氮化铝单晶薄膜的ECR PEMOCVD低温生长研究

采用电子回旋共振等离子体增强金属有机物化学气相沉积（ECR－PEMOCVD）技术，在c轴取向的蓝宝石即α Al2O3（0001）衬底上，以氮化镓（GaN）缓冲层和外延层作为初始层，分别以高纯氮气（N2）和三甲基铝(TMAl)为氮源和铝源低温生长氮化铝（AlN）薄膜.并利用反射高能电子衍射（RHEED）、原子力显微镜（AFM）和x射线衍射（XRD）等测量结果，研究了氢等离子体清洗、氮化和GaN初始层对六方AlN外延层质量的影响，从而获得解理性与α Al2O3衬底一致的六方相AlN单晶薄膜，其XRD半高宽为1 关键词： AlN 氢等离子体清洗 氮化 GaN     

利用MOCVD在r面蓝宝石上生长的α面GaN中两步AlN缓冲层的优化

采用两步AlN缓冲层(一层低温AlN和一层高温AlN)在r面蓝宝石衬底上生长了非极性的α面GaN,并利用高分辨X射线衍射和光致荧光谱对所生长的材料进行了研究.两步AIN缓冲层在我们之前的工作中已被证明比单步高温AlN或低温GaN缓冲层更有利于减小材料各向异性和提高晶体质量,本文进一步优化了两步AlN缓冲层的结构,并得到了各向异性更小,晶体质量更好的α面GaN薄膜.分析表明,两步AlN缓冲层中的低温AlN层在减小各向异性中起着关键作用.低温AlN层能抑制了优势方向(c轴)的原子迁移,有利于劣势方向(m轴)的原子迁移,从而减小了Al原子在不同方向迁移能力的差异,并为其后的高温AlN缓冲层和GaN层提供"生长模板",以得到各向异性更小、晶体质量更好的α面GaN材料.     

等离子增强原子层沉积低温生长AlN薄膜

采用等离子增强原子层沉积技术在单晶硅基体上成功制备了AlN晶态薄膜, 利用椭圆偏振仪、原子力显微镜、小角掠射X射线衍射仪、高分辨透射电子显微镜、 X射线光电子能谱仪对样品的生长速率、表面形貌、晶体结构、薄膜成分进行了表征和分析, 结果表明, 采用等离子增强原子层沉积制备AlN晶态薄膜的最低温度为200 ℃, 薄膜表面平整光滑, 具有六方纤锌矿结构与(100)择优取向, Al_2p与N_1S的特征峰分别为74.1 eV与397.0 eV, 薄膜中Al元素与N元素以Al-N键相结合, 且成分均匀性良好. 关键词： 氮化铝 等离子增强原子层沉积 低温生长 晶态薄膜     

Eu2CuO4缓冲层和YBCO超导薄膜的制备及研究

本文用脉冲激光淀积法在LaAlO3(100)基片上外延生长Eu2CuO4薄膜缓冲层和YBCO超导薄膜,用X射线衍射扫描分析表明ECO薄膜为c轴取向.     

碳硅共掺杂p型AlN的光电性能研究

在SiC衬底上生长了碳硅共掺杂p型AlN晶体,通过X射线衍射、X射线光电子能谱(XPS)、光致发光(PL)光谱、霍尔测试对碳硅共掺杂p型AlN晶体的结构、光学及电学性能进行了综合研究。通过XPS测试分析(尤其是对样品中Si 2p和C 1s的XPS谱分析)发现,样品中C替代N成为受主,而Si替代Al成为施主。样品的PL谱主要包括两个特征发射峰,分别来自于C、Si在AlN中形成的复合物V N-C N和C N-Si Al。     

