二氧化钒薄膜及其性能的研究

过渡金属氧化物二氧化钒(VO₂)在温度340 K附近会发生金属绝缘体的转变(metal-insulator transition, MIT). 基于金属绝缘体的转变性质, VO₂薄膜材料具有很好的应用前景. 本文首先采用脉冲激光沉积制备了高质量的V₂O₅薄膜, 再通过高温氢退火还原V₂O₅薄膜制备出VO₂多晶薄膜. 研究了不同的退火温度、退火时间、退火气氛对VO₂薄膜制备的影响, 采用X射线衍射、X射线光电子能谱、变温电阻特性测量等手段对样品进行分析, 发现在H₂(5%)/Ar退火气氛下, 在一定的退火温度范围内(500–525 ℃), 退火 3 h, 得到了B相和M相共存的VO₂薄膜, 具有M相的VO₂的MIT特性, 而相同退火温度下退火时间达到4.5 h, 薄膜完全变成B相的VO₂. 通过纯Ar气氛下对B相VO₂再退火, 得到了转变温度为350 K, 电阻突变接近4个数量级的M相的VO₂薄膜. 实现了VO₂的B相和M相的相互转变. 关键词： 2薄膜')" href="#">VO₂薄膜 金属绝缘体转变 氢退火     

注硅半绝缘GaAs的深能级

用深能级瞬态谱(DLTS)详细研究了硅离子注入Liquid-encapsulated Czochralski(缩写为LEC)半绝缘GaAs的深中心。结果表明,在注硅并经高温退火的有源区中观测到4个多子(电子)陷阱,E₀₁,E₀₂,E₀₃和E₀₄。它们的电子表观激活能分别为0.298,0.341,0.555和0.821eV。其中E₀₄与EL2有关,但不是EL2缺陷。E₀₄的电子 关键词：     

Ge：SiO2的光敏缺陷的研究

研究了Ｇｅ；ＳｉＯ２光敏缺陷的特性，分别在４８８ｎｍＡｒ离子激光与１９３ｎｍＡｒ准分子激光作用下，由紫外吸收带，激光荧光的测量实验及电子自旋共振实验，发现光纤中５．１ｅＶ锗缺陷吸收带实验上是由５．０６ｅＶ可光致漂白带与５．１７ｅＶ不可漂白带组成；２９５ｎｍ的激发荧光与５．０６ｅＶ的缺氧锗缺陷对应，随５．０６ｅＶ缺陷吸收带的漂白而衰减；     

Radiation-induced defects in annealed carbonate-containing hydroxyapatite

The effect of preliminary (before irradiation) annealing of synthetic carbonate-containing hydroxyapatite powders on the formation of paramagnetic centers under γ-ray and ultraviolet irradiation has been investigated. Annealing of the samples has been performed in the temperature range from 100 to 700°C. It has been found that electron paramagnetic resonance spectra of radiation-induced defects depend substantially on the annealing temperature. The paramagnetic centers CO ₂ ^? dominate in the samples annealed to 250°C (γ-ray irradiation) and 500°C (ultraviolet irradiation). In the samples annealed above 400°C, other defects, in particular, the O^? and CO ₃ ^3? centers, play a significant role. Annealing at some temperatures leads to an increase in the radiation sensitivity of the material. The observed effects can be associated with the escape of molecular water from the annealed hydroxyapatite samples and with the corresponding transformation of the defect subsystem of the material.     

Cathodoluminescence investigations of RIE-induced defects in InP

Cathodoluminescence (CL) measurements have been performed to characterize defects in InP created by reactive ion etching (RIE) in a CH₄/H₂/Ar plasma. Etching of semi-insulating InP:Fe leads to an increase of CL intensity. After etching of undoped, n-type InP a reduction of band-edge as well as band-acceptor/donor-acceptor-pair emission intensity is detected. No additional emission lines due to etching-induced defects have been detected in the spectral range examined. After a few minutes of electron beam injection the band-edge luminescence recovers to its initial value. Using donor-bound exciton emission, which is especially affected by RIE, mapping of these defects is possible, showing homogeneous defect distribution. In conjunction with other measurements (conductivity, photoluminescence, electron-beam-induced current, Raman scattering, Auger electron spectroscopy depth profiling) these results indicate a nonradiative, donor-like defect created by RIE.     