衬底类型对于Ga-N共掺杂ZnMgO薄膜性能的影响

利用直流反应磁控溅射技术分别在玻璃、n-〈111〉Si、氧化硅(SiO2/Si)、石英衬底上制得Ga-N共掺杂ZnMgO薄膜。利用X射线衍射(XRD)、Hall实验、场发射扫描电镜(FE-SEM)和X射线光电子能谱(XPS)对不同衬底上生长的ZnMgO薄膜的性能进行表征。结果表明,Ga-N共掺杂p型ZnMgO薄膜具有高度c轴择优取向的结构特征。生长在玻璃、(111)Si和氧化硅衬底上的ZnMgO薄膜显示p型导电性,而生长在石英衬底上的ZnMgO薄膜显示n型导电性。生长在氧化硅片衬底上的共掺杂ZnMgO薄膜的晶体质量和电学性能最优,载流子浓度为2.28×1017cm-3,电阻率为27.7Ω·cm。而且其表面形貌明显不同于生长在其他衬底上的薄膜。Ga2p和N1s的XPS谱表明Ga-N共掺杂ZnMgO薄膜中存在Ga—N键,有利于N的掺入,从而易于实现p型生长。     

脉冲高能量密度等离子体沉积(Ti,Al)N薄膜组织及其性能研究

利用脉冲高能量密度等离子体技术在室温条件下在45＃钢基材表面沉积了高硬度耐腐蚀(Ti, Al)N薄膜. 利用扫描电子显微镜、X射线衍射、X射线光电子能谱、俄歇电子能谱分析了薄膜的显微组织.利用纳米压痕仪测试了薄膜的纳米硬度.测试了薄膜在05mol/L H2SO4水溶液中的耐蚀性. 测试结果表明：薄膜主要组成相为(Ti, Al)N，同时含有少量的AlN,薄膜的纳米硬度高达26 GPa,薄膜具有良好的耐蚀性，与1Cr18Ni9Ti奥氏体不锈钢相比，耐蚀性提高了一个数量级. 关键词： 脉冲高能量密度等离子体 薄膜 纳米硬度 耐蚀性     

MOCVD法制备Cu掺杂ZnO薄膜

通过金属有机物化学气相沉积(MOCVD)设备,在c-Al2 03衬底上生长本征和Cu掺杂ZnO( ZnO∶ Cu)薄膜.X射线衍射(XRD)谱观察到未掺杂的ZnO和ZnO∶ Cu样品都呈现出较好的c轴择优取向生长.X射线光电子能谱(XPS)表明Cu已掺入到ZnO薄膜中.利用光致发光(PL)测试对本征ZnO和ZnO∶ C...     

直流磁控溅射生长(002)择优取向AlN薄膜及其光致发光

采用直流反应磁控溅射法,在玻璃衬底上生长了沿(002)择优取向的AlN薄膜,用X射线衍射仪(XRD)和扫描电子显微镜(SEM)对AlN薄膜结构和表面形貌进行表征,并测量了AlN薄膜在405 nm激光激发下的光致发光(PL)光谱。结果表明,在不同氮气含量条件下生长的AlN薄膜均呈(002)择优取向,薄膜表面呈小颗粒密堆积排列,颗粒尺寸在20 nm左右。不同氮气含量条件下生长的AlN薄膜在550 nm处均有较强的由于V_(Al)能级向价带跃迁引起的缺陷能级发光峰;AlN薄膜在589,614,654 nm处也有较弱的缺陷能级发光峰,随着氮气含量增大,缺陷能级发光峰越来越明显,产生原因分别为O_N-O_N缺陷对向V_(Al)-2O_N产生的复合缺陷能级的跃迁、导带向与氧有关的杂质能级(I_O)间的跃迁以及V_(Al)-O_N深能级向价带的跃迁。     

磁控溅射制备的AlN薄膜的结构、组分及性能分析

采用DC磁控溅射法,分别在p-Si(111)和玻璃基片上沉积AlN薄膜。利用X射线衍射(XRD)、X射线能谱仪(EDS)、原子力显微镜(AFM)、台阶仪\紫外/可见分光光度计和傅里叶变换红外光谱仪(FTIR)分析了薄膜的结构组分、表面形貌、膜厚、光学性能和红外吸收特性。结果表明:溅射电流对AlN薄膜的生成有很大的影响,当电流增加到0.40A时,薄膜中出现明显的h-AlN(100)和AlN(110)衍射峰;样品的最大高度都小于30nm;样品在250-1000nm波长范围内具有较高的透射率,当溅射电流为0.4A时,薄膜的禁带宽度约为5.94eV;在677.12cm-1处出现强烈的吸收峰。     

Low‐temperature growth of high quality AlN films on carbon face 6H‐SiC

AlN films have been grown on atomically flat carbon face 6H‐SiC (000 ) substrates by pulsed laser deposition and their structural properties have been investigated. In‐situ reflection high‐energy electron diffraction observations have revealed that growth of AlN at 710 °C proceeds in a Stranski–Krastanov mode, while typical layer‐by‐layer growth occurs at room temperature (RT) with atomically flat surfaces. It has been revealed that the crystalline quality of the AlN film is dramatically improved by the reduction in growth temperature down to RT and the full width at half maximum values in the X‐ray rocking curves for 0004 and 10 2 diffractions of the RT‐grown AlN film are 0.05° and 0.07°, respectively. X‐ray reciprocal space mapping has revealed that the introduction of misfit dislocations is suppressed in the case of RT growth, which is probably responsible for the improvement in crystalline quality. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

X光激发氮氧化铝膜层电子特征能量探测与分析

本文报告了用Ｘ光电子能谱法（ＸＰＳ）对氮氧化铝／铁膜内层电子特征能量的探测与分析,获得了膜层中不同深度的元素成分及化学结构．结果表明：ＸＰＳ方法是研究氮氧化铝选择性吸收膜的有效方法．     

Pyroelectric and piezoelectric responses of thin AlN films epitaxy-grown on a SiC/Si substrate

This paper presents the results of pyroelectric and piezoelectric studies of AlN films formed by chloride–hydride epitaxy (CHE) and molecular beam epitaxy (MBE) on epitaxial SiC nanolayers grown on Si by the atom substitution method. The surface topography and piezoelectric and pyroelecrtric responses of AlN films have been analyzed. The results of the study have shown that the vertical component of the piezoresponse in CHE-grown AlN films is more homogeneous over the film area than that in MBE-grown AlN films. However, the signal from the MBE-synthesized AlN films proved to be stronger. The inversion of the polar axis (polarization vector) on passage from MBE-grown AlN films to CHE-grown AlN films has been found experimentally. It has been shown that the polar axis in MBE-grown films is directed from the free surface of the film toward the Si substrate while, in CHE-grown films, the polarization vector is directed toward the free surface.     

Room‐temperature epitaxial growth of high‐quality m ‐plane InGaN films on ZnO substrates

The authors have grown high‐quality m ‐plane In_0.36Ga_0.64N (1 00) films on ZnO (1 00) substrates at room temperature (RT) by pulsed laser deposition (PLD) and have investigated their structural properties. m ‐plane InGaN films grown on ZnO substrates at RT possess atomically flat surfaces with stepped and terraced structures, indicating that the film growth proceeds in a two‐dimensional mode. X‐ray diffraction measurements have revealed that the m ‐plane InGaN films grow without phase separation reactions at RT. The full‐width at half‐maximum values of the 1 00 X‐ray rocking curves of films with X‐ray incident azimuths perpendicular to the c ‐ and a‐axis are 88 arcsec and 78 arcsec, respectively. Reciprocal space‐mapping has revealed that a 50 nm thick m ‐plane In_0.36Ga_0.64N film grows coherently on the ZnO substrate, which can probably explain the low defect density that is observed in the film. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

GaN缓冲层对直流反应磁控溅射AlN薄膜的影响(英文)

通过直流磁控反应溅射制备了氮化铝(AlN)薄膜,研究了沉积条件与氮化镓(GaN)缓冲层对薄膜质量的影响。利用X-射线衍射仪(XRD)和扫描电镜(SEM)表征了AlN薄膜的晶体结构和表面形貌。XRD研究结果表明,低工作压强、短靶距和适当的氮气偏压有利于(002)择优取向的AlN薄膜沉积。随着沉积时间的增加,沉积在50 nm厚的GaN缓冲层上的AlN薄膜的(002)面的衍射峰的半高宽急剧减小,而沉积在1μm厚的GaN薄膜上的AlN薄膜的(002)面的衍射峰的半高宽几乎不变。SEM测试结果表明:在沉积的初期,沉积在1μm厚的GaN薄膜上的AlN薄膜的(002)面的晶粒大小分布比沉积在50 nm厚的GaN缓冲层上的AlN薄膜的均匀,而随着沉积时间的增加,它们的晶粒大小分布几乎趋向一致。     