Investigation of helium implantation induced blistering in InP

 Four-inch InP wafers were implanted with 100 keV helium ions with a dose of 5×10¹⁶ cm⁻² and subsequently annealed in air in the temperature range of 225-400°C in order to determine the blistering kinetics of these wafers. An Arrhenius plot of the blistering time as a function of reciprocal temperature revealed two different activation energies for the formation of surface blisters in InP. The activation energy was found to be 0.30 eV in the higher temperature regime of 300-400 °C and 0.74 eV in the lower temperature regime of 225-300 °C. The implantation induced damage was analyzed by cross-sectional transmission electron microscopy, which revealed a band of defects extending from 400-700 nm from the surface of InP. The damage band was found to be decorated with a large number of nanovoids having diameters between 2 and 5 nm. These nanovoids served as precursors for the formation of microcracks inside InP upon annealing, which led to the formation of surface blisters.     

Visible photoluminescence and its mechanisms from a-SiOx : H films with different stoichiometry

The photoluminescence (PL) properties of H-rich amorphous silicon oxide thin films prepared by dual-plasma chemical vapor deposition have been studied. The three commonly reported PL bands centered around 1.7, 2.1 and 2.9 eV have been detected from the same type of a-SiO_x : H material, only by varying the oxygen content (x≈1.35, 1.65, 2). In order to characterize the PL bands, the samples in as-prepared and annealed states up to 900°C have been analyzed by XPS, FT-IR, gas effusion, ESR and ellipsometry. Temperature quenching experiments are crucial to distinguish the 1.7 eV band, fully consistent with a bandtail-to-bandtail transition, from radiative defect luminescence mechanisms attributed either to defects related to Si–OH groups (2.9 eV) or to oxygen vacancy defects (2.1 eV).     

Defect Characterization of 6H-SiC Studied by Slow Positron Beam

利用单能慢正电子束流,对原生的和经过电子辐照的6H-SiC内的缺陷形成及其退火行为进行研究．发现在n型6H-SiC中,经过退火后缺陷浓度降低．这主要是因为在退火过程中缺陷和间隙子的相互作用所引起．n型6H-Si经过1400 oC、30 min真空退火后,在SiC表面形成一个大约20 nm的Si层,这是在高温退火过程中Si原子向表面逸出的有力证明．在高温退火中,在样品的近表面区域有一个明显的表面效应,既在这些区域的S参数整体较大,这种现象与高温退火中Si不断向表面逸出有关．经过10 MeV的电子辐照,在n型6H-SiC中,正电子有效扩散长度从86.2 nm减少至39.1 nm,说明在样品中由于电子辐照产生大量缺陷．但是对p型6H-SiC,经过10 MeV电子辐照后有效扩散长度变化不大,这与其中缺陷的正电性有关．同时还对n型6H-SiC进行了1.8 MeV电子辐照后的300 oC退火实验,发现退火后缺陷浓度不减反增,这主要是因为在退火过程中,一些双空位缺陷和Si间隙子互相作用从而产生了VC缺陷的缘故．     

Optical properties of aluminum oxide after irradiation with cobalt ions

Optical absorption of leucoosapphire and polycrystalline corund (polycor) is studied after irradiation with cobalt ions and subsequent annealing in a vacuum. The structure of states localized in the forbidden band and induced by various imperfections has a higher stability to annealing as compared to the case of implantation of other types of ions into aluminum oxide. The fan-like behavior of the dose-dependent absorption spectra is a consequence of the defect-induced disordering of crystal lattices. It is determined that intrinsic radiation-induced defects, substitutional defects, complexes containing them, and Co nanoparticles have an influence on the parameters of the focal point of the absorption spectra. The parameters of the interband and exponential absorption demonstrate the formation of a new multidefect material with a band gap width ranging from 5.3 to 5.5 eV and an absorption edge at 2.0–5.2 eV caused by the localized states of defect clusters.     

Radiation enhanced diffusion in face centered cubic cu-zn alloys

The enhancement of diffusion by neutron irradiation has been investigated on a Cu-36 percent Zn alloy for various neutron fluxes and irradiation temperatures by means of in-pile measurements of electrical resistivity. For fresh samples the diffusion rate depends on temperature with an activation energy of 0.35 eV. During repeated irradiations the diffusion rate decreases and becomes nearly temperature independent. The variation of the concentration of interstitials and vacancies with irradiation time has been numerically calculated for various neutron fluxes, irradiation temperatures and sink concentrations. A comparison of the experimental and theoretical results shows that the point defects annihilate in fresh samples mainly by pair recombination and in samples which had been repeatedly cycled by pair recombination and at fixed sinks. Point defect clusters acting as sinks are created during the course of the irradiation as shown by electron microscope investigations. The radiation enhanced diffusion rate was found to depend on interstitials only, the activation energy of which was determined to 0.70 eV.