用锌金属有机源和二氧化碳等离子体增强化学气相沉积的方法制备高质量氧化锌薄膜

报道了用金属锌有机源和二氧化碳混合气源等离子体增强化学气相沉积(PECVD)的方法成功地制备高质量择优取向(0002)的ZnO薄膜。通过X-ray衍射谱进行了结构分析得到六方结构,择优取向,晶粒尺寸大约在220nn.并通过原子力显微镜分析更进一步验证了晶粒的尺寸。通过透射谱分析观察到了典型的激子吸收线。这种方法的特点是可以在低温条件下在任何衬底上生长大面积均匀性好、结晶度高的ZnO薄膜。     

Nonpolar a-plane GaN grown on r-plane sapphire using multilayer AlN buffer by metalorganic chemical vapor deposition

Mirror-like and pit-free non-polar a-plane (1 1 −2 0) GaN films are grown on r-plane (1 −1 0 2) sapphire substrates using metalorganic chemical vapor deposition (MOCVD) with multilayer high-low-high temperature AlN buffer layers. The buffer layer structure and film quality are essential to the growth of a flat, crack-free and pit-free a-plane GaN film. The multilayer AlN buffer structure includes a thin low-temperature-deposited AlN (LT-AlN) layer inserted into the high-temperature-deposited AlN (HT-AlN) layer. The results demonstrate that the multilayer AlN buffer structure can improve the surface morphology of the upper a-plane GaN film. The grown multilayer AlN buffer structure reduced the tensile stress on the AlN buffer layers and increased the compressive stress on the a-plane GaN film. The multilayer AlN buffer structure markedly improves the surface morphology of the a-plane GaN film, as revealed by scanning electron microscopy. The effects of various growth V/III ratios was investigated to obtain a-plane GaN films with better surface morphology. The mean roughness of the surface was 1.02 nm, as revealed by atomic force microscopy. Accordingly, the multilayer AlN buffer structure improves the surface morphology and facilitates the complete coalescence of the a-plane GaN layer.     

不同环境中X射线激光Yb靶表面氧化研究

 用电子束蒸发方法淀积制备X射线激光稀土元素Yb薄膜靶,将薄膜靶在不同的环境气氛中进行氧化。用X射线光电子谱(XPS)、俄歇电子谱(AES)和X射线衍射(XRD)方法研究了Yb薄膜靶表面氧化层的元素价态、组分和微观结构。发现薄膜表面氧化层中存在分层结构,干燥空气中储存的Yb薄膜表面氧化层由表及里的组分依次为化学吸附水、氢氧化物、氧化物及金属元素。表面氢氧化物和氧化物以非晶态形式存在。潮湿空气中水分是薄膜靶氧化速率增加的主要原因。     

Electron penetration depth in amorphous AlN exploiting the luminescence of AlN:Tm/AlN:Ho bilayers

The penetration depth of electron in amorphous aluminum nitride (AlN) is determined in terms of energy loss per unit length using electron beam in a cathodoluminescence (CL) apparatus. Thin films bilayers of holmium doped aluminum nitride (AlN:Ho) and thulium doped aluminum nitride (AlN:Tm) are deposited on silicon substrates by rf magnetron sputtering method at liquid nitrogen temperatures. The bilayers structure consisted of a 37.8 nm thick AlN:Tm film on the top of a 15.3 nm thick AlN:Ho film. Electron beam of different energies are allowed to penetrate the AlN:Tm/AlN:Ho bilayers film. The spectroscopic properties of AlN:Ho and AlN:Tm, the thickness of the film and the energies of electron beam are used to calculate the penetration depth of electron in amorphous AlN. Electron beam of 2.5 keV energy was able to pass through the 37.8 nm thick AlN:Tm film. The electron penetration depth for AlN is found to be 661.4 MeV/cm.